CN107598500B - Housing manufacturing method, housing and mobile terminal - Google Patents

Abstract

The application provides a shell manufacturing method, a shell and a mobile terminal. The manufacturing method of the shell comprises the following steps: providing a plate; forging and pressing the plate to form a shell base and a lug, wherein the shell base comprises a first surface and a second surface, and the lug is arranged on the first surface; forming a blind hole facing the bump on the second surface; filling colloid into the blind hole, and solidifying the colloid; processing the shell substrate from the first surface to form a camera hole; and removing the solidified colloid. The method and the device help to solve the problem that the mobile phone camera hole is curled or collapsed during processing.

Description

Housing manufacturing method, housing and mobile terminal

technical field

The present application relates to the technical field of mobile terminals, and in particular, to a method for manufacturing a casing, a casing and a mobile terminal.

Background technique

At present, as the thickness of the mobile terminal tends to be thinner and thinner, the camera hole of the mobile terminal will be designed as a protruding structure to install the multi-layer camera assembly. The convex structure of the camera hole is generally a thin-walled structure. When processing the convex structure of the camera hole, it is easy to cause the thin-walled edge of the camera hole or the thin-walled collapse, which affects the overall appearance of the mobile terminal casing. and mechanical properties.

SUMMARY OF THE INVENTION

The present application provides a method for manufacturing a casing, and the method for manufacturing a casing includes:

provide plates;

forging the plate to form a housing base and a bump, the housing base includes a first surface and a second surface, and the bump is arranged on the first surface;

forming blind holes facing the bumps on the second surface;

Filling colloid into the blind hole, and curing the colloid;

processing the housing base from the first surface to form a camera hole;

Remove the cured colloid.

In the method for manufacturing a casing provided by the present application, a casing base and bumps are formed by first forging a plate, the bumps are arranged on the first surface, and then the bumps are formed on the second surface facing the bumps. blind holes. Since the bump structure is arranged on the first surface, in the process of machining the blind hole on the second surface, the bump can form a support for the housing base, so as to avoid the process of machining the blind hole. The housing base is deformed. Then, colloid is filled into the blind hole, and the colloid is cured, and then the shell substrate is subjected to material reduction treatment from the first surface to process the required outline to form the camera hole. When the material reduction treatment is performed on the first surface, the colloid can form a support for the casing base, and at this time, deformation of the casing base can be avoided when the outer contour is processed on the first surface. Finally, the cured colloid is removed to obtain a casing with a camera hole.

The present application also provides a casing, which is manufactured by the above casing manufacturing method.

The present application also provides a mobile terminal, the mobile terminal includes a casing manufactured by using the above casing manufacturing method.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

FIG. 1 is a flowchart of a method for manufacturing a casing provided by an embodiment of the present application.

FIG. 2 to FIG. 5 are partial structural schematic diagrams corresponding to the flowchart of the method for manufacturing a casing provided by the embodiments of the present application.

FIG. 6 is a flowchart included in step S300 in the method for manufacturing a casing of the present application.

FIG. 7 is a flowchart included in step S310 in the method for manufacturing a casing of the present application.

8 to 10 are schematic structural diagrams of a method for determining a center position of a bump in an embodiment of the present application.

FIG. 11 and FIG. 12 are partial structural schematic diagrams corresponding to the partial flow chart of the shell manufacturing method provided by the embodiment of the present application.

FIG. 13 is a partial flowchart of a method for manufacturing a casing provided by an embodiment of the present application.

FIG. 14 is a schematic structural diagram corresponding to a partial flow chart of the method for manufacturing a casing in FIG. 13 .

FIG. 15 is a schematic structural diagram of a mobile terminal provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present application.

Furthermore, the following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present application may be practiced. Directional terms referred to in this application, such as "top", "bottom", "top", "bottom", "front", "rear", "left", "right", "inside", "outside" ", "side", etc., are only the directions with reference to the attached drawings, therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the indicated device or element must have The particular orientation, construction and operation in the particular orientation are therefore not to be construed as limitations of the present application.

The numerical range represented by "-" in this specification means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the drawings, structures that are similar or identical are denoted by the same reference numerals.

Please refer to FIG. 1 . FIG. 1 is a flowchart of a method for manufacturing a casing provided by an embodiment of the present application. The flow chart of the shell manufacturing method includes but is not limited to S100, S200, S300, S400, S500 and S600. The detailed steps are described as follows:

S100: Provide plate 100. See Figure 2.

