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CN107591345B - 基板液处理方法和基板液处理装置 - Google Patents

基板液处理方法和基板液处理装置 Download PDF

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Publication number
CN107591345B
CN107591345B CN201710543742.2A CN201710543742A CN107591345B CN 107591345 B CN107591345 B CN 107591345B CN 201710543742 A CN201710543742 A CN 201710543742A CN 107591345 B CN107591345 B CN 107591345B
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CN
China
Prior art keywords
liquid
substrate
processing
wafer
rotation speed
Prior art date
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CN201710543742.2A
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English (en)
Chinese (zh)
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CN107591345A (zh
Inventor
小佐井一树
大塚贵久
篠原和義
铃木启之
八谷洋介
东博之
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN107591345A publication Critical patent/CN107591345A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
CN201710543742.2A 2016-07-06 2017-07-05 基板液处理方法和基板液处理装置 Active CN107591345B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016134313A JP6765878B2 (ja) 2016-07-06 2016-07-06 基板液処理方法及び基板液処理装置
JP2016-134313 2016-07-06

Publications (2)

Publication Number Publication Date
CN107591345A CN107591345A (zh) 2018-01-16
CN107591345B true CN107591345B (zh) 2023-04-18

Family

ID=60949766

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710543742.2A Active CN107591345B (zh) 2016-07-06 2017-07-05 基板液处理方法和基板液处理装置

Country Status (3)

Country Link
JP (1) JP6765878B2 (ja)
KR (1) KR102408472B1 (ja)
CN (1) CN107591345B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010242A (ja) * 2008-06-25 2010-01-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
CN101750898A (zh) * 2008-12-16 2010-06-23 东京毅力科创株式会社 涂敷处理方法及涂敷处理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901650B2 (ja) 2007-08-31 2012-03-21 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP2013201418A (ja) * 2012-02-24 2013-10-03 Ebara Corp 基板処理方法
JP6223839B2 (ja) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP6118758B2 (ja) * 2014-05-01 2017-04-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP6341035B2 (ja) * 2014-09-25 2018-06-13 東京エレクトロン株式会社 基板液処理方法、基板液処理装置、及び記憶媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010010242A (ja) * 2008-06-25 2010-01-14 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
CN101750898A (zh) * 2008-12-16 2010-06-23 东京毅力科创株式会社 涂敷处理方法及涂敷处理装置

Also Published As

Publication number Publication date
CN107591345A (zh) 2018-01-16
KR102408472B1 (ko) 2022-06-10
JP6765878B2 (ja) 2020-10-07
JP2018006647A (ja) 2018-01-11
KR20180005609A (ko) 2018-01-16

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