CN106917080A - The preparation method of Ni Au alloy nanotubes - Google Patents
The preparation method of Ni Au alloy nanotubes Download PDFInfo
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- CN106917080A CN106917080A CN201710128246.0A CN201710128246A CN106917080A CN 106917080 A CN106917080 A CN 106917080A CN 201710128246 A CN201710128246 A CN 201710128246A CN 106917080 A CN106917080 A CN 106917080A
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- solution
- deionized water
- alloy
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- 239000002071 nanotube Substances 0.000 title claims abstract description 36
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000007747 plating Methods 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 40
- 229920000642 polymer Polymers 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 230000001603 reducing effect Effects 0.000 claims abstract description 21
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 16
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 16
- 229910002666 PdCl2 Inorganic materials 0.000 claims abstract description 15
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 230000004913 activation Effects 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 11
- 206010070834 Sensitisation Diseases 0.000 claims abstract description 10
- 150000002739 metals Chemical class 0.000 claims abstract description 10
- 230000008313 sensitization Effects 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 230000003213 activating effect Effects 0.000 claims abstract description 4
- 239000008367 deionised water Substances 0.000 claims description 48
- 229910021641 deionized water Inorganic materials 0.000 claims description 48
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 25
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 24
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 22
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 18
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 11
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 11
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 11
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 11
- 239000011780 sodium chloride Substances 0.000 claims description 11
- 229960000549 4-dimethylaminophenol Drugs 0.000 claims description 10
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- 238000002386 leaching Methods 0.000 claims description 6
- 229910004042 HAuCl4 Inorganic materials 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 235000015424 sodium Nutrition 0.000 claims description 3
- UXGNZZKBCMGWAZ-UHFFFAOYSA-N dimethylformamide dmf Chemical compound CN(C)C=O.CN(C)C=O UXGNZZKBCMGWAZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 7
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 5
- 230000006641 stabilisation Effects 0.000 abstract description 3
- 238000011105 stabilization Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 description 26
- 229910045601 alloy Inorganic materials 0.000 description 19
- 239000010931 gold Substances 0.000 description 14
- 229910000861 Mg alloy Inorganic materials 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 5
- 229910020630 Co Ni Inorganic materials 0.000 description 4
- 229910002440 Co–Ni Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical class [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 2
- 229910004349 Ti-Al Inorganic materials 0.000 description 2
- 229910004692 Ti—Al Inorganic materials 0.000 description 2
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000002028 Biomass Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DXRFZHILMCWCNG-UHFFFAOYSA-N N,N-dimethyl-1,8-naphthyridin-2-amine Chemical compound C1=CC=NC2=NC(N(C)C)=CC=C21 DXRFZHILMCWCNG-UHFFFAOYSA-N 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 229920000891 common polymer Polymers 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 238000007709 nanocrystallization Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of preparation method of Ni Au alloy nanotubes, belongs to field of metal alloy technology, with PETP polymer as raw material, hole is etched through sodium hydroxide solution, in SnCl2Sn is adsorbed under the conditions of sensitized solution2+Ion, by adding PdCl2There is ionic reaction and displace Pd metals as nuclearing centre in activating solution, add chemistry Ni plating solutions and reducing solution, and a small amount of chemistry Au plating solutions are then progressively added dropwise, and 1 h is reacted at 50~90 DEG C, after removal polymer template, obtain Ni Au alloy nano tube materials.The method is raw material from polymer, and abundant raw material, yield abundance is secure, and cost of material is low, energy-saving.The polymer has creep resistance good, and fatigue durability is strong, and rub resistance is good and the advantages of dimensionally stable, ester bond can decompose under strong acid, highly basic and water vapor acting inside it.Use simple sensitization, activation, chemical plating method, so that it may form the Ni Au alloy nanotubes of stabilization.
Description
Technical field
The present invention relates to field of metal alloy technology, specifically a kind of preparation method of Ni-Au alloy nanotubes.
Background technology
Metal alloy nano material has certain perspective and wide application prospect.Its show obvious surface with
Interfacial effect, small-size effect, quantum size effect, macro quanta tunnel effect, have application valency very high in terms of catalysis
Value.Alloy nano-material is typically fine particle and forms presence, because with surface area higher, free energy is larger, is using
During be easy to reunite, cause catalyst to inactivate.Therefore researcher is being devoted to the research of metal nano-tube always, leads to
Cross different methods and be successfully prepared different single metal nano-tubes.Preferable two or more alloy is depended on
This several metallic surface directionality, and plane of crystal unicity etc..Meanwhile, it is different during metal material is prepared
The rate of reduction of reducing agent, reaction temperature and different metal required for metal material in reduction process is also different,
Therefore, it is challenging research topic always that should simultaneously form two kinds of metals and keep the pattern of nanotube again.
