CN106933059A - A kind of apparatus and method for monitoring offset mask layer version thermal deformation on-line - Google Patents
A kind of apparatus and method for monitoring offset mask layer version thermal deformation on-line Download PDFInfo
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- CN106933059A CN106933059A CN201511032055.1A CN201511032055A CN106933059A CN 106933059 A CN106933059 A CN 106933059A CN 201511032055 A CN201511032055 A CN 201511032055A CN 106933059 A CN106933059 A CN 106933059A
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- mask
- electrode
- electrode unit
- thermal deformation
- mask plate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The present invention provides a kind of apparatus and method for monitoring offset mask layer version thermal deformation on-line, first electrode unit is set in mask stage, the opposite polarity second electrode unit of first electrode unit is arranged on mask plate, first electrode unit forms electrode loop and constitutes micro- capacitor cell with second electrode unit, and the control unit that can monitor micro- capacitor cell capacitance is set, by measuring electric capacity so as to the distance between be calculated after mask plate deforms with mask stage, and by control unit coordination electrode loop voltage, so as to control the electrostatic force between mask plate and mask stage so that mask plate is moved to mask stage, distance between the two is reduced so as to the thermal deformation of offset mask layer version, so both can with the thermal deformation degree of on-line real time monitoring mask plate can also real-Time Compensation mask plate thermal deformation.
Description
Technical field
The present invention relates to semiconductor lithography field, more particularly to a kind of on-line monitoring offset mask layer version
The apparatus and method of thermal deformation.
Background technology
In a lithography system, mask is used for producing marking to the figure in substrate.In typical light
It is carved into as during, mask can be positioned on correct position using positioner, so as to protect
Demonstrate,proving the figure for producing can correctly be mapped on the corresponding process layer of integrated circuit.Mask is just
It is determined that position depends on several factors, such as keep the image between mask and integrated circuit technology layer
Away from it is correct, if wherein the vertical Wrong localization of mask, then can influence mask and integrated circuit
The accuracy of object image distance between process layer, so as to cause imaging to deteriorate as matter.
The vertical position error of mask is probably derived from more multifactor, such as the uneven surface of substrate
Whole and mask flexural deformation of itself etc..These error components can cause in whole integrated electricity
Imaging optimal focal plane in the process layer of road can change with locus difference, and if in imaging
During, some places of integrated circuit technology layer are all not at being imaged optimal focal plane, then exposed finally
Can be distorted during Seterolithography.As the optical source wavelength for being used to generate integrated circuit pattern is got over
Come shorter, cause the distortion produced in imaging process to exist due to the vertical position error of mask
It is also increasing to proportion shared in the influence as matter.
In the factor for causing the vertical position error of mask, the flexural deformation of mask is important
A factor.Because in imaging process, the illumination light that lighting source sends is beaten covering always
On film, mask can absorb a part of luminous energy so as to cause the heating effect to mask.Due to mask
Typically sucker is had to fix, but sucker can only fix the edge of mask, therefore mask pars intermedia
Dividing can produce bending, or even marginal portion by the change of the securing part of sucker after expanded by heating
Shape can be transmitted to mask center section and discharged.Mask expanded by heating can cause the figure on mask
The object plane position of shape off-target, so as to cause the vertical position of any two points on mask not phase
Together, so as to the point on using mask carries out generating vertical position error during vertical positioning, from
And object image distance calculation error is occurred.
And currently available technology is to monitor heat by temperature sensor or focusing and leveling means
Deformation, surveys school means or translating meanses to compensate thermal deformation, but cannot but enter by other
Row monitoring in real time and compensation.
It is therefore desirable to invent a kind of apparatus and method for monitoring offset mask layer version thermal deformation on-line,
Can real-time detection go out in exposure process the degree of deformation of mask flexibility and be compensated by.
The content of the invention
To solve the above problems, the present invention proposes a kind of on-line monitoring offset mask layer version thermal deformation
Apparatus and method, first electrode unit is set in mask stage, the is arranged on mask plate
The opposite polarity second electrode unit of one electrode unit, first electrode unit and second electrode list
Unit forms electrode loop and constitutes micro- capacitor cell, and sets control unit, for by connection
The first electrode unit and second electrode unit, the capacitance for monitoring above-mentioned micro- capacitor cell become
Change, and by controlling the voltage change of the electrode loop, regulate and control electrostatic force, suppress described in cover
The thermal deformation of film.By monitor electric capacity so as to measure mask plate deform after between mask stage away from
From, and the voltage for passing through electrode loop so that the electrostatic force between mask plate and mask stage makes
Obtain mask plate to be moved to mask stage, reduce distance between the two so as to the heat of offset mask layer version becomes
Shape.
