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CN106919003B - Pattern forming method and device, pattern exposure method and manufacturing method - Google Patents

Pattern forming method and device, pattern exposure method and manufacturing method Download PDF

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Publication number
CN106919003B
CN106919003B CN201611176699.2A CN201611176699A CN106919003B CN 106919003 B CN106919003 B CN 106919003B CN 201611176699 A CN201611176699 A CN 201611176699A CN 106919003 B CN106919003 B CN 106919003B
Authority
CN
China
Prior art keywords
substrate
pattern
plate shape
shape substrates
side direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201611176699.2A
Other languages
Chinese (zh)
Other versions
CN106919003A (en
Inventor
堀正和
奈良圭
横田宗泰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN106919003A publication Critical patent/CN106919003A/en
Application granted granted Critical
Publication of CN106919003B publication Critical patent/CN106919003B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
    • B65H23/1882—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling longitudinal register of web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/24—Registering, tensioning, smoothing or guiding webs longitudinally by fluid action, e.g. to retard the running web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2404/00—Parts for transporting or guiding the handled material
    • B65H2404/10—Rollers
    • B65H2404/13—Details of longitudinal profile
    • B65H2404/131—Details of longitudinal profile shape
    • B65H2404/1314—Details of longitudinal profile shape convex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2406/00—Means using fluid
    • B65H2406/10—Means using fluid made only for exhausting gaseous medium
    • B65H2406/11—Means using fluid made only for exhausting gaseous medium producing fluidised bed
    • B65H2406/111—Means using fluid made only for exhausting gaseous medium producing fluidised bed for handling material along a curved path, e.g. fluidised turning bar
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/10—Size; Dimensions
    • B65H2511/12—Width
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/50—Occurence
    • B65H2511/51—Presence
    • B65H2511/512—Marks, e.g. invisible to the human eye; Patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2553/00—Sensing or detecting means
    • B65H2553/40—Sensing or detecting means using optical, e.g. photographic, elements
    • B65H2553/42—Cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2601/00—Problem to be solved or advantage achieved
    • B65H2601/20—Avoiding or preventing undesirable effects
    • B65H2601/25—Damages to handled material
    • B65H2601/254—Permanent deformation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/03—Image reproduction devices
    • B65H2801/15—Digital printing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Advancing Webs (AREA)
  • Electroluminescent Light Sources (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)

Abstract

A kind of pattern forming method and device of present invention offer, pattern exposure method and manufacturing method form the pattern of electronic component by substrate conveyance in long side direction in the processed surface of substrate, including：It is supported on position at detach both set a distances on the long side direction of substrate 2 respectively using guiding elements on one side, on one side by between position at make substrate 2 in the short side direction orthogonal with long side direction in such a way that given degree is shunk, the step of assigning long side direction tension to the part of both set a distances of substrate；At 2 between position, in the state of friction free state or small contact area, using supporting member for substrate by the part in the face of the back side of the processed surface of substrate, the step of bearing to planar or curved；With a part of corresponding of the substrate that is supported using supporting member for substrate in the state of being shunk with given degree and the step of be set in the pattern for forming electronic component in the region of processed surface.

Description

Pattern forming method and device, pattern exposure method and manufacturing method
The application is divisional application, original bill application No. is 201280053802.8, the applying date is on 09 27th, 2012, Entitled " substrate board treatment and substrate processing method using same ".
Technical field
The present invention about to the films machine plate such as film and sheet material impose patterning etc. high-precision processing processing substrate The carrying device of device and film substrate.Also, the purpose of the present invention is providing a kind of substrate to implement to process in high precision Processing method.
Present application advocates the priority of Japan's Patent 2011-242788 filed in 4 days November in 2011, by it Content is applied at this.
Background technology
As the display element for constituting the display devices such as display equipment, such as to have liquid crystal display element, organic electric shock Shine (organic EL) element, the electrophoresis element etc. for Electronic Paper.As one of the gimmick of these elements of manufacture, such as there is one kind It is referred to as the gimmick of roll-to-roll (roll to roll) mode (hereinafter referred to as (winding method)) (for example, referring to patent document 1)。
Such winding method is sent out a piece of sheet (sheet shapes) substrate (web) wound on supply substrate side wheel and is incited somebody to action The substrate of submitting transports substrate with substrate recycling side wheel while being wound, sending out substrate to during being wound, The patterns such as display circuit and driving circuit are sequentially formed to the gimmick on substrate.In recent years, it has been proposed that a kind of formation high-precision The processing unit of pattern.
Look-ahead technique document Prior Art
[patent document 1] International Publication No. 2006/100868
Invention content
Invent the project to be solved
However, in response to higher precision situation when, if require nothing more than processing unit patterning precision (height parsing, transfer The low distortion etc. of pattern) it is inadequate.
The purpose of aspect of the present invention is providing a kind of substrate board treatment carrying out high Precision Processing or accurate conveyance The device of film substrate.In addition, the purpose of another aspect of the present invention, is providing a kind of processing substrate carrying out high Precision Processing Method.
To the means to solve the problem
1st aspect of the invention, provides a kind of substrate board treatment, and substrate is transported in the 1st direction and to the quilt of the substrate Process face is handled, and is had：By substrate-guided the 1st guiding elements in the 1st direction；It is detached with the 1st guiding elements Configuration, guiding the 2nd guiding elements of the substrate guided by the 1st guiding elements；In the 1st guiding elements and the 2nd Tension is assigned to the substrate between guiding elements, so that size reduction of the substrate in the 2nd direction that intersects with the 1st direction Tension imparting mechanism；And between the 1st guiding elements and the 2nd guiding elements, at the processed surface of the substrate The processing unit of reason.
The 2nd aspect of the present invention, provides a kind of substrate processing method using same, and the strip substrate of sheet is transported in length direction, In sequentially forming predetermined pattern on the substrate, have；Obtain make the substrate the pattern to be formed subregion with the length The step of spending shrinkage degree when the orthogonal width direction in direction is shunk relevant information；And clip the base in the length direction At specific the 2 of the subregion of plate between position, length direction is assigned to the substrate according to the relevant information of the shrinkage degree Tension the step of.
Invention effect
A kind of aspect according to the present invention, it is possible to provide substrate board treatment that can carry out high Precision Processing.In addition, according to this A kind of another aspect of invention, it is possible to provide substrate processing method using same that can carry out high Precision Processing.
Description of the drawings
Fig. 1：All schematic diagrames constituted of the substrate board treatment of this implementation form.
Fig. 2：Show the 1st front view constituted of the processing unit of this implementation form.
Fig. 3：The vertical view that the 1st of top observation chart 2 is constituted.
Fig. 4：Show the figure of the substrate retracted position of this implementation form.
Fig. 5：The chart for the variation that display is shunk with the substrate that the 1st simulation carries out.
Fig. 6：The chart for the variation that display is shunk with the substrate that the 2nd simulation carries out.
Fig. 7：The chart for the variation that display is shunk with the substrate that the 3rd simulation carries out.
Fig. 8：Show the chart that the condition that substrate is shunk is found out from analog result.
Fig. 9：Show the 2nd vertical view constituted of the processing unit of this implementation form.
Figure 10：Show the 3rd front view constituted of the processing unit of this implementation form.
Figure 11：Viewed from above shown in Fig. 10 3rd vertical view constituted.
Figure 12：Show the 4th figure constituted of the processing unit of this implementation form.
Figure 13：Show the figure for the state for being constituted the substrate handled with the 4th of Figure 12 the.
Figure 14：Show the 5th vertical view constituted of the processing unit of this implementation form.
Figure 15：Show the 6th vertical view constituted of the processing unit of this implementation form.
Figure 16：From the 6th front view constituted of transverse direction observation chart 15.
Main element label declaration：
5 alignment video cameras
10,10A, 10B processing unit
11 the 1st idler wheels
12 the 2nd idler wheels
11a, 12a hold-down roll
13 baskets
The bottom of 13B baskets
The opening portion 13m, 13n
13R reception rooms
13Wa baskets-X-axis side end face
13Wb baskets+X-axis side end face
14 baseplate carrier mechanisms
14a peripheral surfaces
15 driving portions
16 guide rails
17 shifting rollers
18 alignment video cameras
113 base components
113g guide rails
115 fluid control units
116 gas blankets (air bearing)
120 planes keep tool
122 driving mechanisms
The foot of 126 processing heads
ALM alignment marks
Ae, As distance
ATB air turning-bars
CC axis
CONT control units
CR is padded
The conveyance direction of Dx substrates
EA view fields
EX exposure devices
The edge of Ee1, Ee2 substrate
The edge of Es1, Es2 substrate
F tension
HD processing heads
IFM surveys long laser interferometer
The illumination portions IL
LMa stators
LMb can mover
M light shields
MD cylinder light shields
MH light shield maintaining parts
MST mask stages
The gaps Np
P patterns
PA, PB area of the pattern
PD panel zones
PL projection optics system
S substrates
Sa processed surface
Part between Sr idler wheels
The Y direction size of TD substrates
Wx calming zone
Specific implementation mode
《1st implementation form》
Hereinafter, illustrating this implementation form with reference to schema.
