CN107404801A - A kind of multi-layer flexible circuit board - Google Patents
A kind of multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN107404801A CN107404801A CN201710684940.0A CN201710684940A CN107404801A CN 107404801 A CN107404801 A CN 107404801A CN 201710684940 A CN201710684940 A CN 201710684940A CN 107404801 A CN107404801 A CN 107404801A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil plate
- substrate
- plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of multi-layer flexible circuit board,Including the first copper foil plate,Second copper foil plate and the 3rd copper foil plate,This multi-layer flexible circuit board,It is simple in construction,Stable connection,Pass through the first copper foil plate,First substrate,Second copper foil plate,Second substrate and the 3rd copper foil plate are bonded form successively,First substrate and second substrate provide toughness and supporting role,For the first copper foil plate,Second copper foil plate and the 3rd copper foil plate provide stable deformation and depended on,Avoid scrapping caused by bending in assist side installation or transportation,First substrate and second substrate are the hollow box body recovered with deformation,Deformation is first carried out during bending,Can be the deformation quantity of reduction copper foil plate,Avoid fractureing for copper foil plate,Improve overall toughness,First connecting hole and the second connecting hole are the first copper foil plate,The connection of second copper foil plate and the 3rd copper foil plate provides space,Resistance to overturning is strong,It is easy to produce and installs.
Description
Technical field
The present invention relates to FPC technical field, specially a kind of multi-layer flexible circuit board.
Background technology
Because electronic equipment constantly develops to light, thin, short, small direction, conventional rigid wiring board gradually shows thickness
Too thick, volume is too big, is unable to the defects of bending, can not meet that the further volume of product reduces and become more meticulous and require flexible circuitry
Plate can preferably realize miniaturization and bending；But because material is softer on integrated device, attachment difficulty is larger, meanwhile, it is flexible
Wiring board is possible under tension damage and destroys wherein set circuit in use, prevents FPC from normal
Work, is directed to this, and the method taken at this stage mainly carries out thickening processing to FPC, to reduce FPC
Injured rate, but thicken processing can correspondingly reduce FPC pliability, make it easier to fracture, have with electronic product
More preferable reliability and the development trend of more long life are disagreed.
The content of the invention
The technical problem to be solved in the present invention is to overcome the defects of existing, there is provided a kind of multi-layer flexible circuit board, structure are steady
It is fixed, simple production process, convenient processing, the bonding of multilayer circuit board is effectively realized, flexible or folding, toughness is strong, reduces
The thickness of wiring board, it is easily installed and uses, effectively can solves the problems, such as in background technology.
To achieve the above object, the present invention provides following technical scheme：A kind of multi-layer flexible circuit board, including the first copper foil
Plate, the second copper foil plate and the 3rd copper foil plate, the first base is connected to by the way that AD is gluing between first copper foil plate and the second copper foil plate
Plate, second substrate, the first substrate and the second base are connected to by the way that AD is gluing between second copper foil plate and the 3rd copper foil plate
It is connected between the same side end of plate by end plate.
As a preferred technical solution of the present invention, first copper foil plate, the second copper foil plate and the 3rd copper foil plate
Thickness is between 20-35 μm.
As a preferred technical solution of the present invention, the first substrate and second substrate are closed hollow box,
And first substrate and second substrate are cuboid box, it is first convex to be evenly distributed with bar shaped for the inner chamber downside of the first substrate
Rise, the inner chamber upper side of the first substrate is evenly distributed with the second projection of bar shaped.
As a preferred technical solution of the present invention, the described first raised section is semicircle, and described second is raised
Section be isosceles triangle, and first raised and the second raised staggered relative distribution.
As a preferred technical solution of the present invention, ring flat-plate is provided with the middle through-hole of the first substrate, described the
One copper foil plate and the second copper foil plate position corresponding with first substrate inner ring plate are provided with the first connecting hole, second copper foil plate and
3rd copper foil plate position corresponding with second substrate inner ring plate is provided with the second connecting hole, and the first connecting hole and the second connecting hole are handed over
Mistake distribution.