To reach above-mentioned purpose, the present invention provides a kind of on-line monitoring offset mask layer version thermal deformation
Device, for carrying out surface type measurement and control to being secured and retained in mask plate in mask stage, bag
Include：
First electrode unit, is arranged in the mask stage；
Second electrode unit, is arranged on the mask plate, the first electrode unit and second
Electrode unit opposite polarity, forms electrode loop and constitutes micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, supervising
The capacitance variation of above-mentioned micro- capacitor cell is surveyed, and is become by controlling the voltage of the electrode loop
Change, regulate and control electrostatic force, suppress the thermal deformation of the mask.
Preferably, described control unit also provides power supply and capacitive measuring device, the electric capacity
Measuring apparatus are used to measure the capacitance of micro- capacitor cell.
Preferably, the power supply also has the regulation component of the voltage output that can regulate and control power supply,
For the voltage in controlled motor loop.
Preferably, the first electrode unit is arranged on the upper surface of mask stage, described second
Electrode unit is arranged on the lower surface of mask plate, the following table of the upper surface correspondence mask plate of mask stage
Face.
Preferably, the second electrode unit and mask plate integrated molding.
Preferably, the first electrode unit is embedded in the mask stage, and and mask plate
Lower surface is contacted.
Preferably, there is several first electrode units in array distribution in the mask stage,
And several first electrode units are insulated by megohmite insulant each other.
Preferably, the mask plate by first electrode unit Electrostatic Absorption in the mask stage.
Preferably, being also in series with regulation resistance in the electrode loop, institute is passed through for adjusting
State the capacitance of the electric current and the electric capacity in electrode loop.
The present invention also provides a kind of method for monitoring offset mask layer version thermal deformation on-line, in mask stage
Upper setting first electrode unit, sets second electrode unit, and first electricity on mask plate
Pole and second electrode opposite polarity so that first electrode unit forms electrode with second electrode unit
Loop and the micro- capacitor cell of composition, and control unit is set, for by connecting first electricity
Pole unit and second electrode unit, monitor the capacitance variation of above-mentioned micro- capacitor cell, and pass through
The voltage change of the electrode loop is controlled, regulates and controls electrostatic force, suppress the thermal deformation of the mask.
Preferably, the maximum distortion degree of setting mask plate, between correspondence mask plate and mask stage
Ultimate range be d0, when control unit monitor micro- capacitor cell capacitance after, calculate
The distance between mask plate and mask stage are more than d0When, returned by control unit control increase electrode
The voltage on road, so as to increase the electrostatic force between first electrode unit and second electrode unit, makes
The distance between mask plate and mask stage is obtained to reduce.
Preferably, the voltage that power supply and regulation and control power supply are provided with described control unit is defeated
The regulation component for going out, described control unit regulates and controls the output of power supply so as to control by regulation component
The voltage change of electrode loop.
Preferably, the electrode loop is also in series with regulation resistance, described control unit passes through
The capacitance of electric current and micro- capacitor cell in regulation resistance adjustment electrode loop.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention provides a kind of online prison
The device of offset mask layer version thermal deformation is surveyed, for entering to being secured and retained in mask plate in mask stage
Row surface type measurement and control, including：
First electrode unit, is arranged in the mask stage；
Second electrode unit, is arranged on the mask plate, the first electrode unit and second
Electrode unit opposite polarity, forms electrode loop and constitutes micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, supervising
The capacitance variation of above-mentioned micro- capacitor cell is surveyed, and is become by controlling the voltage of the electrode loop
Change, regulate and control electrostatic force, suppress the thermal deformation of the mask.
The present invention also provides a kind of method for monitoring offset mask layer version thermal deformation on-line, in mask stage
Upper setting first electrode unit, sets second electrode unit, and first electricity on mask plate
Pole unit and second electrode unit opposite polarity so that first electrode unit and second electrode unit
Form electrode loop and constitute micro- capacitor cell, and control unit is set, for by connecting
First electrode unit and second electrode unit are stated, the capacitance variation of above-mentioned micro- capacitor cell is monitored,
And by controlling the voltage change of the electrode loop, regulate and control electrostatic force, suppress the mask
Thermal deformation.