Fig. 1 shows the schematic diagram of the composition of the substrate board treatment 100 of the present embodiment.
As shown in Figure 1, substrate board treatment 100 has the substrate of supply belt base plate (for example, band-like flat member) S Supply department 2, the processing substrate portion (patterning device) 3 that surface (processed surface) Sa of substrate S is handled, recycling substrate The substrate recoverer 4 of S and the control unit CONT for controlling these each portions.Processing substrate portion 3, by substrate S from supply substrate portion It 2 sends out, to during until substrate recoverer 4 recycles substrate S, various processing is implemented to the surface of substrate S.
This substrate board treatment 100 can form on substrate S and show member such as organic EL element, liquid crystal display element The occasion of part (electronic device) uses.
Also, in the present embodiment, as shown in Figure 1, one XYZ coordinate systems of setting, hereinafter, appropriate come using this XYZ coordinate system It illustrates.In XYZ coordinate systems, such as sets X-axis and Y-axis along the horizontal plane, sets Z axis upward along vertical direction.In addition, substrate Processing unit 100, generally along X-axis, from-side (- X-axis side) past+side (+X-axis side) conveyance substrate S.At this point, belt base plate The width direction (short side direction) of S is set as Y direction.
In substrate board treatment 100, as the substrate S of process object, it can be used such as resin film and stainless steel Foil (foil).Such as polyvinyl resin, acrylic resin, polyester resin, ethylene vinyl alcohol copolymer tree can be used in resin film Fat, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, The materials such as polyvinyl alcohol resin.
Substrate S, it is preferable for example to bear the small person of hot coefficient of dilatation that the heat of 200 DEG C of degree its size also will not change.Such as Inorganic filler can be mixed in resin film to reduce hot coefficient of dilatation.As inorganic filler, such as there are titanium oxide, zinc oxide, oxygen Change aluminium, silica etc..In addition, substrate S can be with the very thin glass monolith of 100 μm of degree of thickness of the manufactures such as float method or In the above-mentioned resin film of the very thin glass gluing and the laminate of aluminium foil.
The width direction (short side direction) of substrate S is dimensioned so as to such as 1m~2m degree, length direction (long side direction) Size is then formed as such as 10m or more.Certainly, this size only as an example of, however it is not limited to this.For example, the Y direction ruler of substrate S Very little can be 1m or less or 50cm hereinafter, can also be 2m or more.Furthermore the X-direction size of substrate S can be 10m or less.
Substrate S is formed in a manner of with pliability.Herein, so-called pliability refers to the power for applying dead weight degree to substrate Also the property that will not be disconnected or rupture, aforesaid base plate can be bent.In addition, the property being bent by the power for degree of conducting oneself with dignity It is contained in pliability.Also, the variations such as material, size, thickness or temperature of above-mentioned flexible visual aforesaid base plate etc. or environment. Can also be to be connected shape using by the substrate of multiple units furthermore substrate S can be the composition using a piece of belt base plate As band-like composition.
The substrate S for being rolled into such as tubular is sent out toward processing substrate portion 3 and is supplied by supply substrate portion 2.This occasion, in Supply substrate portion 2 is equipped with the axle portion of winding substrate S and makes the rotating driving device etc. of aforementioned axle portion rotation.In addition to this, also may be used It is arranged such as portion cover (cover) to cover the substrate S for being rolled into tubular state.
In addition, supply substrate portion 2 is not limited to will to be wound into the mechanism that the substrate S of tubular is sent out, as long as comprising by band The mechanism (such as clipping driving idler wheel etc.) that shape substrate S is sequentially sent out in its length direction.
Substrate recoverer 4 by by the substrate S of substrate board treatment 100, such as is recycled after being rolled into tubular.Yu Ji Plate recoverer 4, with supply substrate portion 2 likewise, setting is driven to the rotation for winding the axle portion of substrate S and aforementioned axle portion being made to rotate The cover portion etc. of the substrate S of dynamic source and covering recycling.If also, being cut into tablet (panel) into substrate S is about in processing substrate portion 3 Can also be the state different from tubular state is rolled into such as being recycled substrate S with overlap condition when the situation of shape etc. Recycle the composition of substrate S.
The substrate S supplied from supply substrate portion 2 is relocated to substrate recoverer 4 by processing substrate portion 3, and in conveyance process pair The processed surface Sa processing of substrate S.Processing substrate portion 3 has and adds to what the processed surface Sa of substrate S was processed Work processing unit (pattern forming portion) 10, with the driving idler wheel R etc. that includes condition conveyance substrate S in the form of corresponding working process Carrying device (substrate conveying unit) 20.
Processing device 10 has to the processed surface Sa of substrate S, for example forming the various dresses of organic EL element It sets.As such device, such as have to the interval of the marking (imprint) mode of formation spaced walls etc. on processed surface Sa Wall forming apparatus, the electrode forming apparatus to form electrode and the luminescent layer forming apparatus etc. to form luminescent layer.
Specifically, have apparatus for coating liquid droplet (such as inkjet type apparatus for coating etc.), film formation device (such as plating apparatus, Evaporation coating device, sputtering unit etc.), exposure device, developing apparatus, surfaction device, decontaminating apparatus etc..These each devices are along base The transport path of plate S is appropriately arranged with, and can by it is so-called it is roll-to-roll in a manner of produce the panel etc. of flexible display.The present embodiment In, exposure device is set as processing device 10, and optionally its responsible front and back step of (inline) setting is (photosensitive on line Layer forming step, photosensitive layer development step etc.) device.
In processing substrate portion 3, the alignment video camera equipped with action of pulling together with the processing device 10 as exposure device 5.Be aligned the other detection of 5, video camera for example along substrate S-each formation of Y-axis side end edge and+Y-axis side end edge to fiducial mark Remember ALM (with reference to Fig. 3).The testing result of alignment video camera 5 is sent to control unit CONT.
Fig. 2 and Fig. 3 shows the figure that the part in the 1st processing substrate portion 3 constituted of the present embodiment is constituted.Fig. 2 is the 1st composition Processing substrate portion 3 composition front view.Fig. 3 is the vertical view of the composition in the 1st processing substrate portion 3 constituted.
As shown in Figures 2 and 3, processing substrate portion 3 has the 1st idler wheel 11 (swing roller), hold-down roll 11a (rotation rollings Wheel), the 2nd idler wheel 12 (swing roller), hold-down roll 12a (swing roller), basket 13 and the exposure as processing device 10 Electro-optical device EX.
1st idler wheel 11 is towards 13 side of basket in the 1st guiding elements (substrate-guided component) of+X-direction guiding substrate S.1st Idler wheel 11, opposite basket 13 be set as in the conveyance direction upstream side (- X-axis side) of substrate S it is parallel with Y-axis, be configured to with It can be rotated by motor etc. centered on the parallel rotary shaft of Y-axis.Substrate S is clamped by the 1st idler wheel 11 with hold-down roll 11a, and Court+the X-direction as shown in arrow Dx is supported to transport.
2nd idler wheel 12, by the substrate S from basket 13 it is past+X-axis side guiding the 2nd guiding elements (substrate-guided component).
2nd idler wheel 12, relatively basket 13 are configured to parallel with Y-axis in the conveyance direction downstream side (+X-axis side) of substrate S, can Pass through the rotations such as motor centered on the rotary shaft parallel with Y-axis.Substrate S is clamped by the 2nd idler wheel 12 with hold-down roll 12a, and Court+the X-direction as shown in arrow Dx is supported to transport.
Basket 13 configures between the 1st idler wheel 11 and the 2nd idler wheel 12.Basket 13 is for example formed as rectangular-shape.Basket 13 With bottom 13B, wall portion 13W.Bottom 13B composition baskets 13-Z axis side end face.Wall portion 13W by-X-axis side end face 13Wa, the end face 13Wb of+X-axis side, the end face 13Wc of+Y-axis side and the end face 13Wd of-Y-axis side are constituted.
