CN107369624A - A kind of lead frame improves the method and lead frame of encapsulation - Google Patents
A kind of lead frame improves the method and lead frame of encapsulation Download PDFInfo
- Publication number
- CN107369624A CN107369624A CN201710491629.4A CN201710491629A CN107369624A CN 107369624 A CN107369624 A CN 107369624A CN 201710491629 A CN201710491629 A CN 201710491629A CN 107369624 A CN107369624 A CN 107369624A
- Authority
- CN
- China
- Prior art keywords
- region
- product
- product region
- rectangle
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000005538 encapsulation Methods 0.000 title claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 114
- 238000002347 injection Methods 0.000 claims abstract description 59
- 239000007924 injection Substances 0.000 claims abstract description 59
- 238000009826 distribution Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 210000003205 muscle Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000002860 competitive effect Effects 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 17
- 230000009471 action Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses the method and lead frame that a kind of lead frame improves encapsulation, product region and non-product region are separated on the lead frames, non-product region is located at the periphery of product region；The back side increase half-etching design of transitional region between product region and non-product region, the width of transitional region are more than the thickness of cutter；The injection region and the non-injection region of non-product region of non-product region are determined in non-product region, the injection region of non-product region is located between non-injection region and the product region of non-product region, and the front increase total eclipse in the injection region of non-product region and the non-injection region of non-product region is carved and half-etching design respectively；Product region includes multiple finished products, has dowel between adjacent finished product, in the increase half-etching design of the back side of dowel.The present invention is reasonable in design, reduces cutter loss, reduces clipping time, effectively improves cutter service life and the product competitive advantage between industry, reduce production cost.
Description
Technical field
The present invention relates to leadframe technologies field, more particularly to a kind of lead frame to improve the method and lead frame of encapsulation
Frame.
Background technology
Chip carrier of the lead frame as integrated circuit, it is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, the key structure part of electric loop is formed, it is served and outside
The function served as bridge of portion wire connection, it is required for use lead frame in most semiconductor integrated blocks, is that electronic information is produced
Important basic material in industry.
Fig. 1 is the lead frame single-sided structure schematic diagram of prior art, and multiple single encapsulation are arranged with lead frame 1 '
Finished product 2 '.After lead-frame packages in road finished product cutting process, the service life of rear road cutter, which is assessed, usually to be influenced whether
The price fluctuation of single encapsulating products, if the service life of cutter is shorter, the price of product is directly influenced, also has influence on production
The competitiveness of product in the industry.
The content of the invention
Goal of the invention：In order to solve the problems, such as that prior art is present, the service life of lead frame product cutter is improved,
The present invention, which provides a kind of lead frame, improves the method for encapsulation.
It is a further object of the present invention to provide a kind of lead frame.
Technical scheme：A kind of method that lead frame improves encapsulation, comprises the following steps：
S1：It is determined that lead frame to be improved, separate product region and non-product region on the lead frames, it is described it is non-into
Product region is located at the periphery of product region, and the product region is used to place finished product；
S2：There is transitional region between the product region and non-product region, the back side increase by half of the transitional region is lost
Design is carved, transitional region is cutter track, and the width of transitional region is more than the thickness of cutter；
S3：Carved in non-product region increase total eclipse and half-etching designs：The note of non-product region is determined in non-product region
Region and the non-injection region of non-product region are moulded, the injection region of the non-product region is located at the non-injection of non-product region
Between region and product region, the front increase half-etching design in the non-injection region of non-product region, in non-product region
Injection region front increase total eclipse carve design；
S4：The product region includes multiple finished products, there is dowel between adjacent finished product, and the position of the dowel is to cut
Cutter track, in the increase half-etching design of the back side of the dowel.
Preferably, in step S4, the finished product is square, and the dowel is cross-shaped.
Preferably, in step S3, the injection region of the non-product region is disposed with multiple square injection blocks.
Preferably, in step S3, the injection region of the non-product region is provided with the full etching area of multiple rectangles, and rectangle is complete
Etching area includes the full etching area of big rectangle and the full etching area of small rectangle, and the big full etching area of rectangle in part is along dowel
Extended line is distributed, and the big full etching area of rectangle in part is centered around product region periphery；The full etching area of small rectangle was located at
The side in region is crossed, the opposite side of transitional region is arranged with the pin of finished product, and the small full etching area of rectangle is adjacent with finished product to be drawn
The gap alignment of pin.