The present invention sets first electrode unit in mask stage, and the first electricity is arranged on mask plate
The opposite polarity second electrode unit of pole unit, first electrode unit and second electrode unit shape
Into electrode loop and the micro- capacitor cell of composition, and the capacitance that can measure micro- capacitor cell is set
Control unit, for by connecting the first electrode unit and second electrode unit, monitoring
The capacitance variation of above-mentioned micro- capacitor cell, and by controlling the voltage change of the electrode loop,
Regulation and control electrostatic force, suppresses the thermal deformation of the mask., by the electric capacity for measuring micro- capacitor cell
Value is returned so as to the distance between measure after mask plate deformation with mask stage by adjusting electrode
The voltage on road, the electrostatic force between control mask plate and mask stage causes that mask plate is transported to mask stage
It is dynamic, distance between the two is reduced so as to the thermal deformation of offset mask layer version, so both can be online
The thermal deformation degree of real-time monitoring mask plate can also real-Time Compensation mask plate thermal deformation.
Brief description of the drawings
The Electrostatic Absorption mask plate schematic diagram that Fig. 1 is provided for the present invention；
The apparatus structure schematic diagram that Fig. 2 is provided for the present invention；
The mask plate Top electrode distribution schematic diagram that Fig. 3 is provided for the present invention；
The monitoring mask plate thermal deformation schematic diagram that Fig. 4 is provided for the present invention；
The device circuit figure that Fig. 5 is provided for the present invention；
Fig. 6 is the monitoring for providing of the invention and compensation thermal deformation method flow diagram.
In figure：1- mask stages, 2- mask plates, 3- electrodes, 4- electric wires, 5- total control box, 6-
Power supply, 7- capacitive measuring devices, 8- regulation resistance.
Specific embodiment
To enable the above objects, features and advantages of the present invention more obvious understandable, tie below
Accompanying drawing is closed to be described in detail specific embodiment of the invention.
Mask plate 2 is attracted in mask stage 1, and during photoetching, the light that lighting source sends shines
On mask plate 2, due to having reflecting layer in the graphics field on mask plate 2, so from figure
The light that is reflected on region and being collected by optics is exposed on the substrate of work stage, so that will
Figure on mask plate 2 is stamped to substrate.
Fig. 1, Fig. 2 and Fig. 3 are refer to, the present invention provides a kind of on-line monitoring offset mask layer version
The device of thermal deformation, the mask stage 1 installed in mask plate 2 and for carrying the mask plate 2
On, in the present embodiment, mask plate 2 is conductive materials, naturally it is also possible to mask plate 2 with
Conducting medium is coated on that surface of the contact of mask stage 1, mask stage 1 is contacted with mask plate 2
The electrode 3 of array arrangement is embedded with that surface, the material of electrode 3 is mainly metal, the gold
Category electrode 3 can either constitute electric capacity with conductive mask plate 2, be also for Electrostatic Absorption mask
The part of version 2.
Fig. 5 is refer to, every electrode 3 is connected with mask plate 2 using electric wire 4, and connect
One total control box 5 forms the power supply that the loop is provided in loop, total control box 5, and each is returned
A capacitive measuring device 7 for being used to measure capacitance is configured in road, between each loop mutually
It is independent, one total control box 5 of each self-configuring in each loop.
Except with capacitive measuring device 7, can also regulate and control the electricity of power supply 6 in total control box 5
Press the regulation component (not shown) of output size.
Fig. 5 is continued referring to, regulation resistance 8 is also in series with loop, passed through back for adjusting
The capacitance of electric current and electric capacity in road.
Fig. 4 and Fig. 6 is refer to, the present invention also provides one kind and uses on-line monitoring as described above
The on-line monitoring offset mask layer version thermal deformation method of the device of offset mask layer version thermal deformation, specific bag
Include following steps：
Step one：Electrode 3 on mask plate 2 and mask stage 1 and power supply 6 are formed into loop,
And regulation of series resistance 8, and capacitive measuring device 7, after the setting thermal deformation of mask plate 2
With the ultimate range d between mask stage 10。
Step 2：When exposure starts, 6 are turned on the power, now mask plate 2 turns into all electrodes
3 public capacitance pole, that is, all of motor 3 all with mask plate 2 formed electric capacity, but by
It is smaller with the electrostatic field scope that mask plate 2 is formed in each electrode 3, therefore electrode 3 is corresponding
Influenced each other between the electric capacity that electric capacity and another electrode 3 are formed smaller, more will not short circuit.