In addition, in basket 13+Z axis side, if when projection exposure mode be configured with projection optics system PL, if proximity exposure side Mask stage portion MST is then configured with when formula.
Inside the reception room 13R surrounded by wall portion 13Wa~13Wd and bottom 13B, equipped with being imposed at processing to substrate S The baseplate carrier mechanism (substrate supporting portion) 14 of reason (being herein exposure).Therefore, in basket 13-the end face 13Wa shapes of X-axis side At there is the opening portion 13m for making the substrate S moved in from the 1st idler wheel 11 pass through.In addition, in basket 13+the end face 13Wb of X-axis side, It is formed with the opening portion 13n for moving out substrate S from reception room 13R (baseplate carrier mechanism 14) toward the 2nd idler wheel 12.
In bottom 13B-Z axis side, be formed with shifting roller 17.Shifting roller 17 is placed in guide rail 16.Guide rail 16 supports In the supporting part (not shown) in processing substrate portion 3, such as the ground of factory.Guide rail 16 is along X-direction (or Y direction) shape At.Basket 13 is arranged to can be mobile in X-direction (or Y direction) along guide rail 16 by driving mechanism (not shown).This basket 13 by the movement of shifting roller 17 and guide rail 16 not necessarily.
(it is equivalent to the alignment video camera in Fig. 1 in the 13R of receiving portion, being equipped with baseplate carrier mechanism 14, being directed at video camera 18 5).Baseplate carrier mechanism 14, (hereinafter, claiming between the 1st idler wheel 11 and the 2nd idler wheel 12 in supporting substrates S in a non contact fashion " part Sr between idler wheel ") a part, and with for example formed as cylinder planar peripheral surface 14a, peripheral surface 14a in order to The pad component (Porous mattress etc.) that fluid bearing layer is formed between substrate S is constituted.
Baseplate carrier mechanism 14, equipped with one side make composition peripheral surface 14a pad component ejecting fluid (air, nitrogen), one While attracting the fluid control unit 115 of the fluid of the ejection.
The driving portion 15 for including the driving sources such as multiple motors, to make the position of baseplate carrier mechanism 14 (peripheral surface 14a) And the component of the micro variation of posture, it is substantially carried out toward Z axis, X-axis, the fine motion of all directions of Y-axis and past θ Z-directions (about the z axis) With each rotation fine motion of θ X (around X-axis).Driving portion 15 and uses the 1st idler wheel the 11, the 2nd with the control of the control unit CONT in Fig. 1 The conveyance control of the substrate S of idler wheel 12 synchronizes, and adjusts drive volume and sequential etc..
2 alignment video cameras 18, as shown in figure 3, detection is formed in Y direction (width direction) both ends of substrate S respectively The alignment mark ALM in portion.Alignment mark ALM in substrate S+end edge of Y-axis side and the end edge of-Y-axis side formed it is multiple.It is more A alignment mark ALM is in X-direction equidistantly to configure.Be aligned video camera 18 towards in substrate S by 14, baseplate carrier mechanism The part held, in the other inspection in front (- X-direction) position of the slit-shaped view field EA (with reference to Fig. 3) of exposure device EX Survey alignment mark ALM.Also that is, alignment video camera 18 is in the conveyance direction of substrate S, in the more upper position in position compared with view field EA It sets, it is individual to detect alignment mark ALM.The testing result of alignment video camera 18 is sent to control unit CONT.
Alignment video camera 18 is that the picture of the alignment mark ALM amplified with microscope is photographed with solid bodies such as CCD and CMOS Element is subject to the microscope shoot system of light.The microscope shoot system is in the viewing area on substrate S, about tens of μm of length and width The range of~hundreds of μm of degree.Therefore, in order to observing alignment mark ALM really in such narrow viewing area, such as The linear pattern of line width number μm~20 μm degree is formed on substrate S or by parallel arrangement several the lattice of such linear pattern Sub- shape pattern.
In addition, as shown in Fig. 2, exposure device EX has illumination portion IL and mask stage MST.Illumination portion IL is towards substrate S In-Z-direction illumination slit shape illumination light.Mask stage MST keeps the light shield M for being formed with predetermined pattern P.In mask stage MST is equipped with the light shield maintaining part MH that can keep various sizes of light shield M.Mask stage MST is configured to by (not shown) Driving device is displaced into X-direction, and the speed to transport speed sync with the X-direction of substrate S moves.
The movement of mask stage MST can be controlled with control unit CONT.Above-mentioned exposure device EX will shine from illumination portion IL Penetrate, via light shield M exposure light picture (occasion of projection exposure mode be projection optics system PL formed aerial image, proximity The occasion of Exposure mode is then image) it projects to view field EA (with reference to Fig. 3).In addition, in the present embodiment, view field EA's The shape of slit that shape and the crest line parallel elongate of the cylindric peripheral surface 14a of baseplate carrier mechanism 14 extend.
As shown in Fig. 2, substrate S after being clamped by the 1st idler wheel 11, is rolled up in a non contact fashion in the outer of baseplate carrier mechanism 14 After the first retainer of circumferential surface 14a point, is fed by the 2nd idler wheel 12, transported such as arrow Dx.The present embodiment, as shown in figure 3, Between 1st idler wheel 11 and the 2nd idler wheel 12, the conveyance that the tension F of conveyance direction is assigned to substrate S is carried out.
Specifically, the rotation by control unit CONT with the rotary speed (peripheral speed) of the 2nd idler wheel 12 with respect to the 1st idler wheel 11 The slightly fast mode of rotary speed (peripheral speed) controls each motor.During this is constituted, the 1st idler wheel 11 and the 2nd idler wheel 12 are controlled to precision The drive motor of the peripheral speed (or torsion) of such idler wheel and the electrical control system (containing formula) of the motor are made, is equivalent to and opens Power imparting mechanism.
As previously mentioned, when assigning the tension F of X-direction to substrate S, if as shown in figure 3, setting into before the 1st idler wheel 11 Substrate S Y direction size (width) be TD0 if, between the 1st idler wheel 11 and the 2nd idler wheel 12, the Y direction size (width) shrinks and becomes TD1.Also that is, the 1st idler wheel 11 and the 2nd in X-direction separation distance L (true length of substrate S) rolls Between wheel 12, when drawing substrate S with tension F, substrate S has the tendency that shrinking in X-direction stretching, extension, in Y direction.
It is sufficiently above the occasion of the initial stage width TD0 of substrate S in distance L, as shown in figure 3, by simulation, learns from the 1 idler wheel 11 toward until+X-direction to distance As range, with until (- X-direction) distance Ae before the 2nd idler wheel 12 Range, the contraction change rate Y direction shrinkage (shrinkage degree) of length (X-direction per unit) though it is larger, from the 1st idler wheel 11 toward between the range until+X-direction to distance As and the range until the 2nd idler wheel 12 is toward-X-direction to distance Ae Range, can get the almost unchanged and stable range of a contraction change rate (shrinkage degree).Therefore, it in the present embodiment, makes The calming zone of the contraction change rate of the Y direction of one substrate S substantially certain (substantially 0), and view field EA is set in The calming zone is exposed.
Fig. 4 is the simulation, and illustrates the figure of the retracted position of substrate in an exaggerated manner, shows the 1st clamped idler wheel 11 Substrate S distance L between the 2nd idler wheel 12 are more than the state when situation of the initial stage width TD0 of substrate S.When with tension F in X When axis direction draws substrate S, in the range from 11 past+X-direction of the 1st idler wheel to distance As, edge Es1, Es2 of substrate S are generated Initial stage width TD0 compared with substrate S toward inside retraction deformation, in the model until the 2nd idler wheel 12 is toward-X-direction to distance Ae Enclose, then generate substrate S edge Ee1, Ee2 return to substrate S initial stage width TD0 deformation.
And from 11 past+X-direction of the 1st idler wheel to distance As range with from 12 past-X-direction of the 2nd idler wheel to distance The range of distance Wx between the range of Ae obtains the calming zone that a substrate S is contracted to substantially one fixed width TD1.
Calming zone is according in the pattern transfer printing precision of view field EA, (opposite magnification error and aliasing error is allowed Range) determined.In the present embodiment, as an example of simulation, using the Y direction size of view field EA as the first of substrate S It is said premised on 80~90% degree of phase width TD0 and the accurate exposure of several μm of transfer or less fine pattern of size It is bright.