Optionally, the plate 100 is a metal material, and the plate can be arbitrarily cut, bent, punched, welded, and made into various product components, and is flexible and convenient to use. Optionally, the plate is made of aluminum alloy material or stainless steel material, which has good strength and good plasticity.

Optionally, when the plate 100 is provided, the quality of the plate 100 needs to be checked to ensure that the plate 100 meets the quality requirements. Make sure that the processed shell reaches the normal index.

Specifically, the method of detecting whether the plate 100 meets the quality standard may be infrared detection. An infrared detector is used to detect the plate 100, and the detected data is received. If the detected data has obvious local position data If it is too small, it can be considered that there are cracks or voids in this area, and it is considered that the plate does not meet the quality standard. Therefore, it is necessary to consider replacing the plate to ensure the quality of the processed shell.

S200 : forging the plate 100 to form a housing base 110 and bumps 120 , the housing base 110 includes a first surface 110 a and a second surface 110 b , and the bumps 120 are disposed on the first surface 100 a . See Figure 3.

Optionally, sampling and testing the housing base 110 .

In this embodiment, after a plurality of the case bases 110 are produced in batches, the case bases 110 are sampled. The sampling method of the casing bases 110 may be as follows: sampling a preset number of the casing bases 110 in a preset period, measuring the size of the preset number of the casing bases 110 , and judging the preset number of casings Whether the size of the base body 110 is larger than the allowable value range. The minimum value of the allowable value range is close to the size of the housing 100 , and the maximum value of the allowable value range is the size required by the drawing of the housing base 110 plus the allowable error value. Because the actual size of the housing base 110 is larger than the minimum allowable value, the housing base 110 has a machining allowance, which facilitates the subsequent processing of the housing base 110 and prevents the housing base 110 from being processed in the subsequent process. Out of stock. However, because the actual size of the casing base 110 is smaller than the maximum allowable value, the deformation resistance of the casing base 110 during subsequent processing is reduced. If the size of the housing base 110 is within the allowable value range, proceed to the next step. If the size of the shell base 110 exceeds the allowable value range, adjust the extrusion parameters of the forging die to the plate 100, the extrusion parameters include the heating temperature of the plate 100, the extrusion force of the plate 100 , the impact speed on the plate 100, the extrusion time on the plate 100, and the like.

Optionally, the plate 100 is forged multiple times, and when the plate 100 is forged multiple times, the impact force on the plate 100 during forging is gradually increased.

The purpose of performing multiple forging on the plate 100 is to change the metal properties of the plate 100, change the crystal phase structure of the metal structure, and obtain better mechanical properties.

Optionally, when the plate 100 is forged multiple times, the impact force on the plate 100 during forging is gradually increased. For example, when the plate 100 is forged for n times, the impact force of each n times of forging is denoted as Fn, then Fn>Fn-1>...>F1, where n is an integer greater than or equal to 2. In this way, when the plate 100 is forged, the impact force Fn-1 corresponding to the n-1th forging is smaller than the impact force Fn corresponding to the nth forging, which can improve the plasticity of the plate 100, that is, the impact force of the next forging is greater than The impact strength of the last forging helps to improve the plasticity of the plate 100 , thereby increasing the toughness of the plate 100 and improving the metal cutting performance of the plate 100 .

Optionally, before the step of "forging the plate", and after the step of "providing the plate", the shell manufacturing method further includes:

S110: Preheating the plate 100.

The plate 100 is preheated to promote the thermal movement of metal molecules in the plate 100. After preheating, the molecular structure is rearranged, and the metal structure of the plate 100 can be adjusted to eliminate stress and obtain The plate 100 has more excellent mechanical properties.

S300: Form blind holes 130 facing the bumps 120 on the second surface 110b. See Figure 4. In order to make it easier to see the structure of the blind hole 130 , the blind hole 130 is cut along the view angle of FIG. 4 , see FIG. 5 .

Optionally, the step "S300: forming blind holes 130 facing the bumps 120 on the second surface 110b" includes but is not limited to steps S310, S320 and S330, see FIG. 6 , the detailed description is as follows.

S310 : Determine the center of the bump 120 and record it as the first center 123 .

Optionally, the step "S310: determine the center of the bump 120 and record it as the first center 123" includes but is not limited to steps S311, S312, and S313, see FIG. 7, and the detailed description is as follows.