It is main with AAO as template that alloy nanotube is prepared at present, and the preparation process of AAO compares power consumption, and removal mould
The pollutants such as many soda acids can be produced during plate, is unfavorable for actual application.
United States Patent (USP)（US2016276280A1）Describe it is a kind of with copper be the ultra-thin multiple layer metal Nanoalloy material of substrate.
Copper alloy provides stress migration resistance and dielectric layer power prepares tungsten/copper alloy and/copper alloy for its alloy material.The method requirement
Preparation condition it is relatively complicated, with certain application limitation.
Japan Patent（JP2016070885A）Describe a kind of charcoal of alloy nanoparticle and extremely improve its electrode performance.
Electric conductivity is improved by preparing metal alloy nano material, for charcoal provides feasibility as good electrode.Illustrate gold
Category alloy material has certain application prospect and practical significance.
Russ P（RU2015110737A）Describe one kind be attached on Ti-Al alloy formed crystalline nanometric it is porous
The method of oxide.The method is designed into electroplating technology, by preparing Ti-Al alloy powder, and cleans, and dries, at anode
Reason forms nano-porous surface oxide.Electroplating effect is good, but consumed cost is higher, and electroplates uneven, need to develop it is a kind of into
This is low, and plating method is uniform and efficient method.
The Introduction To Cn Patent of Publication No. CN102400014A a kind of Co-Ni based alloys, the crystallization of Co-Ni based alloys
Control method, the manufacture method of Co-Ni based alloys and cerium sulphate crystal Co-Ni based alloys.The method is characterised by that it contains
Co, Ni, Cr and Mo, structure are orientated based on Gauss orientation.The method hole system difference crystalline texture, prepares various Ni based alloys materials
Material.The method complex operation, high cost not environmentally, awaits developing polymer raw material.
The preparation method and Fe of a kind of Fe Based Nanocrystalline Alloys of the Introduction To Cn Patent of Publication No. CN105593382A
The preparation method of Based Nanocrystalline Alloys magnetic core.By can the Fe base amorphous alloy bands of nano-crystallization be heated to crystallization temperature region simultaneously
The heat treatment step for being cooled down, and in the width applying magnetic field of alloy strip.The method is simply efficient, reproducible, can
Prepared for most metals alloy material.The method has certain limitation, awaits developing a kind of polymer as original
Material.
A kind of magnetic Nano with electro-oxidizing-catalyzing performance of the Introduction To Cn Patent of Publication No. CN105648478A
The preparation method of porous Fe-Pt alloys, belongs to new material technology field.Fe-Pt- is prepared using electric arc furnaces or induction melting furnace
（B, Si）It is that alloy master alloy ingot prepares the presoma alloy strip with amorphous or amorphous nano crystal structure.The method technique
Simply, flow is short, energy-efficient, but higher to the selectivity ratios of metal, there is limitation, needs to be improved preparation technology.
The Introduction To Cn Patent of the publication number CN1804118A method of chemical plating nickel-boron alloy on magnesium alloy surface.The method
Design a kind of AZ91D chemical plating nickel-boron alloy on magnesium alloy surface technique.Magnesium alloy is put into by sodium carbonate, sodium phosphate and poly- second two
Washed after being processed in the solution of alcohol octyl phenyl ether composition, obtain magnesium alloy, the magnesium alloy after treatment is put into by glacial acetic acid and
Sodium nitrate composition solution in process after wash, chemical plating, will be put into through the magnesium alloy after alkali cleaning and pickling processes by nickel acetate,
Washed after chemical plating in the chemical plating solution of sodium borohydride, ethylenediamine, NaOH and compound additive composition and obtain Ni-B conjunctions
Gold plate.It is low there is provided a kind of process costs, it is simple to operate, it is environmentally friendly, performance can be obtained in AZ91D Mg alloy surfaces excellent
The process of different Electroless Deposited Ni-B Alloy coating.But preparing has the alloy material of certain pattern more meaningful and valency
Value.
The Chinese patent of Publication No. CN102366839A also describes a kind of preparing rod-like ferrocobalt alloy powder without adopting template
Method.The oxide for preparing iron using coprecipitation is distributed in divalent cobalt ion solution, to being restored in mixture, then
By mixed powder, centrifugation out, is washed alcohol and is washed from solution, is vacuum dried, at dry powder under nitrogen protection heat
Reason obtains ferrocobalt granular powder.This inventive method process is simple, easy to operate, low cost, gained alloying pellet are by uniform
Club shaped structure is constituted, a diameter of 50-100 nm of rod, with good electro-magnetic wave absorption performance.However, by simple preparation side
Method develops a kind of reproducibility and differs that larger two kinds of metal alloy compositions are more meaningful and application prospect.
