CN106950478B - GIS equipment internal joint overheat fault simulation test device and method - Google Patents
GIS equipment internal joint overheat fault simulation test device and method Download PDFInfo
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- CN106950478B CN106950478B CN201710278829.1A CN201710278829A CN106950478B CN 106950478 B CN106950478 B CN 106950478B CN 201710278829 A CN201710278829 A CN 201710278829A CN 106950478 B CN106950478 B CN 106950478B
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- 238000004088 simulation Methods 0.000 title claims abstract description 149
- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 120
- 229910018503 SF6 Inorganic materials 0.000 claims description 10
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 claims description 10
- 229960000909 sulfur hexafluoride Drugs 0.000 claims description 10
- 238000010998 test method Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 9
- 230000007613 environmental effect Effects 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 238000013021 overheating Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000001931 thermography Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/022—Means for indicating or recording specially adapted for thermometers for recording
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention discloses a device and a method for simulating overheat faults of internal joints of GIS equipment, relates to the technical field of electrical equipment, and solves the technical problems that in the prior art, whether the overheat faults of the joints occur in the GIS equipment or not is evaluated under the condition of power failure, so that the part of an electric power system using the GIS equipment cannot operate, the operation efficiency of the electric power system is reduced, and the economic operation of the electric power system is not facilitated. The GIS equipment internal joint overheat fault simulation test device comprises: the GIS equipment body comprises a fault simulation section and a normal simulation section which are sequentially connected, a fault conductor corresponding to the fault simulation section is overheated when current is conducted, and a normal conductor corresponding to the normal simulation section is connected with the fault conductor through a connector; the outer surface of the fault conductor, the outer surface of the normal conductor and the outer surface of the shell of the GIS equipment are provided with temperature sensors. The invention is applied to the overheat fault of the internal joint of the GIS equipment in the simulation test.
Description
Technical Field
The invention relates to the technical field of electrical equipment, in particular to a device and a method for simulating overheat faults of internal joints of GIS equipment.
Background
The gas-insulated metal-enclosed switchgear (GIS equipment for short, gas Instulated Switchgear) is a fully-enclosed combined electrical equipment using sulfur hexafluoride (SF 6) gas as an insulating medium, and has the advantages of strong breaking capacity, low failure rate, low maintenance cost, small occupied area and the like, so that the fully-enclosed combined electrical equipment is widely applied to substations of electric power systems.
However, in the operation process of the power system, the phenomena of insulation aging or poor contact of the components such as the enclosed bus, the isolating switch and the cable head inside the GIS equipment can occur, so that when the temperature of the conductors connected by the components such as the enclosed bus, the isolating switch and the cable head inside the GIS equipment and the temperature of the joints between the conductors are abnormal, the insulation aging of the GIS equipment can be caused, even the GIS equipment shell is broken down, and further, the major accident of the operation of the power system is caused, and the major economic loss is caused.
At present, the thermal fault of the joint between the internal conductors of the GIS device is generally determined by manually observing the surface color of the joint between the internal conductors of the GIS device or periodically measuring the internal loop resistance of the GIS device. However, the surface color of the joint between the internal conductors of the GIS equipment is observed manually, and the internal loop resistance of the GIS equipment is measured periodically, so that the GIS equipment is required to be powered off to be overhauled, and the part using the GIS equipment in the power system cannot operate, so that the operation efficiency of the power system is reduced, and the economic operation of the power system is not facilitated.
Disclosure of Invention
The invention aims to provide a device and a method for simulating overheat faults of internal joints of GIS equipment, which are used for simulating the overheat faults of the internal joints of the GIS equipment, so that whether the overheat faults of the internal joints of the GIS equipment occur or not can be evaluated according to simulation results under the condition of no power failure, and the operation efficiency of an electric power system using the GIS equipment is improved.
In order to achieve the purpose, the invention provides a GIS equipment internal joint overheat fault simulation test device, which adopts the following technical scheme:
the GIS equipment internal joint overheat fault simulation test device comprises: the GIS equipment body comprises a fault simulation section and a normal simulation section which are sequentially connected, wherein a fault conductor corresponding to the fault simulation section is overheated when current is conducted, and a normal conductor corresponding to the normal simulation section is connected with the fault conductor through a connector;
the outer surface of the fault conductor, the outer surface of the normal conductor and the outer surface of the housing of the GIS equipment are all provided with temperature sensors.