Preferably, the length of the full etching area of small rectangle is the length of finished product pin, the small full etching area of rectangle
Width is the spacing of finished product pin.
A kind of lead frame, including product region and non-product region, the non-product region are located at the outer of product region
Enclose, the product region is used to place finished product, has transitional region between product region and non-product region, the transitional region is
Half-etching, the width of transitional region are more than the thickness of cutter；The non-product region includes the injection region of non-product region
With the non-injection region of non-product region, the injection region of non-product region is located at non-injection region and the finished product of non-product region
Between region, the front in the non-injection region of non-product region is half-etching, and the front in the injection region of non-product region includes
Multiple full etching areas of rectangle；Product region includes multiple finished products, and finished product is used to place and connect finished product, had between adjacent finished product
Dowel, the position of the dowel is cutter track, and the back side of the dowel is half-etching.
Preferably, the injection region of the non-product region is provided with the full etching area of multiple rectangles, the full etching area of rectangle
Including the full etching area of big rectangle and the full etching area of small rectangle, the part big full etching area of the rectangle extended line along dowel point
Cloth, the big full etching area of rectangle in part are centered around product region periphery；The small rectangle total eclipse carves area arrangement in transitional region
Side, the opposite side of transitional region is arranged with the pin of finished product, on the full etching area of small rectangle and finished product between adjacent leads
Gap is alignd.
Preferably, the length of the full etching area of small rectangle is the length of finished product pin, the small full etching area of rectangle
Width is the spacing of finished product pin.
Preferably, the half-etching thickness in the non-injection region of the non-product region is the 1/3 of leadframe thickness.
Preferably, the half-etching projected depth of the transitional region is the 1/2 of frame thickness；The half-etching of the dowel
Projected depth is the 1/2 of frame thickness.
Beneficial effect：A kind of lead frame provided by the invention improves the method and lead frame of encapsulation, in non-finished product area
Half-etching area is designed in domain, because the position of the cutter track of non-product region adds half-etching, is cut needed for cutter
Position be thinned, reduce loss, improve the technical parameter of product cutting action, reduce cutter loss, reduce
Clipping time.Due to position is thinned symmetrically, and it is thinned highly moderate, substrate intensity itself will not be substantially reduced.
Dowel of the present invention between finished product is improved, due to adding auxiliary half-etching between finished product, cutting
Metal is thinned at knife track, reduces loss, further the technical parameter of improvement product cutting action, the loss of reduction cutter,
Reduce clipping time.Thinned design size between product will not reduce the bonding strength between product by calculating and assessing.
Transitional region between product region and non-product region increases half-etching, and metal is thinned at cutter track,
Reduce loss, further improve the technical parameter of product cutting action, reduce cutter loss, reduce clipping time,
Non- product region carves design close to one side of transitional region increase total eclipse so that relative equilibrium at left and right sides of cutter track, enters
One step increases the service life of cutter.
The present invention it is reasonable in design, reduce cutter loss, reduce clipping time, effectively improve cutter service life and
Product competitive advantage between industry, reduce production cost.
Brief description of the drawings
Fig. 1 is the lead frame single-sided structure schematic diagram of prior art；
Fig. 2 is to improve the lead frame single-sided structure after the method encapsulated is improved by a kind of lead frame of the present invention to show
It is intended to；
Fig. 3 is Fig. 2 close-up schematic view.
In figure：1 is lead frame；2 be product region；3 be non-product region；21 be finished product；22 be product region with it is non-
Transitional region between product region；31 be the injection region of non-product region；32 be the non-injection region of non-product region；
311 be the full etching area of big rectangle；312 be the full etching area of small rectangle；4 dowel between finished product；5 be chip pin pin.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
S1：It is determined that lead frame 1 to be improved, separates product region 2 and non-product region 3 on lead frame 1, it is described
Non- product region 3 is located at the periphery of product region 2, and the product region 2 is used to place finished product；
S2：There is transitional region 22 between the product region 2 and non-product region 3, the back side of the transitional region 22 increases
Half-etching is added to design, transitional region 22 is cutter track, and the width of transitional region 22 needs the thickness more than cutter；
S3：Carved in non-product region 3 increase total eclipse and half-etching designs：Non- product region is determined in non-product region 3
Region 31 and the non-injection region 32 of non-product region are molded, the injection region 31 of the non-product region is located at non-product region
Non- injection region 32 and product region 2 between, the non-injection region 32 of non-product region front increase half-etching design,
Front increase total eclipse in the injection region 31 of non-product region carves design.The injection region 31 of the non-product region is disposed with
Multiple square injection blocks.The injection region 31 of the non-product region is provided with multiple big full etching areas 311 of rectangle, the big square in part
Extended line distribution of the full etching area 311 of shape along dowel, the big full etching area 311 of rectangle in part are centered around outside product region 2
Enclose；The injection region 31 of the non-product region is provided with multiple small full etching areas 312 of rectangle close to the edge of transitional region 22,
The full etching area 312 of small rectangle is arranged in the side of transitional region 22, and the opposite side of transitional region 22 is arranged with finished product
Pin 5, the small full etching area 312 of rectangle align with the gap of adjacent leads on finished product 5.The full etching area 312 of small rectangle
Length be finished product pin 5 length, the width of the small full etching area 312 of rectangle is the spacing of finished product pin pin 5 (pin).
