CN107127459A - A kind of laser accurate processing method of diamond cutter - Google Patents
A kind of laser accurate processing method of diamond cutter Download PDFInfo
- Publication number
- CN107127459A CN107127459A CN201710402479.5A CN201710402479A CN107127459A CN 107127459 A CN107127459 A CN 107127459A CN 201710402479 A CN201710402479 A CN 201710402479A CN 107127459 A CN107127459 A CN 107127459A
- Authority
- CN
- China
- Prior art keywords
- laser
- diamond cutter
- diamond
- cutter
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 132
- 239000010432 diamond Substances 0.000 title claims abstract description 132
- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000005520 cutting process Methods 0.000 claims abstract description 32
- 238000003754 machining Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 230000008569 process Effects 0.000 claims description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000002893 slag Substances 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 4
- 239000008187 granular material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910017435 S2 In Inorganic materials 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000003912 environmental pollution Methods 0.000 abstract description 6
- 238000000227 grinding Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910001018 Cast iron Inorganic materials 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 238000010892 electric spark Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 206010020843 Hyperthermia Diseases 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000036031 hyperthermia Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser accurate processing method of diamond cutter, comprises the following steps, S1：Choose the diamond cutter of undressed cutting edge, and with the thorough cleaning diamond tool surface of clean solution；S2：Diamond cutter after the completion of cleaning is fixed on work top；S3：Adjust the pulse laser focusing of the Three-Dimensional Dynamic focusing system for the Three-Dimensional Dynamic focusing system being processed to diamond cutter in diamond surface to be processed；S4：Diamond cutter is carried out using high-power low-speed rate laser slightly to cut machining；S5：Diamond cutter is finished according to blade shape using low power high speed laser；Diamond cutter cutting edge tidiness prepared by this method is high, and edge clear, environmental pollution is small, high in machining efficiency, product yield is high, and automation degree of controllability is high, compared to other method, no matter this method all shows obvious advantage in terms of the control of efficiency, cost and shape.
Description
[technical field]
The present invention relates to technical field of laser processing, more particularly to a kind of environmental pollution are small, high in machining efficiency, product is good
Product rate is high, the laser accurate processing method of the high diamond cutter of automation degree of controllability.
[background technology]
In Ultra-precision Turning, diamond cutter is to influence one of key factor of machined surface quality.
Conventional diamond cutter sharpening technology mainly has at present：Mechanical sharpening method, electric spark sharpening method and laser ablation
Method etc..
Mechanical grinding method is traditional diamond cutter sharpening process, and its essence is exactly diamond and diamond
To grinding.For commercial Application angle, mechanical grinding method technique is most simple, and equipment is also than less expensive.But this grinding method
It is limited to grind rotating disk, it is impossible to process high-precision shaped form diamond cutter.
Chinese patent CN105415099A discloses a kind of monocrystalline cutter preparation technology.Its step is：1) sorting, selection is suitable
The cutter for closing sword length is processed；2) face is thrown, the single-chip of well cutting is ground on cast iron abrasive disk；3) weld, throw
The good single-chip of light need to be cleaned up, and be matched with corresponding cutter hub, to ensure rake face to the height at cutter hub center, afterwards true
Welded in empty stove；4) roughly grind, roughly ground using skive；5) refine, fine grinding is enterprising in cast iron abrasive disk
OK, before grinding, first by bortz powder and olive oil or abrasive pastes are mixed into, are then coated with, in grinding panel surface, placing one section
Time makes abrasive pastes be fully infiltrated into the cast iron hole of abrasive disk, then is carried out back and forth in grinding panel surface with a larger diamond
Pre-grinding, further to strengthen tessellation of the bortz powder in cast iron hole, during grinding, typically fills the diamond of grinding
It is clipped on fixture, exposes the face that need to be ground, blade takes inverse mill, that is, grinding direction to point to cutter hub from blade during fine grinding, and
And on the premise of the amount of feeding is given, appropriate increase milling time.Machinery sharpening can efficiently process that to obtain surface clean and tidy
Diamond cutter, but this method can not process curved diamond cutter, and due to machinery sharpening have it is discontinuous
Percussion, obtained diamond cutter jaggedness and metamorphic layer thickness be larger, and surface roughness is also larger.