Compared with the prior art, the GIS equipment internal joint overheat fault simulation test device provided by the invention has the following beneficial effects:
in the GIS equipment internal joint overheat fault simulation test device provided by the invention, the GIS equipment body comprises a fault simulation section and a normal simulation section connected with the fault simulation section, wherein the fault conductor corresponding to the fault simulation section is overheated when current is passed, and the normal conductor corresponding to the normal simulation section is connected with the fault conductor through the joint, so that the abnormal heating fault conductor can transfer heat to the joint contacted with the abnormal heating fault conductor through heat conduction, the joint overheat is caused, the condition that the GIS equipment is faulted due to overheat of the actually used GIS equipment internal joint can be simulated, and the temperature sensors are arranged on the outer surface of the fault conductor, the outer surface of the normal conductor and the outer surface of the shell of the GIS equipment, so that after current is passed to the fault simulation section, the temperature value of the outer surface of the fault conductor, the temperature value of the outer surface of the normal conductor and the temperature value of the outer surface of the shell can be obtained, and the loop resistance value of the GIS equipment body can be combined, the running state of the GIS equipment body and the running state of the GIS equipment can be compared with the running state of the GIS equipment can be improved, and the running state of the GIS equipment can be compared with the actual running state of the GIS equipment can be judged if the fault condition is not happened, and the fault condition of the GIS equipment can be judged by comparing the fact that the fault condition is better.
The embodiment of the invention also provides a GIS equipment internal joint overheat fault simulation test method, which adopts the following technical scheme:
the GIS equipment internal joint overheat fault simulation test method is used for testing by using the GIS equipment internal joint overheat fault simulation test device, and comprises the following steps:
acquiring a pre-test loop resistance value of the GIS equipment body;
connecting the output end of the heavy current generator with the input end of the fault simulation section, connecting the output end of the normal simulation section with the input end of the heavy current generator, and setting the output value of the heavy current generator;
current is led into the fault simulation section through the high-current generator;
acquiring and recording a temperature value of the outer surface of the fault conductor through a temperature sensor arranged on the outer surface of the fault conductor;
acquiring and recording a temperature value of the outer surface of the normal conductor through a temperature sensor arranged on the outer surface of the normal conductor;
acquiring and recording a temperature value of the outer surface of the shell of the GIS equipment body through a temperature sensor arranged on the outer surface of the shell of the GIS equipment body;
after a preset test time, respectively disconnecting the high-current generator from the fault simulation section and the normal simulation section;
acquiring a post-test loop resistance value of the GIS equipment body;
and obtaining a preliminary comparison result of the running state of the fault simulation section and the running state of the normal simulation section according to the pre-test loop resistance value of the GIS equipment body, the temperature value of the outer surface of the fault conductor, the temperature value of the outer surface of the normal conductor, the temperature value of the outer surface of the shell of the GIS equipment body and the post-test loop resistance value of the simulation section of the GIS equipment.
Compared with the prior art, the beneficial effects of the GIS equipment internal joint overheat fault simulation test method provided by the embodiment of the invention are the same as those of the GIS equipment internal joint overheat fault simulation test device, so that the description is omitted here.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a device for simulating overheat faults of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 2 is a schematic diagram of connection between a fault conductor and a normal conductor in a device for simulating overheat fault of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an internal fixing plate in a device for simulating overheat faults of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 4 is a schematic diagram of positions of temperature measuring points set on a fault conductor and a first normal conductor in a device for simulating overheat fault of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 5 is a schematic diagram of positions of temperature measuring points set on a first normal conductor and a second normal conductor in a device for simulating overheat fault of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a position of a temperature measuring point set on a non-fault phase conductor corresponding to a fault simulation segment and corresponding to a first normal simulation segment in a device for simulating an overheat fault of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a position of a temperature measuring point set on a non-fault phase conductor corresponding to a first normal simulation segment and corresponding to a second normal simulation segment in a device for simulating an overheat fault of an internal joint of a GIS device according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a position of a temperature measuring point set on an outer surface of a housing of a GIS device body in a GIS device inner joint overheat fault simulation test device according to an embodiment of the present invention;
fig. 9 is a schematic diagram of the positions of temperature measuring points on the outer surface of the outer shell of the GIS device body and the inner fixing plate in the GIS device body in the GIS device inner joint overheat fault simulation test device provided by the embodiment of the invention;
fig. 10 is a flowchart of a method for simulating and testing overheat faults of an internal joint of a GIS device according to an embodiment of the present invention.