For example, the occasion that width TD0 is 300mm in the early stage, Y direction size is 260mm in the design of view field EA, When wet process and drying process via preceding step make substrate S integrally stretch 50ppm degree, projected area on counterpart substrate S The Y direction size of domain EA stretches 13.0 μm.This value is represented and is overlapped after positioning the pattern for counting μ m in size with high precision When exposure, maximum 13.0 μm of site error (aliasing error) can be caused, be intended to carry out accurate exposure-processed right and wrong under this state It is often difficult.
When the situation of the PET film of typical film substrate, stretched because of processing procedure sometimes up to 100ppm degree.When in order to Manufacture giant display and increase the initial stage width TD0 and view field EA of substrate S, and set Y-axis in the design of view field EA Direction size is 520mm (TD0=600mm), and when substrate S integrally stretches 100ppm, the maximum extension amount of Y direction will be more than 50μm。
It is pattern ruler to be transferred in addition, in general, the aliasing error of exposure device and the permissible range of site error Several points of a degree of very little (or line width).Thus, for example if the minimum dimension (line width) of pattern to be transferred is 3 μm, overlapping The permissible range of error and site error is 0.6 μm.Also that is, when actual exposure, the Y direction in view field EA is any Point all must make aliasing error and site error at 0.6 μm or less.
Therefore, in the present embodiment, the distance L of the substrate S between changing 2 idler wheels 11,12, the initial stage width of substrate S Various simulations have been carried out in the case of TD0, substrate thickness t, tension F, Poisson's ratio (Poisson's ratio), young's modulus, it will The range for meeting following 2 conditions is set as calming zone.
(1) it finds out and is shunk from 2 idler wheels (11,12) towards the centers substrate S, in Y direction of the X-direction per 30mm pitches Amount, the variable quantity are 0.3 μm or less (contraction change rate substantially 0).
(2) variable quantity be in 0.3 μm of range entirety below, the variation of the absolute value of the width TD1 of substrate S shunk it is wide Degree is within 1.5 μm.
These value conditions are an example in simulation, and actual numerical value regards the extension of substrate S, pattern to be transferred caused by processing procedure Minimum dimension, the permissible range etc. of aliasing error and site error suitably determined.
The distance L of substrate S between 2 idler wheels 11,12 is set as 100cm by Fig. 5 simulations, initial stage width TD0 is set as 30cm, base The PET film (Poisson's ratio is set as 0.35, young's modulus and is set as 4GPa) that the thickness t of plate S is 100 μm is object, F points of tension The chart of contraction distortion state (shrinkage, shrinkage degree) when not being changed to the situation of 20N, 50N, 100N, 150N.Horizontal axis position Set to 0 the clip position that cm and 100cm distinguishes the 1st idler wheel 11 and the 2nd idler wheel 12.
As shown in figure 5, the variation substantially directly proportional to the size of tension F of maximum collapse amount.In addition, substantially certain in shrinkage Range that is, calming zone width as tension F becomes larger and narrows.When tension F is 20N degree, from both ends to 10cm journeys It is nonlinear shrinkage until degree, can get the calming zone width of 80cm degree.When tension F is 150N, from both ends to 20cm journeys It is nonlinear shrinkage until degree, the width of calming zone is 60cm degree.
Fig. 6 shows that the situation with Fig. 5 is compared, and the distance L of the substrate S between 2 idler wheels 11,12 is contracted to the point of 40cm Outside, the chart of analog result when other conditions are all identical.It is compared with the situation of Fig. 5, distance L is contracted to 40%, in each Calming zone width obtained by tension F also accordingly narrows.In addition, in simulation, with the reduction of distance L, the nonlinear shrinkage of both sides Range has bigger tendency.
From both ends to 10cm degree it is non-linear under conditions of Fig. 5, but in the situation of Fig. 6 for example, when tension F is 20N When, it is non-linear from both ends to 14~15cm degree.
The distance L of substrate S between 2 idler wheels 11,12 is set as 100cm by Fig. 7 simulations, the thickness t of substrate S is 100 μm PET film (Poisson's ratio is set as 0.35, young's modulus and is set as 4GPa) is object, and tension F is set as 100N, and initial stage is wide The chart of contraction distortion state (shrinkage, shrinkage degree) when degree TD0 is changed to the situation of 40cm, 60cm, 100cm respectively.
Initial stage width is the situation (that is, L=TD0) of 100cm, does not obtain the calming zone of eligible, in distance L's It is whole that nonlinear contraction is presented.But as initial stage width TD0 gradually decreases as 60cm, 40cm, that is, there is calming zone. The width Wx1 of calming zone when TD0=60cm is slightly below 30cm, the width Wx2 of calming zone when TD0=40cm then About 60cm.
It is simulated in addition, also changing the Poisson's ratio of different substrate S, young's modulus, thickness t, but calming zone There is tendency and have no too big difference, from the point of view of the analog result shown in Fig. 5~7, it is known that the helpful master of the appearance to calming zone It is the ratio between distance L and initial stage width TD0 to want reason.
Fig. 8 as substrate S using PET film as object, with the ratio (TD0/L) of distance L between the opposite clampings of initial stage width TD0 Ratio (Wx/L) for the opposite distance L of width Wx of the longitudinal axis, calming zone is horizontal axis, and analog result several times is shown Chart.
The analog result of pictorialization is the situation that tension F is all set as 100N, links the 1.0 of the longitudinal axis and 1.0 line of horizontal axis Boundary on BS representation theories, the occasion of the resinous thins such as PET film, the tendency will appear in the lower-left of line BS, without Come across upper right.
Gained analog result when line Sim1 thickness t in Fig. 8 is 200 μm, Poisson's ratio 0.3, young's modulus are 6GPa It is average, line Sim2 when then representative thickness t is 100 μm, Poisson's ratio 0.4, young's modulus are 4GPa gained analog result be averaged. The occasion of representative PET film, result is substantially distributed between line Sim1 and line Sim2 under simulation.
However, when the extreme thin or surface area layers of thickness t have the situation of certain film, though there have result to occur to be online The situation of the lower left of Sim2, but never appear in the upper right of boundary line BS.
From the tendency of above-mentioned analog result, when it can be seen that each data that above-mentioned Fig. 2, Fig. 3 shown device is constituted, such as The Y direction shrinkage (shrinking percentage, shrinkage degree) of needed substrate S and therefore and needed tension F in view field EA Size when, width, distance L and the initial stage of the calming zone by the tension F bottom lines that can ensure that can be found out in advance The relationship of width TD0 three, therefore the substrate carrying channel length (distance L) of 11 to the 2nd idler wheel 12 of the 1st idler wheel can be given most preferably Change.
Secondly, illustrate to manufacture organic EL element, liquid crystal display member using the substrate board treatment 100 constituted in the above described manner The step of display elements such as part (electronic component).Substrate board treatment 100 is according to formula (the processing item for being set in control unit CONT Part, sequential, driving parameter etc.) control, manufacture aforementioned display element.
First, volume is wound in supply substrate portion 2 in the substrate S of idler wheel (not shown).Control unit CONT makes (not shown) Idler wheel is rotated to send out aforesaid base plate S from supply substrate portion 2 from this state.And the aforesaid base plate S in processing substrate portion 3 will be passed through It is wound with the idler wheel (not shown) set on substrate recoverer 4.
Control unit CONT, substrate S be sent to from supply substrate portion 2 winding is subject to substrate recoverer 4 during, with base The carrying device 20 of plate processing unit 3 conveyance substrate S appropriate in aforesaid base plate processing unit 3.
When being exposed processing using exposure device EX to the substrate S transported in processing substrate portion 3, first, control unit CONT, in the state that substrate S is clamped with hold-down roll 11a with the 1st idler wheel 11, make in substrate S compared with the 1st idler wheel 11 more-X-axis The partial relaxation of side.In addition, control unit CONT makes base in the state that substrate S is clamped with hold-down roll 12a with the 2nd idler wheel 12 In plate S compared with the 2nd idler wheel 12 more+partial relaxation of X-axis side.By this action, can opposing substrate S the independent tune of other parts The tension (tension F) of part Sr between whole idler wheel.
Later, control unit CONT is by the 1st idler wheel 11, hold-down roll 11a, the 2nd idler wheel 12 and hold-down roll 12a, on one side Part Sr adds set tension, on one side with set conveyance speed in+X-direction conveyance substrate S between idler wheel.
Control unit CONT in the state of transporting substrate S, from illumination portion, use up, and makes mask stage MST by IL irradiation exposures Past+X-direction movement.At this point, control unit CONT makes the movement speed of mask stage MST and the conveyance speed sync of substrate S.