The removal of material is realized in the galvano-cautery effect that electric spark sharpening is discharged by high-frequency impulse between two electrodes.When processing
Each side as electrode of workpiece and instrument in machining medium by high frequency pulse power supply energy, machined material is produced
Electric discharge corrosiveness, the essence of this corrosiveness is the friction that machining medium ionizes the electronics to be formed or cation high-speed motion
Heating, and hit moment thawing and the blast action of the produced localized hyperthermia of electrode effect.
Chinese patent CN101327564A discloses a kind of processing method of diamond cutter cutting edge.Its step is：A) will
Required shape and size are ground to after tool matrix heat treatment；B) in diamond blade welding position relief grinding and blade kissing
Knife face after the tool matrix of conjunction, tool matrix should subtract 0.05-0.2mm than diamond blade compact dimensions, to enter to cutter
When row cutting edge is processed, tool matrix is not worked into；C) diamond blade is welded on tool matrix relevant position exactly；d)
By diamond blade with required shape is laser-cut into, 0.15mm surplus is uniformly flowed out；E) copper rod is pressed to diamond blade
The size and dimension smart car of cutting edge is installed on numerical control electric spark into electrode；F) by cutter positioning on the correct position of lathe,
Guarantee correctly to coincide with electrode；G) electrode rotary is made close to cutter, until forming suitable discharging gap；H) according to cutting edge
Surplus chooses the power parameters such as the rough machined electric current of electric spark, pulse width, makes electrode electric close to being produced during diamond blade
Erosion effect removes unnecessary diamond；I) electrode is redressed, the power supplys such as electric current, the pulse width of finishing ginseng is selected
Number, makes electrode produce galvanic corrosion close to diamond blade and plays finishing function, to obtain high-precision size, shape and cutting edge.Electricity
Erosion effect processing cutting edge, does not make the linearity and finish of cutting edge be significantly improved.
Laser ablation method makes irradiation table using 1-100Hz single beam or multi beam Nd-YAG laser irradiation diamond cutter surface
Face issues raw burn erosion in localized hyperthermia's effect.Using the instantaneous power density feature of laser ultrahigh, can moment to diamond tool
Tool produces small destruction, and due to the processing characteristics of laser, laser damage region is smaller, and acquisition tool surface is bright and clean, edge
Clearly.
[content of the invention]
To overcome the problems of prior art, a kind of environmental pollution of present invention offer is small, high in machining efficiency, product
Yields is high, the laser accurate processing method of the high diamond cutter of automation degree of controllability.
The scheme that the present invention solves technical problem is to provide the laser accurate processing method of diamond cutter a kind of, including with
Lower step,
S1：Choose the diamond cutter of undressed cutting edge, and with the thorough cleaning diamond tool surface of clean solution, it is ensured that
Tool surface free from admixture；
S2：Diamond cutter after the completion of being cleaned in step S1 is stably fixed on work top；
S3：The Three-Dimensional Dynamic focusing system for being processed to diamond cutter is adjusted, and is adjusted in synchronism laser
Focus, by the pulse laser focusing of the Three-Dimensional Dynamic focusing system on diamond surface to be processed, and it is different along with laser
Shape scans diamond；
S4：Diamond cutter is carried out along predetermined profile using high-power low-speed rate laser slightly to cut machining, and
Ensure reserved 10-20 μm allowance；
S5：The diamond cutter machined using low power high speed laser to step S4 carries out knife according to blade shape
Has the finishing of cutting edge；
S6：Repeat step S5, until processing obtains required diamond cutter cutting edge.
Preferably, before the step S3, using blowning installation to blowing oxygen above diamond cutter side, processing is blown away
During diamond cutter surface produce slag and dust granules.
Preferably, the clean solution cleaned in the step S1 to diamond cutter surface is that alcohol or acetone etc. are molten
Liquid.
Preferably, spiral is all presented to the process of diamond surface using laser in described step S4, S5 and S6
Shape processing mode；And the Three-Dimensional Dynamic focusing system, in the case where ensureing that external circuits are constant, the focussing plane of laser has
10mm depth of focus.
Preferably, rough machined laser is carried out to diamond cutter in the step S4 for 1-200W 1064nm to swash
Light device, pulsewidth 1ps-10ns, process velocity 50-200mm/s.
Preferably, rough machined laser is carried out to diamond cutter in the step S5 for 1-100W 1064nm to swash
Light device, pulsewidth 1ps-10ns, process velocity 10-100mm/s.
Preferably, in the step S2, after diamond cutter to be processed is fixed on work top, using CCD
Assisted detection system is detected to the position of diamond cutter, realizes accurate adjustable controllable automatic processing.
