CN106935732B - A kind of thin-film packing structure and its packaging method, OLED device - Google Patents
A kind of thin-film packing structure and its packaging method, OLED device Download PDFInfo
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- CN106935732B CN106935732B CN201710355710.XA CN201710355710A CN106935732B CN 106935732 B CN106935732 B CN 106935732B CN 201710355710 A CN201710355710 A CN 201710355710A CN 106935732 B CN106935732 B CN 106935732B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The embodiment of the present invention provides a kind of thin-film packing structure and its packaging method, OLED device, is related to field of display technology, be able to solve by dried object be arranged in inorganic barrier layer and caused by inorganic barrier ply stress pull problem.The thin-film packing structure includes substrate, further includes: the film layer structure of the part to be packaged on covering substrate；Film layer structure includes: the first inorganic barrier layer being sequentially formed on part to be packaged, first organic barrier layer, second organic barrier layer and the second inorganic barrier layer；At least one dried object is provided between first organic barrier layer and second organic barrier layer.The present invention is encapsulated for device.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of thin-film packing structure and its packaging methods, OLED device.
Background technique
Organic electroluminescence device (Organic Light Emitting Device, abbreviation OLED) is in recent years gradually
The display illuminating device to grow up, due to its have many advantages, such as high response, high contrast, can flexibility, be considered as possessing extensively
General application prospect.But since OLED device is under the action of steam and oxygen, it may appear that the phenomenon that corrosion and damage, therefore,
Select preferable packaged type particularly important for OLED device.
Currently, thin-film package is a kind of packaged type being widely used in OLED display production, i.e., had using inorganic
Machine pile stack structure covers OLED device, to achieve the purpose that obstruct water oxygen.Desiccant is added in thin-film package to incite somebody to action
Encapsulation performance improves at least one grade, however desiccant is typically fabricated in inorganic barrier layer or is covered in nothing in the prior art
On machine barrier layer, it is easy expansion after water suction, causes stress to pull inorganic barrier layer, influences packaging effect.
Summary of the invention
The embodiment of the present invention provides a kind of thin-film packing structure and its packaging method, OLED device, and being able to solve will be dry
Dry object be arranged in inorganic barrier layer and caused by inorganic barrier ply stress pull problem.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
On the one hand, the embodiment of the present invention provides a kind of thin-film packing structure, including substrate, further includes:
Cover the film layer structure of the part to be packaged on the substrate；
The film layer structure includes: the first inorganic barrier layer being sequentially formed on the part to be packaged, first organic resistance
Interlayer, second organic barrier layer and the second inorganic barrier layer；
At least one dried object is provided between first organic barrier layer and second organic barrier layer.
Optionally, the dried object is strip or dotted.
Optionally, multiple dryings are provided between described first organic barrier layer and second organic barrier layer
Object；Multiple dried objects are in array distribution.
Optionally, the thickness of the dried object of array distribution is the 1/10~1/ of the thickness of described second organic barrier layer
5。
Optionally, the viscosity of the dried object is 10000mPas~40000mPas.
Optionally, the viscosity of described second organic barrier layer is 1mPas~10mPas.
Optionally, multiple film layer structures have been superposed on the part to be packaged.
Optionally, the nanometer water-absorbent material that the dried object is liquid drier or partial size is 10nm~50nm.
On the other hand, the embodiment of the present invention provides a kind of film encapsulation method, which comprises
Sequentially form the first inorganic barrier layer and first organic barrier layer of the part to be packaged on covering substrate；
Multiple dried objects are set on described first organic barrier layer；
Form the second organic barrier layer for covering the dried object；
Form the second inorganic barrier layer for covering second organic barrier layer.
In another aspect, the embodiment of the present invention provides a kind of OLED device, including described in part to be packaged and any one of the above
Thin-film packing structure；Wherein, the part to be packaged is OLED main structure.
