CN107262943A - Ultrafast laser processes the devices and methods therefor of superfine back taper hole - Google Patents
Ultrafast laser processes the devices and methods therefor of superfine back taper hole Download PDFInfo
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- CN107262943A CN107262943A CN201710679561.2A CN201710679561A CN107262943A CN 107262943 A CN107262943 A CN 107262943A CN 201710679561 A CN201710679561 A CN 201710679561A CN 107262943 A CN107262943 A CN 107262943A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses the device and method that ultrafast laser processes superfine back taper hole, Laser Transmission module includes picosecond laser, times frequency module, polarizer and the beam expander being sequentially arranged along optic path direction, optical manufacturing module includes rotary-cut module and the light extraction mouth being sequentially arranged along optic path direction, the output end linking arrangement rotary-cut module of beam expander；Picosecond laser exports laser, output fundamental frequency light, two frequency doubled lights or frequency tripling light after being changed through frequency module again, the wave of output is linearly distributed the laser-beam transformation of linear polarization for wave is rounded or laser beam of elliptic systems circular polarization by the laser beam of times frequency module output by polarizer, and then light beam conduction is amplified into beam expander, obtain broader collimated light beam, collimated light beam after amplification is transmitted to rotary-cut module, rotary-cut module carries out the deviation angle adjustment of light beam, control processing hole pore size and taper, are most oriented to through light extraction mouth and export afterwards.It is easily achieved the processing of fine reverse taper holes.
Description
Technical field
The present invention relates to a kind of method of Laser Processing, and in particular to a kind of ultrafast laser processes the device of superfine back taper hole
And its method, belong to laser fine technical field.
Background technology
Structure of Mechanical Parts be miniaturized and the trend of precise treatment under, the superfine back taper hole of high aspect ratio Aero-Space,
The application in the fields such as space flight turbo blade, engine nozzle and precision instrument is more and more, required precision also more and more higher.Example
Superfine back taper shape spray orifice on such as Diesel engine atomizer can effectively improve the efficiency of combustion of fuel oil, reduce waste gas discharge,
And can further improve the discharge coefficient of fuel oil in its fuel-injected porch processing fillet.With reverse taper holes size shape
The gradually increase of shape and the continuous improvement of required precision, superfine back taper hole precision form and surface finishing difficulty, it is how real
The problem of processing of the existing superfine back taper hole that size is small, form accuracy is high, surface quality is good is a challenge.
The conventional processing technology of current superfine back taper shape spray orifice is to realize that hole adds using electrical discharge machining or Electrolyzed Processing
Work is shaped, and the surface quality of through hole is then improved using abrasive Flow crush and grind technique.Micro EDM obtains reverse taper holes
Electrode deflection mechanism or shaped electrode need to be used, although its forming efficiency is higher, but the loss of tool-electrode can not be avoided, shadow
The form accuracy in hole is rung, and the miniature hole machined in nonmetallic materials can not be realized.Though abrasive Flow crush and grind can be aided in
Reduction surface roughness improvement surface quality, but the form accuracy of abrasive Flow meeting destroying pores, and the abrasive particle remained in hole is clear
Wash relatively difficult.
Patent publication No. is the electrochemical machining method and device that CN201110144408.2 discloses a kind of superfine back taper hole, its
Technique is advance drilling or the through hole of electrical discharge machining one on workpiece, and then Electrolyzed Processing obtains back taper on the basis of the through hole
The secondary error of centralization of tool-electrode and through hole is larger in hole, its electrowinning process, and accuracy of alignment directly affects superfine back taper hole
Form accuracy, and due to needing secondary operation, so process is also more complicated, technical requirements are very high, and machining accuracy is difficult to
To good guarantee.
Laser Processing is developed rapidly in recent years, constantly shows the advantage that traditional processing hardly matches, with conspicuous characteristics, such as
CO2Laser and Nd：Though YAG laser processes micropore without tool loss, its surface quality is poor.Although femtosecond arteries and veins
The development of punching Laser Processing is with the potentiality for improving processing efficiency and surface quality, but its application is not still extensive.Comparatively, skin
Pulse per second (PPS) laser machines the maturation development because of its technology, can be good at overcoming above-mentioned variety of problems, and fine to processing
Taper hole need not carry out secondary operation, and surface topography is superior, precise fine is processed workpiece quality and obtain good guarantee.