Preferably, the Three-Dimensional Dynamic focusing system includes laser, moving lens, amasthenic lens and galvanometer；Laser
The light of device transmitting is focused by reaching amasthenic lens after moving lens, is focused on the laser beam completed and is sent out at galvanometer position
Raw direction changes, and is consequently focused on diamond surface to be processed.
Preferably, the diamond cutter cutting edge is included after rake face, anterior angle, relief angle, cutting edge, helical angle, major flank, pair
Face, front cutting edge and row cut groove.
Compared with prior art, a kind of laser accurate processing method of diamond cutter of the invention is by using different capacity
Roughing and finishing are carried out to diamond cutter with the laser of speed, and using Three-Dimensional Dynamic focusing system in diamond tool
Tool surface forms laser special-shaped machined surface, not only realizes the high-precision diamond tool sharpening technique of cost effective, Er Qieke
Difficulty is prepared to solve curve diamond cutter, it is difficult to which the problems such as meeting required precision, prepared diamond cutter cutting edge is whole
Cleanliness is high, and edge clear, environmental pollution is small, high in machining efficiency, and product yield is high, and automation degree of controllability is high, compared to it
No matter his method, this method all shows obvious advantage in terms of the control of efficiency, cost and shape.
[brief description of the drawings]
Fig. 1 is a kind of process chart of the laser accurate processing method of diamond cutter of the invention.
[embodiment]
To make the purpose of the present invention, technical scheme and advantage are more clearly understood, below in conjunction with drawings and Examples, to this
Invention is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting this invention.
Referring to Fig. 1, a kind of laser accurate processing method of diamond cutter of the invention, comprises the following steps,
S1：Choose the diamond cutter of undressed cutting edge, and with the thorough cleaning diamond tool surface of clean solution, it is ensured that
Tool surface free from admixture；
S2：Diamond cutter after the completion of being cleaned in step S1 is stably fixed on work top；
S3：The Three-Dimensional Dynamic focusing system for being processed to diamond cutter is adjusted, and is adjusted in synchronism laser
Focus, by the pulse laser focusing of the Three-Dimensional Dynamic focusing system on diamond surface to be processed, and it is different along with laser
Shape scans diamond；On the diamond, along with laser special-shaped scanning diamond, focus is with optimization processing for pulse laser focusing
Figure layer synchronizing moving afterwards, shape needed for processing the special-shaped figure layer of optimization can be channel-shaped and Arbitrary groove profile figure.
S4：Diamond cutter is carried out along predetermined profile using high-power low-speed rate laser slightly to cut machining, and
Ensure reserved 10-20 μm allowance；
S5：The diamond cutter machined using low power high speed laser to step S4 carries out knife according to blade shape
Has the finishing of cutting edge；
S6：Repeat step S5, until processing obtains required diamond cutter cutting edge.
The application carries out roughing and finishing to diamond cutter by using different capacity and the laser of speed, and
Laser special-shaped machined surface is formed on diamond cutter surface using Three-Dimensional Dynamic focusing system, the height of cost effective is not only realized
Precision diamond cutter processing technology, and it is difficult to solve the preparation of curve diamond cutter, it is difficult to meet required precision etc.
Problem, prepared diamond cutter cutting edge tidiness is high, and edge clear, environmental pollution is small, high in machining efficiency, product non-defective unit
Rate is high, and automation degree of controllability is high, compared to other method, this method no matter in terms of the control of efficiency, cost and shape all tables
Reveal obvious advantage.
Preferably, before the step S3, using blowning installation to blowing oxygen above diamond cutter side, processing is blown away
During diamond cutter surface produce slag and dust granules.On the one hand applying for blowning installation can improve laser ablation
The efficiency and precision of diamond, on the other hand in process can blow the slag and dust granules on diamond cutter surface
Walk, it is to avoid slag formation solidification layer and diamond particles when diamond is processed are splashed to undressed region, cause tool surface
Micro-crack is produced, the surface smoothness of diamond cutter is reduced.
Preferably, the clean solution cleaned in the step S1 to diamond cutter surface is that alcohol or acetone etc. are molten
Liquid.Ensure that tool surface is clean and tidy.
Preferably, spiral is all presented to the process of diamond surface using laser in described step S4, S5 and S6
Shape processing mode；And the Three-Dimensional Dynamic focusing system, in the case where ensureing that external circuits are constant, the focussing plane of laser has
10mm depth of focus.