Step 3：When mask plate 2 start deformation when, between mask plate 2 and mask stage 1 away from
Can increase from d, the electric capacity between mask plate 2 and electrode 3Wherein ε is dielectric
Constant, k is electrostatic force constant, and S is the area of electrode 3, it follows that when d increases,
Electric capacity between mask plate 2 and electrode 3 reduces, therefore when capacitive measuring device 7 measures mask
Electric capacity between version 2 and electrode 3, so as to be calculated d>d0, and mask plate 2 and electrode 3
Between electrostatic force F=U/d, i.e.,Wherein U is the magnitude of voltage of the output of power supply 6,
The size of the magnitude of voltage that therefore can be exported by regulation power supply 6, improves mask plate 2 and electrode
Electrostatic force between 3, so that change the distance between mask plate 2 and electrode 3, until d<d0,
With the thermal deformation of timely offset mask layer version 2.
In d<d0When, it may not be necessary to the size of the magnitude of voltage of the output of regulation power supply 6, can see in real time
The capacitance that capacitive measuring device 7 is measured is surveyed, is so achieved that for the thermal deformation of mask plate 2
Real-time monitoring.
The present invention is described to above-described embodiment, but the present invention is not limited only to above-described embodiment,
Obvious those skilled in the art can carry out various changes and modification without deviating from this to invention
The spirit and scope of invention.So, if these modifications of the invention and modification belong to the present invention
Within the scope of claim and its equivalent technologies, then the present invention be also intended to include these change and
Including modification.
Claims (13)
1. it is a kind of monitor on-line offset mask layer version thermal deformation device, for being secured and retained in
Mask plate carries out surface type measurement and control in mask stage, it is characterised in that including：
First electrode unit, is arranged in the mask stage；
Second electrode unit, is arranged on the mask plate, the first electrode unit and second
Electrode unit opposite polarity, forms electrode loop and constitutes micro- capacitor cell；
Control unit, for by connecting the first electrode unit and second electrode unit, supervising
The capacitance variation of above-mentioned micro- capacitor cell is surveyed, and is become by controlling the voltage of the electrode loop
Change, regulate and control electrostatic force, suppress the thermal deformation of the mask plate.
2. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, described control unit also provides power supply and capacitive measuring device, the capacitance measurement sets
It is ready for use on the capacitance for measuring micro- capacitor cell.
3. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 2, and it is special
Levy and be, the power supply also has the regulation component of the voltage output that can regulate and control power supply, is used for
The voltage in controlled motor loop.
4. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, the first electrode unit is arranged on the upper surface of mask stage, the second electrode list
Unit is arranged on the lower surface of mask plate, the lower surface of the upper surface correspondence mask plate of mask stage.
5. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 4, and it is special
Levy and be, the second electrode unit and mask plate integrated molding.
6. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, the first electrode unit is embedded in the mask stage, and with mask plate lower surface
Contact.
7. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, there is several first electrode units in array distribution in the mask stage, and
Several first electrode units are insulated by megohmite insulant each other.
8. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, the mask plate is by first electrode unit Electrostatic Absorption in the mask stage.
9. the device of offset mask layer version thermal deformation is monitored on-line as claimed in claim 1, and it is special
Levy and be, regulation resistance is also in series with the electrode loop, the electrode is passed through for adjusting
The capacitance of electric current and the electric capacity in loop.
10. it is a kind of monitor on-line offset mask layer version thermal deformation method, it is characterised in that covering
First electrode unit is set on film platform, second electrode unit, and described the are set on mask plate
One electrode unit and second electrode unit opposite polarity so that first electrode unit and second electrode
Unit forms electrode loop and constitutes micro- capacitor cell, and sets control unit, for by even
The first electrode unit and second electrode unit are connect, the capacitance of above-mentioned micro- capacitor cell is monitored
Change, and by controlling the voltage change of the electrode loop, regulate and control electrostatic force, suppress described
The thermal deformation of mask.