S4：The product region 2 includes multiple finished products 21, has dowel 4 between adjacent finished product 21, the dowel 4
Position is cutter track (i.e. Cutting Road), in the increase half-etching design of the back side of the dowel 4.The finished product 21 is pros
Shape, the dowel 4 are cross-shaped.
A kind of lead frame is obtained according to the method, as shown in Figures 2 and 3, including product region 2 and non-product region 3, institute
The periphery that non-product region 3 is located at product region 2 is stated, the product region 2 is used to place finished product, product region 2 and non-finished product
There is transitional region 22 between region 3, the transitional region 22 is half-etching, and the half-etching width of transitional region 22 is more than cutter
Thickness；The non-product region 3 includes the injection region 31 and the non-injection region 32 of non-product region of non-product region, non-
The injection region 31 of product region is located between non-injection region 32 and the product region 2 of non-product region, non-product region
The front in non-injection region 32 is half-etching, and the front in the injection region 31 of non-product region includes the full etching region of multiple rectangles
Domain；Product region 2 includes multiple finished products 21, has dowel 4 between adjacent finished product 21, the position of the dowel 4 is cutter
Track, the back side of the dowel 4 is half-etching.
The full etching area of rectangle on the injection region 31 of the non-product region includes the full He of etching area 311 of big rectangle
The small full etching area 312 of rectangle, extended line distribution of the big full etching area 311 of rectangle in part along dowel 4, the big rectangle in part are complete
Etching area 311 is centered around the periphery of product region 2；The full etching area 312 of small rectangle is located at the edge of transitional region 22, institute
The side that the full etching area 311 of small rectangle is arranged in transitional region 22 is stated, the opposite side of transitional region 22 is arranged with drawing for finished product
Pin 5, the small full etching area 312 of rectangle align with the gap of adjacent leads on finished product 5.
The length of the full etching area 312 of small rectangle is the length of finished product pin 5, the small full etching area 312 of rectangle
Width is the spacing of finished product pin 5.
The non-injection region 32 of non-product region is designed as half-etching by the present embodiment, due to cutting the non-rail of product region 32
Road position adds half-etching, and the position of cutting is thinned needed for cutter, reduces loss, improves product cutting action
Technical parameter, reduce cutter loss, reduce clipping time.Due to position is thinned symmetrically, and it is thinned highly moderate,
Substrate intensity itself will not be substantially reduced；The half-etching design at transition region 22 and dowel 4 is added in product region 2,
Because finishing room connection adds auxiliary half-etching, metal is thinned at cutter track, reduces loss, further improves product
The technical parameter of cutting action, reduce cutter loss, reduce clipping time.Thinned design size between product is by calculating
And assessment, the bonding strength between product will not be reduced.