Preferably, rough machined laser is carried out to diamond cutter in the step S4 for 1-200W 1064nm to swash
Light device, pulsewidth 1ps-10ns, process velocity 50-200mm/s.
Preferably, rough machined laser is carried out to diamond cutter in the step S5 for 1-100W 1064nm to swash
Light device, pulsewidth 1ps-10ns, process velocity 10-100mm/s.
Preferably, in the step S2, after diamond cutter to be processed is fixed on work top, using CCD
Assisted detection system is detected to the position of diamond cutter, realizes accurate adjustable controllable automatic processing.
Preferably, the Three-Dimensional Dynamic focusing system includes laser, moving lens, amasthenic lens and galvanometer；Laser
The light of device transmitting is focused by reaching amasthenic lens after moving lens, is focused on the laser beam completed and is sent out at galvanometer position
Raw direction changes, and is consequently focused on diamond surface to be processed.
Preferably, the diamond cutter cutting edge is included after rake face, anterior angle, relief angle, cutting edge, helical angle, major flank, pair
Face, front cutting edge and row cut groove.Its structure can be arbitrary surface.
The advantage of the invention is that：
1) laser has the characteristic such as noncontact, nonpollution environment, easy to control, easily realizes Automated condtrol and environmental protection
Technological requirement；
2) graphics processing and the controllable inhibition and generation of machining path and easy programming, efficiency high, automaticity are high；
3) edge surface prepared by the present invention is smooth, clear-cut.Using the instantaneous power density feature of laser ultrahigh,
Moment small destruction can be produced to diamond cutter, and due to the processing characteristics of laser, laser damage region is smaller (can be with
Reach several microns even sub-micrometer scale), the influence to destroyed area adjacent material is smaller, forms the broken of unusual light
Error area；
4) present invention realizes that the optional position in diamond is focused on by Three-Dimensional Dynamic focusing system, according to dynamic focusing
Diode laser feature realizes that arbitrary region processes any shape in diamond, greatly alleviates traditional special-shaped cutter processing and passes through
The multi-shaft interlocked workload for carrying out unnecessary diamond removal simultaneously improves formed precision, greatly improve Laser Processing efficiency and
Quality；
6) cutting edge prepared by the present invention is artificial controllable.By controlling the parameters such as laser energy, laser scanning speed can
To realize the width and depth of cutting edge；
Compared with prior art, a kind of laser accurate processing method of diamond cutter of the invention is by using different capacity
Roughing and finishing are carried out to diamond cutter with the laser of speed, and using Three-Dimensional Dynamic focusing system in diamond tool
Tool surface forms laser special-shaped machined surface, not only realizes the high-precision diamond tool sharpening technique of cost effective, Er Qieke
Difficulty is prepared to solve curve diamond cutter, it is difficult to which the problems such as meeting required precision, prepared diamond cutter cutting edge is whole
Cleanliness is high, and edge clear, environmental pollution is small, high in machining efficiency, and product yield is high, and automation degree of controllability is high, compared to it
No matter his method, this method all shows obvious advantage in terms of the control of efficiency, cost and shape.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (9)
1. a kind of laser accurate processing method of diamond cutter, it is characterised in that：Comprise the following steps,
S1：Choose the diamond cutter of undressed cutting edge, and with the thorough cleaning diamond tool surface of clean solution, it is ensured that cutter
Surface free from admixture；
S2：Diamond cutter after the completion of being cleaned in step S1 is stably fixed on work top；
S3：Adjust the Three-Dimensional Dynamic focusing system for being processed to diamond cutter, and be adjusted in synchronism laser spot,
By the pulse laser focusing of the Three-Dimensional Dynamic focusing system on diamond surface to be processed, and along with laser special-shaped scanning
Diamond；
S4：Diamond cutter is carried out along predetermined profile using high-power low-speed rate laser slightly to cut machining, and ensure
Reserved 10-20 μm allowance；
S5：The diamond cutter machined using low power high speed laser to step S4 carries out tool blade according to blade shape
The finishing of mouth；
S6：Repeat step S5, until processing obtains required diamond cutter cutting edge.
2. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：The step S3
Before, blow away diamond cutter surface in process to blowing oxygen above diamond cutter side using blowning installation and produce
Slag and dust granules.
3. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：The step S1
In the clean solution that is cleaned to diamond cutter surface be alcohol or acetone.
