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CN107011818A - Heat-conducting glue band - Google Patents

Heat-conducting glue band Download PDF

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Publication number
CN107011818A
CN107011818A CN201710052689.6A CN201710052689A CN107011818A CN 107011818 A CN107011818 A CN 107011818A CN 201710052689 A CN201710052689 A CN 201710052689A CN 107011818 A CN107011818 A CN 107011818A
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CN
China
Prior art keywords
graphite
heat
film
parts
kapton
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710052689.6A
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Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Stick New Materials Polytron Technologies Inc
Original Assignee
Jiangsu Stick New Materials Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Stick New Materials Polytron Technologies Inc filed Critical Jiangsu Stick New Materials Polytron Technologies Inc
Priority to CN201710052689.6A priority Critical patent/CN107011818A/en
Publication of CN107011818A publication Critical patent/CN107011818A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention discloses a kind of heat-conducting glue band, and its graphite linings is obtained by following process, and this process comprises the following steps：Be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after Kapton, described graphite modified dose of viscosity is 30000 ~ 48000CP；The graphite modified dose of component by following parts by weight is constituted：Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, N methyl pyrrolidones, ethylene glycol, dimethyl silicone polymer；Kapton after processing is risen to 240 ~ 260 DEG C from room temperature, 480 ~ 520 DEG C are warming up to after insulation, 790 ~ 810 DEG C are warming up to after insulation, then is warming up to cooling after 1180 ~ 1250 DEG C, so as to obtain the carbonized film of pre-burned.The present invention is filled with the pin hole in heating process, improves crystallinity simultaneously, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance.

Description

Heat-conducting glue band
Technical field
The present invention relates to a kind of heat-conducting glue band, belong to graphite flake technical field.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment (such as notebook computer, mobile phone, tablet personal computer) is increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, the heat produced by operation is difficult Discharge, be easy to rapid accumulation and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment is normally run.
Kapton is mostly used for flexible PCB in the prior art, although has and is obtained using polyimide film sintered Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, there is following technical problem：Radiating is uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improves product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
The content of the invention
Objects of the present invention are to provide a kind of heat-conducting glue band, and the heat-conducting glue band is both vertically and horizontally being improved Heat conductivility, it is to avoid hot-spot, while realize the uniformity of heat conductivility, the heat dispersion for improving product is stable Property, reliability, greatly reduce the cost of product.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of heat-conducting glue band, the heat-conducting glue band patch Together in heat generating components surface, the heat-conducting glue band includes graphite linings, heat conduction adhesive layer and separated type material positioned at graphite layer surface Layer, this separated type material layer fits in the heat conduction adhesive layer surface opposite with graphite linings；The graphite linings pass through following process Obtain, this process comprises the following steps：
Step 1: be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after polyamides Imines film, described graphite modified dose of viscosity is 30000~48000CP；
The graphite modified dose of component by following parts by weight is constituted：22 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid 16 parts of dianhydride, 24 parts of MDA, 22.5 parts of dimethylformamide, 6 parts of 1-METHYLPYRROLIDONE, 1.8 parts of ethylene glycol, 2.5 parts of dimethyl silicone polymer；
Step 2: the Kapton after processing is risen into 240~260 DEG C from room temperature, it is warming up to 480 after insulation~ 520 DEG C, 790~810 DEG C are warming up to after insulation, then is warming up to cooling after 1180~1250 DEG C, so as to obtain the carbonization of pre-burned Film；
Step 3: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 4: being warming up to 2350~2450 DEG C, 2850~2950 DEG C are warming up to after insulation, is cooled down after insulation, so as to obtain The graphite film that winner fires；
Step 5: the graphite film of the then main firing obtained by step 4 carries out calendering to obtain the graphite linings.
Further improved scheme is as follows in above-mentioned technical proposal：
1st, in such scheme, the graphite linings are obtained by following process, and this process comprises the following steps：
Step 1: be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after polyamides Imines film；
Step 2: by the Kapton after processing under inert gas shielding, with 4~6 degree/min speed from room temperature 250 DEG C are risen to, is kept for 0.9~1.1 hour, then with 2.5~3.5 degree/min, 500 DEG C is risen to, is kept for 1 hour；Then with 4~ 6 degree/min speed rises to 800 DEG C, is kept for 0.9~1.1 hour；1200 DEG C, preservation are risen to 9~11 degree/min speed again Cooled down after 0.9~1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 4: rising to 2400 DEG C with 19~21 degree/min speed, kept for 0.9~1.1 hour, then with 19~21 degree/ Min speed rises to 2900 DEG C, is cooled down after being kept for 1.8~2.2 hours, so as to obtain the graphite film of main firing；
Step 5: the graphite film of the then main firing obtained by step 4 carries out calendering to obtain the graphite linings.
2nd, in such scheme, the step 4 is obtained into graphite linings and carries out calendering process.
Because above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1st, graphite linings are coated with one layer graphite modified dose of polyamides by upper and lower surface in heat-conducting glue band of the present invention, its structure Imines film preparation is formed, and is improved in heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, is realized The uniformity of adhesive tape heat conductivility；Next, it is located at graphite modified dose of Kapton surface by benzophenone tetracid two Acid anhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, dimethyl silicone polymer composition, coating In the pin hole on Kapton, being filled with heating process, crystallinity is improved simultaneously, also overcome that thermal contraction is excessive to be led What is caused is uneven, improves graphite linings biaxial tension performance.
2nd, heat-conducting glue band of the present invention, it is located at graphite modified dose of Kapton surface by benzophenone tetracid two Acid anhydride, pyromellitic acid anhydride, MDA, dimethylformamide, 1-METHYLPYRROLIDONE, ethylene glycol, poly dimethyl Siloxanes is constituted, and is reduced azeotropic point using dimethylformamide, 1-METHYLPYRROLIDONE and smooth boiling point area, is improved The flatness and pliability of final products film forming；Secondly, Kapton surface has graphite modified dose, improves Double-face adhesive Graphite linings and heat conduction adhesive layer heat conductivility in film.
3rd, heat-conducting glue band of the present invention, increases calendaring processes, and re-form between the carbonized film and graphitization of pre-burned Roll again after heat conduction graphite patch, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and Crystallinity, is further increased in heat conductivility both vertically and horizontally.
Embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of heat-conducting glue band, the heat-conducting glue band fits in heat generating components surface, and the heat-conducting glue band includes stone Layer of ink, heat conduction adhesive layer and the separated type material layer positioned at graphite layer surface, this separated type material layer fit in heat conduction adhesive layer and stone The opposite surface of layer of ink；The graphite linings are obtained by following process, and this process comprises the following steps：
Step 1: be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after polyamides Imines film, described graphite modified dose of viscosity is 30000~48000CP；
The graphite modified dose of component by following parts by weight is constituted：22 parts of benzophenone tetracarboxylic dianhydride, Pyromellitic Acid 16 parts of dianhydride, 24 parts of MDA, 22.5 parts of dimethylformamide, 6 parts of 1-METHYLPYRROLIDONE, 1.8 parts of ethylene glycol, 2.5 parts of dimethyl silicone polymer；
Graphite modified dose of viscosity of embodiment is 35000CP.
Step 2: by the Kapton after processing under inert gas shielding, with 4~6 degree/min speed from room temperature 250 DEG C are risen to, is kept for 0.9~1.1 hour, then with 2.5~3.5 degree/min, 500 DEG C is risen to, is kept for 1 hour；Then with 4~ 6 degree/min speed rises to 800 DEG C, is kept for 0.9~1.1 hour；1200 DEG C, preservation are risen to 9~11 degree/min speed again Cooled down after 0.9~1.1 hour, so as to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 4: rising to 2400 DEG C with 19~21 degree/min speed, kept for 0.9~1.1 hour, then with 19~21 degree/ Min speed rises to 2900 DEG C, is cooled down after being kept for 1.8~2.2 hours, so as to obtain the graphite film of main firing；
Step 5: the graphite film of the then main firing obtained by step 4 carries out calendering to obtain the graphite linings 2.
The step 5 is obtained into graphite film and carries out calendering process.
During using above-mentioned heat-conducting glue band, graphite linings are coated with one layer graphite modified dose poly- by upper and lower surface in its structure Imide membrane is prepared from, and is improved in heat conductivility both vertically and horizontally, it is to avoid adhesive tape hot-spot, is realized The uniformity of adhesive tape heat conductivility；Next, it is located at graphite modified dose of Kapton surface by benzophenone tetracid Dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, dimethyl silicone polymer composition, are applied It is overlying on Kapton, is filled with the pin hole in heating process, improves crystallinity simultaneously, also overcome thermal contraction excessive It is caused uneven, graphite linings biaxial tension performance is improved, azeotropic point is also reduced and smooth boiling point area, improves most The flatness and pliability of finished product film forming；Again, Kapton surface has graphite modified dose, improves two-sided pad pasting Middle graphite linings and heat conduction adhesive layer heat conductivility, and roll using calender the carbonized film of the pre-burned, it is to avoid fold and Volume contraction in graphitization sintering process, improves compactness and crystallinity, further increases in vertical direction and level The heat conductivility in direction.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, should all be included within the scope of the present invention.

Claims (3)

1. a kind of heat-conducting glue band, the heat-conducting glue band fits in heat generating components surface, the heat-conducting glue band includes graphite linings, is located at Heat conduction adhesive layer and the separated type material layer of graphite layer surface, it is opposite with graphite linings that this separated type material layer fits in heat conduction adhesive layer Surface；It is characterized in that：The graphite linings are obtained by following process, and this process comprises the following steps：
Step 1: be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after polyimides Film, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following parts by weight is constituted：22 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 16 parts, 24 parts of MDA, 22.5 parts of dimethylformamide, 6 parts of 1-METHYLPYRROLIDONE, 1.8 parts of ethylene glycol, poly- two 2.5 parts of methylsiloxane；
Step 2: the Kapton after processing is risen into 240 ~ 260 DEG C from room temperature, 480 ~ 520 DEG C are warming up to after insulation, 790 ~ 810 DEG C are warming up to after insulation, then is warming up to cooling after 1180 ~ 1250 DEG C, so as to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 4: being warming up to 2350 ~ 2450 DEG C, 2850 ~ 2950 DEG C are warming up to after insulation, is cooled down after insulation, so as to obtain main burning The graphite film of system；
Step 5: the graphite film of the then main firing obtained by step 4 carries out calendering to obtain the graphite linings 4.
2. heat-conducting glue band according to claim 1, it is characterised in that：The graphite linings are obtained by following process, This process comprises the following steps：
Step 1: be coated with the upper and lower surface of Kapton one layer graphite modified dose handled after polyimides Film；
Step 2: by the Kapton after processing under inert gas shielding, being risen to 4 ~ 6 degree/min speed from room temperature 250 DEG C, kept for 0.9 ~ 1.1 hour, then with 2.5 ~ 3.5 degree/min, rise to 500 DEG C, kept for 1 hour；Then with 4 ~ 6 degree/min Speed rise to 800 DEG C, kept for 0.9 ~ 1.1 hour；1200 DEG C are risen to 9 ~ 11 degree/min speed again, 0.9 ~ 1.1 is preserved small When after cool down, so as to obtain the carbonized film of pre-burned；
Step 3: rolling the carbonized film of the pre-burned of the step 4 using calender；
Step 4: rising to 2400 DEG C with 19 ~ 21 degree/min speed, kept for 0.9 ~ 1.1 hour, then with 19 ~ 21 degree/min speed Degree rises to 2900 DEG C, is cooled down after being kept for 1.8 ~ 2.2 hours, so as to obtain the graphite film of main firing；
Step 5: the graphite film of the then main firing obtained by step 4 carries out calendering to obtain the graphite linings.
3. heat-conducting glue band according to claim 1, it is characterised in that：The step 5 is obtained into graphite linings to carry out at calendering Reason.
CN201710052689.6A 2014-01-26 2014-01-26 Heat-conducting glue band Pending CN107011818A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710052689.6A CN107011818A (en) 2014-01-26 2014-01-26 Heat-conducting glue band

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710052689.6A CN107011818A (en) 2014-01-26 2014-01-26 Heat-conducting glue band
CN201410036660.5A CN104812205B (en) 2014-01-26 2014-01-26 Stretch-proof radiating graphite paster

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410036660.5A Division CN104812205B (en) 2014-01-26 2014-01-26 Stretch-proof radiating graphite paster

Publications (1)

Publication Number Publication Date
CN107011818A true CN107011818A (en) 2017-08-04

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ID=53696527

Family Applications (6)

Application Number Title Priority Date Filing Date
CN201710052689.6A Pending CN107011818A (en) 2014-01-26 2014-01-26 Heat-conducting glue band
CN201710052688.1A Pending CN106987216A (en) 2014-01-26 2014-01-26 The two-sided pad pasting of high efficiency and heat radiation
CN201710052642.XA Pending CN106987213A (en) 2014-01-26 2014-01-26 The two-sided pad pasting of high densification heat transmission
CN201410036660.5A Active CN104812205B (en) 2014-01-26 2014-01-26 Stretch-proof radiating graphite paster
CN201710052681.XA Pending CN106987214A (en) 2014-01-26 2014-01-26 Radiating stone paster for electronic equipment
CN201710052687.7A Pending CN106987215A (en) 2014-01-26 2014-01-26 The uniform type graphite paster of heat conduction

Family Applications After (5)

Application Number Title Priority Date Filing Date
CN201710052688.1A Pending CN106987216A (en) 2014-01-26 2014-01-26 The two-sided pad pasting of high efficiency and heat radiation
CN201710052642.XA Pending CN106987213A (en) 2014-01-26 2014-01-26 The two-sided pad pasting of high densification heat transmission
CN201410036660.5A Active CN104812205B (en) 2014-01-26 2014-01-26 Stretch-proof radiating graphite paster
CN201710052681.XA Pending CN106987214A (en) 2014-01-26 2014-01-26 Radiating stone paster for electronic equipment
CN201710052687.7A Pending CN106987215A (en) 2014-01-26 2014-01-26 The uniform type graphite paster of heat conduction

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CN (6) CN107011818A (en)

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KR20190094190A (en) * 2016-12-15 2019-08-12 제이엔씨 주식회사 Transfer sheet
CN113292971A (en) * 2021-06-01 2021-08-24 江西德思恩新材料有限公司 Artificial graphite film with enhanced tensile strength for heat dissipation function and preparation method thereof
CN117303904A (en) * 2023-07-04 2023-12-29 张润枝 Production process of heat dissipation film

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CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient

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