Thin-film packing structure provided in an embodiment of the present invention and its packaging method, OLED device, the thin-film packing structure
Including substrate, further includes: the film layer structure of the part to be packaged on covering substrate；Film layer structure include: be sequentially formed at it is to be packaged
The first inorganic barrier layer, first organic barrier layer, second organic barrier layer and the second inorganic barrier layer on part；First organic resistance
At least one dried object is provided between interlayer and second organic barrier layer.Compared to the prior art, the embodiment of the present invention provides
Thin-film packing structure by by dried object be arranged between first organic barrier layer and second organic barrier layer, dried object water suction
Stress after expansion can be absorbed by first organic barrier layer and second organic barrier layer, will not be to the first inorganic barrier layer and the
Two inorganic barrier layers have an impact, so that the packaging effect of thin-film packing structure is preferable.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of thin-film packing structure schematic diagram one provided in an embodiment of the present invention；
Fig. 2 is a kind of thin-film packing structure schematic diagram two provided in an embodiment of the present invention；
Fig. 3 is a kind of thin-film packing structure schematic diagram three provided in an embodiment of the present invention；
Fig. 4 is a kind of thin-film packing structure schematic diagram four provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of thin-film packing structure, as shown in Figure 1, including substrate 10, further includes: covering substrate
The film layer structure of part to be packaged 11 on 10；The film layer structure include: be sequentially formed on part 11 to be packaged it is first inorganic
Barrier layer 12, first organic barrier layer 13, second organic barrier layer 14 and the second inorganic barrier layer 15；First organic barrier layer 13
And second be provided at least one dried object 16 between organic barrier layer 14.
Wherein, part 11 to be packaged is the device for needing to carry out thin-film package, and it is not limited in the embodiment of the present invention.In reality
In the application of border, part 11 to be packaged can be OLED main structure.
The embodiment of the present invention is for the first inorganic barrier layer 12, first organic barrier layer 13, second organic 14 and of barrier layer
Without limitation, those skilled in the art can be with for the material of second inorganic barrier layer 15, manufacture craft, production thickness, viscosity etc.
It is set according to the actual situation.
Dried object 16 is the substance for capableing of adsorption moisture, and the embodiment of the present invention is for the specific material of dried object 16, setting
Quantity, shape, viscosity etc. are without limitation.Refering to what is shown in Fig. 1, the setting of dried object 16 has in first organic barrier layer 13 and second
Between machine barrier layer 14, only contacted with first organic barrier layer 13 and second organic barrier layer 14.Dried object 16 absorbs water in this way
Stress after expansion can be absorbed by first organic barrier layer 13 and second organic barrier layer 14, will not be to the first inorganic barrier layer
12 and second inorganic barrier layer 15 have an impact, so that the packaging effect of thin-film packing structure is preferable.
Preferably, refering to what is shown in Fig. 1, dried object 16 is strip or dotted.In this way convenient for dried object 16 to different zones
The absorption of moisture；And it is arranged to a monolith compared to by dried object 16, by 16 scattering device of dried object at multiple strips or point
Shape can to bond between first organic barrier layer 13 and second organic barrier layer 14 more preferable.
Further, multiple dried objects 16 are provided between first organic barrier layer 13 and second organic barrier layer 14；It is more
A dried object 16 is in array distribution.It is made in this way convenient for technique, is also more conducive to dried object 16 to the moisture of different zones
Uniform pickup.Size of the embodiment of the present invention for spacing and single dried object 16 between multiple dried objects 16 of array distribution
Without limitation.In actual fabrication, the interval between two neighboring dried object 16 can be set to 1mm~2mm.Work as dried object
16 for it is dotted when, the equivalent diameter of dried object 16 can be 0.5mm~2mm.The material of main part of dried object 16 can be 10-50nm
CaO, BaO, TiO of partial size2Etc. nanometers water-absorbent material, the easy volatile solvents shape such as methanol, ethyl alcohol can be added in material of main part
At paste；Alternatively, dried object 16 is the liquid driers such as glycerol, diethylene glycol (DEG).Dried object 16 can pass through spraying, printing or print
The mode of brush is produced on the surface of first organic barrier layer 13.
For the ease of forming strip or dotted dried object 16 on the surface of first organic barrier layer 13, dried object 16 glues
Spend generally large, viscosity can be in 10000mPas~40000mPas；Second organic barrier is made on dried object 16
When layer 14, in order to cover dried object 16 by way of natural levelling, the viscosity of second organic barrier layer 14 is typically small, glues
Degree can be in 1mPas~10mPas.In order to guarantee second organic barrier layer 14 to the coverage effect of dried object 16, preferably
, the thickness of the dried object 16 of array distribution is the 1/10~1/5 of the thickness of second organic barrier layer 14.