4. a kind of laser accurate processing method of diamond cutter as claimed in claim 1 or 2, it is characterised in that：The step
Helical form processing mode is all presented to the process of diamond surface using laser in rapid S4, S5 and S6；And the three-dimensional is dynamic
State focusing system is in the case where ensureing that external circuits are constant, and the focussing plane of laser has 10mm depth of focus.
5. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：The step S4
In the laser that rough machined laser is 1-200W 1064nm, pulsewidth 1ps-10ns, process velocity are carried out to diamond cutter
50-200mm/s。
6. a kind of laser accurate processing method of diamond cutter as described in claim 1 or 5, it is characterised in that：The step
The laser that rough machined laser is 1-100W 1064nm, pulsewidth 1ps-10ns, processing are carried out in rapid S5 to diamond cutter
Speed 10-100mm/s.
7. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：The step S2
In, after diamond cutter to be processed is fixed on work top, using CCD assisted detection systems to diamond cutter
Position is detected, realizes accurate adjustable controllable automatic processing.
8. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：It is described three-dimensional dynamic
State focusing system includes laser, moving lens, amasthenic lens and galvanometer；After the light of laser transmitting is by moving lens
Reach amasthenic lens to be focused, focus on the laser beam completed and occur direction at galvanometer position and change, and be consequently focused on and treat
On the diamond surface of processing.
9. a kind of laser accurate processing method of diamond cutter as claimed in claim 1, it is characterised in that：The diamond
Cutting edge roundness cuts groove including rake face, anterior angle, relief angle, cutting edge, helical angle, major flank, minor flank, front cutting edge and row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710402479.5A CN107127459B (en) | 2017-06-01 | 2017-06-01 | A kind of laser accurate processing method of diamond cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710402479.5A CN107127459B (en) | 2017-06-01 | 2017-06-01 | A kind of laser accurate processing method of diamond cutter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107127459A true CN107127459A (en) | 2017-09-05 |
| CN107127459B CN107127459B (en) | 2019-04-05 |
Family
ID=59734221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710402479.5A Expired - Fee Related CN107127459B (en) | 2017-06-01 | 2017-06-01 | A kind of laser accurate processing method of diamond cutter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107127459B (en) |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| CN109048080A (en) * | 2018-09-12 | 2018-12-21 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109048079A (en) * | 2018-09-10 | 2018-12-21 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109128528A (en) * | 2018-10-17 | 2019-01-04 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109290591A (en) * | 2018-12-14 | 2019-02-01 | 廊坊西波尔钻石技术有限公司 | A kind of welded type superhard cutting blade |
| CN109623307A (en) * | 2019-01-22 | 2019-04-16 | 厦门鸿鹭联创工具有限公司 | High length-diameter ratio precision cutting tool processing method |
| CN109676258A (en) * | 2019-01-21 | 2019-04-26 | 南京航空航天大学 | A kind of micro- milling cutter preparation method of cvd diamond based on laser and accurate sharpening |
| CN109926731A (en) * | 2017-12-18 | 2019-06-25 | 夏浥 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
| CN109954978A (en) * | 2019-04-26 | 2019-07-02 | 哈尔滨工业大学 | Femtosecond laser system of processing for nano twin crystal diamond cutter and based on the processing method of the system |
| CN110039265A (en) * | 2019-05-14 | 2019-07-23 | 亿和塑胶电子制品(深圳)有限公司 | A kind of printer cleaning doctor processing technology and fixture |
| CN110202266A (en) * | 2019-05-14 | 2019-09-06 | 中国电子科技集团公司第三十八研究所 | A kind of regulation method of femtosecond laser processing diamond microflute cross sectional shape |
| CN110480188A (en) * | 2019-08-29 | 2019-11-22 | 燕山大学 | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping |
| CN111098039A (en) * | 2019-12-20 | 2020-05-05 | 西安交通大学 | Ultraviolet nanosecond laser cutting method of PCD (Poly Crystal Diamond) turning cutter |