Reference numerals illustrate:
1-fault simulation section, 2-normal simulation section,
11-faulty conductors, 21-normal conductors,
3-joint, 4-basin insulator,
111-a base part, 112-a through-flow part,
5-inner fixing plate, 21 a-first normal conductor,
21 b-a second normal conductor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a GIS equipment internal joint overheat fault simulation test device, as shown in fig. 1 and 2, the GIS equipment internal joint overheat fault simulation test device comprises: the GIS equipment body comprises a fault simulation section 1 and a normal simulation section 2 which are connected in sequence, a fault conductor 11 corresponding to the fault simulation section 1 is overheated when current is conducted, a normal conductor 21 corresponding to the normal simulation section 2 is connected with the fault conductor 11 through a connector 3, and temperature sensors are arranged on the outer surface of the fault conductor 11, the outer surface of the normal conductor 21 and the outer surface of a shell of the GIS equipment. Illustratively, as shown in FIG. 1, the fault simulation segment 1 and the normal simulation segment 2 described above may be separated by a basin insulator 4.
In the test process of the GIS equipment internal joint overheat fault simulation test device, the loop resistance value before the test of the GIS equipment can be obtained firstly, then the output end of the high current generator is connected with the input end of the fault simulation section 1, after the output end of the normal simulation section 2 is connected with the input end of the high current generator, current is introduced into the fault simulation section 1 through the high current generator, the temperature value of the outer surface of the fault conductor 11, the temperature value of the outer surface of the normal conductor 21 and the temperature value of the outer surface of the shell of the GIS equipment body are obtained and recorded respectively through the temperature sensors arranged on the outer surface of the fault conductor 11, the temperature value of the outer surface of the normal conductor 21 and the temperature value of the outer surface of the shell of the GIS equipment body, after the preset test time, the connection between the high current generator and the fault simulation section 1 and the normal simulation section 2 can be disconnected, the loop resistance value after the test of the GIS equipment body is obtained, and finally the operation state of the loop simulation section 1 after the test of the GIS equipment body can be compared with the initial operation state after the test of the GIS equipment body is obtained.
In the overheat fault simulation test device for the internal joint of the GIS equipment provided by the embodiment, the GIS equipment body not only comprises the fault simulation section 1, but also comprises the normal simulation section 2 connected with the fault simulation section 1, wherein the fault conductor 11 corresponding to the fault simulation section 1 is overheated when current is conducted, and the normal conductor 21 corresponding to the normal simulation section 2 is connected with the fault conductor 11 through the joint, so that the abnormally heated fault conductor 11 can transfer heat to the joint 3 contacted with the abnormally heated fault conductor through heat conduction, the joint 3 is overheated, thereby simulating the condition that the GIS equipment is in fault due to overheat of the internal joint of the GIS equipment in actual use, and the temperature sensors are arranged on the outer surface of the fault conductor 11, the outer surface of the normal conductor 21 and the outer surface of the shell of the GIS equipment, so that after current is conducted to the fault simulation section 1, the temperature value of the outer surface of the fault conductor 11, the temperature value of the outer surface of the normal conductor 21 and the temperature value of the outer surface of the shell are obtained, the temperature value of the outer surface of the normal conductor 11 can be transmitted to the joint 3 through heat conduction, the temperature value of the body of the shell outer surface of the GIS equipment is overheated, the GIS equipment can be compared with the actual operation condition that the GIS equipment is in the fact that the GIS equipment is in the fault condition, and the GIS equipment is in the fact that the GIS equipment is in the GIS equipment has the fact that the GIS equipment has the fault condition is not in the normal state, and the GIS equipment has the fact that the GIS equipment has the electrical resistance, and the fact that the temperature has been compared with the fact.
