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CN107464769A - 一种注塑型led料盒及其制备工艺 - Google Patents

一种注塑型led料盒及其制备工艺 Download PDF

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CN107464769A
CN107464769A CN201710469056.5A CN201710469056A CN107464769A CN 107464769 A CN107464769 A CN 107464769A CN 201710469056 A CN201710469056 A CN 201710469056A CN 107464769 A CN107464769 A CN 107464769A
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injection molding
magazines
led
injection
polyphenylene sulfide
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刘天明
刘志平
高伟峰
张沛
涂梅仙
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MLS Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • H01L21/67336Trays for chips characterized by a material, a roughness, a coating or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00Making granules
    • B29B9/02Making granules by dividing preformed material
    • B29B9/06Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/77Measuring, controlling or regulating of velocity or pressure of moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76498Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76531Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76595Velocity
    • B29C2945/76605Velocity rotational movement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

本发明涉及LED料盒技术领域,具体涉及一种注塑型LED料盒及其制备工艺,该LED料盒由聚苯硫醚、玻璃纤维制成,具有机械强度高、耐高温、耐腐蚀、质轻的优点;其制备工艺包括:步骤一、熔融造粒,步骤二、注塑成型,该制备工艺具有易于操作,且制备成本低的优点。

Description

一种注塑型LED料盒及其制备工艺
技术领域
本发明涉及LED料盒技术领域,具体涉及一种注塑型LED料盒及其制备工艺。
背景技术
LED料盒是LED封装过程中用来摆放支架、周转支架或用来烘烤支架的简易装置。实际生产中,考虑到LED料盒的重复利用性及用于烘烤支架时的作业环境温度高,现有技术中的LED料盒主要由金属加工而成。
然而,金属质LED料盒虽具有较好的机械性能和耐高温性能,但仍有不足之处:其一是金属材质需压力加工成型,即利用金属的塑性,使其改变形状,从而获取所需LED料盒,这样非常不便于加工,以致加工难度大;其二是金属的质量重,以致 LED料盒不能快速周转支架,降低了生产LED的效率;其三是金属材质成本较高,不利于降低料盒的成本。
发明内容
针对现有技术存在上述技术问题,本发明目的之一在于提供一种注塑型LED料盒,该LED料盒具有机械强度高、耐高温、耐腐蚀、质轻的优点。
针对现有技术存在上述技术问题,本发明目的之二在于提供一种能制出上述优点的LED料盒的制备工艺,该制备工艺易于操作,且制备成本低。
为实现上述目的之一,本发明提供以下技术方案:
提供一种注塑型LED料盒,它主要由聚苯硫醚、玻璃纤维制成。
上述技术方案中,所述聚苯硫醚与所述玻璃纤维的重量之比为1:0.5~0.7。
上述技术方案中,所述聚苯硫醚与所述玻璃纤维的重量之比为1:0.6。
为实现上述目的之二,本发明提供以下技术方案:
提供上述注塑型LED料盒的制备工艺,包括以下步骤:
步骤一、熔融造粒:把配方量的聚苯硫醚与配方量的玻璃纤维混合,然后投入造粒机并在260~310℃下熔融造粒,得到成粒塑料,备用;
步骤二、注塑成型:
1)熔融塑化:将步骤一所得的成粒塑料以120~150℃干燥除湿3~5h,将干燥的塑料投入料筒中,在260~330℃下熔融,得到粘流态的物料;
2)施压注射:将粘流态的物料通过射嘴射入模腔,所述射嘴的注射温度为280~300℃,注射压力为70~150Mpa,注射速度为30~50%,且注射的背压为0~2Mpa;
3)充模冷却:对填满物料的模腔施加保压压力,然后在80~150℃的模温下冷却成型;
4)脱模取件:打开模具,然后顶出冷却成型的制品,得到注塑成型的LED料盒。
上述技术方案中,所述料筒中,螺杆的转速为40~100r/min。
上述技术方案中,所述造粒机是双螺杆挤出机。
上述技术方案中,所述模腔喷涂有脱模剂。
本发明的有益效果:
(1)本发明的一种LED料盒,主要由聚苯硫醚与玻璃纤维制成,该材质的LED料盒综合了聚苯硫醚耐磨、韧性高的优点以及玻璃纤维耐热性强、抗腐蚀性好、机械强度高的优点,因而具有机械强度高、耐高温、耐腐蚀的特性,进而能够替代金属材质的LED料盒以适用于摆放LED支架或烘烤LED支架;并且,聚苯硫醚耐磨和玻璃纤维均属于质轻的高分子聚合物,这样大大减少了LED的重量,从而利于LED料盒快速周转以提高工作效率。
(2)本发明提供的上述LED料盒的制备工艺,该制备工艺使用聚苯硫醚与玻璃纤维注塑成型LED料盒;该制备工艺不但能制出上述优点的LED料盒,且克服了现有技术中金属加工难度大、制备成本高的问题,具有制易于操作、生产成本低、并能够适用于大规模生产的特点。
具体实施方式
下面结合实施例对本发明作进一步的说明。
实施例1。
本实施例的LED料盒,其制备工艺如下:
步骤一、熔融造粒:把7.7kg聚苯硫醚与2.3kg玻璃纤维混合,然后投入双螺杆挤出机并在260~310℃下熔融挤出造粒,得到成粒塑料,备用;
步骤二、注塑成型:
1)熔融塑化:将步骤一所得的成粒塑料以120℃干燥除湿3h;将干燥的塑料投入料筒中,在260℃下熔融,这样的熔融温度不但防止物料氧化变色,且能使物料顺利充满模腔,得到粘流态的物料;其中,料筒中的螺杆的转速为40r/min以防止转速太高玻璃纤维断裂的问题;
2)施压注射:将粘流态的物料通过射嘴射入模腔,所述射嘴的注射温度为280℃以保证物料的流动性,注射压力为70Mpa以保证制品的致密度及力学性能,注射速度为30%以保证制品的光泽度;其中,模腔先喷涂脱模剂再注射物料,从而助于顺利脱模;
3)充模冷却:对填满物料的模腔施加保压压力,然后在80℃的模温下冷却成型,这样的模温有助于提高制品的结晶度;
4)脱模取件:打开模具,然后慢慢顶出冷却成型的制品,得到注塑成型的LED料盒。
实施例2。
本实施例的LED料盒,其制备工艺如下:
步骤一、熔融造粒:把6.7kg聚苯硫醚与3.3kg玻璃纤维混合,然后投入双螺杆挤出机并在310℃下熔融挤出造粒,得到成粒塑料,备用;
步骤二、注塑成型:
1)熔融塑化:将步骤一所得的成粒塑料以150℃干燥除湿5h;将干燥的塑料投入料筒中,在330℃下熔融,这样的熔融温度不但防止物料氧化变色,且能使物料顺利充满模腔,得到粘流态的物料;其中,料筒中的螺杆的转速为100r/min以防止转速太高玻璃纤维断裂的问题;
2)施压注射:将粘流态的物料通过射嘴射入模腔,所述射嘴的注射温度为300℃以保证物料的流动性,注射压力为150Mpa以保证制品的致密度及力学性能,注射速度为30~50%以保证制品的光泽度,且注射的背压为2Mpa以保证制品品质的稳定性;其中,模腔先喷涂脱模剂再注射物料,从而助于顺利脱模;
3)充模冷却:对填满物料的模腔施加保压压力,然后在150℃的模温下冷却成型,这样的模温有助于提高制品的结晶度;
4)脱模取件:打开模具,然后慢慢顶出冷却成型的制品,得到注塑成型的LED料盒。
实施例3。
本实施例的LED料盒,其制备工艺如下:
步骤一、熔融造粒:把7.1kg聚苯硫醚与2.8kg玻璃纤维混合,然后投入双螺杆挤出机并在290℃下熔融挤出造粒,得到成粒塑料,备用;
步骤二、注塑成型:
1)熔融塑化:将步骤一所得的成粒塑料以130℃干燥除湿4h;将干燥的塑料投入料筒中,在300℃下熔融,这样的熔融温度不但防止物料氧化变色,且能使物料顺利充满模腔,得到粘流态的物料;其中,料筒中的螺杆的转速为80r/min以防止转速太高玻璃纤维断裂的问题;
2)施压注射:将粘流态的物料通过射嘴射入模腔,所述射嘴的注射温度为290℃以保证物料的流动性,注射压力为100Mpa以保证制品的致密度及力学性能,注射速度为40%以保证制品的光泽度,且注射的背压为1Mpa以保证制品品质的稳定性;其中,模腔先喷涂脱模剂再注射物料,从而助于顺利脱模;
3)充模冷却:对填满物料的模腔施加保压压力,然后在90℃的模温下冷却成型,这样的模温有助于提高制品的结晶度;
4)脱模取件:打开模具,然后慢慢顶出冷却成型的制品,得到注塑成型的LED料盒。
最后应当说明的是,以上实施例仅用以说明本发明的技术方案,而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细地说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。