| CN111331259A (en) * | 2020-02-26 | 2020-06-26 | 上海交通大学 | Method and device for processing high-precision monocrystal diamond arc cutter by using laser |
| CN111375900A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Complex-profile cutter laser processing method based on three-dimensional shaping focal spot |
| CN111375899A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Laser processing and forming method for large-curvature curved surface |
| CN111375901A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| CN111822865A (en) * | 2019-04-15 | 2020-10-27 | 汇专科技集团股份有限公司 | Laser processing method of integral PCD cutter |
| WO2021020007A1 (en) * | 2019-08-01 | 2021-02-04 | 住友電工ハードメタル株式会社 | Cutting tool manufacturing method and cutting tool |
| CN112461266A (en) * | 2020-11-20 | 2021-03-09 | 大连理工大学 | Diamond gyro harmonic oscillator nano-manufacturing equipment |
| CN112620947A (en) * | 2020-12-01 | 2021-04-09 | 贵州大学 | Laser preparation method of vein bionic surface diamond cutting tool |
| CN113070564A (en) * | 2021-04-19 | 2021-07-06 | 河南景链新材料有限公司 | Method for rapidly processing polycrystalline diamond compact by using laser |
| CN114260590A (en) * | 2021-12-08 | 2022-04-01 | 西安晟光硅研半导体科技有限公司 | SiC cutting device based on multi-power micro-jet laser and cutting method thereof |
| CN114850517A (en) * | 2022-02-23 | 2022-08-05 | 深圳精匠云创科技有限公司 | Polycrystalline diamond cutter and machining method thereof |
| CN114985978A (en) * | 2022-06-30 | 2022-09-02 | 长沙中拓创新科技有限公司 | Diamond processing laser lathe and processing technology |
| CN115519185A (en) * | 2022-11-11 | 2022-12-27 | 临沂友诚制锯技术服务有限公司 | Machining process for machining two sides of PCD diamond saw teeth by utilizing laser |
| CN115673420A (en) * | 2022-11-11 | 2023-02-03 | 临沂友诚制锯技术服务有限公司 | Diamond sawtooth back angle laser processing technology |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213735A (en) * | 2018-01-16 | 2018-06-29 | 广东工业大学 | It is a kind of without graphitization complex outline PCD molding cutter cutting edge laser processings |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2812938A1 (en) * | 1977-03-24 | 1978-09-28 | Lloyd R Oliver | Hollow cutter used in retreading tyres - has two cutting edges at each end to permit cut material to pass through |
| CN101327564A (en) * | 2008-07-30 | 2008-12-24 | 威海威硬工具有限公司 | Method for processing cutting edge of diamond compound tool |
| CN102248302A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Device and method for abnormally cutting toughened glass by ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| CN104440004A (en) * | 2014-11-14 | 2015-03-25 | 深圳市迈高机械工具有限公司 | PCD tool cutting edge processing method |
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| CN105149790A (en) * | 2015-07-10 | 2015-12-16 | 西安交通大学 | Deep machining method and system for annular diamond cutter of millimeter and submillimeter size |
| CN105269284A (en) * | 2015-09-09 | 2016-01-27 | 无锡国宏硬质合金模具刃具有限公司 | Ultra-precise efficient preparing technology method of inward-concave PCD cutter with complex outline |
| CN105269283A (en) * | 2015-09-09 | 2016-01-27 | 无锡国宏硬质合金模具刃具有限公司 | Preparing method of PCD cutter long in service life |
| CN106312341A (en) * | 2016-11-11 | 2017-01-11 | 北京工业大学 | Work fixture, device and method for machining tool edge |
-
2017
- 2017-06-01 CN CN201710402479.5A patent/CN107127459B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2812938A1 (en) * | 1977-03-24 | 1978-09-28 | Lloyd R Oliver | Hollow cutter used in retreading tyres - has two cutting edges at each end to permit cut material to pass through |
| CN101327564A (en) * | 2008-07-30 | 2008-12-24 | 威海威硬工具有限公司 | Method for processing cutting edge of diamond compound tool |
| CN102248302A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Device and method for abnormally cutting toughened glass by ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| CN104440004A (en) * | 2014-11-14 | 2015-03-25 | 深圳市迈高机械工具有限公司 | PCD tool cutting edge processing method |
| CN105149790A (en) * | 2015-07-10 | 2015-12-16 | 西安交通大学 | Deep machining method and system for annular diamond cutter of millimeter and submillimeter size |
