CN107317574B - Self-cooling high-voltage pulse switch device - Google Patents
Self-cooling high-voltage pulse switch device Download PDFInfo
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- CN107317574B CN107317574B CN201710429675.1A CN201710429675A CN107317574B CN 107317574 B CN107317574 B CN 107317574B CN 201710429675 A CN201710429675 A CN 201710429675A CN 107317574 B CN107317574 B CN 107317574B
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- molybdenum sheet
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- voltage pulse
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/72—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K2017/0806—Modifications for protecting switching circuit against overcurrent or overvoltage against excessive temperature
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Abstract
The invention discloses a self-cooling high-voltage pulse switch device, which comprises a ceramic bushing (1) with a cylindrical inner cavity, disc-shaped upper and lower copper bases (2 and 3), a gate pole component (4), a disc-shaped tube core component (6), disc-shaped upper and lower molybdenum sheet components (5 and 7); the upper copper base (2) is connected with the upper end of the ceramic bushing (1) in a sealing manner, and the lower copper base (3) is connected with the lower end of the ceramic bushing (1) in a sealing manner to form a closed cavity (); the tube core assembly (6) is horizontally clamped between the upper molybdenum sheet assembly (5) and the lower molybdenum sheet assembly (7), the gate electrode assembly (4) is fixedly arranged at the central position of the upper surface of the upper molybdenum sheet assembly (5), and the ceramic lining (1) is led out through a trigger line; the upper and lower molybdenum sheet assemblies (5, 7) of the clamping tube core assembly (6) are horizontally arranged in the middle of the closed cavity, and the periphery of the clamping tube core assembly is fixedly connected with the ceramic bushing (1) in a sealing way; the sealed cavity is filled with a refrigerant (19), the refrigerant (19) takes the tube core assembly (6) as an evaporation section, and the upper copper base (2) and the lower copper base (3) as condensation sections to form heat tube circulation. The self-cooling high-voltage pulse switch device has good cooling effect and small volume.
Description
Technical Field
The invention belongs to the technical field of power electronics and pulse power source devices, and particularly relates to a self-cooling high-voltage pulse switch device with a good cooling effect and a small size.
Background
The high-voltage pulse switch device is used as a key device of a pulse power source, is a control link of the work of a pulse power adjusting system, is widely applied with strong power magnitude and larger overload capacity, and becomes a continuous research focus in the technical field of pulse power.
The parameters and characteristics of the pulse switching device are not only the basis of reliable operation of a pulse power system, but also have direct influence on relevant parameters such as rise time and amplitude of a pulse waveform. Because the pulse switching device works in a pulse loop, the circulating current is large, the transient power is high, the power loss of electric energy in the switching device is large and the electric energy is converted into heat, so that the temperature of the switching device is increased, the junction temperature of the pulse power switching device is determined by the power loss and the heat dissipation capacity of the device, and the characteristics of the switching device are changed due to the excessively high junction temperature, so that the normal work of the device is influenced. The leakage current of the switching device is increased exponentially, when the junction temperature reaches above 125 ℃, the leakage current is overlarge, the device loses blocking capability, and misconduction without gate control is generated, and more seriously, the local temperature is overhigh after the conduction, even a semiconductor layer of the switching device is melted, so that the device is permanently invalid.
The high-voltage pulse switching device generally comprises a ceramic bushing with a cylindrical inner cavity, a disc-shaped upper copper base, a disc-shaped lower copper base, a gate pole assembly, a disc-shaped tube core assembly, a disc-shaped upper molybdenum sheet assembly and a disc-shaped lower molybdenum sheet assembly; the upper copper base is connected with the upper end of the ceramic bushing in a sealing way, and the lower copper base is connected with the lower end of the ceramic bushing in a sealing way to form a closed cavity; the tube core component is horizontally clamped between the upper molybdenum sheet component and the lower molybdenum sheet component, the gate pole component is fixedly arranged at the central position of the upper surface of the upper molybdenum sheet component, and the ceramic lining is led out through the trigger line; the upper and lower molybdenum sheet components of the clamping tube core component are horizontally arranged in the middle of the closed cavity, and the periphery of the clamping tube core component is fixedly connected with the ceramic lining in a sealing way.
Aiming at the problem of thermal characteristics of a switching device, Zhangqiang (Zhangqiang, theory and experimental research on low temperature difference heat dissipation of a high-power electronic device, Zhangqiang, university of Zhejiang university, academic paper 2010.) designs a loop type gravity heat pipe cooling system, namely, a thyristor of the switching device is tightly attached to the center of an evaporation section of a heat pipe, working fluid in the evaporation section absorbs the heat of the thyristor, then the working fluid is gasified and enters a condensation section of the heat pipe through an ascending pipe to dissipate heat and condense into liquid, and the condensed liquid flows back to the evaporation section through a descending pipe under the action of gravity, so that the switching device is cooled circularly. Although the mode can control the temperature rise of the thyristor to a certain extent to realize thermal management and temperature control of the thyristor, the cooling system occupies large space and has large volume, the heating part of the thyristor exchanges heat through indirect contact, the heat transfer efficiency is low, particularly, in a pulse working mode, the mode obviously reduces the thermal management performance of the thyristor, is difficult to effectively realize the temperature control in the pulse transient state, and can possibly cause the thyristor to have overlarge temperature rise in the pulse instant and reduce the performance or lose the performance.
In summary, the prior art has the following problems: the high-voltage pulse switch device has poor cooling effect, and the working performance and reliability of the high-voltage pulse switch device are seriously influenced and limited.
Disclosure of Invention
The invention aims to provide a self-cooling high-voltage pulse switching device which is good in cooling effect and small in size.
The technical solution for realizing the purpose of the invention is as follows:
a self-cooling high-voltage pulse switch device comprises a ceramic bushing with a cylindrical inner cavity, a disc-shaped upper copper base, a disc-shaped lower copper base, a gate electrode assembly, a disc-shaped tube core assembly, a disc-shaped upper molybdenum sheet assembly and a disc-shaped lower molybdenum sheet assembly; the upper copper base is connected with the upper end of the ceramic bushing in a sealing manner, and the lower copper base is connected with the lower end of the ceramic bushing in a sealing manner to form a closed cavity (); the tube core assembly is horizontally clamped between the upper molybdenum sheet assembly and the lower molybdenum sheet assembly, the gate electrode assembly is fixedly arranged at the central position of the upper surface of the upper molybdenum sheet assembly, and the ceramic lining is led out through a trigger line; the upper molybdenum sheet component and the lower molybdenum sheet component of the clamping tube core component are horizontally arranged in the middle of the closed cavity, and the periphery of the clamping tube core component is fixedly connected with the ceramic lining in a sealing way; the closed cavity is filled with a refrigerant, the refrigerant takes the tube core assembly as an evaporation section, and the upper copper base and the lower copper base as a condensation section to form heat tube circulation.
Compared with the prior art, the invention has the following remarkable advantages:
1. the cooling effect is good: the invention fills refrigeration working medium-refrigerant in the switch device, a heat pipe loop is formed between the pipe core component and the upper and lower copper block components, the pipe core component is used as an evaporation section of the heat pipe, the heat productivity of the pipe core component is quickly transferred to the upper and lower copper block components by utilizing the phase change heat exchange of the liquid working medium, the cooling effect is good, thereby realizing the temperature control of the pipe core component, and the heat productivity of the pipe core component is transferred to the upper and lower copper block components layer by adopting a heat conduction mode in the prior art; as a further improvement, heat dissipation holes are formed in half areas of the upper molybdenum sheet assembly and the lower molybdenum sheet assembly, so that a refrigerant is in direct contact with the tube core assembly, the tube core assembly of the high-voltage pulse switch device is directly soaked in a heat pipe working medium, the heat dissipation amount of the tube core assembly is directly absorbed by the heat pipe working medium, the heat exchange thermal resistance is small, the heat exchange performance is high, and the heat dissipation of the refrigerant and the tube core assembly is further improved;
2. the bearing and sealing capability is good: compared with the prior art which adopts skirt edge pressing, the upper and lower copper block assemblies and the ceramic lining are fastened and sealed by adopting nuts, so that the bearing is good, and the sealing performance is strong.
3. The structure is compact: according to the invention, the cooling flow channels are arranged in the upper copper base and the lower copper base, the heat pipe working medium forms a closed heat pipe loop in the switch device, and the copper base is used as a condensation section of the heat pipe to form a self-cooling mode, so that the structure of a cooling system of the high-voltage pulse switch device is effectively simplified, the volume of the cooling system of the switch device is obviously reduced, and the miniaturization is convenient to realize;
4. good electrical property and high working reliability: the self-cooling high-voltage pulse switch device has high heat exchange efficiency, can effectively reduce the tube voltage drop and reduce the leakage current, obviously improves the working performance and reliability of the pulse switch device, and improves the pulse power regulation efficiency of the switch device;
the invention is described in further detail below with reference to the figures and the detailed description.
Drawings
Fig. 1 is an assembly view of a self-cooling high-voltage pulse switching device of the present invention.
Fig. 2 is a detailed view of the structure of the molybdenum plate assembly of fig. 1. Fig. 2(a) is a plan view, and fig. 2(b) is a main sectional view.
Fig. 3(a) is a main sectional view of the ceramic bushing of fig. 1.
Fig. 3(b) is a left sectional view of the ceramic bushing of fig. 1.
FIG. 3(c) is a top view of the ceramic bushing of FIG. 1.
FIG. 4(a) is a main sectional view of the upper copper pedestal of FIG. 1.
FIG. 4(b) is a left sectional view of the upper copper base of FIG. 1.
FIG. 4(c) is a top view of the upper copper base of FIG. 1.
FIG. 5(a) is a main sectional view of the lower copper pedestal of FIG. 1.
FIG. 5(b) is a left cross-sectional view of the lower copper pedestal of FIG. 1.
FIG. 5(c) is a top view of the lower copper base of FIG. 1.
In the figure, 1-ceramic bushing, 2-upper copper base, 3-lower copper base, 4-gate assembly, 5-upper molybdenum sheet assembly, 6-tube core assembly, 7-lower molybdenum sheet assembly, 8-silicon rubber ring, 9-sealing ring, 10-elastic washer, 11-nut, 12-first refrigerant communication hole, 13-second refrigerant communication hole, 14-leading-out hole, 15-fastening screw hole, 16-upper heat exchange hole, 161-lower heat exchange hole, 17-upper countersunk head screw hole, 18-positioning hole, 19-refrigerant, 20-upper copper base cooling channel, 21-gate assembly hole, 22-gate line leading-out channel, 23-positioning pile, 24-lower countersunk head screw hole and 25-lower copper base cooling channel.
Detailed Description
As shown in fig. 1, the self-cooling high-voltage pulse switching device of the present invention comprises a ceramic bushing 1 with a cylindrical inner cavity, a disc-shaped upper copper base 2, a lower copper base 3, a gate assembly 4, a disc-shaped tube core assembly 6, and disc-shaped upper and lower molybdenum sheet assemblies 5 and 7;
the upper copper base 2 is hermetically connected with the upper end of the ceramic bushing 1, and the lower copper base 3 is hermetically connected with the lower end of the ceramic bushing 1 to form a closed cavity;
the tube core assembly 6 is horizontally clamped between the upper molybdenum sheet assembly 5 and the lower molybdenum sheet assembly 7, the gate electrode assembly 4 is fixedly arranged at the central position of the upper surface of the upper molybdenum sheet assembly 5, and the ceramic lining 1 is led out through a trigger line; the upper molybdenum sheet assembly 5 and the lower molybdenum sheet assembly 7 of the clamping tube core assembly 6 are horizontally arranged in the middle of the closed cavity, and the periphery of the clamping tube core assembly is fixedly connected with the ceramic bushing 1 in a sealing way;
the closed cavity is filled with a refrigerant 19, the refrigerant 19 takes the tube core assembly 6 as an evaporation section, and the upper copper base 2 and the lower copper base 3 as condensation sections to form heat pipe circulation.
The heat pipe circulation is adopted to replace natural convection heat exchange in the prior art, the pipe core assembly of the high-voltage pulse switch device is directly soaked in the heat pipe working medium, the heat productivity of the pipe core assembly is directly absorbed by the heat pipe working medium, the heat exchange thermal resistance is small, the heat exchange performance is high, the heat dissipation efficiency of the pipe core assembly 6 is greatly improved, and particularly, the heat control effect is more obvious compared with a heat control effect in a pulse working mode, so that the heat management of the high-voltage pulse switch device is realized, and the pipe pressure drop of the switch device is reduced. Because of high heat exchange efficiency, the tube voltage drop can be effectively reduced, the leakage current is reduced, the working performance and the reliability of the pulse switch device are obviously improved, and the pulse power regulation and control efficiency of the switch device is improved.
As a preferred solution, the heat pipe cycle is formed by:
the upper copper base 2 extends downwards in the ceramic lining 1 and reaches the upper molybdenum sheet component 5, a plurality of upper copper base cooling channels 20 are arranged, and a plurality of upper heat exchange holes 16 are formed in the upper molybdenum sheet component 5, wherein one end of each upper heat exchange hole is communicated with the tube core component 6, and the other end of each upper heat exchange hole is communicated with the upper copper base cooling channels 20.
According to the preferred scheme, a heat pipe loop is formed between the inner flow channel of the upper copper base 2 and the tube core assembly, and the heat productivity of the tube core assembly is transferred into the upper copper base in a convection or phase change heat transfer mode, so that the self-cooling of the high-voltage pulse switch device is realized.
As another preferred solution, the heat pipe cycle is formed by:
the lower copper base 3 extends upwards in the ceramic bushing 1 until reaching the lower molybdenum sheet component 7, and is provided with a plurality of lower copper base cooling channels 25, and the lower molybdenum sheet component 7 is provided with a plurality of lower heat exchange holes 161, one end of each lower heat exchange hole is communicated with the tube core component 6, and the other end of each lower heat exchange hole is communicated with the lower copper base cooling channels 25.
According to the preferred scheme, a heat pipe loop is formed between the inner flow channel of the lower copper base 3 and the tube core assembly, and the heat productivity of the tube core assembly is transferred into the lower copper base in a convection or phase change heat transfer mode, so that the self-cooling of the high-voltage pulse switch device is realized.
The two optimal schemes are combined for use, so that heat pipe circulation is formed on the upper side and the lower side of the tube core assembly, heat is dissipated to the upper side and the lower side, and the heat dissipation effect is greatly enhanced. The cooling channels are arranged in the upper copper base and the lower copper base, a closed heat pipe loop is formed in the switch device through a heat pipe working medium, the copper base is used as a condensation section of the heat pipe, a self-cooling mode is formed, the structure of a cooling system of the high-voltage pulse switch device is effectively simplified, and the cooling channels extend inwards, so that the overall size of the whole device is not increased, the structure is compact, and the miniaturization is convenient to realize.
As an improvement, the upper copper base 2 is provided with a first refrigerant communication hole 12, one end of the first refrigerant communication hole 12 is communicated with at least one upper copper base cooling channel 20, and the other end is communicated with the outside.
The lower copper base 3 is provided with a second refrigerant communication hole 13, one end of the second refrigerant communication hole 13 is communicated with at least one lower copper base cooling channel 25, and the other end is communicated with the outside.
A check valve core or an external check valve component can be arranged in the first refrigerant communication hole 12 and/or the second refrigerant communication hole 13 and is used for filling a refrigeration working medium, namely a refrigerant. Meanwhile, the communication of a plurality of high-voltage pulse switch device cooling systems and the expansion of the functions of the cooling systems are facilitated, the switch devices can be connected with an external condensation section for cooling in a continuous high-frequency pulse working mode or a continuous working mode, and the adaptability and the expansibility of the cooling systems are further improved.
Preferably, the upper heat exchange holes 16 formed in the upper molybdenum sheet assembly 5 are all located in a semicircular range, the aperture ratio is 0% -50%, and the aperture diameter is 0.5 mm-3 mm.
Similarly, the lower heat exchange holes 161 formed in the lower molybdenum sheet assembly 7 are all located in the range of the semicircle, the aperture ratio is 0% -50%, and the aperture diameter is 0.5 mm-3 mm.
Radiating holes are formed in the half areas of the upper molybdenum sheet assembly and the lower molybdenum sheet assembly, so that the refrigerant is in direct contact with the tube core assembly, namely, the tube core assembly is soaked in the refrigerant, and the heat dissipation of the refrigerant and the tube core assembly is improved.
Preferably, two ends of the ceramic bushing 1 are of circular ring double-truncated-cone structures, and a plurality of symmetrically arranged fastening screw holes 15 are uniformly formed in the circumferential direction of circular truncated-cone end surfaces at the two ends; the upper copper base 2 is of a double-table structure, and a plurality of upper countersunk head screw holes 17 corresponding to the fastening screw holes 15 are uniformly formed in the circumferential direction of the upper copper base; the lower copper base 3 is of a double-platform structure, and a plurality of sinking head screw holes 24 corresponding to the fastening screw holes 15 are uniformly formed in the circumferential direction of the lower copper base; and sealing rings 9 and elastic gaskets 10 are respectively arranged on two table-shaped end faces at two ends of the ceramic bushing 1, and are respectively tightly pressed with the table-shaped end faces of the upper copper base 2 and the lower copper base 3, and nuts 11 penetrate through the upper countersunk head screw holes 17, the fastening screw holes 15 and the lower countersunk head screw holes 24 to hermetically connect the upper copper base 2, the ceramic bushing 1 and the lower copper base 3 into a closed cavity.
Considering the pressure-bearing and sealing requirements, the upper and lower copper block assemblies and the ceramic bushing are fastened and sealed by nuts, while the skirt edge is adopted for pressing in the prior art, so that the pressure-bearing and sealing capabilities are poor.
The working principle of the invention is as follows: a heat pipe loop is formed among flow channels in a pipe core assembly 6, an upper copper base 2 and a lower copper base 3 by taking a refrigerant 19 as a heat carrier, the heating pipe core assembly 6 of the high-voltage pulse switch device is soaked in the refrigerant 19, the pipe core assembly 6 is taken as an evaporation section of the heat pipe loop, the upper copper base 2 and the lower copper base 3 are taken as condensation sections of the heat pipe loop, the refrigerant 19 is taken as a working medium of the heat pipe, and the heat productivity of the pipe core assembly 6 is transferred into the upper copper base 2 and the lower copper base 3 in the switch device through the convection and phase change heat exchange of the refrigerant, so that the self-cooling of the high-voltage pulse switch device is.
Claims (8)
1. A self-cooling high-voltage pulse switch device comprises a ceramic bushing (1) with a cylindrical inner cavity, a disc-shaped upper copper base (2), a lower copper base (3), a gate pole assembly (4), a disc-shaped tube core assembly (6), disc-shaped upper and lower molybdenum sheet assemblies (5 and 7);
the upper copper base (2) is connected with the upper end of the ceramic bushing (1) in a sealing manner, and the lower copper base (3) is connected with the lower end of the ceramic bushing (1) in a sealing manner to form a closed cavity;
the tube core assembly (6) is horizontally clamped between the upper molybdenum sheet assembly (5) and the lower molybdenum sheet assembly (7), the gate electrode assembly (4) is fixedly arranged at the central position of the upper surface of the upper molybdenum sheet assembly (5), and the ceramic lining (1) is led out through a trigger line; the upper and lower molybdenum sheet assemblies (5, 7) of the clamping tube core assembly (6) are horizontally arranged in the middle of the closed cavity, and the periphery of the clamping tube core assembly is fixedly connected with the ceramic bushing (1) in a sealing way;
the method is characterized in that:
the sealed cavity is filled with a refrigerant (19), the refrigerant (19) takes the tube core assembly (6) as an evaporation section, and the upper copper base (2) and the lower copper base (3) as condensation sections to form heat tube circulation.
2. A self-cooling high-voltage pulse switching device according to claim 1, wherein said heat pipe cycle is formed by:
the upper copper base (2) extends downwards in the ceramic lining (1) to reach the upper molybdenum sheet component (5) and is provided with a plurality of upper copper base cooling channels (20), and the upper molybdenum sheet component (5) is provided with a plurality of upper heat exchange holes (16) of which one end is communicated with the tube core component (6) and the other end is communicated with the upper copper base cooling channels (20).
3. A self-cooling high-voltage pulse switching device according to claim 1 or 2, wherein said heat pipe cycle is formed by:
the lower copper base (3) extends upwards in the ceramic lining (1) and reaches the lower molybdenum sheet assembly (7), a plurality of lower copper base cooling channels (25) are arranged, and a plurality of lower heat exchange holes (161) with one ends communicated with the tube core assembly (6) and the other ends communicated with the lower copper base cooling channels (25) are formed in the lower molybdenum sheet assembly (7).
4. A self-cooling high-voltage pulse switching device according to claim 2, wherein:
the upper copper base (2) is provided with a first refrigerant communication hole (12), one end of the first refrigerant communication hole (12) is communicated with at least one upper copper base cooling channel (20), and the other end of the first refrigerant communication hole is communicated with the outside.
5. A self-cooling high-voltage pulse switching device according to claim 3, wherein:
the lower copper base (3) is provided with a second refrigerant communication hole (13), one end of the second refrigerant communication hole (13) is communicated with at least one lower copper base cooling channel (25), and the other end of the second refrigerant communication hole is communicated with the outside.
6. A self-cooling high-voltage pulse switching device according to claim 3, wherein:
the upper heat exchange holes (16) formed in the upper molybdenum sheet assembly (5) are all located in the range of a semicircle, the hole opening rate is 0% -50%, and the hole opening diameter is 0.5 mm-3 mm.
7. A self-cooling high-voltage pulse switching device according to claim 3, wherein:
the lower heat exchange holes (161) formed in the lower molybdenum sheet assembly (7) are all located in the range of a semicircle, the aperture ratio is 0% -50%, and the diameter of each opening is 0.5 mm-3 mm.
8. A self-cooling high-voltage pulse switching device according to claim 1, wherein:
the two ends of the ceramic bushing (1) are of circular ring double-truncated-cone structures, and a plurality of symmetrically-arranged fastening screw holes (15) are uniformly formed in the circumferential direction of circular truncated-cone end faces at the two ends;
the upper copper base (2) is of a double-table structure, and a plurality of upper countersunk head screw holes (17) corresponding to the fastening screw holes (15) are uniformly formed in the circumferential direction of the upper copper base;
the lower copper base (3) is of a double-table structure, and a plurality of countersunk head screw holes (24) corresponding to the fastening screw holes (15) are uniformly formed in the circumferential direction of the lower copper base;
sealing rings (9) and elastic gaskets (10) are respectively arranged on two table-shaped end faces at two ends of the ceramic bushing (1), and are respectively tightly pressed with the table-shaped end faces of the upper copper base (2) and the lower copper base (3), a nut (11) penetrates through an upper countersunk head screw hole (17), a fastening screw hole (15) and a lower countersunk head screw hole (24), and the upper copper base (2), the ceramic bushing (1) and the lower copper base (3) are hermetically connected to form a closed cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429675.1A CN107317574B (en) | 2017-06-09 | 2017-06-09 | Self-cooling high-voltage pulse switch device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710429675.1A CN107317574B (en) | 2017-06-09 | 2017-06-09 | Self-cooling high-voltage pulse switch device |
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| CN107317574A CN107317574A (en) | 2017-11-03 |
| CN107317574B true CN107317574B (en) | 2020-08-11 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060010572A (en) * | 2004-07-28 | 2006-02-02 | 현대자동차주식회사 | Foldable apparatus of evaporator core in automobile |
| CN201022078Y (en) * | 2006-10-19 | 2008-02-13 | 株洲南车时代电气股份有限公司 | A center positioning power part |
| EP1906128A3 (en) * | 2003-10-27 | 2008-04-09 | Advanced Thermal Device Inc. | Heat transfer device |
| CN102169028A (en) * | 2011-01-20 | 2011-08-31 | 中国电力科学研究院 | System for measuring temperature in thyristor in real time |
| CN103579143A (en) * | 2013-11-04 | 2014-02-12 | 株洲南车时代电气股份有限公司 | Flat type power device packaging structure based on internal cooling heat dissipation |
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2017
- 2017-06-09 CN CN201710429675.1A patent/CN107317574B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1906128A3 (en) * | 2003-10-27 | 2008-04-09 | Advanced Thermal Device Inc. | Heat transfer device |
| KR20060010572A (en) * | 2004-07-28 | 2006-02-02 | 현대자동차주식회사 | Foldable apparatus of evaporator core in automobile |
| CN201022078Y (en) * | 2006-10-19 | 2008-02-13 | 株洲南车时代电气股份有限公司 | A center positioning power part |
| CN102169028A (en) * | 2011-01-20 | 2011-08-31 | 中国电力科学研究院 | System for measuring temperature in thyristor in real time |
| CN103579143A (en) * | 2013-11-04 | 2014-02-12 | 株洲南车时代电气股份有限公司 | Flat type power device packaging structure based on internal cooling heat dissipation |
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