The normal simulation segment may include a plurality of normal simulation subsections, wherein normal conductors corresponding to two adjacent normal simulation subsections are connected through a connector, and the normal simulation subsections close to the fault simulation segment may be used as transition simulation segments by setting the plurality of normal simulation subsections, so that local overheating of the fault simulation segment is prevented from affecting the normal simulation segment, and further, test results obtained by using the GIS equipment internal connector overheating fault simulation test device are prevented from being affected, and test results obtained by using the GIS equipment internal connector overheating fault simulation test device are more accurate.
Specifically, as shown in fig. 2, the area of the through-flow section of the faulty conductor 11 may be made smaller than that of the normal conductor 21, so that the through-flow capability of the faulty conductor 11 is insufficient, resulting in local overheating.
Alternatively, as shown in fig. 2, the fault conductor 11 may include a base 111 and a through-current portion 112, where temperature sensors are disposed on the outer surfaces of the base 111 and the through-current portion 112, and since the resistivity of iron is greater than that of aluminum, the through-current portion 112 may be configured as an iron through-current portion, the base 111 may be configured as an aluminum base, and the normal conductor may be configured as an aluminum normal conductor, so that the through-current capability of the through-current portion 112 may be further reduced, resulting in local overheating.
In addition, as shown in fig. 3, at least one internal fixing plate 5 may be disposed in the housing of the GIS device body, the diameter of the internal fixing plate 5 is matched with the housing of the GIS device body, a through hole for the fault conductor and/or the normal conductor to pass through is formed in the internal fixing plate 5, and a temperature sensor is mounted on the internal fixing plate, so that the temperature of sulfur hexafluoride gas at any point in the GIS device body can be obtained by using the upper temperature sensor mounted on the internal fixing plate, and thus, according to the temperature value of sulfur hexafluoride gas in the housing of the GIS device body, the primary comparison result of the operation state of the fault simulation section and the operation state of the normal simulation section can be obtained, so that in the practical application of the GIS device, a worker can more accurately judge whether the GIS device has an internal joint overheat fault according to the optimized comparison result.
For example, since the phenolic resin has certain mechanical strength and high temperature resistance (-250-150 ℃), and the heat conductivity coefficient of the phenolic resin is close to that of sulfur hexafluoride gas, the internal fixing plate is preferably of a phenolic resin net structure in the embodiment of the invention, so that the influence of the internal fixing plate on the temperature distribution under the condition of GIS local overheat can be reduced, and the consistency of the GIS equipment internal joint overheat fault simulation test device and the actual GIS equipment is ensured.
In addition, through setting up the fixed plate into the circulation that sulfur hexafluoride gas in the GIS equipment still is favorable to the network structure, avoid because of the local overheated condition emergence of sulfur hexafluoride gas that causes of internal fixation board to the influence of temperature distribution under the local overheated condition of GIS can further reduce the internal fixation board, further guarantee the inside joint overheat fault analogue test device of GIS equipment and the uniformity of actual license GIS equipment.
The temperature sensor may be a platinum resistance temperature sensor or a copper resistance temperature sensor, which may be selected by those skilled in the art according to practical situations, and the embodiment of the present invention is not limited.
In addition, the temperature sensors are connected with a temperature rise tester for receiving temperature signals acquired by the temperature sensors, so that a worker can directly read the temperature values from the temperature rise tester.
It is to be added that the above-mentioned GIS equipment internal joint overheat fault simulation test device can also include the infrared thermal imaging system that is used for testing the temperature of the casing of GIS equipment body to can be according to the infrared thermal imaging system of the casing of GIS equipment body that this infrared thermal imaging system obtained, the audio-visual temperature distribution value of the casing of GIS equipment body of knowing on the whole, so that the staff sets for test time, macroscopically holds experimental progress etc..
Optionally, the above-mentioned GIS equipment internal joint overheat fault simulation test device may further include an environmental temperature sensor for testing an environmental temperature, specifically, the environmental temperature sensor may be disposed at a position greater than or equal to 2m from the GIS equipment body, so as to avoid the influence of the GIS equipment body on the environmental temperature sensor, obtain a relatively accurate environmental temperature value, so as to provide a reference for a staff when obtaining a preliminary comparison result of an operation state of the fault simulation section and an operation state of the normal simulation section, and eliminate interference factors of the environmental temperature.
In addition, in order to facilitate better understanding and implementation by those skilled in the art, the following embodiments of the present invention provide a specific example of a setting position of a temperature sensor in the above-mentioned GIS device internal joint overheat fault simulation test device:
the device for simulating the overheat fault of the internal joint of the GIS device includes a fault simulation section and a normal simulation section, where the normal simulation section may include two normal simulation subsections, the fault simulation section is connected to the first normal simulation subsection through a basin insulator, the first normal simulation subsection is connected to the second normal simulation subsection through a basin insulator, the GIS device includes a three-phase conductor, and optionally any one phase conductor is used as a fault phase conductor, 16 temperature measurement points may be disposed on the fault phase conductor, specifically, 6 temperature measurement points of A, B, C, D, E, F are disposed on the fault conductor 11 corresponding to the fault simulation section, 8 temperature measurement points of G, H, I, J, K, L, M, N are disposed on the first normal conductor 21a corresponding to the first normal simulation subsection, 2 temperature measurement points of O, P are disposed on the second normal conductor 21b corresponding to the second normal simulation subsection, and positions of each temperature measurement point are as shown in fig. 4 and 5, where positions of A, B, C, D, E, F on the fault conductor 11 are symmetrical with positions of G, H, I, J, K, L on the first normal conductor corresponding to 864 of the basin conductor; on the other two non-fault phase conductors, 8 temperature measuring points can be respectively arranged, Q, R two temperature measuring points are arranged on the conductor corresponding to the fault simulation section, S, T, U, V four temperature measuring points are arranged on the conductor corresponding to the first normal simulation sub-section, W, X two temperature measuring points are arranged on the conductor corresponding to the second normal simulation sub-section, and the specific positions of each temperature measuring point are shown in fig. 6 and 7; 32 temperature measuring points can be arranged on the outer surface of the shell of the GIS equipment body, specifically, 4 temperature measuring points are arranged on the outer surface of the shell of the GIS equipment body corresponding to each temperature measuring point in B, C, D, E, H, I, J, K on the fault phase conductor in fig. 4, the specific positions of the 4 temperature measuring points on the outer surface of the shell of the GIS equipment body are shown in fig. 8, and black dots in the figure represent the temperature measuring points; 128 temperature measuring points can be arranged on the outer surface of the shell of the GIS equipment body and the inner fixing plate in the GIS equipment body, specifically, 16 temperature measuring points are arranged on the outer surface of the shell of the GIS equipment body and the inner fixing plate in the GIS equipment body, which correspond to each temperature measuring point in A, F, G, L, M, N, O, P on the fault phase conductor in fig. 4 and 5, the specific positions of the 4 temperature measuring points on the outer surface of the shell of the GIS equipment body and the inner fixing plate in the GIS equipment body are shown in fig. 9, and black dots in the drawings represent the temperature measuring points; 8 temperature measuring points can be arranged on the outer surface of the basin-type insulator arranged between the fault simulation section and the normal simulation section; at a distance of 2m from the test device, 3 temperature sensors for measuring the ambient temperature may be provided.
The embodiment of the invention provides a GIS equipment internal joint overheat fault simulation test method, which uses the GIS equipment internal joint overheat fault simulation test device to test, and concretely, as shown in fig. 10, the GIS equipment internal joint overheat fault simulation test method comprises the following steps:
and S1, acquiring a pre-test loop resistance value of the GIS equipment body.
And S2, connecting the output end of the heavy current generator with the input end of the fault simulation section, connecting the output end of the normal simulation section with the input end of the heavy current generator, setting the output value of the heavy current generator, and adjusting the air pressure of the GIS equipment body to the rated air pressure.
In step 2, the output end of the heavy current generator may be connected to the input end of the normal analog section, and the output end of the fault analog section may be connected to the input end of the heavy current generator, which may be set by those skilled in the art according to the actual situation, which is not limited in the embodiment of the present invention.
And S3, introducing current into the fault simulation section through the high-current generator.
And S4, acquiring and recording the temperature value of the outer surface of the fault conductor through a temperature sensor arranged on the outer surface of the fault conductor.
And S5, acquiring and recording the temperature value of the outer surface of the normal conductor through a temperature sensor arranged on the outer surface of the normal conductor.
And S6, acquiring and recording the temperature value of the outer surface of the shell of the GIS equipment body through a temperature sensor arranged on the outer surface of the shell of the GIS equipment body.
It should be noted that, the embodiment of the present invention is not limited to the specific sequence of the step S4 and the step S5 and the step S6, and specifically, the step S4, the step S5 and the step S6 may be performed simultaneously.
And S7, respectively disconnecting the high-current generator from the fault simulation section and the normal simulation section after the preset test time.
And S8, acquiring a post-test loop resistance value of the GIS equipment body.
And S9, obtaining a preliminary comparison result of the running state of the fault simulation section and the running state of the normal simulation section according to the pre-test loop resistance value of the GIS equipment body, the temperature value of the outer surface of the fault conductor, the temperature value of the outer surface of the normal conductor, the temperature value of the outer surface of the shell of the GIS equipment body and the post-test loop resistance value of the GIS equipment body.
The beneficial effects of the GIS equipment internal joint overheat fault simulation test method provided by the embodiment can be referred to the beneficial effects of the GIS equipment internal joint overheat fault simulation test device, and the description is omitted here.
Illustratively, after the current is introduced into the fault simulation segment through the high current generator in the step S3, the method for testing the overheat fault of the internal joint of the GIS device may further include:
acquiring and recording the temperature value of sulfur hexafluoride gas in the shell of the GIS equipment body through a temperature sensor arranged on an inner fixing plate in the shell of the GIS equipment body;
and obtaining an optimized comparison result of the operation state of the fault simulation section and the operation state of the normal simulation section according to the temperature value of sulfur hexafluoride gas in the shell of the GIS equipment body and the preliminary comparison result of the operation state of the fault simulation section and the operation state of the normal simulation section.
The staff can judge whether the GIS equipment has the overheat faults of the internal joint more accurately according to the optimized comparison result, and the safe operation of the power system using the GIS equipment is further ensured.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. GIS equipment internal joint overheat fault simulation test device, its characterized in that includes: the GIS equipment body comprises a fault simulation section and a normal simulation section which are sequentially connected, wherein a fault conductor corresponding to the fault simulation section is overheated when current is conducted, and a normal conductor corresponding to the normal simulation section is connected with the fault conductor through a connector;
the outer surface of the fault conductor, the outer surface of the normal conductor and the outer surface of the GIS equipment shell are provided with temperature sensors;
the GIS equipment comprises three-phase conductors, wherein any one phase is a fault phase conductor, the other two phases are non-fault phase conductors, one part of the fault phase conductors is the fault conductor of the fault simulation section, and one part of the non-fault phase conductors is a conductor corresponding to the fault simulation section;
the fault conductor comprises a main part and a through-flow part, and the through-flow part is connected to one side of the main part, which is close to the normal conductor, and is connected with the normal conductor through a joint; the area of the through-flow section of the through-flow part is smaller than that of the through-flow section of the normal conductor, so that the through-flow part of the fault conductor is overheated when current is conducted;
the outer surfaces of the base part and the through-flow part are respectively provided with the temperature sensor; the through-flow part is an iron through-flow part, the aluminum part is an aluminum part, and the normal conductor is an aluminum normal conductor;
at least one inner fixing plate is arranged in the shell of the GIS equipment body; the diameter of the inner fixing plate is matched with that of the shell of the GIS equipment body, through holes for the fault conductors and/or the normal conductors to pass through are formed in the inner fixing plate, and a temperature sensor is mounted on the inner fixing plate.
2. The device for simulating the overheat fault of the internal joint of the GIS equipment according to claim 1, wherein the normal simulation section comprises a plurality of normal simulation subsections, and the normal conductors corresponding to two adjacent normal simulation subsections are connected through the joint.
3. The GIS equipment internal joint overheat fault simulation test device of claim 1, wherein the internal fixing plate is of a phenolic resin net structure.
4. The GIS equipment internal joint overheat fault simulation test device according to any one of claims 1 to 3, wherein the temperature sensor is a platinum resistance temperature sensor or a copper resistance temperature sensor.
5. The GIS equipment internal joint overheat fault simulation test device according to any one of claims 1 to 3, wherein the temperature sensor is connected with a temperature rise tester for receiving temperature signals acquired by the temperature sensor.
6. The GIS device inner joint overheat fault simulation test device of claim 1, further comprising a thermal infrared imager for testing the temperature of the housing of the GIS device body.
7. The GIS device inner joint overheat fault simulation test device of claim 1, further comprising an ambient temperature sensor for testing an ambient temperature.
8. The GIS equipment internal joint overheat fault simulation test method is characterized by using the GIS equipment internal joint overheat fault simulation test device according to any one of claims 1-7 to test, and comprises the following steps:
acquiring a pre-test loop resistance value of the GIS equipment body;
connecting the output end of the heavy current generator with the input end of the fault simulation section, connecting the output end of the normal simulation section with the input end of the heavy current generator, setting the output value of the heavy current generator, and adjusting the air pressure of the GIS equipment body to the rated air pressure;
current is led into the fault simulation section through the high-current generator;
acquiring and recording a temperature value of the outer surface of the fault conductor through a temperature sensor arranged on the outer surface of the fault conductor;
acquiring and recording a temperature value of the outer surface of the normal conductor through a temperature sensor arranged on the outer surface of the normal conductor;
acquiring and recording a temperature value of the outer surface of the shell of the GIS equipment body through a temperature sensor arranged on the outer surface of the shell of the GIS equipment body;
after a preset test time, respectively disconnecting the high-current generator from the fault simulation section and the normal simulation section;
acquiring a post-test loop resistance value of the GIS equipment body;
and obtaining a preliminary comparison result of the running state of the fault simulation section and the running state of the normal simulation section according to the pre-test loop resistance value of the GIS equipment body, the temperature value of the outer surface of the fault conductor, the temperature value of the outer surface of the normal conductor, the temperature value of the outer surface of the shell of the GIS equipment body and the post-test loop resistance value of the GIS equipment body.
9. The GIS device inner joint overheat fault simulation test method of claim 8, wherein after passing a current through the large current generator to the fault simulation section, the GIS device inner joint overheat fault simulation test method further comprises:
acquiring and recording a temperature value of sulfur hexafluoride gas in the shell of the GIS equipment body through a temperature sensor arranged on an inner fixing plate in the shell of the GIS equipment body;
and obtaining an optimized comparison result of the operation state of the fault simulation section and the operation state of the normal simulation section according to the temperature value of sulfur hexafluoride gas in the shell of the GIS equipment body and the preliminary comparison result of the operation state of the fault simulation section and the operation state of the normal simulation section.
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| CN107436400B (en) * | 2017-07-26 | 2020-06-19 | 南方电网科学研究院有限责任公司 | Method and device for detecting overheating fault of GIS contact |
| CN107515363A (en) * | 2017-08-08 | 2017-12-26 | 国网重庆市电力公司电力科学研究院 | A kind of analogue means of solid insulation ablation in sulfur hexafluoride atmosphere |
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| CN111880122A (en) * | 2020-06-30 | 2020-11-03 | 中国南方电网有限责任公司超高压输电公司检修试验中心 | Device and method for evaluating contact state of contact seat and conductive rod of GIL equipment |
| CN113091916B (en) * | 2021-04-21 | 2022-03-25 | 国网山西省电力公司检修分公司 | GIS disconnecting switch fault diagnosis method |
| CN113406488A (en) * | 2021-06-16 | 2021-09-17 | 国网安徽省电力有限公司电力科学研究院 | GIS internal overheating fault test device and test method |
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