| CN105127604A (en) * | 2015-09-06 | 2015-12-09 | 深圳英诺激光科技有限公司 | Laser processing system and method |
| CN105269284A (en) * | 2015-09-09 | 2016-01-27 | 无锡国宏硬质合金模具刃具有限公司 | Ultra-precise efficient preparing technology method of inward-concave PCD cutter with complex outline |
| CN105269283A (en) * | 2015-09-09 | 2016-01-27 | 无锡国宏硬质合金模具刃具有限公司 | Preparing method of PCD cutter long in service life |
| CN106312341A (en) * | 2016-11-11 | 2017-01-11 | 北京工业大学 | Work fixture, device and method for machining tool edge |
Cited By (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109926731A (en) * | 2017-12-18 | 2019-06-25 | 夏浥 | A kind of method and device for the preparation of diamond cutter femtosecond laser |
| CN108941715A (en) * | 2018-06-29 | 2018-12-07 | 南京航空航天大学 | A kind of preparation method of the micro- milling cutter of cvd diamond |
| CN109048079A (en) * | 2018-09-10 | 2018-12-21 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109048080A (en) * | 2018-09-12 | 2018-12-21 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109128528A (en) * | 2018-10-17 | 2019-01-04 | 基准精密工业（惠州）有限公司 | The laser processing of cutter |
| CN109290591A (en) * | 2018-12-14 | 2019-02-01 | 廊坊西波尔钻石技术有限公司 | A kind of welded type superhard cutting blade |
| CN109676258A (en) * | 2019-01-21 | 2019-04-26 | 南京航空航天大学 | A kind of micro- milling cutter preparation method of cvd diamond based on laser and accurate sharpening |
| CN109623307A (en) * | 2019-01-22 | 2019-04-16 | 厦门鸿鹭联创工具有限公司 | High length-diameter ratio precision cutting tool processing method |
| CN111822865A (en) * | 2019-04-15 | 2020-10-27 | 汇专科技集团股份有限公司 | Laser processing method of integral PCD cutter |
| CN109954978A (en) * | 2019-04-26 | 2019-07-02 | 哈尔滨工业大学 | Femtosecond laser system of processing for nano twin crystal diamond cutter and based on the processing method of the system |
| CN110202266A (en) * | 2019-05-14 | 2019-09-06 | 中国电子科技集团公司第三十八研究所 | A kind of regulation method of femtosecond laser processing diamond microflute cross sectional shape |
| CN110039265B (en) * | 2019-05-14 | 2024-04-09 | 亿和塑胶电子制品(深圳)有限公司 | Machining process for cleaning scraper of printer |
| CN110039265A (en) * | 2019-05-14 | 2019-07-23 | 亿和塑胶电子制品(深圳)有限公司 | A kind of printer cleaning doctor processing technology and fixture |
| JP7001245B2 (en) | 2019-08-01 | 2022-01-19 | 住友電工ハードメタル株式会社 | How to manufacture cutting tools |
| JPWO2021020007A1 (en) * | 2019-08-01 | 2021-09-13 | 住友電工ハードメタル株式会社 | Cutting tool manufacturing method and cutting tool |
| US12030143B2 (en) | 2019-08-01 | 2024-07-09 | Sumitomo Electric Hardmetal Corp. | Method for manufacturing a cutting tool, and the cutting tool |
| WO2021020007A1 (en) * | 2019-08-01 | 2021-02-04 | 住友電工ハードメタル株式会社 | Cutting tool manufacturing method and cutting tool |
| CN110480188A (en) * | 2019-08-29 | 2019-11-22 | 燕山大学 | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping |
| CN111098039B (en) * | 2019-12-20 | 2021-05-28 | 西安交通大学 | Ultraviolet nanosecond laser cutting method of PCD (Poly Crystal Diamond) turning cutter |
| CN111098039A (en) * | 2019-12-20 | 2020-05-05 | 西安交通大学 | Ultraviolet nanosecond laser cutting method of PCD (Poly Crystal Diamond) turning cutter |
| CN111331259B (en) * | 2020-02-26 | 2021-11-12 | 上海交通大学 | Method and device for processing high-precision monocrystal diamond arc cutter by using laser |
| CN111331259A (en) * | 2020-02-26 | 2020-06-26 | 上海交通大学 | Method and device for processing high-precision monocrystal diamond arc cutter by using laser |
| CN111375901A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| CN111375899A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Laser processing and forming method for large-curvature curved surface |
| CN111375900A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Complex-profile cutter laser processing method based on three-dimensional shaping focal spot |
| WO2021190533A1 (en) * | 2020-03-25 | 2021-09-30 | 广东工业大学 | Laser machining forming method for large-curvature curved surface |
| WO2021190534A1 (en) * | 2020-03-25 | 2021-09-30 | 广东工业大学 | Complex surface cutter laser machining method based on three-dimensional shaping focal spot |
| CN111375901B (en) * | 2020-03-25 | 2021-10-15 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| CN112461266A (en) * | 2020-11-20 | 2021-03-09 | 大连理工大学 | Diamond gyro harmonic oscillator nano-manufacturing equipment |