As a preferred technical solution of the present invention, airway tube is provided with the end mounting hole of the end plate, it is described to lead
The end of tracheae extends to the inner chamber of first substrate.
Compared with prior art, the beneficial effects of the invention are as follows：This multi-layer flexible circuit board, simple in construction, stable connection,
It is bonded forms successively by the first copper foil plate, first substrate, the second copper foil plate, second substrate and the 3rd copper foil plate, first substrate
Toughness and supporting role are provided with second substrate, stable shape is provided for the first copper foil plate, the second copper foil plate and the 3rd copper foil plate
Change is depended on, avoid assist side install or transportation in scrapped caused by bending, first substrate and second substrate be with
The hollow box body that deformation recovers, deformation is first carried out during bending, can be the deformation quantity of reduction copper foil plate, avoid fractureing for copper foil plate,
Improve overall toughness, the first connecting hole and the company that the second connecting hole is the first copper foil plate, the second copper foil plate and the 3rd copper foil plate
Connect and space is provided, resistance to overturning is strong, is easy to produce and installs.
Brief description of the drawings
Fig. 1 is the overall cross-sectional view of the present invention；
Fig. 2 is structure enlargement diagram at A of the present invention.
In figure：1 first copper foil plate, 2 second copper foil plates, 3 the 3rd copper foil plates, 4 first substrates, it is 401 first raised, 402 the
Two projections, 403 ring flat-plates, 5 second substrates, 6 end plates, 601 airway tubes, 7 first connecting holes, 8 second connecting holes.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1-2 is referred to, the present invention provides a kind of technical scheme：A kind of multi-layer flexible circuit board, including the first copper foil plate
1st, the second copper foil plate 2 and the 3rd copper foil plate 3, the thickness of the first copper foil plate 1, the second copper foil plate 2 and the 3rd copper foil plate 3 is in 20-
Between 35 μm, first substrate 4, the second copper foil plate 2 and are connected to by the way that AD is gluing between the first copper foil plate 1 and the second copper foil plate 2
Second substrate 5 is connected to by the way that AD is gluing between three copper foil plates 3, first substrate 4 and second substrate 5 are closed hollow box, and
First substrate 4 and second substrate 5 are cuboid box, and the inner chamber downside of first substrate 4 is evenly distributed with the first projection of bar shaped
401, the inner chamber upper side of first substrate 4 is evenly distributed with the second projection 402 of bar shaped, and the section of the first projection 401 is semicircle
Shape, the section of the second projection 402 is isosceles triangle, and the first projection 401 and the second raised 402 staggered relatives are distributed, first
It is connected between substrate 4 and the same side end of second substrate 5 by end plate 6, ring flat-plate 403 is provided with the middle through-hole of first substrate 4,
First copper foil plate 1 and the second copper foil plate 2 are provided with the first connecting hole 7, the second bronze medal with 4 inner ring plate of first substrate, 403 corresponding position
The copper foil plate 3 of paper tinsel plate 2 and the 3rd is provided with the second connecting hole 8, and the first connecting hole 7 with 5 inner ring plate of second substrate, 403 corresponding position
It is interspersed with the second connecting hole 8, is provided with airway tube 601 in the end mounting hole of end plate 6, the end of airway tube 601 extends to
The inner chamber of first substrate 4, this multi-layer flexible circuit board is simple in construction, stable connection, by the first copper foil plate 1, first substrate 4,
Second copper foil plate 2, second substrate 5 and the plate of the 3rd copper foil 3 are bonded form successively, first substrate 4 and second substrate 5 provide toughness and
Supporting role, provide stable deformation for the first copper foil plate 1, the second copper foil plate 2 and the 3rd copper foil plate 3 and depend on, avoid in circuit
Scrapped in plate installation or transportation caused by bending, first substrate 4 and second substrate 5 are the hollow box recovered with deformation
Body, deformation is first carried out during bending, can be the deformation quantity for reducing copper foil plate, avoid fractureing for copper foil plate, improve overall toughness, the
One connecting hole 7 and the second connecting hole 8 provide space for the connection of the first copper foil plate 1, the second copper foil plate 2 and the 3rd copper foil plate 3, whole
Body stability is strong, is easy to produce and installs.