In practical applications, the material of the first inorganic barrier layer 12 and the second inorganic barrier layer 15 can be SiNx, SiO2、
SiC、Al2O3, ZnS, ZnO etc. there is the material of barrier water oxygen effect, sunk by chemical vapor deposition (CVD), sputtering, atomic force
The modes such as product (ALD) form 0.05 μm~2.5 μm of film.The material of first organic barrier layer 13 and second organic barrier layer 14
Can be the polymer such as monomer, polyacrylate, polymethyl methacrylate (PMMA), polycarbonate, by spraying, printing or
The modes such as printing form film.Wherein, the thickness of first organic barrier layer 13 can be 0.5 μm -5 μm；Second organic barrier layer
14 thickness can be 10 μm -20 μm.
It, can also be with it should be noted that the material of first organic barrier layer 13 and second organic barrier layer 14 can be identical
Difference, it is not limited in the embodiment of the present invention, preferably, the material of the first organic barrier layer 13 and second organic barrier layer 14
It is identical, the bond effect of first organic barrier layer 13 and second organic barrier layer 14 can be made more preferable in this way.
In order to further increase the packaging effect for treating packaging part 11, can be superposed on part 11 to be packaged multiple described
Film layer structure, the embodiment of the present invention for the film layer structure specific setting quantity without limitation.
Thin-film packing structure provided in an embodiment of the present invention, including substrate, further includes: cover the part to be packaged on substrate
Film layer structure；Film layer structure includes: the first inorganic barrier layer being sequentially formed on part to be packaged, first organic barrier layer,
Two organic barrier layers and the second inorganic barrier layer；At least one is provided between first organic barrier layer and second organic barrier layer
Dried object.Compared to the prior art, thin-film packing structure provided in an embodiment of the present invention has by being arranged dried object first
Between machine barrier layer and second organic barrier layer, the stress after dried object water swelling can be by first organic barrier layer and second
Organic barrier layer absorbs, and will not have an impact to the first inorganic barrier layer and the second inorganic barrier layer, so that thin-film package
The packaging effect of structure is preferable.
Another embodiment of the present invention provides a kind of film encapsulation methods, as shown in Figures 1 to 4, which comprises successively
Form the first inorganic barrier layer 12 and first organic barrier layer 13 of the part to be packaged 11 on covering substrate 10；In first organic resistance
Multiple dried objects 16 are set on interlayer 13；Form second organic barrier layer 14 of covering dried object 16；It is organic to form covering second
Second inorganic barrier layer 15 of barrier layer 14.
The embodiment of the present invention is for the first inorganic barrier layer 12, first organic barrier layer 13, dried object 16, second organic resistance
The specific manufacture craft of interlayer 14 and the second inorganic barrier layer 15 is without limitation.
In actual fabrication, referring to figs. 1 to shown in Fig. 4, the first inorganic barrier layer 12 is formed on part 11 to be packaged first,
First organic barrier layer 13 is formed on the surface of the first inorganic barrier layer 12, and is solidified；Then in first organic barrier layer 13
Surface forms the strip or dotted dried object 16 of array distribution in a manner of being coated with or print, in 16 gap of dried object using spray
The mode of ink printing forms second organic barrier layer 14, by the natural levelling of second organic barrier layer 14, covers dried object
16, then carry out second organic barrier layer 14 and solidify, make the second inorganic barrier layer 15 again later.
Yet another embodiment of the invention provides a kind of OLED device, including part 11 to be packaged and among the above described in any one
Thin-film packing structure；Wherein, part 11 to be packaged is OLED main structure.
The embodiment of the present invention does not do the specific material, thickness, manufacture craft etc. of each film layer of thin-film packing structure
It limits.
It is exemplary, carry out OLED main structure thin-film package when, in OLED main structure by the way of CVD shape
At 0.5 μm of SiNx film, as the first inorganic barrier layer 12, on the surface of the first inorganic barrier layer 12 by the way of printing
The monomer film of 1 μm of formation is as first organic barrier layer 13, and UV irradiation solidifies；The surface of first organic barrier layer 13 with
The mode of printing forms interval 1mm, wide 1mm, and the strip liquid dried object 16 of 2 μm of height uses ink-jet in 16 gap of dried object
The mode of printing forms 10 μm of monomer as second organic barrier layer 14, by the natural levelling of second organic barrier layer 14,
Liquid dried object 16 is covered, then carries out the UV irradiation solidification of second organic barrier layer 14, dried object 16 is folded in the in this way
Between one organic barrier layer 13 and second organic barrier layer 14,1 μm of SiNx film is made again later as the second inorganic barrier
Layer 15.
Alternatively, 0.05 μm of Al is formed by the way of ALD in OLED main structure2O3Film, as the first inorganic resistance
Interlayer 12 forms 1 μm of monomer as first organic barrier layer by the way of printing on the surface of the first inorganic barrier layer 12
13, and UV irradiation solidification；Interval 1mm, wide 1mm, 2 μm of height are formed in a manner of spraying on the surface of first organic barrier layer 13
Dotted CaO and ethyl alcohol mixing paste dried object 16, and dried under 40 DEG C of environment；It is beaten in 16 gap of dried object using ink-jet
The monomer that the mode of print forms 10 μm is covered as second organic barrier layer 14 by the natural levelling of second organic barrier layer 14
Liquid dried object 16 is covered, then carries out the UV irradiation solidification of second organic barrier layer 14, dried object 16 is folded in first in this way
Between organic barrier layer 13 and second organic barrier layer 14,1 μm of SiNx film is made again later as the second inorganic barrier layer
15。
Since thin-film packing structure provided in an embodiment of the present invention is by dried object setting in first organic barrier layer and the
Between two organic barrier layers, the stress after dried object water swelling can be inhaled by first organic barrier layer and second organic barrier layer
It receives, the first inorganic barrier layer and the second inorganic barrier layer will not be had an impact, so that the encapsulation of thin-film packing structure is imitated
Fruit is preferable.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of thin-film packing structure, including substrate, which is characterized in that further include:
Cover the film layer structure of the part to be packaged on the substrate；
The film layer structure include: the first inorganic barrier layer being sequentially formed on the part to be packaged, first organic barrier layer,
Second organic barrier layer and the second inorganic barrier layer；
At least one dried object is provided between first organic barrier layer and second organic barrier layer；
The dried object is strip or dotted.
2. thin-film packing structure according to claim 1, which is characterized in that first organic barrier layer and described second
Multiple dried objects are provided between organic barrier layer；Multiple dried objects are in array distribution.
3. thin-film packing structure according to claim 2, which is characterized in that the thickness of the dried object of array distribution is
The 1/10~1/5 of the thickness of second organic barrier layer.
4. thin-film packing structure according to claim 1, which is characterized in that the viscosity of the dried object is 10000mPa
S~40000mPas.
5. thin-film packing structure according to claim 1, which is characterized in that the viscosity of second organic barrier layer is
1mPas~10mPas.
6. thin-film packing structure according to claim 1, which is characterized in that be superposed on the part to be packaged multiple
The film layer structure.
7. thin-film packing structure according to claim 1, which is characterized in that the dried object is liquid drier or partial size
For the nanometer water-absorbent material of 10nm~50nm.
8. a kind of film encapsulation method, which is characterized in that the described method includes:
Sequentially form the first inorganic barrier layer and first organic barrier layer of the part to be packaged on covering substrate；
Multiple dried objects are set on described first organic barrier layer；
Form the second organic barrier layer for covering the dried object；
Form the second inorganic barrier layer for covering second organic barrier layer；
Forming the dried object is strip or dotted.
9. a kind of OLED device, which is characterized in that including film described in any one of part to be packaged and claim 1 to 7
Encapsulating structure；Wherein, the part to be packaged is OLED main structure.
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| CN107403883A (en) * | 2017-09-13 | 2017-11-28 | 武汉华星光电半导体显示技术有限公司 | The method for packing of OLED display panel |
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| CN208045504U (en) * | 2018-04-09 | 2018-11-02 | 京东方科技集团股份有限公司 | A kind of encapsulating structure, display device and display device |
| CN108428807A (en) * | 2018-05-14 | 2018-08-21 | 云谷（固安）科技有限公司 | Thin-film packing structure and display screen |
| CN109904345A (en) * | 2019-02-28 | 2019-06-18 | 武汉华星光电半导体显示技术有限公司 | Encapsulating structure and its display device |
| CN110707236B (en) | 2019-10-17 | 2022-08-30 | 京东方科技集团股份有限公司 | Packaging structure and packaging method of display substrate and display device |
| CN114256400B (en) * | 2020-09-24 | 2023-05-12 | 重庆康佳光电技术研究院有限公司 | Micro light-emitting chip assembly, manufacturing method thereof and micro light-emitting chip transferring method |
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