| CN112461266B (en) * | 2020-11-20 | 2023-04-11 | 大连理工大学 | Diamond gyro harmonic oscillator nano-manufacturing equipment |
| CN112620947A (en) * | 2020-12-01 | 2021-04-09 | 贵州大学 | Laser preparation method of vein bionic surface diamond cutting tool |
| CN113070564A (en) * | 2021-04-19 | 2021-07-06 | 河南景链新材料有限公司 | Method for rapidly processing polycrystalline diamond compact by using laser |
| CN114260590A (en) * | 2021-12-08 | 2022-04-01 | 西安晟光硅研半导体科技有限公司 | SiC cutting device based on multi-power micro-jet laser and cutting method thereof |
| CN114850517A (en) * | 2022-02-23 | 2022-08-05 | 深圳精匠云创科技有限公司 | Polycrystalline diamond cutter and machining method thereof |
| CN114985978A (en) * | 2022-06-30 | 2022-09-02 | 长沙中拓创新科技有限公司 | Diamond processing laser lathe and processing technology |
| CN114985978B (en) * | 2022-06-30 | 2023-08-18 | 长沙中拓创新科技有限公司 | Diamond processing laser lathe and processing technology |
| CN115519185A (en) * | 2022-11-11 | 2022-12-27 | 临沂友诚制锯技术服务有限公司 | Machining process for machining two sides of PCD diamond saw teeth by utilizing laser |
| CN115673420A (en) * | 2022-11-11 | 2023-02-03 | 临沂友诚制锯技术服务有限公司 | Diamond sawtooth back angle laser processing technology |
| CN115519185B (en) * | 2022-11-11 | 2023-03-21 | 临沂友诚制锯技术服务有限公司 | Machining process for machining two sides of PCD diamond saw teeth by utilizing laser |
| CN115673420B (en) * | 2022-11-11 | 2023-04-07 | 临沂友诚制锯技术服务有限公司 | Diamond sawtooth back angle laser processing technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107127459B (en) | 2019-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107127459B (en) | A kind of laser accurate processing method of diamond cutter | |
| CN101767252B (en) | Laser tool grinding method and tool grinding machine | |
| CN104999176B (en) | The processing method of cutting edge | |
| CN108081137B (en) | A kind of grinding wheel double excitation trimming device and method with gas-liquid parallel connection tubular type | |
| CN107127583A (en) | Ultrasonic cutting is applied to the equipment and processing method in powder feeding formula increase and decrease material composite manufacturing | |
| CN201632768U (en) | Laser tool blade milling machine | |
| CN103802039B (en) | A kind of concave curved surface super-abrasive grinding wheel laser finishing device and method | |
| CN114571064B (en) | Laser-induced oxidation auxiliary milling composite processing device and method | |
| Ding et al. | Diamond wheel dressing: A comprehensive review | |
| CN103042468B (en) | Method for roughly trimming diamond grinding wheel | |
| CN106498389B (en) | The laser cladding apparatus of the gentle cold light of preheating is generated based on multi-focus lens | |
| EP0191203A2 (en) | Cutting tool structures, apparatus and method for making same | |
| CN101327564A (en) | Method for processing cutting edge of diamond compound tool | |
| WO2017088209A1 (en) | Laser beam machining center | |
| CN109454326A (en) | A kind of transparent material laser-assisted machining processing method | |
| WO2021190530A1 (en) | Processing method for tool having complex cutting edge using combined laser | |
| CN109514103A (en) | A kind of system of processing and processing method of glass cover-plate | |
| CN108581844A (en) | The device and method of short wavelength's ultrafast laser finishing metal binding agent skive | |
| Hao et al. | Fabrication of large aspect ratio PCD micro-milling tool with pulsed lasers and grinding | |
| CN101190503A (en) | Method for finishing resin binding agent diamond abrasive wheel by combining laser and machinery | |
| CN109967804B (en) | Micro turning tool front tool surface texture derivative cutting inhibition processing method | |
| CN208772489U (en) | A kind of chip breaking device of PCD cutter | |
| JP6980320B2 (en) | Laser machining method of workpiece and manufacturing method of cutting tool | |
| CN112935559A (en) | Method for manufacturing molding grinding wheel based on ultrashort pulse water-guided laser | |
| CN101190505A (en) | Method for finishing metal binding agent diamond abrasive wheel by combining laser and machinery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |