CN107427918A - Composite polycrystal-diamond with graded interface layer - Google Patents
Composite polycrystal-diamond with graded interface layer Download PDFInfo
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- CN107427918A CN107427918A CN201580078046.8A CN201580078046A CN107427918A CN 107427918 A CN107427918 A CN 107427918A CN 201580078046 A CN201580078046 A CN 201580078046A CN 107427918 A CN107427918 A CN 107427918A
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- interface layer
- sublayer
- tsp
- graded interface
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- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/62—Treatment of workpieces or articles after build-up by chemical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B10/00—Drill bits
- E21B10/46—Drill bits characterised by wear resisting parts, e.g. diamond inserts
- E21B10/56—Button-type inserts
- E21B10/567—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
- E21B10/573—Button-type inserts with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element
- E21B10/5735—Interface between the substrate and the cutting element
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21C—MINING OR QUARRYING
- E21C35/00—Details of, or accessories for, machines for slitting or completely freeing the mineral from the seam, not provided for in groups E21C25/00 - E21C33/00, E21C37/00 or E21C39/00
- E21C35/18—Mining picks; Holders therefor
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21C—MINING OR QUARRYING
- E21C35/00—Details of, or accessories for, machines for slitting or completely freeing the mineral from the seam, not provided for in groups E21C25/00 - E21C33/00, E21C37/00 or E21C39/00
- E21C35/18—Mining picks; Holders therefor
- E21C35/183—Mining picks; Holders therefor with inserts or layers of wear-resisting material
- E21C35/1835—Chemical composition or specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2207/00—Aspects of the compositions, gradients
- B22F2207/11—Gradients other than composition gradients, e.g. size gradients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2204/00—End product comprising different layers, coatings or parts of cermet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
This disclosure relates to a kind of composite polycrystal-diamond (PDC), it includes being located at graded interface layer of the thermostabilization diamond (TSP) between platform and substrate, the substrate such as base material or earth-boring bits body.The graded interface layer has the thermal coefficient of expansion gradient between the thermal coefficient of expansion of the diamond and the thermal coefficient of expansion of the substrate.The disclosure further relates to the method to form graded interface layer and the PDC containing this layer.
Description
Technical field
This disclosure relates to contain the composite polycrystal-diamond (PDC) of thermostabilization diamond (TSP), in such as earth-boring bits
Cutting tooth.
Background of invention
The part of various commercial plants is often subjected to extreme condition, such as high temperature and with rigid surface and/or abrasion table
The HI high impact contact that face is carried out.For example, for typically encountering extreme temperature during oil exploitation or the probing for purpose of digging up mine
And pressure.When appropriate in use, diamond is impayable because of its in for the cutting element of probing or wear resistant contact element
Engineering properties and can be maximally effective material.Diamond anomaly is hard, and heat is conducted away from into the contact point with abrasive surfaces,
And other benefits can be provided under such conditions.
Due to the random distribution of diamond crystal, in the diamond of glomerocryst form, toughness has increased compared with single-crystal diamond
Add, this avoids the specific fracture plane in the presence of single-crystal diamond.Therefore, polycrystalline diamond is often many probing applications
In preferable diamond form.Drill bit cutting elements using polycrystalline diamond are commonly referred to as polycrystalline diamond cutting tooth or compound
Piece (PDC).Therefore, the drill bit for being incorporated to PDC can be described as PDC drill bit.
PDC can be in a press by making diamond and the little particle of other parent materials be subjected to hyperpressure and temperature strip
Part manufactures.A kind of PDC manufacturing process includes：Polycrystalline diamond platform is directly formed on base material (such as tungsten carbide base material).Institute
Stating technique includes：Base material is placed into the container of forcing press together with the loose diamond particles mixed with catalyst, and
And the content of forcing press is set to be subjected to HTHP (HTHP) press cycle.High moderate pressure causes small diamond particles to be molded into
The overall polycrystalline diamond platform of base material is closely adhered to, the wherein cobalt in tungsten carbide base material serves as catalyst.Then can leaching by
This polycrystalline diamond platform formed, to remove catalyst from polycrystalline diamond all or in part.Leaching major part catalyst produces
TSP platforms.At a certain temperature, at least 750 DEG C typically at normal atmospheric pressure, TSP will not split or graphitization.Then
TSP can be re-attached to new substrate, and (primary substrate that polycrystalline diamond is formed on generally removes before leaching processes
Or damage in this process) to form PDC.
Brief description
It can be obtained by reference to the description made below in conjunction with accompanying drawing to embodiment of the present invention and its advantage more
Complete to understand, accompanying drawing shows the specific embodiment of the disclosure, and wherein like numeral refers to like, and in the accompanying drawings：
Fig. 1 is the viewgraph of cross-section of the not to scale (NTS) of the first embodiment of the PDC with graded interface layer；
Fig. 2 is the flow chart for the method to form the PDC with graded interface layer；
Fig. 3 is the figure of the change for the thermal coefficient of expansion (CTE) for showing PDC, the PDC have TSP platforms, graded interface layer and
Tungsten carbide base material；Green line and red line are the schematic illustrations of non-linear CTE curves；
Fig. 4 A, 4B and 4C be the PDC containing graded interface layer be differently formed step during side view；
Fig. 5 A, 5B and 5C be the PDC containing graded interface layer be differently formed step during side view；
Fig. 6 is the earth-boring bits for including at least one PDC in PDC cutting tooth patterns.