The method of 11. on-line monitoring offset mask layer version thermal deformations as claimed in claim 10, its
It is characterised by, sets the maximum distortion degree of mask plate, between correspondence mask plate and mask stage most
Big distance is d0, when control unit monitor micro- capacitor cell capacitance after, calculate mask
The distance between version and mask stage are more than d0When, by control unit control increase electrode loop
Voltage, so as to increase the electrostatic force between first electrode unit and second electrode unit so that cover
The distance between film version and mask stage reduce.
The method of 12. on-line monitoring offset mask layer version thermal deformations as claimed in claim 10, its
It is characterised by, the voltage output of power supply and regulation and control power supply is provided with described control unit
Regulation component, described control unit regulates and controls the output of power supply so as to coordination electrode by regulation component
The voltage change in loop.
The method of 13. on-line monitoring offset mask layer version thermal deformations as claimed in claim 10, its
It is characterised by, the electrode loop is also in series with regulation resistance, and described control unit is by regulation
The capacitance of electric current and micro- capacitor cell in resistance adjustment electrode loop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511032055.1A CN106933059B (en) | 2015-12-31 | 2015-12-31 | A kind of device and method of on-line monitoring offset mask layer version thermal deformation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511032055.1A CN106933059B (en) | 2015-12-31 | 2015-12-31 | A kind of device and method of on-line monitoring offset mask layer version thermal deformation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106933059A true CN106933059A (en) | 2017-07-07 |
| CN106933059B CN106933059B (en) | 2018-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511032055.1A Active CN106933059B (en) | 2015-12-31 | 2015-12-31 | A kind of device and method of on-line monitoring offset mask layer version thermal deformation |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976872A (en) * | 2017-12-29 | 2018-05-01 | 武汉华星光电技术有限公司 | Compensate method and device, the exposure machine of the deformation quantity of light shield |
| CN108362771A (en) * | 2018-02-13 | 2018-08-03 | 京东方科技集团股份有限公司 | A kind of damage monitoring apparatus and system |
| CN111352317A (en) * | 2018-12-21 | 2020-06-30 | 夏泰鑫半导体(青岛)有限公司 | Exposure device and method for detecting mask alignment error |
| CN111769028A (en) * | 2020-06-24 | 2020-10-13 | 上海理工大学 | Glass negative flatness correction device and method |
| CN116791028A (en) * | 2023-06-28 | 2023-09-22 | 惠科股份有限公司 | Mask plate assembly and evaporation device |
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| JP2002036373A (en) * | 2000-07-25 | 2002-02-05 | Sanyo Electric Co Ltd | Stereo lithographic apparatus |
| JP2003324028A (en) * | 2002-04-30 | 2003-11-14 | Jfe Steel Kk | Method of manufacturing planar magnetic element |
| CN1991591A (en) * | 2005-12-30 | 2007-07-04 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
| CN103415811A (en) * | 2011-03-11 | 2013-11-27 | Asml荷兰有限公司 | Electrostatic clamp apparatus and lithographic apparatus |
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| JP2002036373A (en) * | 2000-07-25 | 2002-02-05 | Sanyo Electric Co Ltd | Stereo lithographic apparatus |
| JP2003324028A (en) * | 2002-04-30 | 2003-11-14 | Jfe Steel Kk | Method of manufacturing planar magnetic element |
| CN1991591A (en) * | 2005-12-30 | 2007-07-04 | Asml荷兰有限公司 | Lithographic apparatus and device manufacturing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976872A (en) * | 2017-12-29 | 2018-05-01 | 武汉华星光电技术有限公司 | Compensate method and device, the exposure machine of the deformation quantity of light shield |
| CN108362771A (en) * | 2018-02-13 | 2018-08-03 | 京东方科技集团股份有限公司 | A kind of damage monitoring apparatus and system |
| CN111352317A (en) * | 2018-12-21 | 2020-06-30 | 夏泰鑫半导体(青岛)有限公司 | Exposure device and method for detecting mask alignment error |
| CN111769028A (en) * | 2020-06-24 | 2020-10-13 | 上海理工大学 | Glass negative flatness correction device and method |
| CN111769028B (en) * | 2020-06-24 | 2023-03-21 | 上海理工大学 | Glass negative flatness correction device and method |
| CN116791028A (en) * | 2023-06-28 | 2023-09-22 | 惠科股份有限公司 | Mask plate assembly and evaporation device |
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| Publication number | Publication date |
|---|---|
| CN106933059B (en) | 2018-11-13 |
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