When in use：First substrate 4 is connected with the end of second substrate 5 by end plate 6, the first copper foil plate 1, the second copper foil
The copper foil plate 3 of plate 2 and the 3rd, which interlocks, is bonded in the surface of first substrate 4 and second substrate 5, and the first connecting hole 7 and the second connection
Hole 8 is alignd with ring flat-plate 403, and first substrate 4 and second substrate 5 first carry out deformation during bending, and the first projection 401 and second is raised
402 articulate relatives are extruded, and gas is discharged by airway tube 601, and first substrate 4 and second substrate 5 are in the first projection 401 after release
Recover with the second raised 402 shape inotropic actions.
Stability Analysis of Structures of the present invention, simple production process, convenient processing, the bonding of multilayer circuit board is effectively realized, it is flexible
Or fold, ensure toughness while reducing circuit plate thickness, be easily installed and use.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of multi-layer flexible circuit board, including the first copper foil plate（1）, the second copper foil plate（2）With the 3rd copper foil plate（3）, it is special
Sign is：First copper foil plate（1）With the second copper foil plate（2）Between by the way that AD is gluing be connected to first substrate（4）, described second
Copper foil plate（2）With the 3rd copper foil plate（3）Between by the way that AD is gluing be connected to second substrate（5）, the first substrate（4）With the second base
Plate（5）Same side end between pass through end plate（6）It is connected.
A kind of 2. multi-layer flexible circuit board according to claim 1, it is characterised in that：First copper foil plate（1）, second
Copper foil plate（2）With the 3rd copper foil plate（3）Thickness between 20-35 μm.
A kind of 3. multi-layer flexible circuit board according to claim 1, it is characterised in that：The first substrate（4）With second
Substrate（5）It is closed hollow box, and first substrate（4）And second substrate（5）For cuboid box, the first substrate（4）
Inner chamber downside be evenly distributed with the first raised of bar shaped（401）, the first substrate（4）Inner chamber upper side be uniformly distributed
There is the second projection of bar shaped（402）.
A kind of 4. multi-layer flexible circuit board according to claim 3, it is characterised in that：Described first is raised（401）Cut
Face is semicircle, and described second is raised（402）Section be isosceles triangle, and first is raised（401）It is raised with second（402）
Staggered relative is distributed.
A kind of 5. multi-layer flexible circuit board according to claim 1, it is characterised in that：The first substrate（4）Middle part
Ring flat-plate is provided with through hole（403）, first copper foil plate（1）With the second copper foil plate（2）With first substrate（4）Inner ring plate（403）
Corresponding position is provided with the first connecting hole（7）, second copper foil plate（2）With the 3rd copper foil plate（3）With second substrate（5）Inner ring
Plate（403）Corresponding position is provided with the second connecting hole（8）, and the first connecting hole（7）With the second connecting hole（8）It is interspersed.
A kind of 6. multi-layer flexible circuit board according to claim 1, it is characterised in that：The end plate（6）End installation
Airway tube is provided with hole（601）, the airway tube（601）End extend to first substrate（4）Inner chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710684940.0A CN107404801A (en) | 2017-08-11 | 2017-08-11 | A kind of multi-layer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710684940.0A CN107404801A (en) | 2017-08-11 | 2017-08-11 | A kind of multi-layer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107404801A true CN107404801A (en) | 2017-11-28 |
Family
ID=60396352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710684940.0A Pending CN107404801A (en) | 2017-08-11 | 2017-08-11 | A kind of multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107404801A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117377195A (en) * | 2023-10-20 | 2024-01-09 | 同扬光电（江苏）有限公司 | Durable flexible circuit board capable of avoiding excessive bending |
-
2017
- 2017-08-11 CN CN201710684940.0A patent/CN107404801A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117377195A (en) * | 2023-10-20 | 2024-01-09 | 同扬光电（江苏）有限公司 | Durable flexible circuit board capable of avoiding excessive bending |
| CN117377195B (en) * | 2023-10-20 | 2024-04-26 | 同扬光电（江苏）有限公司 | Durable flexible circuit board capable of avoiding excessive bending |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171128 |