It is described in detail
This disclosure relates to for TSP platforms to be attached into base material to form PDC graded interface layer.The disclosure further relate to containing
The PDC (such as, PDC cutting tooths) of graded interface layer and the commercial plant (such as, earth-boring bits) containing this PDC.
In order that polycrystalline diamond more thermal-stable, drill bit designer can leaching be used to being formed some of polycrystalline diamond and urge
Agent (typically containing group VIII metal or metal alloy, such as material of cobalt (Co) or Co alloys).If leaching is whole
Individual polycrystalline diamond platform or substantially its whole, then platform can is TSP platforms.TSP platforms are also possible to lack base material, the base material
Can once exist during the polycrystalline diamond for being used for producing TSP is formed.Base material may by leaching processes and machinery remove,
Damage, or both.TSP platforms can include some remainder catalysts, the 70% of original existing catalyst such as no more than in PCD table
Or by weight or stereometer be no more than 1% catalyst.TSP platforms under atmospheric pressure at least 750 DEG C, at least 1050 DEG C or very
Can be heat-staple at least 1200 DEG C.TSP platforms can also be in addition heat-staple under certain temperature and pressure, in institute
State and be expected the graphitization that diamond occurs under temperature and pressure in the presence of a catalyst.
TSP platforms can be attached to new substrate to form PDC.Because with most of brazing materials, base material and other attachment materials
Material may be due to by TSP, base material and/or attachment material compared to relatively low diamond CTE, TSP element (after attachment)
In different heat expansion rate caused by stress and fail.
This disclosure relates to the interface gradients layer between TSP platforms and base material, the interface gradients layer contains variable quantity
Material with low CTE, to control the residual stress as caused by TSP platforms CTE different between base material.
Although the disclosure focuses on is attached to base material by TSP platforms, one of ordinary skill in the art will realize TSP
Similar approach can be used to be similarly attached to other base portions, such as bit body for platform.This represents to be better than using HIP cemented tungsten carbides
The improvement of conventional method.
Base material can include hard alloy, tungsten carbide (WC or W such as with suitable binder2C).Base material can also include can
The identical or different metal or metal alloy binding agent with the catalyst used in polycrystalline diamond formation, such as VIII gold
Category or metal alloy, specifically cobalt (Co) or Co alloys.
Fig. 1 is the cross-sectional view of the PDC 2 containing TSP platforms 4, base material 6 and graded interface layer 8, and wherein sublayer is by the moon
Shadow gradient indicates.It is away from TSP platforms 4 and cumulative close to base material 6, the CTE of the sublayer of graded interface layer 8.Although TSP platforms 4, base material 6
It is depicted as in Fig. 1 with graded interface layer 8 with plane is adjacent and outer surface, but the disclosure covers all of these parts
Possible on-plane surface is adjacent and outer interface or surface.Graded interface layer 8 can have multiple sublayers, and the multiple sublayer may include
At least two sublayer, at least five sublayer, at least ten sublayer, at least 20 sublayers or at least 50 sublayers.
Fig. 2 is the flow chart of the manufacture method 10 of the TSP elements (such as PDC2) with graded interface layer.In step 12
In, form the first sublayer of graded interface layer.At step 14, the second or another subsequent sublayer is formed.In step 16, really
It is fixed whether to have reached last sublayer.If not yet reach last sublayer, then repeat step 14.If have arrived at last son
Layer, then in step 18, by the way that graded interface layer, TSP platforms and/or base material are attached to each other to form PDC.
Before formation, sublayer shown in PDC 2 or the sublayer formed in manufacture method 10 can contain at least three kinds
Component：Diamond dust or abrasive particle containing diamond particles, the catalyst that can make to combine between diamond particles, with
And the sacrifice binding agent that can adhere to diamond particles, (such as forming sublayer until sacrificing binder degradation and/or discharge
Period or during graded interface layer is attached into TSP platforms and/or base material) untill.Per grain concentration, the weight of sublayer diamond
Ratio or volume ratio are generally in graded interface layer as sublayer moves away from attachment or the part that will be attached to TSP platforms and court
Reduce to the part that is attached or will be attached to base material.Relative scale can be particularly based on desired use and the leaching journey of TSP platforms
Spend with the composition of base material to determine so that because stress is less than certain caused by the CTE difference between sublayer or between TSP platforms and base material
A little pre-selected thresholds.These threshold values are selectable to depart from caused by avoiding being mismatched due to CTE and combine or ftracture, and are specifically existed
Period that graded interface layer is undergone in the following technique and disengaging occurred in temperature range combines or cracking：During probing
The process and TSP elements and the mistake of coolant (such as, drilling fluid) contact equally during probing that PDC contacts with stratum
Journey.Although the composition of different sublayers generally between each layer will change, once in a while provide with same composition multiple layers,
Particularly adjacent multiple layers may be beneficial.
The diamond concentration adjacent with TSP platforms can be by volume 50% or bigger, by volume in graded interface layer
60% or bigger, by volume 70% or bigger or even by volume 80% or bigger.In graded interface layer with TSP platform phases
Adjacent any catalyst or containing catalyst material (such as tungsten carbide (WC or W2C concentration)) can be by volume 50% or more
It is small, by volume 40% or smaller, by volume 30% or smaller or by volume 20% or smaller.In graded interface layer with
The concentration of the adjacent sacrifice binding agent of TSP platforms can be by volume 30% or smaller, by volume 20% or smaller, by volume
Meter 10% or smaller or by volume 5% or smaller.
The CTE curves of graded interface layer (such as graded interface layer 8 or another layer formed by step 12 to 16) can be with
Be linear, nonlinear (such as by sublayer progressively), S-shaped or any other shape.Show that exemplary CTE is bent in Fig. 3
Line.It is 1 × 10 that TSP platforms, which generally have,-6Inch/inch */DEG C CTE, or if incomplete leaching, still very close to
This numeral.It is 4-7 × 10 that hard tungsten carbide, which has,-6Inch/inch */DEG C CTE.Therefore, for tungsten carbide base material
PDC, graded interface layer have from close to 1 × 10-6Inch/inch */DEG C gradually rise to close to 4-7 × 10-6Inch/inch */
DEG C CTE.For other base materials, similar growth can be provided.
The thickness of graded interface layer 8 or another graded interface layer formed by step 12 to 16 can be by for forming sublayer
Technique, their composition, tolerable CTE difference between sublayer, the factor such as method that is attached to TSP platforms and base material determine.It is logical
Often, graded interface layer will be between 1 micron and 200 microns, although layer can have submicron thickness and reach as high as 5mm
It is thick.Sublayer can each have approximately uniform thickness, or they can be different on thickness.Adjustable molecular layers thick is with CTE
Difference is produced in curve, so as to adapt to the different amounts of consolidation during sintering, and adapts to various other properties and processing needs.
The big I of diamond particles is different between sublayer and sublayer.In addition, in a sublayer, diamond particles
More than one size can be shown.The big I of diamond particles is for example by making diamond particles pass through one or more classifying screens
Or determined by any other method.Diamond particles in different sublayers or in same sublayer may include a kind of relatively large
Size and at least one relatively small size.As it is used herein, phrase " relatively large " and " relatively small " are
Refer to the granularity of difference at least twice that is being determined by any appropriate method.Relatively large size may include 100 μm, 90 μm, 80
μm, 70 μm, 60 μm, 50 μm, 40 μm, 30 μm, 20 μm, 15 μm, 12 μm, 10 μm or 8 μm.Relatively small size may include 30 μ
M, 20 μm, 10 μm, 15 μm, 12 μm, 10 μm, 8 μm, 4 μm, 2 μm, 1 μm, 0.5 μm, less than 0.5 μm, 0.1 μm or less than 0.1 μm.
Relatively small size can be shown between 40 μm and 15 μm by showing the diamond particles of relatively large size
Diamond particles can be between 12 μm and 2 μm.Diamond particles may also include three or more different sizes.
The big I of diamond particles changes with the position in one layer, to improve antiwear characteristic or mechanical property and control
System ftractures during use.For example, sublayer can be containing the inner ring with a kind of granular size and with variable grain size
Outer shroud.Sublayer can also contain the diamond strips for having variable grain size with the remainder of sublayer.
Non-diamond carbon (such as graphite particle, fullerene, other non-diamond carbons or foregoing combination) can be with diamond
Particle mixes.During the HTHP techniques for forming graded interface layer or PDC, non-diamond carbon is substantially transformed into Buddha's warrior attendant
Stone.The presence of non-diamond carbon can improve the diamond density of graded interface layer.Non-diamond carbon can be selected to a certain amount of
It is present in sublayer or whole graded interface layer, the amount is 0.1 weight % to 20 weight %, such as 0.1 weight % to 10 weights
Measure %, 1 weight % to 9 weight %, 2 weight % to 9 weight %, 3 weight % to 6 weight %, 4.5 weight % to 5.5 weight %,
5 weight %, 0.1 weight % are to 0.8 weight % or 0.1 weight % to 0.50 weight %.Any granular graphite in non-diamond carbon
Son can have 1 μm to 5 μm, such as 1 μm to 3 μm of particle mean size so that graphite particle can be coupled to and be limited by diamond particles
Gap area in.Graphite particle can be kish particle, amorphous graphite particle, synthetic graphite particle or its combination.
Term " amorphous graphite " refers to naturally occurring micro crystal graphite.Kish particle can be naturally occurring or synthesized.
Various types of graphite particles can be commercially available from Ashbury Graphite Mills of Kittanning, Pa.
In addition, the composition of catalyst also can be different between sublayer and sublayer.Generally, it can include VIII race's metal
Or alloy, such as Co, nickel (Ni), iron (Fe) or its alloy, and any combination of them.Catalyst can be with size and diamond
Particulate forms as particulate species are present.On average, the diameter of catalyst particle or longest dimension can be 1 μm.Although herein
It is main that conventional catalyst is discussed, but new and unconventional catalyst can also be used.
Sacrificing binding agent may include：Polyolefin, such as ethylene vinyl acetate, high density polyethylene (HDPE), low density polyethylene (LDPE)
And polypropylene；Functionalised polyolefin, such as ethylene ethyl acrylate, grafted maleic anhydride and ionomer；Wax, such as babassu
Wax, beeswax and beeswax blend；Thermoplastic polyurethane；Polyaryl ether ether ketone；Functionalized styrene block copolymer, such as acid anhydrides
Graft phenylethene block copolymer；And tackifier, such as pentalyn, maleic anhydride modified ester gum,
Partially hydrogenated gum rosin, face cream resin, esterification thermoplastic resin, partially polymerized (dimerization) rosin, aliphatic hydrocarbon resin,
Aliphatic hydrocarbon resin, aromatic modified aliphatic hydrocarbon resin, alicyclic hydrocarbon resin, aromatic modified alicyclic hydrocarbon resin, polyethylene second
It is acid butyl ester (PEBA), ethylene vinyl acetate (EVA), ethylene-ethyl acetate, polyethylene glycol (PEG), polyvinyl alcohol (PVA), poly-
It is styrene (PS), polymethyl methacrylate, polyethylencarbonate (PEC), zinc-containing solid catalyst (PAC), makrolon, poly-
Propene carbonate (PPC), nylon, polyvinyl chloride, polybutene, polyester.
Binding agent may also include water-based and gelation polymer or inorganic polymer.Suitable water-based and gelation polymer
It may include those formed by cellulose, alginates, polyvinyl alcohol, polyethylene glycol, polysaccharide, water and its mixture.Inorganic polymeric
Thing binding agent includes silicones.Other binding agents may include wax or natural and artificial oil (such as, mineral oil) and its mixture.Can
Other suitable binding agents are selected to leave the residue of minimum, such as charcoal after HTHP techniques are undergone.
Sacrificing binding agent can exist in the form of particle (such as with 100 μm of average diameter or maximum sized particle).
Graded interface layer can also include CTE adjustment materials, and the material is compatible with the formation of solid-state and stable layer in addition.
These CTE adjustment material can have the CTE between diamond CTE and base material CTE.Suitable CTE adjustment material includes silicon
Carbide, silicon nitride, zirconium carbide, titanium carbide and its any combinations.
According to used method, graded interface layer (such as, graded interface layer 8) can be formed as in step 12 to 16 with
The separate part of both TSP platforms and base material is attached to afterwards, or it may be formed on TSP platforms or base material and is subsequently attached to another
Individual part.If graded interface layer is initially formed as separate part, it can be coherent enough, to bear be attached to
Any transport or manipulation before TSP platforms and base material or associated with the attachment.
Used method is similarly dependent on, second or subsequent sublayer may be formed in first or sublayer before, or
Person's sublayer can be formed individually or in the form of sublayer group.Then single sublayer or sublayer group can be assembled to form gradient interface
Layer, such as graded interface layer 8.If the combination of sublayer or sublayer is initially formed as separate part, they can be connected enough
Pass through, to bear be attached to any transport or manipulation each other or before TSP platforms and base material or associated with the attachment.
Generally, increasing material manufacturing method, such as 3D can be used to print to form graded interface layer, such as in step 12 and 14
Graded interface layer 8.This increasing material manufacturing allows to be sequentially formed independent sublayer.For example, 3D printings can be used to lay every height
The material of layer.Each sublayer can be made to be subjected to postfinishing process, such as consolidation technique before next sublayer is added, or can be made
Sublayer group is subjected to postfinishing process, or even whole graded interface layer can be made to be subjected to postfinishing process.Postfinishing process can wrap
Include melting and it is compression molded.Postfinishing process can avoid performing under the conditions of diamond particles are graphited, such as be deposited in air
Performed under at a temperature of less than 900 DEG C or in a vacuum at a temperature of less than 1050 DEG C.
In some alternative techniques using method disclosed herein in addition, the first sublayer may be formed at base material or TSP platforms
On, and last sublayer can be formed when attaching it to base material or TSP platforms.Carbide former (such as titanium (Ti), zirconium
(Zr), vanadium (V), manganese (Mn), tungsten (W), molybdenum (Mo), chromium (Cr), yttrium (Y), niobium (Nb), hafnium (Hf) or tantalum (Ta) can be used as attached
It is connected to sublayer of the TSP platforms without HTHP techniques.Carbide forms sublayer and increasing material manufacturing technique, such as 3D printings can also be used
To be formed.Or when using HTHP techniques, the binding agent or catalyst that are present in graded interface layer can spread base material
And/or it is bonded thereto in TSP platforms and by graded interface layer.
The sublayer of graded interface layer is formed (such as, according to manufacture method (such as, the step 12 of method 10 and layer 8 14))
Appropriate method include：Binding agent sprays, such as when liquid binder is optionally deposited with combining powder；Material sprays
Penetrate, such as when optionally depositing the droplet of construction material；Powder bed melts, wherein heat energy optionally melted powder bed
Region；DIRECT ENERGY deposits, wherein heat energy fusing material when material deposits；Sheet material is laminated, wherein material sheet is incorporated in
Together；It is photopolymerization curing, wherein optionally solidifying liquid optical polymer by photoactivation；And material extrusion, wherein selecting
Property distribute material, including lamination entity manufacture (LOM) by nozzle or aperture, wherein by thin layer (such as paper, polymer or gold
Category) cutting forming, then link, and automatic mortar injection forming.Suitable method also includes direct metal laser sintering (DMLS),
The temperature that metallic is wherein heated to its melted material but not fully melted.DMLS uses three-dimensional computer Computer Aided Design
(3D CAD) data carry out establishment file (such as .stl files), and the file is sent to manufacturing equipment.DMLS is applied to stainless
Steel, such as 17-4 and 15-5 stainless steels；Austenite nickel chromium triangle base superalloy, such as(Special Metals
Corp., New Hartford, NY) 625 or 718；Or titanium and titanium alloy, such as Ti6AlV4.Suitable method also includes selectivity
Laser sintered (SLS), wherein the temperature that metallic is heated into its melted material but not fully melted.Suitable for SLS's
Material includes plastics, glass and ceramics.Suitable method comprises additionally in selective laser melting (SLM), wherein being swashed with high power
Light device melts fine metal powder.Particle is completely melt into homogeneous component.3D CAD are used as the information source of SLM device.SLM subclass
, i.e., it is not laser sintered, carried out in inertia or non-reactive (such as, argon gas or nitrogen).Another suitable method is
Fusion sediment moulds (FDM), and wherein plastic filament or wire by unwinding and supplies material with generating means.FDM also referred to as " is sent
Silk 3D printings ".Multiple material can be printed in the same part, so as to for example allow to be changed in gradient interface sublayer.Unwinding
Afterwards, material is heated to melting in extrusion nozzle, is then deposited into appropriate place.Vertically and horizontally deposition is possible
's.Cnc mechanism can be used.Computer-aided manufacturing (CAM) software can provide tool path.The combination of any of above method can
For forming graded interface layer, including its any sublayer.