S311 : Detect the positions of multiple points on the side of the housing base 110 , determine the center of the bump 120 according to the positions of the multiple points on the side of the housing base 110 , and record it as the first Reference Center 121.

For example, according to the positions of the three points A1 , A2 and A3 on the side of the housing base 110 , and according to the distances between the three points A1 , A2 and A3 and the outline of the bump 120 , The three points A1, A2 and A3 are assigned the degree of membership of the distance parameter. In short, if the distance between A1 and the outline of the bump 120 is small, the degree of membership of the distance parameter assigned to A1 is relatively large, Thereby increasing the weight of A1 point. If the distance between A3 and the outline of the bump 120 is large, the degree of membership of the distance parameter assigned to A3 is small, so that the weight of the point A3 is reduced, so that the outline of the bump 120 can be reduced. Points with a larger distance between contours interfere with determining the center of the bump 120 , increasing the accuracy of determining the center of the bump 120 . The center of the bump 120 is determined in combination with the fuzzy matter-element analysis method and recorded as the first reference center 121 . See Figure 8.

S312 : Detect the positions of multiple points on the periphery of the bump 120 , and determine the center of the bump 120 according to the positions of the multiple points on the periphery of the bump 120 , and record it as the second reference center 122 .

For example, according to the positions of the three points B1 , B2 and B3 on the periphery of the bump 120 , and according to the distances between the three points B1 , B2 and B3 and the periphery of the bump 120 , for the three points B1, B2 and B3 are assigned the membership degree of the distance parameter. In short, if the distance between B1 and the periphery of the bump 120 is small, the membership degree of the distance parameter assigned to B1 is larger, thereby increasing B1 point weight. If the distance between B3 and the periphery of the bump 120 is large, the degree of membership of the distance parameter assigned to B3 is small, so that the weight of point B3 is reduced, so that the distance between B3 and the periphery of the bump 120 can be reduced. The larger distance between the points will interfere with the determination of the center of the bump 120 , which increases the accuracy of determining the center of the bump 120 . The center of the bump 120 is determined in combination with the fuzzy matter-element analysis method, and recorded as the second reference center 122 . See Figure 9.

S313 : Obtain the first center 123 according to the first reference center 121 and the second reference center 122 , and the first center 123 is located connected to the first reference center 121 and the second reference center 122 The midpoint M of the line is within the preset radiation range S with the center. See Figure 10.

S320 : Determine the position of the blind hole 130 on the plate 100 to be formed according to the first center 123 .

Optionally, the first center 123 is the point M in FIG. 10 , and the preset radiation range S centered on the point M can be regarded as the center of the bump 120 , which can determine the blind hole to be formed. 130 location.

The preset radiation range S may be a circle with point M as the center and R as the radius. In this case, the determination of the preset radiation range S can be converted into a determined radius R. Draw a circle with R as the radius, the area of the circle is the preset radiation range S, and the position of any point in the circle with R as the radius can be regarded as the center position of the bump 120, which can be used to determine The position of the blind hole 130 to be formed. In this way, the position of the blind hole 130 to be formed is a floating area within a preset range, which avoids considering the position of the blind hole 130 as a certain position, and reduces the need for the irregular structure of the plate 100 . The difficulty in finding the center position of the bump 120 increases the operational flexibility.

S330 : Process the board 100 from the second surface 110 b to form the blind holes 130 according to the positions on the board 100 where blind holes are to be formed.

Optionally, the method of processing the plate 100 from the second surface 110b to form the blind hole 130 may be grinding or cutting. Here, the processing for forming the blind hole 130 is mainly material reduction processing. Subtractive processing methods include: turning, planing, milling, drilling and grinding. If it is necessary to reduce the material of the plate 100 more, it can be obtained by machining, mainly by using a computer numerical control machine tool (CNC) to perform machining methods such as turning, milling, drilling, etc. on the plate 100. . If it is necessary to reduce the material of the plate 100 less, the method of grinding is adopted. Specifically, the surface of the plate 100 may be polished with a file, or the surface of the plate 100 may be polished with sandpaper or a grinding wheel. . The present application does not limit the manner of forming the blind hole 130 .

S400 : Filling the colloid 140 into the blind hole 130 , and curing the colloid 140 . See Figure 11.

Specifically, the gel 140 may be a liquid gel. Because the liquid glue has good fluidity, when filling the blind holes 130 with colloid, the blind holes 130 can be better filled, which can prevent problems such as leakage of glue, less glue, etc., and then cure the blind holes 130. The colloid 140 forms a support for the subsequent material reduction process and avoids problems such as curling or collapse of the thin wall of the blind hole.

Optionally, the colloid 140 can also be a solid glue. After the solid glue is cured, the hardness is relatively large and can have better supporting strength, thereby forming a stable supporting effect for the subsequent material reduction process and avoiding the blindness. The thin wall of the hole 130 forms a problem such as curling or collapse.

Optionally, the method of filling the blind hole 130 with the colloid 140 may be a glue dispenser or other filling methods. The application does not limit the method of filling the blind hole 130 with the colloid 140. .

In addition, it should be noted that this application does not limit the number of glue dispensing devices. There can be one glue dispensing device or multiple glue dispensing devices. Specifically, the point can be determined in combination with the effect of glue filling. The number of glue devices.

In addition, it should be noted that the application does not limit the number of times of glue dispensing by the glue dispensing device, and the number of times of glue dispensing by the glue dispensing device may be one time or multiple times. Taking two dispensings as an example for illustration: the colloid 140 includes a first colloid 141 and a second colloid 142 . Specifically, the number of times of glue dispensing by the glue dispensing device can be determined in combination with the effect of glue filling. And when the first colloid 141 filled in the blind hole 130 is filled, the first colloid 141 is pressurized, so as to remove air bubbles in the blind hole 130 . The method of pressurizing the first colloid 141 may be, but not limited to, cooperating with a pressurizing device, such as a booster pump, to pressurize the first colloid 141 filled in the blind hole 130 . Pressurizing the first colloid 141 can help the first colloid 141 filled in the blind hole 130 to flow better, and discharge the air bubbles in the first colloid 141 filled in the blind hole 130 to prevent leakage of glue The occurrence of problems such as , less glue, etc., makes the colloid 140 fill more tightly, and increases the support strength of the subsequent material reduction process.

In another embodiment, in the process of filling the colloid 140, the colloid 140 can also be blown. Optionally, the device for blowing can be an air blower, a high-pressure nozzle, an air gun, etc. . The present application does not limit the way to achieve air blowing, as long as it does not violate the original intention of the technical solution of the present application, it is within the scope of protection claimed in the present application, and it is considered to be an air blowing way that satisfies the conditions.

In addition, it should be noted that this application does not limit the number of air blowing devices. There may be one air blowing device or multiple air blowing devices. Specifically, the blowing device can be determined in combination with the effect of the glue filling. The number of gas devices.

In addition, it should be noted that the application does not limit the number of times of air blowing, and the number of times of air blowing may be one or multiple times. And when the first colloid 141 filled in the blind hole 130 is blown, the first colloid 141 filled in the blind hole 130 is subjected to pressure treatment, so as to help the first colloid 141 filled in the blind hole 130. The colloid 141 flows better, and the air bubbles in the first colloid 141 filled in the blind hole 130 are discharged, preventing the occurrence of problems such as leakage of glue and lack of glue, and enhancing the support strength of the subsequent material reduction process.

Optionally, the method of curing the colloid 140 in the blind hole 130 may be ultraviolet curing. The principle of UV curing: UV photocuring is to use the photosensitivity of photoinitiators (photosensitizers) to form excited ecological molecules under UV light irradiation, decompose them into free radicals or ions, and make unsaturated organics polymerize and connect. , cross-linking and other chemical reactions to achieve the purpose of curing. The method of curing the colloid 140 in the blind hole 130 may also be baking curing. Bake curing refers to a change in the physical properties of a material, either by chemical reaction, or by pressure/no pressure to heat. The present application does not limit the manner in which the colloid 140 in the blind hole 130 is cured.

S500 : Process the housing base 110 from the first surface 110 a to form the camera hole 150 . See Figure 12.

Optionally, the casing base 110 is processed from the first surface 110a to form the camera hole 150 by grinding or cutting. Here, the processing for forming the camera hole 150 is mainly material reduction processing, optional The material reduction processing methods are: turning, planing, milling, drilling, grinding. If it is necessary to reduce the material of the plate 100 more, it can be obtained by machining, mainly by using a computer numerical control machine tool (Computer numerical control, CNC) to perform machining methods such as turning, milling, and drilling on the plate 100. of. If it is necessary to reduce the material of the plate 100 less, a grinding method can be used. Specifically, the first surface 110a of the plate 100 can be ground by using a file, or the plate can be ground with sandpaper or a grinding wheel. The first surface 110a of 100 is ground. The present application does not limit the manner of forming the camera hole 150 .

Optionally, after the step "S400: Filling the blind hole with a colloid and curing the colloid", in the step "S500: Performing on the shell base from the first surface" Before processing to form a camera hole", the housing manufacturing method further includes, but is not limited to, step S410. The detailed description of step S410 is as follows.

S410 : Detect the wall thickness of the blind hole 130 , process the part with the wall thickness greater than or equal to the preset thickness by milling, and process the part with the wall thickness less than the preset thickness by grinding to form the camera hole 150. See Figure 13.

Optionally, the method for detecting the wall thickness of the blind hole 130 may be an infrared sensing method, an image recognition method, or a three-dimensional map reconstruction method. The method of the wall thickness is not limited.

Specifically, if an infrared sensing method is used to detect the wall thickness of the blind hole 130, several infrared sensors need to be arranged at the peripheral position of the blind hole 130, and the infrared sensors are used for emitting infrared rays. , to receive the returned infrared rays, the approximate distance between several infrared sensors and the blind hole 130 can be determined, and then the distances detected by several infrared sensors can be statistically calculated to determine the wall of the blind hole 130. Thickness parameter.

Specifically, if the image recognition method is used to detect the wall thickness of the blind hole 130, it is necessary to set several cameras in the peripheral space of the blind hole 130 to take pictures of the blind hole 130, and then receive the taken pictures, By performing pixel analysis on the photo, the approximate distance between several cameras and the blind hole 130 can be determined, and then by performing statistical operations on the distances detected by several cameras, the wall thickness of the blind hole 130 can be determined parameter.

Specifically, if the method of three-dimensional map reconstruction is used to detect the wall thickness of the blind hole 130, several sensors need to be arranged in the peripheral space of the blind hole 130, and the contour shape of the casing base 110 is detected by the sensors, and The approximate position of the blind hole 130 on the housing base 110 is simulated by simulating the outlines of the three-dimensional models of the housing base 110 and the blind hole 130, and the outline of the three-dimensional model of the entire plate 100 After the simulation, the coordinates of each point at any position on the plate 100 can be determined, and then the wall thickness parameters of the blind hole 130 can be determined.

Optionally, milling is used to process the part whose wall thickness is greater than or equal to the preset thickness, and several cameras are arranged in the peripheral space of the blind hole 130 to take pictures of the blind hole 130. The thickness of the part is processed by grinding to form the camera hole 150, which can be grinding or cutting. Here, the processing to form the camera hole 150 is mainly material reduction processing. The optional material reduction processing methods are: car, Planing, milling, drilling, grinding. If it is necessary to reduce the material of the plate 100 more, it can be obtained by machining, mainly by using a computer numerical control machine tool (Computer numerical control, CNC) to perform machining methods such as turning, milling, and drilling on the plate 100. of. If it is necessary to reduce the material of the plate 100 less, a grinding method can be used. Specifically, the first surface 110a of the plate 100 can be ground by using a file, or the plate can be ground with sandpaper or a grinding wheel. The first surface 110a of 100 is ground. The present application does not limit the manner of forming the camera hole 150 .

S600: Remove the cured colloid 140. See Figure 14.

The method for removing the cured colloid 140 is: placing the processed board 100 in a chemical solution, and the chemical solution is used to dissolve the colloid. The chemical solution has two functions. First, dissolving the colloid 140 to avoid the disadvantages of long CNC machining cycle and high cost; Performing additional cleaning saves cleaning steps.

Specifically, the shell substrate 110 after batch processing can be put into a vessel containing a chemical solution, and then wait for a certain period of time, for example, 10 minutes, 20 minutes, or half an hour. The present application does not limit the length of time for placing the plate 100 in the chemical solvent, and the purpose of completely dissolving the colloid 140 can be achieved, that is, the required dissolving time. Finally, the shell base 110 can be taken out from the vessel containing the chemical solution.

In the case manufacturing method provided by the present application, a case base 110 and bumps 120 are formed by first forging the plate 100 . The blind holes 130 facing the bumps 120 are formed on the second surface 110 b of the . Since the structure of the bumps 120 is disposed on the first surface 110a, during the process of machining the blind holes 130 on the second surface 110b, the bumps 120 can form a support for the housing base 110, so as to avoid the process of machining the blind holes 130. During the process of forming the blind hole 130 , the housing base 110 is deformed. Then, the colloid 140 is filled into the blind hole 130, and the colloid 140 is cured, and then the shell base 110 is subjected to material reduction treatment from the first surface 110a to process the required outline to form a camera hole 150. When the first surface 110a is subjected to the material reduction treatment, the colloid 140 can form a support for the shell base 110, and at this time, it can be avoided that the shell base 110 is formed when the outer contour of the first surface 110a is processed. 110 is deformed. Finally, the cured colloid 140 is removed with a chemical solution to obtain a casing with a camera hole 150 . In addition, using a chemical solution to dissolve the colloid 140 can avoid the disadvantages of long CNC machining cycle and high cost.