This leadframe design mainly for lead frame cutter losing quantity it is big the problem of, lead frame is improved,
Increase a large amount of positive half-etching designs in the non-injection region 32 of the non-product region of non-product region 3, control half-etching thickness
The intensity of lead frame is neither influenceed, reduces the resistance in cutting processing procedure again, adds the life-span of cutter, general control is non-
The leadframe thickness that the half-etching thickness in the non-injection region 32 of product region is 1/3 is optimal；The injection area of non-product region
Domain 31 increases the full etching area 312 of small rectangle, controls the full spacing of etching area 312 of small rectangle and size neither to influence lead frame
Intensity, reduce the resistance in cutting process again, make to balance as far as possible at left and right sides of transition region, add the life-span of cutter,
The length of the general small full etching area 312 of rectangle is the length of finished product pin 5, the width of the small full etching area 312 of rectangle be into
The spacing of product pin 5；Transitional region 22 between product region 2 and non-product region 3 increases half-etching and designed, between control design case
Away from the depth with size and control half-etching, the intensity for neither influenceing lead frame can be reached, reduced again in cutting process
Resistance, add life-spans of cutter, the spacing of half-etching herein is greater than the size of cutter, is generally located on 0.3mm,
Half-etching is deep-controlled in the 1/2 optimal of frame thickness, and described cutter are road finished product cutting process after lead-frame packages
The position of middle cutting；Dowel 4 between adjacent finished product 21 is cutter track and increase half-etching design, controls half-etching
Width and depth, the intensity for neither influenceing lead frame can be reached, reduce the resistance in cutting processing procedure again, add cutting
The life-span of knife, half-etching size herein for proof strength, reserve 0.02mm width no more than the position of pins of products
Degree, half-etching herein are deep-controlled in the 1/2 optimal of frame thickness.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (10)
1. a kind of method that lead frame improves encapsulation, it is characterised in that comprise the following steps：
S1：It is determined that lead frame to be improved, separates product region and non-product region, the non-finished product area on the lead frames
Domain is located at the periphery of product region, and the product region is used to place finished product；
S2：There is transitional region between the product region and non-product region, the back side increase half-etching of the transitional region is set
Meter, transitional region are cutter track, and the width of transitional region is more than the thickness of cutter；
S3：Carved in non-product region increase total eclipse and half-etching designs：The injection area of non-product region is determined in non-product region
Domain and the non-injection region of non-product region, the injection region of the non-product region are located at the non-injection region of non-product region
Between product region, the front increase half-etching design in the non-injection region of non-product region, in the note of non-product region
The front increase total eclipse for moulding region carves design；
S4：The product region includes multiple finished products, has dowel between adjacent finished product, the position of the dowel is cutter
Track, in the increase half-etching design of the back side of the dowel.
2. the method that lead frame according to claim 1 improves encapsulation, it is characterised in that in step S4, the finished product
For square, the dowel is cross-shaped.
3. the method that lead frame according to claim 1 or 2 improves encapsulation, it is characterised in that described non-in step S3
The injection region of product region is disposed with multiple square injection blocks.
4. the method that lead frame according to claim 1 or 2 improves encapsulation, it is characterised in that described non-in step S3
The injection region of product region is provided with the full etching area of multiple rectangles, the full etching area of rectangle include the full etching area of big rectangle and
The small full etching area of rectangle, extended line distribution of the big full etching area of rectangle in part along dowel, the big full etching region of rectangle in part
Domain is centered around product region periphery；The full etching area of small rectangle is located at the side of transitional region, the opposite side of transitional region
The pin of finished product is arranged with, the small full etching area of rectangle aligns with the gap of adjacent leads on finished product.
5. lead frame according to claim 4, it is characterised in that the length of the small full etching area of rectangle is finished product
The length of pin, the width of the small full etching area of rectangle are the spacing of finished product pin.
6. a kind of lead frame, it is characterised in that including product region and non-product region, the non-product region is located at finished product
The periphery in region, the product region are used to place finished product, there is transitional region, the mistake between product region and non-product region
It is half-etching to cross region, and the width of transitional region is more than the thickness of cutter；The non-product region includes non-product region
Region and the non-injection region of non-product region are molded, the injection region of non-product region is located at the non-injection area of non-product region
Between domain and product region, the front in the non-injection region of non-product region is half-etching, the injection region of non-product region
Front includes the full etching area of multiple rectangles；Product region includes multiple finished products, has dowel, the connection between adjacent finished product
The position of muscle is cutter track, and the back side of the dowel is half-etching.
7. lead frame according to claim 6, it is characterised in that the injection region of the non-product region is provided with multiple
The full etching area of rectangle, the full etching area of rectangle include the full etching area of big rectangle and the full etching area of small rectangle, the big square in part
Extended line distribution of the full etching area of shape along dowel, the big full etching area of rectangle in part are centered around product region periphery；It is described
Small rectangle total eclipse carves area arrangement and is arranged with the pin of finished product, small rectangle in the side of transitional region, the opposite side of transitional region
Full etching area aligns with the gap of adjacent leads on finished product.