Attachment step 18 may include any suitable method, such as sintering, electron beam welding or other high-temperature high-pressure crafts.
In some techniques, the binding agent included in graded interface layer just may can degrade or discharge until this attachment step.
Any PDC that is disclosed herein or being manufactured using method disclosed herein can be subjected to other leaching step, to go
Except any catalyst or binding agent that enter TSP platforms during forming graded interface layer and/or being attached to graded interface layer.It is this
Other leaching can extend to the combination without destruction and graded interface layer in TSP platforms as far as possible, or it can be limited
Make to surface, such as working surface or side surface.
In it may also include PDC disclosed herein and the manufacture method instantiation of the element more typically described, it can make
Have with HTHP sintering process (such as temperature at up to 1400 DEG C and the technique that is up to carried out under 6GPa pressure) to be formed
The TSP of graded interface layer.
The disclosure is additionally included in the infiltration rate and degree for being attached to TSP platforms and catalyst being changed during base material.HTHP works
Skill has the ability of limited control changes in process parameters rate.Specifically, HTHP techniques may cause catalyst excessively to penetrate into wear
Cross graded interface layer and enter in TSP platforms, cause gradient to reduce, so as to also reduce heat endurance.Therefore, catalyst infiltration is slowed down
Speed can be useful to avoid excessive catalyst from penetrating into.At least one part or at least one discrete sublayer can be changed and urged
The speed and degree that agent is penetrated into.Modification and its position can be adjusted together with temperature, pressure and other HTHP technological parameters
It is whole, to realize required catalyst diffusion levels and limited infiltration.
The non-catalytic sintering that a kind of modification includes introducing the formation carbide during the sintering process higher than 700 DEG C helps
Agent, such as silicon (Si), boron (B), titanium (Ti), hafnium (Hf), zirconium (Zr), niobium (Nb), vanadium (V) and combinations thereof.This metalloid contributes to
Make diamond sintering, and caused carbide binding matrix is extremely hard and tool abrasion.In addition, caused carbonization
Thing has the CTE similar with diamond CTE, and is chemically inert, therefore it will not be catalyzed diamond and change into graphite.
Possessed fusing point is less than any non-catalytic sintering aid (such as, element of catalyst fusing point under super-pressure
Silicon or its alloy) it can be penetrated into by gap in graded interface layer, TSP and base material, and change into carbide form or on-catalytic
Silicide or boride form.
Fig. 4 A, 4B and 4C show by technique (such as, as the technique 10 in Fig. 2 more generally shown in technique) shape
Into the PDC of the different phase of period, such as PDC 2.Interface surface 106 that can be by adjacent base material 104 and neighbouring TSP platforms
108 interface surface 110 sets graded interface layer 102a at least two sublayers to form component 100.Can be in temperature in use model
It is 200 DEG C to 1400 DEG C to enclose and pressure limit is that environmental pressure links graded interface layer 102, base material 104 into 9GPa technique
With TSP platforms 108.
It is (such as, resistance in embedded pyrophyllite or other pressure transmission mediums that component 100 can be placed on to pressure transmission medium
Molten metal can) in.Ultra high pressure machine can be used to produce diamond in its lower stable temperature and pressure condition pass pressure
Pass medium (including the component 100 wherein closed) and be subjected to HTHP techniques.The temperature of HTHP techniques can be at least 1000 DEG C, at least
1200 DEG C or at least 1600 DEG C, and pressure can be at least 4.0GPa, 5.0GPa to 12GPa or 7.5GPa to 11GPa.Institute
The generable time span of technique is stated to be enough to make diamond particles sintering to form sintering graded interface layer 102b.For example, high temperature
The pressure of high-pressure process can be 8GPa to 10GPa, and its temperature can be 1150 DEG C to 1450 DEG C.After HTHP techniques
When being cooled down, sintered interface gradient layer 102b is attached to base material 104 and TSP platforms 108.
Above-mentioned pressure value employed in HTHP techniques refers to the pressure that pressure is delivered to component 100 from ultra high pressure machine
Pressure in power Transfer Medium.
During HTHP techniques, catalyst present in graded interface layer 102a liquefies and is catalyzed what is be directly joined together
The formation of diamond particles, to form sintering graded interface layer 102b.In addition, (it can be with depositing for the catalyst from base material 104
Binding agent in one or more sublayers in graded interface layer 102 is identical or different) it can be liquefied, and ladder can be penetrated into
Spend in the diamond particles of one or more sublayers of boundary layer 102.The catalyst of infiltration can be catalyzed what is be directly joined together
The formation of diamond particles, to form sintering graded interface layer 102b.Sinter graded interface layer 102b then including directly in conjunction with
Diamond particles together, wherein the catalyst penetrated into is arranged between the diamond particles of combination with interstitial system.
With reference to figure 4A, sintering graded interface layer 102b can be made to be subjected to planarization process, such as grind, so that at least one table
Face planarization is suitable for being attached to TSP platforms 108 or base material 104.If TSP 108 or base material 104 both or any one have non-
Plane surface, then it can produce the non-planar surfaces for coordinating with TSP 108 or base material 104 using grinding process.
With reference to figure 4C, the upper surface 112 of TSP platforms 108 can be made to be subjected to planarization process, such as grind, to form worksheet
Face.Before or after planarization process, grinding process can be used to form chamfering 114 in TSP platforms 108.It can planarize
Processing and/or formed before or after chamfering, using not being in the mood for wheel grinding technique or other suitable techniques come in TSP platforms 108
Middle restriction peripheral surface 116.
Figure Fig. 5 A, 5B and 5C show using pre-sintered graded interface layer 102c, by technique (such as, in such as Fig. 2
The technique that technique 10 is more generally shown) formed during different phase another PDC, such as PDC 2.Pass through neighbouring pre-burning
Knot graded interface layer 102c sets the interface surface 110 of TSP platforms 108 and the interface surface 106 of base material 104 to form component 200.
Pre-sintered graded interface layer 102c includes TSP interface surfaces 202 and is positioned adjacent to the interface surface 106 of base material 104
Substrate interface surface 204.Pre-sintered graded interface layer 102c substrate interface surface 204 is configured to corresponding to base material 104
The geometry of interface surface 106.Pre-sintered graded interface layer 102c includes the diamond particles being directly joined together, and it is limited
Fixed gap region, the gap area form the net at least partly hole of interconnection, and this is allowed fluid in gradient interface stratum boundary
At least one in face surface 202 and 204 is flowed between the interface surface of base material 104 106.
Increasing material manufacturing method, such as 3D can be used to print to realize gradient-structure.
Pre-sintered graded interface layer 102c can be by having sublayer in the case of with or without base material, in presence
HPHT sintered diamond particles are formed when catalyst or binding agent or composition gradient as disclosed herein.
HPHT techniques can also be used for manufacturing component.Component 200 can be placed on to pressure transmission medium (such as, embedded leaf wax
Refractory metal tank in stone or other pressure transmission mediums) in.Ultra high pressure machine can be used, use disclosed HPHT techniques bar
Any condition in part makes pressure transmission medium (including the component 200 wherein closed) be subjected to HPHT techniques so that from base
The metal-solvent catalyst of material 104 liquefies and penetrated into pre-sintered graded interface layer 102c gap area.For example, HPHT works
The pressure of skill can be about 5GPa to about 7GPa, and the temperature of HPHT techniques can be about 1150 DEG C to about 1450 DEG C, such as
Up to 1200 DEG C or up to 1400 DEG C.When being cooled down from HPHT techniques, graded interface layer 102c becomes incorporated into base material 104
With TSP platforms 108.
With reference to figure 5A, the TSP interface surfaces 202 and substrate interface surface 204 that can make pre-sintered graded interface layer 102c pass through
By planarization process, such as grind.Or can be used grinding process come produce for TSP platforms 108 or base material 104 cooperation
Non-planar surfaces, TSP platforms 108 or base material 104 have the non-planar surfaces that pre-sintered graded interface layer 102c will be attached to.
With reference to figure 5C, the upper surface 112 of TSP platforms 108 can be made to be subjected to planarization process, such as grind, to form worksheet
Face.Before or after planarization process, grinding process can be used to form chamfering 114 in TSP platforms 108.It can planarize
Processing and/or formed before or after chamfering, using not being in the mood for wheel grinding technique or other suitable techniques come in TSP platforms 108
Middle restriction peripheral surface 116.
No matter graded interface layer is to be sintered together with PDC or pre-sintered and then be bound to base in single HTHP techniques
Material or TSP platforms, alternate material can be made to penetrate at least one of gap area of graded interface layer 8.For example, can be another
Neighbouring TSP interface surfaces (such as, the surface 202 of graded interface layer 8 and/or peripheral surface) or neighbouring base during individual HTHP techniques
Material interface surface (such as, surface 204) sets alternate material.
Can with or alternate material is penetrated at least a portion of TSP platforms 4
Gap area in.For example, can during another HTHP technique adjacent upper surface (such as, surface 112) and/or peripheral surface
(such as, surface 116) sets alternate material.
Alternate material may include：Carbonate, including lithium (Li), sodium (Na), potassium (K), beryllium (Be), magnesium (Mg), calcium (Ca), strontium
(Sr) and barium (Ba) one or more carbonate；Sulfate, include Be, Mg, Ca, Sr and Ba one or more sulfate；
Hydroxide, include Be, Mg, Ca, Sr and Ba one or more hydroxide；Element phosphor (P) and/or its derivative；Chlorination
Thing, include Li, Na and K one or more chlorides；Elementary sulfur (S)；Polycyclic aromatic hydrocarbon, including naphthalene, anthracene, pentacene, six benzene
One or more in acene or foregoing combination, and/or its derivative；Chlorinated hydrocabon and/or its derivative；Semi-conducting material,
Such as germanium or germanium alloy；And foregoing any combinations.For example, a kind of suitable carbonate material is alkali carbonate material
Material, include the mixture of the sodium carbonate of formation low melting point ternary eutectic system, lithium carbonate and potassium carbonate.It is arranged on graded interface layer
Infiltration alkali metal carbonate material in 102 gap area can after infiltration by appropriate heat treatment and partially or substantially
On be fully converted into alkali metal oxide corresponding to one or more.