By this action, for the processed surface Sa of the substrate S of past+X-direction movement, via the exposure light of light shield M It is projected in view field EA (with reference to Fig. 3), forms the pattern P of light shield M in a manner of scan exposure in aforementioned processed surface Sa Picture.
When carrying out such exposure actions, control unit CONT between the 1st idler wheel 11 and the 2nd idler wheel 12 by assigning slightly Rotary speed it is poor, to substrate S assign needed for X-direction tension F so that initial stage width TD0 of substrate S shrink, to adjust The Y direction size of area of the pattern on light shield M, with the processed surface Sa to be transferred to substrate S on area of the pattern (substrate Subregion) Y direction size relative error (opposite magnification error).
In addition, the present embodiment, due to the use of view field EA to be made to the elongate slit shape for extending Y direction, in X-axis Direction is scanned the mode of exposure, therefore the essence on view field EA, that is, substrate S is exposed region.Therefore, substrate S Y direction size adjusting (shrinking correction) only needs at least to be exposed region (subregion of substrate) implementation to this, not It must implement the Y direction size adjusting (shrink and make corrections) of substrate S to 1 area of the pattern entirety on substrate S.
The present embodiment, as shown in figure 3, the downside of part Sr is by the stream of the peripheral surface 14a of baseplate carrier mechanism 14 between idler wheel Body bearing layer supports, therefore there's almost no substantive friction at this.Therefore, between the idler wheel of substrate S part Sr in aggravate direction X-direction can extend, and with aggravate the Y direction intersected of direction, initial stage, width TD0 can be shrunk to TD1.
The Y direction of part Sr is shunk between the idler wheel for showing substrate S slightly exaggerated in Fig. 3, and baseplate carrier mechanism 14 Peripheral surface 14a be then set in the width for the calming zone that can equally obtain contracted width TD1.
In addition, after by the 2nd idler wheel 12, the tension F due to acting on substrate S originally can be eliminated, and substrate S can be because Elasticity and restore tension assign before shape.Also that is, substrate S can be received toward Y direction elongation and from the state of Fig. 3 toward X-direction Contracting.Therefore, it is shunk after the pattern P of the substrate S transfer light shields M of the state of Y direction to shown in Fig. 3, when tension F is eliminated When, it is transferred to the area of the pattern (subregion of substrate) of processed surface Sa and with ratio identical with substrate S in Y direction It extends and is then shunk in X-direction.
The present embodiment is carried out using view field EA to be made to the elongate slit shape extended in Y direction in X-direction The mode of scan exposure.It therefore, can be by throwing for the opposite magnification error of X-direction (calibration (sacling) error) The original synchronized relation of the movement speed Mv of the conveyance speed Sv and light shield M of the substrate S of shadow zone domain EA, Sv=kMv are (if close Connecing Exposure mode, then k is 1, is the multiplying power of projection system if projection exposure mode) speed difference (X of counterpart substrate S of imparting slightly Axis direction extension rate) it is adjusted.
If in addition, in substrate S processed surface Sa as bottom area of the pattern (subregion of substrate) with wet type system The formation such as journey (coating step or etching step etc.), and when at this by the situation of the area of the pattern overlapping exposures of light shield M, substrate S is possible to generate larger extension in wet process.
When such situation, in especially known proximity Exposure mode, by light shield M area of the pattern and have been formed on base The area of the pattern (subregion of substrate) of plate S, until good less than Y direction (direction orthogonal with scan exposure direction) add It is very difficult with overlapping that is, the correction of the calibration error of Y direction.
In the present embodiment, opened by assigning conveyance direction (X-direction) to substrate S with the 1st idler wheel 11 and the 2nd idler wheel 12 Power, and the Y direction size of part Sr between the idler wheel of substrate S can be made to be shunk in the range of flexible deformation, simply to be constituted reality The correction of the calibration error for the Y direction being now not readily accomplished in the past.
From the above, control unit CONT, can by while ensuring calming zone, change assign of substrate S on one side The size of power F adjusts the Y direction shrinkage of substrate S, and the Y direction size to adjust exposing patterns located with substrate S The relative ratios of the Y direction size of reason face Sa.Therefore, the Y-axis for the mask pattern picture for being transferred to substrate S can substantially be adjusted The opposite multiplying power in direction.
Substrate S toward Y direction shrinkage to cope with substrate S X-direction tension F.Therefore, in control base board S toward Y The occasion of the shrinkage of axis direction is found out through the simulation of above-mentioned Fig. 5~Fig. 8 and experiment etc. to the X-direction of substrate S in advance Relationship between tension F and the shrinkage of Y direction controls the action of the 1st idler wheel 11, the 2nd idler wheel 12 with right as data Substrate S applies the tension F of corresponding institute's palpus shrinkage.
When carrying out above-mentioned action, control unit CONT finds out shrinkage (or shrinking percentage, the contraction of substrate S in the following manner Degree).First, control unit CONT, detected using alignment video camera 18 be formed in substrate S-alignment mark of Y-axis side end edge ALM and it is formed in+alignment mark the ALM of Y-axis side end edge.Control unit CONT is according to the testing result calculating pair for being directed at video camera 18 Fiducial mark remembers the Y direction distance of ALM, and the Y direction size (width after contraction of part Sr between idler wheel is calculated according to afore-mentioned distance TD1).Later, control unit CONT is calculated using the Y direction size of space for calculating result and pre-recorded alignment mark ALM Go out the shrinkage (or shrinking percentage, shrinkage degree) of substrate S.
In addition, in above-mentioned experiment and simulation etc., the Y direction for finding out counterpart substrate S in advance as data information is shunk The X-direction elongation of amount adjusts the movement speed of mask stage MST and the conveyance speed of substrate S according to X-direction elongation Degree, can substantially adjust the opposite multiplying power (calibration error) of the X-direction of mask pattern picture.
Control unit CONT, in the occasion of the conveyance speed of the movement speed and substrate S of adjustment mask stage MST, if aforementioned Mask stage MST is past+and the movement speed of X-direction is conveyance speed (the peripheral surface 14a of baseplate carrier 14 of Mv, aforesaid base plate S Circumferential direction speed) be Sv, if the calibration error of X-direction (extension rate) is A (ppm), following formula (1) must be met.
Sv=kMv (1+A) or Sv (1-A)=kMv ... (1)
Wherein, if proximity Exposure mode, then k is 1, if projection exposure mode, then k is the multiplying power for projecting system.
If in addition, if proximity Exposure mode, control unit CONT is to be carried by the suitably adjustment substrate of the driving portion 15 in Fig. 2 The posture of platform mechanism 14 (peripheral surface 14a) and position, by view field EA and gap between light shield M on substrate S and parallel Degree setting is in a certain range.
As previously discussed, according to the present embodiment, in the processing substrate portion 3 that the processed surface Sa to substrate S is handled, in By substrate S conveyances between the 1st idler wheel 11 of X-direction and the 2nd idler wheel 12, in the receipts that the Y direction size for making substrate S is stabilized It is exposed processing in the state of contracting, therefore can simply adjust opposite multiplying power (calibration error), realizes high-precision patterning.
Also, in processing unit 10 using the occasion of other devices different from exposure device EX, it also can be conveyance substrate S's Relative size between the idler wheel of conveyance side adjustment substrate S between part Sr and the range handled by processing unit 10.
Using the processing unit 10 other than the exposure device EX of light shield, for example, ink-jet table printing machine, using DMD etc. without light shield Exposure machine, scanning laser point also can all be applicable in the present embodiment with the laser beam printer etc. for carrying out pattern plotter.
The technical scope of the present invention is simultaneously defined in above-described embodiment, is not departing within the scope of the gist of the invention, certainly may be used It is appropriate to be changed.
For example, in the composition of above-mentioned Fig. 2, Fig. 3, alignment video camera 18 only view field EA-X-direction position sets Set one group.But as shown in figure 9, may also set up configuration view field EA-one group of alignment video camera of X-direction position One group of alignment the video camera 18b, 18e and configuration of 18a, 18d, configuration in X-direction roughly the same with view field EA position The rear positions view field EA (position of+X-direction or in substrate S conveyance direction view field EA downstream bits Set) one group of alignment video camera 18c, 18f total totally 6 alignment video cameras (microscope shoot system).
When the multiple alignment video camera 18a~18f of configuration as shown in Figure 9, including the part of the substrate S of view field EA Face shape distortion (micro-strain in the faces XY), can in alignment mark ALM each pitch of X-direction it is instant, continue Measured.Therefore, can the high-precision specific substrate S in view field EA distortion inaccuracy slightly and multiplying power miss Difference, and for mitigate the error and instant adjustment assign substrate S the size of tension F and the position of baseplate carrier mechanism 14 and Posture.
As described above, in the occasion for configuring multiple alignment video camera 18a~18f, the label test position of each video camera, It is desirable in the calming zone Wx of substrate S.
In addition, the driving mechanism of the mask stage MST as driving exposure device EX, can be used shown in Figure 10, Figure 11 Linear motor mechanism LM.
Figure 10, Figure 11 show the composition of the scanning-exposure apparatus of proximity mode, and mask stage MST is with stator LMa with can the linear motor mechanism LM of mover LMb be subject to accurate driving.
Stator LMa extends X-direction.In stator LMa, being arranged along X-direction has multiple lines (not shown) Circle.Stator LMa is equipped with a pair in Y direction across mask stage MST.A pair of of stator LMa has in the sides mask stage MST Groove portion.This groove portion is formed along X-direction.
Can mover LMb, be respectively provided at mask stage MST+side of Y-axis side and the side of-Y-axis side.It respectively can mover LMb is respectively provided with magnetite.Can mover LMb be inserted into the groove portion of corresponding stator LMa respectively.Can mover LMb can be along aforementioned groove portion It is displaced into X-direction.It is equipped with the guiding face 13g of a pair of of bearing mask stage MST in 13 top of basket, with by can mover LMb Toward the movement of X-direction, mask stage MST is made to be moved toward X-direction.
In the composition of the present embodiment, it is set as from conveyance substrate S approximate horizontal between 11 to the 2nd idler wheel 12 of the 1st idler wheel, It is configured to rotate the peripheral surface 14a of the baseplate carrier mechanism 14 of drum, is contacted in minimum region with the back side of substrate S.Also that is, Keep the X-direction width of view field EA small as far as possible, and peripheral surface 14a and the X-direction of the contact area of substrate S is wide Degree is made the X-direction width with slit-shaped view field EA with the small of degree.
Further, the present embodiment makes baseplate carrier mechanism 14 (rotational circle cylinder) peripheral surface with the control of driving portion 15 Conveyance speed syncs of the substrate S of peripheral speed and the 1st idler wheel 11 and the 2nd idler wheel 12 toward X-direction.
This occasion, since the contact area of the peripheral surface 14a and substrate S of baseplate carrier mechanism 14 prolong in Y direction is elongated The slit-shaped and X-direction width stretched are sufficiently narrow, while the conveyance of baseplate carrier mechanism 14 (rotational circle cylinder) and substrate S Speed sync rotates, therefore when assigning the tension F of X-direction to substrate S between the 1st idler wheel 11 and the 2nd idler wheel 12, i.e., such as Shown in above-mentioned Fig. 4, substrate S is shunk in Y direction.
Certainly, in substrate S friction is will produce with the slit-shaped regions contacted the peripheral surface 14a of baseplate carrier mechanism 14.So And if the region X-direction width fully it is small if, can be in the case of hardly by the frictional influence, substrate S is substantially Such as the contraction of Fig. 4.
In the composition of this Figure 10, Figure 11, the tension F (X-direction) when being transported by control base board S can make substrate S's Width (Y direction) is shunk, and can adjust opposite scale error (the especially opposite calibration of Y direction when patterning Error).
In addition, in this composition, due to keeping the X-direction width of view field EA adequately small, can make Fig. 4, Fig. 5~ The width of calming zone Wx illustrated by Fig. 8 is narrow, the interval (distance L) of the 1st idler wheel 11 and the 2nd idler wheel 12 can also make it is shorter, Device entirety can therefore minimized.
In addition, can also be the composition that multiple processing units are arranged in X-direction as shown in figure 12.In Figure 12, in X-axis Direction configured with 2 have with the exposure device EX of above-described embodiment (Fig. 2,3 device or Figure 10,11 device) identical composition Processing unit 10A and 10B.Processing unit 10A with light shield M1 and between the processing unit 10B with light shield M2, is equipped with Tension to interdict the tension of substrate S interdicts mechanism 60.
The occasion of processing is exposed to substrate S using 2 processing unit 10A and 10B, such as shown in Figure 13, it can will be with Area of the pattern (subregion of the substrate) PA of the light shield M1 exposures of processing unit 10A is exposed with the light shield M2 of processing unit 10B Area of the pattern (subregion of the substrate) PB of light is in the mode of X-direction interaction arrangement, in each processing unit 10A and 10B phases It is exposed processing away from certain intervals.
This occasion, such as can ensure that past+X-direction when the mask stage MST that X-direction moves back and forth is in exposure-processed After movement, it is past-X-direction return time.
Furthermore in such composition, it is installed on each pattern P of each light shield M1, M2 of processing unit 10A, 10B, is differed Surely must be identical.Such as can the exposure of 36 inch display panel patterns be carried out in processing unit 10A, and fill in processing Set the exposure that 10B then carries out 40 inch display panel patterns.
Also, in above-described embodiment, though it is described for lifting the situation that view field EA is a shape of slit, it is unlimited In this.Such as can also be slit-shaped exposure area and arrange a plurality of formation in Y direction, and such exposure area with it is interactive in The composition of the so-called zigzag configuration for the state configuration that X-direction is staggered.
This occasion, the entirety (opposite when in the subregion of substrate) for configuring saw-toothed multiple exposure areas are set to In the calming zone Wx determined according to the maximum tension F of scenario.
In addition, such as previous explanation, the substrate shown in above-mentioned each state sample implementation to make substrate S be shunk in Y direction The composition of conveyance, can be used as light exposure, ink jet printing, laser description, static printing etc. need precise pattern various processing The transport mechanism of device.But, from the viewpoint of with regard to production, with use cylinder light shield light expose be most it can be expected that.
Figure 14 is to be combined penetrating type cylinder light shield MD and the substrate transport mechanism of the embodiment of above-mentioned Fig. 2, Fig. 3 Proximity exposure device an example.
In Figure 14, the quartz hollow cylinder that cylinder light shield MD thickness is several millimeters or more forms in the drum surface and schemes Case P.Cylinder light shield MD is held in through the pad CR etc. of air bearing bearing in device, and the axis CC to extend Y direction is Center is rotated in the faces XZ.Its rotary speed is with the peripheral surface (formation of pattern P of the conveyance speed of substrate S and cylinder light shield MD Face) peripheral speed synchronize mode set.Configured with being projeced into pattern P, Y direction is elongated to prolong inside cylinder light shield MD The illumination for the slit-shaped illumination light stretched is IL.
Substrate S is by baseplate carrier identical with Fig. 2 mechanism 14 through gas blanket (air bearing) 116 along bearing surface 14a (convex barrel surface) supports, and to make the nethermost part of peripheral surface of cylinder light shield MD and being located for the substrate S on bearing surface 14a Reason face Sa can keep set proximity, gap (tens of μm~hundreds of μm), and carry out baseplate carrier mechanism (support pads portion) 14 or circle The fine tuning of the Z-direction position of cylinder light shield MD.
In the present embodiment, baseplate carrier mechanism 14 includes gas supply device, the gas supply works such as road and multiple supply openings For gas blanket forming portion.
The transport mechanism of substrate S is with contactless air turning-bar (turn bar) ATB, the 1st idler wheel 11, hold-down roll 11a, the 2nd idler wheel 12, hold-down roll 12a are constituted, and are also assigned to substrate S between 11 to the 2nd idler wheel 12 of the 1st idler wheel in the present embodiment The tension of X-direction is given, substrate S is made to shrink in Y direction according to this.Therefore, the drive motor for controlling each idler wheel makes the 2nd idler wheel Peripheral speed (torque) the big given amount of 12 peripheral speed (torque) compared with the 1st idler wheel 11.
In addition, in such as composition of Figure 14, curvature (radius) and the baseplate carrier mechanism 14 of the peripheral surface of cylinder light shield MD The curvature of cylindric bearing surface 14a might not must be consistent, the curvature of bearing surface 14a be decided to be can reach substrate S stablize branch It holds and transports, the diameter of cylinder light shield MD is then determined according to the size of display panel to be exposed.
In each embodiment discussed above, as processing unit 10, to use sweeping for planar light cover M or cylinder light shield MD For retouching type exposure device.However, the transport mechanism of the present embodiment is equally applicable to be formed on the substrate S of display panel Entire area be temporarily adsorbed in plane and keep device of the tool to be exposed.
Figure 15, Figure 16 show that substrate S, which is adsorbed in plane, keeps tool to be exposed an example of the device of processing, such as Figure 15 Vertical view shown in, be formed with multiple panel zones (subregion of substrate) PD at certain intervals in X-direction on substrate S. The present embodiment, can be in the calming zone Wx that the Y direction of substrate S is shunk with the X-direction width of a panel zone PD Mode sets the X-direction interval (distance L) between the 1st idler wheel 11 and the 2nd idler wheel 12.
In addition, being to avoid panel zone PD from configuring in the 1st idler wheel 11 from substrate S to rear (+X-direction) distance As Non-linear region only is with from the 2nd idler wheel 12 toward the non-linear region until-X-direction distance Ae, and panel zone PD is in X The mode with gap Np (Np ＞ As, Ae) of axis direction arranges.
In the present embodiment, by substrate S toward X-direction transport and reach state shown in Figure 15, that is, substrate S be located at wait exposing When light or a panel zone PD of drawing processing are in calming zone Wx, that is, stop the drive of the 1st idler wheel 11 and the 2nd idler wheel 12 It is dynamic, temporarily cease the conveyance of substrate S.
As shown in figure 16, between the 1st idler wheel 11 and the 2nd idler wheel 12, substrate S with plane to keep flat above tool 120 Smooth adsorption plane is substantially parallel to be transported in X-direction.
Under the state, as shown in figure 16, plane keep tool 120 (adsorption planes) X-direction width be set as by comprising In calming zone Wx, and adsorb the entirety of panel zone PD.
When panel zone PD is positioned at plane holding 120 top of tool, supporting plane keeps the base component of tool 120 113 is i.e. mobile toward top (+Z-direction) by driving mechanism 122 of Z-direction, is uniformly contacted at the back side of substrate S When plane keeps the adsorption plane of tool 120, stop the driving of Z-direction.
Also, the back portion of the corresponding panel region PD of substrate S is protected by the way that vacuum suction or Electrostatic Absorption are temporary It is held in plane and keeps tool 120.So far until the eve of absorption holding, the tension F of X-direction is assigned to maintain base to substrate S The calming zone Wx of plate S is shunk with pre-determined amount in the state of Y direction.
When the entirety of the panel zone PD of substrate S, which is uniformly adsorbed in plane, keeps tool 120, it is supported in and is located at base The guide rail 113g at the Y direction both ends of seat component 113, can exist toward the mobile processing head HD of X-direction (or Y direction) 1 dimension or 2 dimension movements are carried out on panel zone PD, are carried out required exposure-processed and are described printing treatment.
As processing head HD, using unglazed Lacquer finish pattern generator, ink-jet table printing machine head, the microlens array of DMD Mask pattern projector, laser point scanning plotter etc..
In addition, in the foot 126 for supporting processing head HD from base component 113, in order to which the surface of head and substrate S will be processed Actuator (the pressure for being most preferably equipped with and being moved up and down in Z-direction with grade is set in the interval of Z-direction and relative tilt Electric notor and voice coil motor etc.), the X-axis of processing head HD, Y direction position are to survey length laser interferometer IFM or uniform enconding Device is accurate to be measured.
Also can be in this processing head HD, setting detects alignment mark ALM and panel zone PD on substrate S optically The alignment video camera 18 of interior specific pattern shape and other alignment sensors.
The occasion of the present embodiment, as shown in figure 15, the panel zone PD on substrate S is in X-direction with gap (remaining white) Np and arrange, if the clip position of the 1st idler wheel 11 between the clip position of the 2nd idler wheel 12 at a distance from for L, panel zone PD X Axis direction width be Xpd when, when be set in for the relationship of following formula (2) when, temporarily ceasing substrate S's to be processed When conveyance, since the 1st idler wheel 11, each of the 2nd idler wheel 12 can reduce on the PD of adjacent panels region without static To panel zone PD cause without having to scratch etc..
Xpd ＜ L ＜ (Xpd+2Np) ... (2)
In addition, as shown in Figure 15, Figure 16, the panel zone PD entirety on substrate S can adsorbed with good accuracy at flat When the situation in face, it is ready for the macrotype light shield of an energy cover plate region PD entirety, is carried out using the primary static of proximity mode Exposure.
In the above various embodiments, though it is set as being exposed processing in the calming zone Wx shown in Fig. 4 (or Fig. 9, Figure 15), If but can make the slit-shaped exposure area (view field EA) for extending Y direction X-direction width fully it is narrow if, The non-linear region of distance As and distance Ae that can be in Fig. 4 be exposed.
In addition, in Fig. 2, Figure 10, Figure 12, Figure 14, Figure 15 it is each shown in processing unit (exposure device), to making For the 1st guiding elements (substrate-guided component) the 1st idler wheel 11 (and hold-down roll 11a) with as the 2nd guiding elements, (substrate draws Lead component) the 2nd idler wheel 12 (and hold-down roll 12a) between each peripheral speed assign narrow difference method with constitute tension tax Give mechanism.However, the occasion of silent oscillation substrate board treatment (exposure device) shown in figure 15, also applicable not utilize the 1st rolling Take turns the tension imparting mechanism of the difference of the peripheral speed of the 11 and the 2nd idler wheel 12.
Specifically, one driving system of setting controls when transport substrate S at passing through the 1st idler wheel 11 in Figure 15, Figure 16 Substrate S is transported with relatively loose tension (such as 10~20N degree) with the 2nd idler wheel 12, is positioned in the panel zone PD of substrate S After the superjacent air space of plane holding tool 120 is static, in the case of keeping clamp position, mobile 1st idler wheel 11 and clamping The group of idler wheel 11a or the 2nd idler wheel 12 and any group in the group of hold-down roll 12a, so that this two groups in the interval of X-direction Expansion.
Alternatively, in Figure 15, be made following composition, also that is, in substrate S conveyance direction (+X-direction) and then With the position before and then the 2nd idler wheel 12, the Y direction width entirety for being respectively arranged at substrate S is strong for position after 1 idler wheel 11 Clamping substrate S rodlike clamping components, in substrate S by positioning and after static, with the clamping components clamping substrate S's at two Gap (remaining white) parts Np make any clamping components in X-direction fine motion later, between the X-direction for making two clamping components according to this Every expansion.
This occasion is made of clamping components at two and the driving mechanism for changing the X-direction interval between two clamping components Power imparting mechanism.
In the various embodiments described above, microscope shoot system (alignment video camera 5,18 etc.) is used as mark detecting system Carry out the radiographic measurement of the alignment mark ALM (such as cross bar shapes) on substrate S.Therefore, base is being transported with certain speed In the state of plate S, the occasion of the image of detection label ALM, the picture of the label ALM to be photographed will become problem.It therefore, also can profit With the mark detecting system without using the photographic elements such as CCD and CMOS (video camera).
Its an example, the thunder laser beam for the wavelength band that the photoinduction layer without substrate S can be incuded, is shaped as elongate slit It is projeced on substrate S after shape or interference fringe shape, and the alignment mark of the diffraction clathrate to being formed on substrate S crosses the slit The diffraction light generated when the light beam of shape or interference fringe shape carries out the mode of Photoelectric Detection.The generation position of the diffraction light can lead to The rotary encoder for the idler wheel 14 crossed in 11, the 12 or Figure 10 of idler wheel for being located at and transporting substrate S is found out.The embodiment of Figure 16 Occasion can carry out diffraction light in head HD assemblings the mark detecting system of Photoelectric Detection, to find out by surveying length interferometer IFM Generate the position of diffraction light.

Claims (22)

1. a kind of pattern forming method transports the plate shape substrates with flexible strip in long side direction, in the sheet The processed surface of substrate forms the pattern of electronic component, including：
It is supported on position at detach both set a distances on the long side direction of the plate shape substrates 2 respectively using guiding elements on one side, On one side so that at described the 2 of the plate shape substrates between position in the short side direction orthogonal with the long side direction with given degree The mode of contraction, to the step of both part of set a distance assigns the tension of the long side direction described in the plate shape substrates；
At described 2 between position, in the state of friction free state or small contact area, using supporting member for substrate by institute The part in the face of the back side of the processed surface of plate shape substrates is stated, the step of bearing to planar or curved；With And
The step of pattern of the electronic component is formed in the region for being set in the processed surface, the region with A part for the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree It corresponds to and is set in the processed surface.
2. pattern forming method as described in claim 1, wherein the guiding elements include with described in the plate shape substrates The face of processed surface or back side contacts and the hold-down roll of revolvable idler wheel or the clamping plate shape substrates.
