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CN107043258A - The manufacture method of notebook computer fin - Google Patents

The manufacture method of notebook computer fin Download PDF

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Publication number
CN107043258A
CN107043258A CN201710095581.5A CN201710095581A CN107043258A CN 107043258 A CN107043258 A CN 107043258A CN 201710095581 A CN201710095581 A CN 201710095581A CN 107043258 A CN107043258 A CN 107043258A
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CN
China
Prior art keywords
parts
kapton
graphite
warming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710095581.5A
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Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
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Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201710095581.5A priority Critical patent/CN107043258A/en
Publication of CN107043258A publication Critical patent/CN107043258A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/12—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein one or more rollers exert pressure on the material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/616—Liquid infiltration of green bodies or pre-forms
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient

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  • Theoretical Computer Science (AREA)
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  • Health & Medical Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

A kind of manufacture method of notebook computer fin of the present invention, the fin is obtained by following steps：Be respectively coated on the upper and lower surface of Kapton graphite modified dose handled after Kapton, the Kapton after processing is made up of Kapton, the first coat and the second coat；By the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C are risen to from room temperature, 480 DEG C ~ 500 DEG C are risen to after insulation, 780 DEG C ~ 820 DEG C are warming up to after insulation again, rises to after 1200 DEG C and cools down after insulation, so as to obtain the carbonized film of pre-burned；Carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, is incubated, then is warming up to cooling after 2850 DEG C ~ 2950 DEG C, so as to obtain the graphite film of main firing.The present invention improves crystallinity simultaneously, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance.

Description

The manufacture method of notebook computer fin
Technical field
The present invention relates to a kind of manufacture method of notebook computer fin, belong to graphite flake technical field.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment（Such as notebook computer, mobile phone, tablet personal computer）Increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, the heat produced by operation is difficult Discharge, be easy to rapid accumulation and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment is normally run.
Kapton is mostly used for flexible PCB in the prior art, although has and is obtained using polyimide film sintered Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, there is following technical problem：Radiating is uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improves product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
The content of the invention
Objects of the present invention are to provide a kind of manufacture method of notebook computer fin, what the manufacturing process was obtained Fin is both vertically and horizontally improving heat conductivility, it is to avoid hot-spot, realizes the uniform of heat conductivility While property, heat dispersion stability, the reliability of product are improved, the cost of product is greatly reduced.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of system of notebook computer fin Method is made, the graphite heat radiation fin is obtained by following steps：
Step 1: be respectively coated on the upper and lower surface of Kapton graphite modified dose handled after polyimides it is thin Film, the Kapton after processing is made up of Kapton, the first coat and the second coat；
The graphite modified dose of component by following parts by weight is constituted：
20 parts of benzophenone tetracarboxylic dianhydride,
12 parts of pyromellitic acid anhydride,
28 parts of MDA,
25 parts of dimethylformamide,
8 parts of 1-METHYLPYRROLIDONE,
2.5 parts of ethylene glycol,
3 parts of dimethyl silicone polymer,
1.4 parts of dibutyl phthalate；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C, insulation are risen to from room temperature After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after insulation again, risen to after insulation after 1200 DEG C cool down, so as to obtain pre- The carbonized film of firing；
Step 3: carbonized film is warming up into 2350 DEG C ~ 2450 DEG C, it is incubated, then is warming up to cooling after 2850 DEG C ~ 2950 DEG C, so that Obtain the graphite film of main firing；
Step 4: then the graphite film of the main firing obtained by step 3 is carried out calendering to obtain the heat conduction graphite patch.
Because above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1st, graphite linings are coated with one layer by upper and lower surface in the manufacture method of notebook computer fin of the present invention, its structure Graphite modified dose of Kapton is prepared from, and is improved in heat conductivility both vertically and horizontally, it is to avoid glue Band hot-spot, realizes the uniformity of adhesive tape heat conductivility；Next, it is located at graphite modified dose of Kapton surface By benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly dimethyl Siloxanes is constituted, and is coated on Kapton, is filled with the pin hole in heating process, improves crystallinity simultaneously, also gram Take thermal contraction excessive caused uneven, improve graphite linings biaxial tension performance.
2nd, the manufacture method of notebook computer fin of the present invention, it is located at the graphite modified of Kapton surface Agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, N- crassitudes Ketone, ethylene glycol, dimethyl silicone polymer composition, using dimethylformamide, 1-METHYLPYRROLIDONE reduce azeotropic point and Smooth boiling point area, improves the flatness and pliability of final products film forming；；Secondly, dimethylformamide, N- methylpyrroles Alkanone and dibutyl phthalate Kapton surface, prevent bubble from producing, are more beneficial for filled polyimide film Small pin hole, improve radiating paster heat conductivility uniformity.
3rd, the manufacture method of notebook computer fin of the present invention, increases between the carbonized film and graphitization of pre-burned Calendaring processes, and re-form and roll again after heat conduction graphite patch, it is to avoid the volume in fold and graphitization sintering process Shrink, improve compactness and crystallinity, further increase in heat conductivility both vertically and horizontally.
Embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of manufacture method of notebook computer fin, the graphite heat radiation fin is obtained by following steps：
Step 1: be respectively coated on the upper and lower surface of Kapton graphite modified dose handled after polyimides it is thin Film, the Kapton after processing is made up of Kapton, the first coat and the second coat；
The graphite modified dose of component by following parts by weight is constituted：
20 parts of benzophenone tetracarboxylic dianhydride,
12 parts of pyromellitic acid anhydride,
28 parts of MDA,
25 parts of dimethylformamide,
8 parts of 1-METHYLPYRROLIDONE,
2.5 parts of ethylene glycol,
3 parts of dimethyl silicone polymer,
1.4 parts of dibutyl phthalate；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C, insulation are risen to from room temperature After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after insulation again, risen to after insulation after 1200 DEG C cool down, so as to obtain pre- The carbonized film of firing；
Step 3: carbonized film is warming up into 2350 DEG C ~ 2450 DEG C, it is incubated, then is warming up to cooling after 2850 DEG C ~ 2950 DEG C, so that Obtain the graphite film of main firing；
Step 4: then the graphite film of the main firing obtained by step 3 is carried out calendering to obtain the heat conduction graphite patch.
Above-mentioned graphite modified dose of viscosity is 30000 ~ 48000CP.
A kind of manufacturing process of above-mentioned graphite heat radiation fin, comprises the following steps：
Step 1: be respectively coated on the upper and lower surface of Kapton graphite modified dose handled after polyimides it is thin Film, the Kapton after processing is made up of Kapton, the first coat and the second coat, described graphite modified The viscosity of agent is 30000 ~ 48000CP；
The graphite modified dose of component by following parts by weight is constituted：
20 parts of benzophenone tetracarboxylic dianhydride,
12 parts of pyromellitic acid anhydride,
28 parts of MDA,
25 parts of dimethylformamide,
8 parts of 1-METHYLPYRROLIDONE,
2.5 parts of ethylene glycol,
3 parts of dimethyl silicone polymer,
1.4 parts of dibutyl phthalate；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C, insulation are risen to from room temperature After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after insulation again, risen to after insulation after 1200 DEG C cool down, so as to obtain pre- The carbonized film of firing；
Step 3: carbonized film is warming up into 2350 DEG C ~ 2450 DEG C, it is incubated, then is warming up to cooling after 2850 DEG C ~ 2950 DEG C, so that Obtain the graphite film of main firing；
Step 4: then the graphite film of the main firing obtained by step 3 is carried out calendering to obtain the heat conduction graphite patch.
During using above-mentioned manufacturing process, obtain and be coated with for graphite linings in graphite heat radiation fin its structure by upper and lower surface One layer graphite modified dose of Kapton is prepared from, and is improved in heat conductivility both vertically and horizontally, is kept away Exempt from adhesive tape hot-spot, realize the uniformity of adhesive tape heat conductivility；Secondly, its graphite for being located at Kapton surface changes Property agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- two Methylsiloxane is constituted, and is coated on Kapton, is filled with the pin hole in heating process, improves crystallinity simultaneously, Also overcome thermal contraction excessive caused uneven, improve graphite linings biaxial tension performance, also reduce azeotropic point and put down Sliding boiling point area, improves the flatness and pliability of final products film forming；Again, there is graphite to change on Kapton surface Property agent, improve graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and the pre-burned is rolled using calender Carbonized film, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and crystallinity, further improves In heat conductivility both vertically and horizontally.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.

Claims (1)

1. a kind of manufacture method of notebook computer fin, it is characterised in that：The fin is obtained by following steps：
Step 1: be respectively coated on the upper and lower surface of Kapton graphite modified dose handled after polyimides it is thin Film, the Kapton after processing is made up of Kapton, the first coat and the second coat；
The graphite modified dose of component by following parts by weight is constituted：
20 parts of benzophenone tetracarboxylic dianhydride,
12 parts of pyromellitic acid anhydride,
28 parts of MDA,
25 parts of dimethylformamide,
8 parts of 1-METHYLPYRROLIDONE,
2.5 parts of ethylene glycol,
3 parts of dimethyl silicone polymer,
1.4 parts of dibutyl phthalate；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C, insulation are risen to from room temperature After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after insulation again, risen to after insulation after 1200 DEG C cool down, so as to obtain pre- The carbonized film of firing；
Step 3: carbonized film is warming up into 2350 DEG C ~ 2450 DEG C, it is incubated, then is warming up to cooling after 2850 DEG C ~ 2950 DEG C, so that Obtain the graphite film of main firing；
Step 4: then the graphite film of the main firing obtained by step 3 is carried out calendering to obtain the heat conduction graphite patch.
CN201710095581.5A 2014-01-26 2014-01-26 The manufacture method of notebook computer fin Pending CN107043258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710095581.5A CN107043258A (en) 2014-01-26 2014-01-26 The manufacture method of notebook computer fin