Alternate material for TSP platforms 4 may include silicon (Si) or silicon-cobalt alloy, including cobalt silicide.Alternate material can be at least
Partly at least one of diamond particles with TSP platforms 4 react, to form the mixing carbon of carborundum, cobalt carbide, cobalt and silicon
Compound or foregoing combination.
Silicon-cobalt alternate material may be present in the layer of adjacent upper surface 112.Alternate material layer can be included with about 50 to about 60
Silicon particle existing for weight % amount and with cobalt particle existing for about 40 to about 50 weight % amount.Alternate material layer can be about
Amount equal or close to the eutectic composition of silicon-cobalt chemical system includes silicon particle and cobalt particle.Silicon particle and cobalt particle can lead to
Organic binder bond is crossed to keep together to form the generating layer of cobalt and silicon particle.Or layer may include have by mechanical alloying
Low melting point eutectic or nearly eutectic composition are come the generating layer of silicon-cobalt alloy thin slice or silicon-cobalt alloy particle that is formed.
Before final TSP elements are formed, the graded interface layer or described herein with graded interface layer, separation can be checked
Sublayer part PDC quality.Quality examination may include vision, sound wave, radiation (such as computed tomography (CT) and
Non-radiative inspection.
In addition, for being formed as larger compared with the graded interface layer or sublayer that will be used in any one final PDC
Single graded interface layer or sublayer intermediate, this kind of inspection may include：Defect area is identified to be arranged from final PDC
Remove, or determine the maximum quantity of available graded interface layer or sublayer obtained from middleware.Middleware can be in slab, plate,
The form of bar, prefabricated component or blank.Shaping and forming method suitable for middleware include cutting, electron beam, forging, heat treatment
And peening.
PDC comprising attachment concatenator as described herein can be coupled in industrial equipment (such as, earth-boring bits), such as scheme
Shown in 6.Fig. 6 shows fixed cutter drill bits 300, and it contains the multiple cutting tooths 302 for being connected to bit body 304.Cutting tooth
At least one in 302 can be the PDC containing graded interface layer as described herein, the PDC 2 described in such as Fig. 1.It is fixed
Cutter drill bits 300 can include the bit body 304 with multiple blades 306 from its extension.Bit body 304 can be by with institute
Steel, steel alloy, host material or other suitable bit body materials of intensity, toughness and machining property are needed to be formed.Bit body
304 can be formed with required wear-resisting and corrosion-resistance characteristics.Disclosed method can be used or use other method by PDC
Cutting tooth 302 is arranged on drill bit.PDC cutting tooths can be located in gage areas 308, or in non-gage areas, or two
Person.
For the embodiment shown in Fig. 6, fixed cutter drill bits 300 have five (5) blades 306.Should for some
With the number for being arranged on the blade being combined with the fixed cutter drill bits of disclosure religious doctrine can be in four (4) blades and eight
(8) change between blade or more blade.
The probing action associated with drill bit 300 may be in bit body 304 in response to being associated drill string (being not explicitly depicted)
Rotation and when being rotated relative to the bottom (being not explicitly depicted) of well.At least one be arranged on associated blade 306
A little PDC cutting tooths 302 can contact the adjacent part of down-hole formation (being not explicitly depicted) probing.These PDC cutting tooths 302 can be determined
To into cause TSP platforms contact stratum.
PDC can also attach to the other parts (being not explicitly depicted) of drill bit 300, such as high eroded area, be included in nozzle
Nearby, those in chip area or in Dampening regions or cutting depth control area.
In addition, TSP platforms can be directly attached to drill bit 300 and without using intermediary base material.In such cases, can use such as
Graded interface layer as described herein.Position on the attachable bit body of this TSP platforms can be by bit body material or different materials
Expect (substrate material pre-seted in such as bit body) formation.
The disclosure provides embodiment A, and it is related to a kind of method for forming PDC in the following manner：It is multiple by being formed
The multiple sublayer is simultaneously attached to each other to form the graded interface layer with CTE gradients, the scope of the CTE gradients by sublayer
Between the CTE of TSP platforms and the CTE of substrate, at least two in the multiple sublayer have different CTE；By gradient circle
Surface layer is attached to the TSP platforms；And the graded interface layer is attached to the substrate.
The disclosure also provides embodiment B, and it is related to a kind of PDC, and the PDC includes the TSP platforms with TSP CTE, tool
There is substrate CTE substrate and be attached to the graded interface layer of the TSP and the substrate, the graded interface layer has in institute
State the CTE gradients between TSP CTE and the substrate CTE.Embodiment A method can be used to be formed for embodiment B PDC.
The disclosure also provides embodiment C, and it is related to a kind of earth-boring bits of the PDC containing described in embodiment B.
In addition, embodiment A, B and C can be used in combination with element additionally below, the element in addition can also group each other
Close, unless clearly mutually exclusive, and those method elements can be used for obtaining equipment, and those equipment components can by with
Lower method produces：I) CTE gradient can form CTE curves, and it can be linear, nonlinear or S-shaped；Ii) CTE curves
Can be it is nonlinear and be by sublayer progressively；Iii) at least when being initially formed, each sublayer of graded interface layer can
Comprising diamond particles, catalyst and sacrifice binding agent；Iv) after being initially formed, sublayer can be subjected to HTHP techniques to be formed
Sinter sublayer；V) sintering sublayer can include diamond particles and catalyst；Vi) can will sintering sublayer leaching with from the sublayer
At least a portion remove at least a portion catalyst；Vii) increasing material manufacturing method can be used to form at least one sublayer；
Viii) increasing material manufacturing method may include that 3D prints；Ix graded interface layer) is attached to TSP platforms or is attached to graded interface layer
Substrate can include performing HTHP techniques；X) formed graded interface layer and graded interface layer is attached to substrate can be in same step
Middle generation；Xi) substrate may include base material, and TSP elements may include the cutting tooth for earth-boring bits；Xii) substrate can include
Hard alloy；Xiii) graded interface layer may include multiple sublayers；Xiv) ratio of diamond particles can be with graded interface layer
CTE increase and reduce；Xv) CTE gradients can form CTE curves, and it can be linear, nonlinear or S-shaped；xvi)
PDC may include the PDC cutting tooths for being connected to bit body；Xvii) bit body may include substrate.
Although the merely exemplary embodiment of the present invention described in detail above, it is to be understood that and not departing from the present invention
Spirit and desired extent in the case of, the modifications and variations of these examples are possible.For example, it may be referred to drill bit example
Determine use of the TSP elements on other industrial equipments.
Claims (20)
1. the method that one kind forms composite polycrystal-diamond (PDC), methods described include：
By forming multiple sublayers and the multiple sublayer being attached to each other to be formed with certain thermal coefficient of expansion (CTE) ladder
The graded interface layer of degree, the scope of the CTE gradients between the CTE of thermostabilization diamond (TSP) platform and the CTE of substrate,
At least two in the multiple sublayer have different CTE；
The graded interface layer is attached to the TSP platforms；And
The graded interface layer is attached to the substrate.
2. the method as described in claim 1, wherein the thermal coefficient of expansion gradient forms CTE curves, its can be it is linear,
It is nonlinear or S-shaped.
3. method as claimed in claim 2, wherein the CTE curves be it is nonlinear and be by sublayer progressively.
4. the method as described in claim 1, wherein at least when being initially formed, each sublayer of the graded interface layer includes
Diamond particles, catalyst and sacrifice binding agent.
5. method as claimed in claim 4, wherein the sublayer is subjected to HTHP (HTHP) technique after being initially formed
Sublayer is sintered to be formed.
6. method as claimed in claim 5, wherein the sintering sublayer includes diamond particles and catalyst.
7. method as claimed in claim 5, wherein the sintering sublayer is leached and gone with least a portion from the sublayer
Except at least a portion catalyst.
8. method as claimed in claim 4, wherein at least one sublayer is formed using increasing material manufacturing method.
9. method as claimed in claim 8, printed wherein the increasing material manufacturing method includes three-dimensional (3D).
10. the method as described in claim 1, wherein the graded interface layer is attached into the TSP platforms or by the gradient
Boundary layer, which is attached to the substrate, to be included performing HTHP (HTHP) technique.
11. the method as described in claim 1, wherein forming the graded interface layer and the graded interface layer being attached into institute
Substrate is stated in same step to occur.
12. a kind of composite polycrystal-diamond (PDC), it includes：
Thermostabilization diamond (TSP) platform, it has TSP thermal coefficient of expansions (CTE)；
Substrate, it has substrate CTE；And
Graded interface layer, it is attached to the TSP and the substrate, the graded interface layer have between the TSP CTE and
CTE gradients between the substrate CTE.
13. PDC as claimed in claim 12, wherein the substrate includes base material, and the PDC includes being used for earth-boring bits
Cutting tooth.
14. PDC as claimed in claim 12, wherein the substrate includes hard alloy.
15. PDC as claimed in claim 12, wherein the graded interface layer includes multiple sublayers.
16. PDC as claimed in claim 12, wherein the ratio of diamond particles is with CTE increasing in the graded interface layer
Add and reduce.
17. PDC as claimed in claim 12, wherein the CTE gradients form CTE curves, it can be linear, non-linear
Or S-shaped.
18. a kind of earth-boring bits, it includes：
Bit body；And
Composite polycrystal-diamond (PDC), it includes：
Thermostabilization diamond (TSP) platform, it has TSP thermal coefficient of expansions (CTE)；
Substrate, it has substrate CTE；And
Graded interface layer, it is attached to the TSP and the substrate, the graded interface layer have between the TSP CTE and
CTE gradients between the substrate CTE.
19. earth-boring bits as claimed in claim 18, wherein the PDC includes being connected to the PDC cutting tooths of the bit body.
20. earth-boring bits as claimed in claim 18, wherein the bit body includes the substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2015/028018 WO2016175763A1 (en) | 2015-04-28 | 2015-04-28 | Polycrystalline diamond compact with gradient interfacial layer |
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| Publication Number | Publication Date |
|---|---|
| CN107427918A true CN107427918A (en) | 2017-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201580078046.8A Pending CN107427918A (en) | 2015-04-28 | 2015-04-28 | Composite polycrystal-diamond with graded interface layer |
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| Country | Link |
|---|---|
| US (1) | US10711331B2 (en) |
| KR (1) | KR20170119716A (en) |
| CN (1) | CN107427918A (en) |
| CA (1) | CA2978270C (en) |
| GB (1) | GB2552286A (en) |
| WO (1) | WO2016175763A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CA2978270C (en) | 2019-11-26 |
| KR20170119716A (en) | 2017-10-27 |
| US20180087134A1 (en) | 2018-03-29 |
| GB2552286A (en) | 2018-01-17 |
| WO2016175763A1 (en) | 2016-11-03 |
| US10711331B2 (en) | 2020-07-14 |
| CA2978270A1 (en) | 2016-11-03 |
| GB201715026D0 (en) | 2017-11-01 |
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