3. pattern forming method as claimed in claim 2, wherein the step of forming the pattern is to utilize to will be formed in light shield The pattern exposed in a manner of projection pattern or proximity exposure device, using DMD without light shield exposure device, scanning laser Point is implemented with either one or two of printer or ink-jet table printing machine for carrying out pattern plotter.
4. pattern forming method as claimed in claim 2, wherein the step of forming the pattern be using by the pattern with Exposure device that projection pattern or proximity mode expose, using DMD without light shield exposure device, scanning laser point to carry out pattern Either one or two of printer of description is implemented,
The region is set to the exposure area of the narrow slit-shaped of width of the long side direction of the plate shape substrates, described At described the 2 of plate shape substrates between position, the exposure area of the slit-shaped is set in the short side direction of the plate shape substrates Contraction the big part of change rate.
5. a kind of patterning device transports the plate shape substrates with flexible strip in long side direction, in the sheet The processed surface of substrate forms the pattern of electronic component, has：
Tension imparting mechanism, one lateral dominance be supported on respectively with guiding elements on the long side direction of the plate shape substrates detach it is set Position at the 2 of distance, on one side so that in the short side orthogonal with the long side direction between position at described the 2 of the plate shape substrates Direction is in such a way that given degree is shunk, to both the part of set a distance assigns the long side direction described in the plate shape substrates Tension；
Supporting member for substrate, at described 2 between position, in the state of friction free state or small contact area, by institute The part in the face of the back side of the processed surface of plate shape substrates is stated, is supported to planar or curved；And
Pattern forming portion forms the pattern of the electronic component in the region for being set in the processed surface, described Region and the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree A part of correspondence and be set in the processed surface.
6. patterning device as claimed in claim 5, wherein the pattern forming portion is by will be formed in described in light shield Exposure device that pattern is exposed in a manner of projection pattern or proximity, using DMD without light shield exposure device, scanning laser point with into Either one or two of printer or ink-jet table printing machine of row pattern plotter are constituted.
7. a kind of pattern exposure method transports the plate shape substrates with flexible strip in long side direction, in the sheet The pattern of the processed surface exposure electronic component of substrate, including：
It is supported on position at detach both set a distances on the long side direction of the plate shape substrates 2 respectively using guiding elements, so that At described 2 between position the short side direction orthogonal with the long side direction by given degree shrink in a manner of, to the sheet The step of part of both set a distances of substrate assigns the tension of the long side direction；
At described 2 between position, in the state of friction free state or small contact area, described in the plate shape substrates The part in the face of the back side of processed surface, the step of bearing to planar or curved；And
In the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree The processed surface on the step of exposing the pattern of the electronic component.
8. pattern exposure method as claimed in claim 7, wherein the guiding elements include with described in the plate shape substrates The face of processed surface or back side contacts and the hold-down roll of revolvable idler wheel or the clamping plate shape substrates.
9. pattern exposure method as claimed in claim 8, wherein the step of exposure is to utilize the institute that will be formed in light shield State exposure device that pattern exposes in a manner of projection pattern or proximity, using DMD without light shield exposure device or scanning laser Point is implemented with carrying out either one or two of printer of pattern plotter.
10. such as claim 7 to 9 any one of them pattern exposure method, wherein, will be described in the exposure the step of The region of exposure is set to the exposure area of the narrow slit-shaped of width of the long side direction of the plate shape substrates, in the sheet At described the 2 of substrate between position, the exposure area of the slit-shaped is set in the receipts of the short side direction of the plate shape substrates The big part of the change rate of contracting.
11. such as claim 7 to 9 any one of them pattern exposure method, wherein the supporting member for substrate has bearing The surface bearing of the back side of the plate shape substrates is to possess curvature in the long side direction by face, the bearing surface.
12. such as claim 7 to 9 any one of them pattern exposure method, wherein make institute comprising one side the step of the exposure It states plate shape substrates to move with set conveyance speed in long side direction, exposes the figure in the scanned in regions of the exposure on one side The action of case.
13. a kind of manufacturing method forms electronic component, packet in the processed surface of the plate shape substrates with flexible strip Contain：
By with treated the plate shape substrates conveyance of the device of being responsible for photosensitive layer forming step in the long side direction the step of；
It is supported on position at detach both set a distances on the long side direction of the plate shape substrates 2 respectively using guiding elements, so that At described 2 between position the short side direction orthogonal with the long side direction by given degree shrink in a manner of, to the sheet The step of range of both set a distances of substrate assigns the tension of the long side direction；
At described 2 between position, in the state of friction free state or small contact area, using supporting member for substrate by institute The part in the face of the back side of the processed surface of plate shape substrates is stated, the step of bearing to planar or curved；With And
In the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree The processed surface on given area the step of exposing the pattern of the electronic component.
14. manufacturing method as claimed in claim 13, wherein the guiding elements includes the institute with the plate shape substrates State the face contact of processed surface or back side and the hold-down roll of revolvable idler wheel or the clamping plate shape substrates.
15. manufacturing method as claimed in claim 14, wherein the step of forming the pattern is utilized the pattern The exposure device that is exposed in a manner of projection pattern or proximity, using DMD without light shield exposure device, scanning laser point to carry out figure Printer or either one or two of ink-jet table printing machine that case is described is implemented.
16. manufacturing method as claimed in claim 14, wherein the step of forming the pattern is utilized the pattern The exposure device that is exposed in a manner of projection pattern or proximity, using DMD without light shield exposure device, scanning laser point to carry out figure Either one or two of printer that case is described is implemented,
The given area is set to the exposure area of the narrow slit-shaped of width of the long side direction of the plate shape substrates, At described the 2 of the plate shape substrates between position, the exposure area of the slit-shaped is set in the short side of the plate shape substrates The big part of the change rate of the contraction in direction or described it is punctured into certain part.
17. a kind of pattern forming method transports the plate shape substrates with flexible strip in long side direction, in the sheet The processed surface of substrate forms the pattern of electronic component, including：
It is supported on position at detach both set a distances on the long side direction of the plate shape substrates 2 respectively using guiding elements on one side, On one side between the position at described the 2 of the plate shape substrates, to be formed and the long side with given width in the long side direction In a manner of the size of the orthogonal short side direction in direction is contracted to substantially certain calming zone by given degree, at described 2 The step of tension of the long side direction being assigned between the guiding elements to the plate shape substrates；
In the state that plate shape substrates imparting has the tension, by the plate shape substrates corresponding with the calming zone The part in the face of the back side of the processed surface is there's almost no the step of state of friction flatly supports；
To be installed on the part of the peripheral surface of the rotatable cylinder light shield of the exposure device of proximity mode with it is described flat The step of processed surface of the plate shape substrates of ground bearing is adjusted to set gap；And
Keep conveyance speed and the peripheral speed of the peripheral surface of the cylinder light shield of the long side direction of the plate shape substrates same Step, the sheet base is exposed to by the pattern scan of the electronic component for the peripheral surface that will be formed in the cylinder light shield The processed surface of plate, in the flat shape of the processed surface corresponding with the calming zone of the plate shape substrates At the electronic component pattern the step of.
18. pattern forming method as claimed in claim 17, wherein the guiding elements includes the institute with the plate shape substrates State the face contact of processed surface or back side and the hold-down roll of revolvable idler wheel or the clamping plate shape substrates.
19. pattern forming method as claimed in claim 18, wherein the step of forming the pattern is utilized the pattern The exposure device that is exposed in a manner of projection pattern or proximity, using DMD without light shield exposure device, scanning laser point to carry out figure Printer or either one or two of ink-jet table printing machine that case is described is implemented.
20. pattern forming method as claimed in claim 18, wherein the step of forming the pattern is utilized the pattern The exposure device that is exposed in a manner of projection pattern or proximity, using DMD without light shield exposure device, scanning laser point to carry out figure Either one or two of printer that case is described is implemented,
When forming the pattern, flatly kept using supporting member for substrate corresponding with the calming zone of the plate shape substrates Back side face.
21. pattern forming method as claimed in claim 20, wherein the supporting member for substrate includes that plane keeps tool, is used The face of the back side of the plate shape substrates corresponding with the calming zone is kept with absorption.
22. such as claim 17 to 21 any one of them pattern forming method, wherein so as to be formed with the described of the pattern The width of the long side direction of area of the pattern in the processed surface of plate shape substrates be housed in the calming zone it is described both Mode in fixed width degree sets both set a distances between the guiding elements at described 2.
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