Claims (7)

1.一种注塑型LED料盒,其特征是:它主要由聚苯硫醚、玻璃纤维制成。
2.根权利要求1所述的一种注塑型LED料盒,其特征是:所述聚苯硫醚与所述玻璃纤维的重量之比为1:0.5~0.7。
3.根权利要求2所述的一种注塑型LED料盒,其特征是:所述聚苯硫醚与所述玻璃纤维的重量之比为1:0.6。
4.根据权利要求1至3任一项所述的一种注塑型LED料盒的制备工艺,其特征是:包括以下步骤:
步骤一、熔融造粒:把配方量的聚苯硫醚与配方量的玻璃纤维混合,然后投入造粒机并在260~310℃下熔融造粒,得到成粒塑料,备用;
步骤二、注塑成型:
1)熔融塑化:将步骤一所得的成粒塑料以120~150℃干燥除湿3~5h,将干燥的塑料投入料筒中,在260~330℃下熔融,得到粘流态的物料;
2)施压注射:将粘流态的物料通过射嘴射入模腔,所述射嘴的注射温度为280~300℃,注射压力为70~150Mpa,注射速度为30~50%,且注射的背压为0~2Mpa;
3)充模冷却:对填满物料的模腔施加保压压力,然后在80~150℃的模温下冷却成型;
4)脱模取件:打开模具,然后顶出冷却成型的制品,得到注塑成型的LED料盒。
5.根据权利要求4所述的一种注塑型LED料盒的制备工艺,其特征是:所述料筒中,螺杆的转速为40~100r/min。
6.根据权利要求4所述的一种注塑型LED料盒的制备工艺,其特征是:所述造粒机是双螺杆挤出机。
7.据权利要求4所述的一种注塑型LED料盒的制备工艺,其特征是:所述模腔喷涂有脱模剂。
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CN103509342A (zh) * 2012-06-28 2014-01-15 苏州汉扬精密电子有限公司 玻璃纤维增强聚苯硫醚树脂及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102321370A (zh) * 2011-09-23 2012-01-18 东莞市驰明电子科技有限公司 一种防静电、高热导率的led封装基座材料及其生产工艺
US20130156565A1 (en) * 2011-12-16 2013-06-20 Ticona Llc Boron-Containing Nucleating Agent for Polyphenylene Sulfide
CN103509342A (zh) * 2012-06-28 2014-01-15 苏州汉扬精密电子有限公司 玻璃纤维增强聚苯硫醚树脂及其制备方法

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