8. lead frame according to claim 7, it is characterised in that the length of the small full etching area of rectangle is finished product
The length of pin, the width of the small full etching area of rectangle are the spacing of finished product pin.
9. according to the lead frame described in claim 6 or 7 or 8, it is characterised in that the non-injection region of the non-product region
Half-etching thickness be leadframe thickness 1/3.
10. according to the lead frame described in claim 6 or 7 or 8, it is characterised in that the half-etching design of the transitional region
Depth is the 1/2 of frame thickness；The half-etching projected depth of the dowel is the 1/2 of frame thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491629.4A CN107369624A (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame improves the method and lead frame of encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710491629.4A CN107369624A (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame improves the method and lead frame of encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107369624A true CN107369624A (en) | 2017-11-21 |
Family
ID=60305053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710491629.4A Pending CN107369624A (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame improves the method and lead frame of encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107369624A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110527949A (en) * | 2019-09-24 | 2019-12-03 | 昆山国显光电有限公司 | A kind of contraposition mask plate, mask plate and production method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579162A (en) * | 2012-07-20 | 2014-02-12 | 台湾道康宁股份有限公司 | Lead frame assembly, lead frame thereof and cutting method |
| CN103928420A (en) * | 2013-01-11 | 2014-07-16 | 株式会社三井高科技 | Lead frame |
| CN204516751U (en) * | 2015-02-11 | 2015-07-29 | 江苏长电科技股份有限公司 | A kind of lead frame structure of square flat pinless encapsulation and package body structure |
| CN207052570U (en) * | 2017-06-20 | 2018-02-27 | 南京矽邦半导体有限公司 | A kind of lead frame |
-
2017
- 2017-06-20 CN CN201710491629.4A patent/CN107369624A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579162A (en) * | 2012-07-20 | 2014-02-12 | 台湾道康宁股份有限公司 | Lead frame assembly, lead frame thereof and cutting method |
| CN103928420A (en) * | 2013-01-11 | 2014-07-16 | 株式会社三井高科技 | Lead frame |
| CN204516751U (en) * | 2015-02-11 | 2015-07-29 | 江苏长电科技股份有限公司 | A kind of lead frame structure of square flat pinless encapsulation and package body structure |
| CN207052570U (en) * | 2017-06-20 | 2018-02-27 | 南京矽邦半导体有限公司 | A kind of lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110527949A (en) * | 2019-09-24 | 2019-12-03 | 昆山国显光电有限公司 | A kind of contraposition mask plate, mask plate and production method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7183630B1 (en) | Lead frame with plated end leads | |
| US20120126378A1 (en) | Semiconductor device package with electromagnetic shielding | |
| US9190351B2 (en) | Semiconductor device with webbing between leads | |
| JP2001320007A (en) | Frame for resin sealed semiconductor device | |
| US6469369B1 (en) | Leadframe having a mold inflow groove and method for making | |
| US20170271278A1 (en) | Sensor chip package assembly and electronic device having sensor chip package assembly | |
| US6882048B2 (en) | Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area | |
| JP2016127067A (en) | Semiconductor device manufacturing method | |
| CN207052570U (en) | A kind of lead frame | |
| CN107369624A (en) | A kind of lead frame improves the method and lead frame of encapsulation | |
| CN101894822B (en) | Lead frame band construction for semiconductor packaging | |
| CN207883687U (en) | SOP-8 encapsulating leads | |
| CN205789946U (en) | Lead frame preform and lead frame encapsulation structure | |
| CN114883288A (en) | Lead frame structure, manufacturing method thereof, packaging structure, chip assembly and terminal | |
| CN209169136U (en) | A kind of TO packaging frame | |
| CN203134784U (en) | Lead frame strip for semiconductor packaging | |
| CN111106089B (en) | High-density pin QFN packaging structure and method | |
| CN103021879A (en) | Leadless semiconductor package, method for manufacturing the same, and lead frame strip | |
| CN207993847U (en) | Semiconductor package | |
| JP4475785B2 (en) | Manufacturing method of resin-encapsulated semiconductor device | |
| CN205159315U (en) | Lead frame strip | |
| JP2013235896A (en) | Method of manufacturing semiconductor device and semiconductor device | |
| CN207474456U (en) | Lead frame and the packaging body using the lead frame | |
| CN211208437U (en) | TO-247-2L lead frame structure | |
| CN207517674U (en) | A kind of lead frame with concave inward structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171121 |