Please refer to FIG. 15 . FIG. 15 is a mobile terminal 200 provided by an embodiment of the present application, and the mobile terminal 200 may be any device with communication and storage functions. For example: tablet computer, mobile phone, electronic reader, remote control, personal computer (Personal Computer, PC), notebook computer, in-vehicle device, Internet TV, wearable device and other smart devices with network functions. The mobile terminal 200 includes the housing base 110 and the camera hole 150 .

The embodiments of the present invention have been introduced in detail above, and specific examples are used to illustrate the principles and implementations of the present invention. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; at the same time, for Persons of ordinary skill in the art, according to the idea of the present invention, will have changes in the specific embodiments and application scope. To sum up, the contents of this specification should not be construed as limiting the present invention.

Claims (10)

1. a kind of method for producing shell, which is characterized in that the method for producing shell includes:

Plate is provided；

The plate is forged and pressed, housing base is formed and convex block, the housing base includes first surface and second surface, The convex block is arranged in the first surface；

The blind hole of convex block described in face is formed in the second surface；

Colloid is filled into the blind hole, and solidifies the colloid；

It is described that colloid is filled into the blind hole, and solidifying the colloid includes: that the first colloid is filled into the blind hole, to institute It states the first colloid to be handled according to predetermined manner the intracorporal bubble of the first glue is discharged, fills the second glue in Xiang Suoshu blind hole Body so that second colloid covers first colloid, the predetermined manner processing for blow or pressurization at least It is a kind of；

The housing base is processed from the first surface, to form camera shooting head bore；

Remove the colloid after solidifying.

2. method for producing shell as described in claim 1, which is characterized in that the step " is formed just in the second surface To the blind hole of the convex block " include:

It determines the center of the convex block, and is denoted as the first center；

The position of the blind hole of being formed on the plate is determined according to first center；

The plate is processed to be formed from the second surface according to the position of the blind hole of being formed on the plate State blind hole.

3. method for producing shell as claimed in claim 2, which is characterized in that the step " determine the center of the convex block, and Being denoted as the first " center " includes:

The position for detecting multiple points on the side of the housing base, according to the position of multiple points on the side of the housing base The center for determining the convex block is set, and is denoted as the first reference center；

The position of multiple points on the convex block periphery is detected, and according to the determination of the position of points multiple on the convex block periphery The center of convex block, and it is denoted as the second reference center；

Obtain first center according to first reference center and second reference center, first center be located at In default radiation scope centered on the midpoint of first reference center and the second reference center line.

4. method for producing shell as described in claim 1, which is characterized in that " being forged and pressed to the plate " the step of In, the method for producing shell includes:

The plate is repeatedly forged and pressed.

5. method for producing shell as claimed in claim 4, which is characterized in that when repeatedly being forged and pressed to the plate, gradually Increase impact dynamics when forging and pressing to the plate.

6. method for producing shell as described in claim 1, which is characterized in that in the step, " filler fills in Xiang Suoshu blind hole Body, and solidify the colloid " after, " housing base is processed from the first surface, to be formed in the step Image head bore " before, the method for producing shell further include:

The wall thickness for detecting the blind hole, the part for being greater than or equal to preset thickness for wall thickness are added by the way of milling Work uses the mode of polishing to be processed to form the camera shooting head bore part that wall thickness is less than preset thickness.

7. method for producing shell as described in claim 1, which is characterized in that the step of " removal solidify after colloid " includes:

The plate after processing is completed is placed in chemical solution, the chemical solution is for dissolving the colloid.

8. method for producing shell as described in claim 1, which is characterized in that " forged and pressed to the plate " in the step Before, after the step " plate is provided ", the method for producing shell further include:

The plate is preheated.

9. a kind of shell, which is characterized in that the shell is as the method for producing shell as described in 8 any one of claim 1 ~ It is made.

10. a kind of mobile terminal, which is characterized in that including shell as claimed in claim 9.