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Application Number Priority Date Filing Date Title
CN201710095581.5A CN107043258A (en) 2014-01-26 2014-01-26 The manufacture method of notebook computer fin
CN201410036320.2A CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410036320.2A Division CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin

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CN107043258A true CN107043258A (en) 2017-08-15

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Family Applications (11)

Application Number Title Priority Date Filing Date
CN201710665184.7A Pending CN108218428A (en) 2014-01-26 2014-01-26 For the manufacturing method of tablet computer soaking patch
CN201710665192.1A Pending CN108646885A (en) 2014-01-26 2014-01-26 Cooling fin for laptop
CN201710665183.2A Pending CN107986789A (en) 2014-01-26 2014-01-26 Smart mobile phone heat dissipation film
CN201710665173.9A Pending CN107573072A (en) 2014-01-26 2014-01-26 The production method of high compactness fin
CN201410036320.2A Active CN104812204B (en) 2014-01-26 2014-01-26 Manufacturing process for graphite heat radiation fin
CN201710095544.4A Pending CN107043256A (en) 2014-01-26 2014-01-26 Manufacturing process for the paster that radiates
CN201710095543.XA Active CN107043108B (en) 2014-01-26 2014-01-26 Cooling fin manufacturing process for smart phone
CN201710095575.XA Pending CN107043255A (en) 2014-01-26 2014-01-26 The manufacturing process of fin
CN201710095581.5A Pending CN107043258A (en) 2014-01-26 2014-01-26 The manufacture method of notebook computer fin
CN201710095545.9A Pending CN107043257A (en) 2014-01-26 2014-01-26 Manufacture method for the fin of computer radiator
CN201710665185.1A Pending CN108206164A (en) 2014-01-26 2014-01-26 For the cooling fin of microelectronics heat dissipation

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Application Number Title Priority Date Filing Date
CN201710665184.7A Pending CN108218428A (en) 2014-01-26 2014-01-26 For the manufacturing method of tablet computer soaking patch
CN201710665192.1A Pending CN108646885A (en) 2014-01-26 2014-01-26 Cooling fin for laptop
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy
WO2022198661A1 (en) * 2021-03-26 2022-09-29 浙江华熔科技有限公司 Ultrathin thermally-conductive graphite film and manufacturing method therefor
CN114714687B (en) * 2022-03-30 2023-09-29 安徽碳华新材料科技有限公司 Preparation method of graphite heat dissipation film without halogen residues

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120141758A1 (en) * 2010-12-07 2012-06-07 E.I. Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
CN102560453A (en) * 2012-03-08 2012-07-11 哈尔滨工业大学 Method for preparing carbide film by carbonizing graphene reinforced polyimide resin
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103144387A (en) * 2007-05-17 2013-06-12 株式会社钟化 Graphite film and graphite composite film

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
AU2003261889A1 (en) * 2003-09-02 2005-03-29 Kaneka Corporation Filmy graphite and process for producing the same
JP2005119887A (en) * 2003-10-14 2005-05-12 Matsushita Electric Ind Co Ltd High thermal conductivity member, its producing method, and heat dissipation system using the member
JP5069860B2 (en) * 2006-01-31 2012-11-07 株式会社カネカ Graphite film
WO2008149920A1 (en) * 2007-06-07 2008-12-11 Kaneka Corporation Graphite composite film
JP2010003981A (en) * 2008-06-23 2010-01-07 Kaneka Corp Heat-conducting sheet with graphite oriented in thickness direction
TWI405667B (en) * 2010-12-15 2013-08-21 Ind Tech Res Inst Polyimide film laminate and metal laminate employing the same
TWI468342B (en) * 2011-03-28 2015-01-11 鐘化股份有限公司 Method of producing graphite film
CN102757736A (en) * 2011-04-29 2012-10-31 苏州沛德导热材料有限公司 Graphite heat conducting adhesive tape and production process thereof
TWI554548B (en) * 2011-07-08 2016-10-21 三井化學股份有限公司 Polyimide resin composition and laminated body containing thereof
TWM446318U (en) * 2012-08-09 2013-02-01 Hugetemp Energy Ltd Material stacked structure of flexible graphite paper
CN103043657B (en) * 2012-12-28 2014-10-15 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes
CN104263267B (en) * 2012-12-28 2016-04-27 斯迪克新型材料（江苏）有限公司 Multi-usage conductive and heat-conductive compound adhesive tape

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103144387A (en) * 2007-05-17 2013-06-12 株式会社钟化 Graphite film and graphite composite film
US20120141758A1 (en) * 2010-12-07 2012-06-07 E.I. Du Pont De Nemours And Company Filled polyimide films and coverlays comprising such films
CN102560453A (en) * 2012-03-08 2012-07-11 哈尔滨工业大学 Method for preparing carbide film by carbonizing graphene reinforced polyimide resin
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient

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CN107043255A (en) 2017-08-15
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CN108218428A (en) 2018-06-29
CN107986789A (en) 2018-05-04

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