The content of the invention
The purpose of the present invention is to overcome the shortcomings of that prior art is present to process superfine back taper hole there is provided a kind of ultrafast laser
Devices and methods therefor.
The purpose of the present invention is achieved through the following technical solutions：
Ultrafast laser processes the device of superfine back taper hole, and feature is：Include Laser Transmission module and optical manufacturing module, institute
Picosecond laser, times frequency module, polarizer and beam expander that Laser Transmission module includes being sequentially arranged along optic path direction are stated,
The optical manufacturing module includes rotary-cut module and the light extraction mouth being sequentially arranged along optic path direction, the output end rank of beam expander
Connect arrangement rotary-cut module.
Further, above-mentioned ultrafast laser processes the device of superfine back taper hole, wherein, the picosecond laser is wavelength
For 1030nm solid-state picosecond laser.
Further, above-mentioned ultrafast laser processes the device of superfine back taper hole, wherein, described times of frequency module is with ripple
Long 1030nm fundamental frequencies, the frequencys multiplication of wavelength 515nm bis-, three kinds of wave bands of wavelength 343nm frequency triplings export times frequency module of selection.
Further, above-mentioned ultrafast laser processes the device of superfine back taper hole, wherein, the rotary-cut module, which is included, to be used for
A pair of deflection wedges of control processing hole pore size and a pair of parallel wedge for controlling processing hole taper.
Further, above-mentioned ultrafast laser processes the device of superfine back taper hole, wherein, four light of the rotary-cut module
Wedge is coaxially sequentially arranged from top to bottom, and a pair of deflection wedges of top arrange that a pair of parallel wedge of lower section is in wedge surface opposite to each other
Wedge surface is positioned opposite.
The method that ultrafast laser of the present invention processes superfine back taper hole, picosecond laser output laser, is changed through frequency module again
Output fundamental frequency light, two frequency doubled lights or frequency tripling light afterwards, the laser beam of times frequency module output is by polarizer by the fluctuation of output
Form is linearly distributed the laser-beam transformation of linear polarization for wave is rounded or laser beam of elliptic systems circular polarization, and then
Light beam conduction is amplified into beam expander, is obtained broader collimated light beam, is then transmitted the collimated light beam after amplification to rotation
Module is cut, rotary-cut module carries out the deviation angle adjustment of light beam, control processing hole pore size and control processing hole taper, finally
It is oriented to and exports through light extraction mouth.
Further, the method that above-mentioned ultrafast laser processes superfine back taper hole, picosecond laser output wavelength is
1030nm light beam, it is defeated that wavelength 1030nm light beams are converted into the light beam that wavelength is 515nm or wavelength is 343nm by times frequency module
Go out, the light beam that its medium wavelength is 1030nm is fundamental frequency light, the light beam that wavelength is 515nm is two frequency doubled lights, and wavelength is 343nm light
Beam be frequency tripling light, three kinds of band of light it is available one of them exported.
The present invention has significant advantage and beneficial effect compared with prior art, embodies in the following areas：
Apparatus of the present invention compact conformation, method is succinct, reduces laser beam energy loss, is not contacted with processing workpiece,
Avoid interfering, no tool damage, it is easy to accomplish the processing of fine reverse taper holes, and hole surface quality is protected well
Card, is not required to carry out secondary operation, greatly improves processing efficiency, saved production cost.The cone in hole can be processed with flexible modulation
Size is spent, back taper aperture difference scope can reach 0~80um, compared with prior art, the scope of hole machined is more extensively and clever
It is living, it can greatly meet industrial requirement high-precision to cone hole machine.
Brief description of the drawings
Fig. 1：The light channel structure schematic diagram of apparatus of the present invention；
Fig. 2：The machining state schematic diagram of the present invention；
Fig. 3：The structural representation of rotary-cut module；
Fig. 4：The structural representation of wedge.
Embodiment
In order to which technical characteristic, purpose and effect to the present invention are more clearly understood from, specific implementation is now described in detail
Scheme.
As shown in figure 1, ultrafast laser processes the device of superfine back taper hole, Laser Transmission module and optical manufacturing mould are included
Group, Laser Transmission module includes picosecond laser 1, times frequency module 2, polarizer 3 and the expansion being sequentially arranged along optic path direction
Beam device 4, optical manufacturing module includes the rotary-cut module 5 that is sequentially arranged along optic path direction and light extraction mouth 6, beam expander 4 it is defeated
Go out end linking arrangement rotary-cut module 5.
Wherein, picosecond laser 1 is the solid-state picosecond laser that wavelength is 1030nm, with higher repetition rate peace
Equal power, by transient high power especially when being interacted with rapidoprint, occurs high temperature compared with low duty ratio and material and burns
Removal material has been lost, can greatly reduce heat-affected zone.
Times frequency module 2 is with wavelength 1030nm fundamental frequencies, the frequencys multiplication of wavelength 515nm bis-, three kinds of wave bands of wavelength 343nm frequency triplings
Export times frequency module of selection.
Beam expander 4 is that the less laser beam of diameter is expanded to the collimated laser beam being relatively large in diameter, and reaches that amplification light beam is straight
Footpath, diminution beam divergence angle, reduction power density reduce focal beam spot diameter, improve machining accuracy etc. to protect optical element
Purpose.
Rotary-cut module 5, which is included, is used for a pair of deflection wedges for controlling processing hole pore size and for controlling processing hole cone
The a pair of parallel wedge of degree.Four wedges (wedge 51, wedge 52, wedge 53, wedge 54) of rotary-cut module are coaxial from top to bottom
It is sequentially arranged, a pair of deflection wedges of top arrange that a pair of parallel wedge of lower section is positioned opposite in wedge surface in wedge surface opposite to each other.
Wherein deflection wedge (wedge 51, wedge 52), which is rotated about the axis, controls processed pore size, parallel wedge (light
Wedge 53) position is constant, processes the taper in hole in the translation distance control of axis direction by adjusting parallel wedge (wedge 54),
Wedge is glassware.
The method that ultrafast laser processes superfine back taper hole, the output laser of picosecond laser 1 is defeated after being changed through frequency module 2 again
Go out fundamental frequency light, two frequency doubled lights or frequency tripling light, the laser beam that times frequency module 2 is exported is by polarizer 3 by the fluctuation shape of output
Formula is linearly distributed the laser-beam transformation of linear polarization for wave is rounded or laser beam of elliptic systems circular polarization, Jin Erguang
Beam conduction is amplified into beam expander 4, is obtained broader collimated light beam, is then transmitted the collimated light beam after amplification to rotary-cut
Module 5, rotary-cut module 5 carries out the deviation angle adjustment of light beam, control processing hole pore size and control processing hole taper, finally
It is oriented to and exports through light extraction mouth 6, as shown in Fig. 2 light extraction mouth 6 is oriented on the scanning machining part 8 of light beam 7 of output.
The output wavelength of picosecond laser 1 is 1030nm light beam, and wavelength 1030nm light beams are converted into wavelength by times frequency module 2
The light beam output for being 343nm for 515nm or wavelength, the light beam that its medium wavelength is 1030nm is fundamental frequency light, and wavelength is 515nm light
Beam is two frequency doubled lights, and the light beam that wavelength is 343nm is frequency tripling light, three kinds of band of light it is available one of them exported.
A times selection for frequency module progress wavelength output is controlled by computer.
In summary, apparatus of the present invention compact conformation, method is succinct, laser beam energy loss is reduced, not with processing
Workpiece is contacted, it is to avoid interfered, no tool damage, it is easy to accomplish the processing of fine reverse taper holes, and hole surface quality is obtained
To good guarantee, it is not required to carry out secondary operation, greatly improves processing efficiency, saved production cost.Can be with flexible modulation institute
The taper size in hole is processed, back taper aperture difference scope can reach 0~80um, and compared with prior art, the scope of hole machined is more
Plus extensively and flexibly, can greatly meet industrial requirement high-precision to cone hole machine.
It should be noted that：The preferred embodiment of the present invention is the foregoing is only, the power of the present invention is not limited to
Sharp scope；Simultaneously more than description, should can understand and implement for the special personage of correlative technology field, thus it is other without departing from
The equivalent change or modification completed under disclosed spirit, should be included in claim.
Claims (7)
1. ultrafast laser processes the device of superfine back taper hole, it is characterised in that：Comprising Laser Transmission module and optical manufacturing module,
The Laser Transmission module is including the picosecond laser being sequentially arranged along optic path direction, times frequency module, polarizer and expands
Device, the optical manufacturing module includes rotary-cut module and the light extraction mouth being sequentially arranged along optic path direction, the output of beam expander
End linking arrangement rotary-cut module.
2. ultrafast laser according to claim 1 processes the device of superfine back taper hole, it is characterised in that：The picosecond laser
Device is the solid-state picosecond laser that wavelength is 1030nm.
3. ultrafast laser according to claim 1 processes the device of superfine back taper hole, it is characterised in that：Described times of frequency module
It is the frequency multiplication mould that selection is exported with wavelength 1030nm fundamental frequencies, the frequencys multiplication of wavelength 515nm bis-, three kinds of wave bands of wavelength 343nm frequency triplings
Block.
4. ultrafast laser according to claim 1 processes the device of superfine back taper hole, it is characterised in that：The rotary-cut module
Comprising for controlling a pair of deflection wedges of processing hole pore size and a pair of parallel wedge of hole taper being processed for control.
5. ultrafast laser according to claim 4 processes the device of superfine back taper hole, it is characterised in that：The rotary-cut module
Four wedges be coaxially sequentially arranged from top to bottom, a pair of of top deflection wedges arrange that a pair of lower section are flat in wedge surface opposite to each other
Row wedge is positioned opposite in wedge surface.
6. claim 1 described device realizes the method that ultrafast laser processes superfine back taper hole, it is characterised in that：Picosecond laser
Laser is exported, output fundamental frequency light, two frequency doubled lights or frequency tripling light after being changed through frequency module again, the laser beam of times frequency module output
The wave of output is linearly distributed for wave is rounded or ellipse by the laser-beam transformation of linear polarization by polarizer
The laser beam of circular polarization is distributed, and then light beam conduction is amplified into beam expander, is obtained broader collimated light beam, then will be put
Collimated light beam after big is transmitted to rotary-cut module, and rotary-cut module carries out the deviation angle adjustment of light beam, and control processing hole aperture is big
Small and taper, is most oriented to through light extraction mouth and exports afterwards.
7. the method that ultrafast laser according to claim 6 processes superfine back taper hole, it is characterised in that：Picosecond laser is defeated
Go out the light beam that wavelength is 1030nm, wavelength 1030nm light beams are converted into that wavelength is 515nm or wavelength is 343nm's by times frequency module
Light beam is exported, and the light beam that its medium wavelength is 1030nm is fundamental frequency light, and the light beam that wavelength is 515nm is two frequency doubled lights, and wavelength is
343nm light beam be frequency tripling light, three kinds of band of light it is available one of them exported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710679561.2A CN107262943A (en) | 2017-08-10 | 2017-08-10 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710679561.2A CN107262943A (en) | 2017-08-10 | 2017-08-10 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
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| Publication Number | Publication Date |
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| CN107262943A true CN107262943A (en) | 2017-10-20 |
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| CN201710679561.2A Pending CN107262943A (en) | 2017-08-10 | 2017-08-10 | Ultrafast laser processes the devices and methods therefor of superfine back taper hole |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107717215A (en) * | 2017-11-28 | 2018-02-23 | 温州大学 | Multi-functional ultra-fast laser assisted microprocessing system and method |
| CN111299859A (en) * | 2020-03-12 | 2020-06-19 | 中国航空制造技术研究院 | Ultrafast laser non-taper cutting system and cutting method |
| CN111331263A (en) * | 2020-03-28 | 2020-06-26 | 北京工业大学 | Device and method for accurately preparing turbine blade cooling hole by picosecond laser |
| WO2021036270A1 (en) * | 2019-08-30 | 2021-03-04 | 温州大学 | Femtosecond laser-machining hole drilling device having controllable taper, and hole drilling process thereof |
| CN113523613A (en) * | 2020-04-29 | 2021-10-22 | 中国科学院宁波材料技术与工程研究所 | Device and method for laser processing taper hole |
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