In sum, received significant attention for raw material prepares metal nano alloy from common biomass film, while
Preparation process is simple, efficiently time-saving energy-saving, easily industrialization also receive much concern.The present invention is from a kind of common polymer to benzene two
The ester film of formic acid second two is raw material, and pore structure is etched through sensitization plays activation method, then through different chemical plating fluids, and identical
Metallic reducing agent, simply, efficiently prepares the nano metal Ni-Au alloy materials with abundant tubular morphology.
The content of the invention
Technical assignment of the invention is to solve the deficiencies in the prior art, there is provided a kind of preparation side of Ni-Au alloy nanotubes
Method.
The technical scheme is that realize in the following manner, the preparation method of the Ni-Au alloy nanotubes is：
With PETP polymer as raw material, hole is etched through sodium hydroxide solution, in SnCl2Sensitized solution condition
Lower absorption Sn2+Ion, by adding PdCl2Pd metals are displaced there is ionic reaction as nuclearing centre, additionization in activating solution
Ni plating solutions and reducing solution are learned, a small amount of chemistry Au plating solutions are then progressively added dropwise, 1 h is reacted at 50~90 DEG C, remove polymer in-mold
After plate, Ni-Au alloy nano tube materials are obtained.
The method is specifically：
From PETP polymer as template, 1~4M mol sodiums at 40~70 DEG C
Its tow sides is then carried out uviol lamp and radiates 0.5~3 h by 5~30 min of lower etching respectively, then in dimethylformamide
5~20 min are impregnated in DMF solvent；
Via SnCl2The trifluoroacetic acid 10 of ethanol 1~10 mL, titer 1.0mol/L of 50~200 mg, 90%-98wt%
~100 uL, the sensitized solution that the mL of deionized water 1~20 is mixed impregnates 1~20 min；In SnCl2Sensitized solution condition
Lower absorption Sn2+Ion；
Again via PdCl2The activated solution that 20~100mg of 100~300mg, deionized water 5~20 mL, NaCl is mixed
1~20 min of dipping；Generation ionic reaction displaces Pd metals as nuclearing centre；
Repeat sensitization, activation step 1~5 time；
By the mg of nickel sulfate 50~100；The mg of iminodiacetic acid 50~200；The μ L of NaOH solution 100~300 of 32wt%；Go from
Sub- 1~20mL of water mixes Ni plating solutions；
Reducing solution is mixed by the μ L of hydrazine hydrate 255 and the mL of deionized water 1~20 of 40%-80wt%；
By the HAuCl of titer 1.0mol/L4The μ L of solution 200~600；The mg of DMAP 10~100；Deionized water
0.2~5 mL mixes Au plating solutions；
Film after treatment is put at 50~90 DEG C in the mixture of Ni plating solutions and reducing solution, and is dripped with 200 μ L/30s speed
Plus Au plating solutions, and 0.5~3 h is reacted, after removal polymer template, obtain Ni-Au alloy nano tube materials.
Sensitized solution is by SnCl290 mg, the mL of ethanol 3.3, the uL of trifluoroacetic acid 46, the mL of deionized water 6.7 mix and
Into.
Activated solution is by PdCl2218 mg, deionized water 10 mL, NaCl 47 mg are mixed.
Ni plating solutions are by the mg of nickel sulfate 79；The mg of iminodiacetic acid 93；The μ L of NaOH solution 197；The mL of deionized water 3 mixes
Form.
Au plating solutions are by HAuCl4The μ L of solution 368；The mg of DMAP 34；The mL of deionized water 1 is mixed.
Reducing solution is by the μ L of the hydrazine hydrate 255 and mL of deionized water 3.
The produced compared with prior art beneficial effect of the present invention is：
The preparation method of the Ni-Au alloy nanotubes is raw material, abundant raw material, yield from PETP polymer
Sufficient secure, cost of material is low, energy-saving.Therefore thin polymer film is developed for template prepares metal nano-tube with very high
Researching value.The crystallization degree of polymer is key issue, and crystallinity polymer high can be such that metal is preferably attached to
Polymer surfaces, form the alloy material of stabilization.Polyethylene terephthalate (PET), is a kind of crystal type saturated polyester,
Crystallinity is very high, is creamy white or light yellow.The polymer has creep resistance good, and fatigue durability is strong, rub resistance it is good and
The advantages of dimensionally stable, its internal ester bond can decompose under strong acid, highly basic and water vapor acting, therefore select it as mould
Plate, efficiently preparing metal nano alloy material using simple method has important realistic meaning and application value.
The method changes traditional production technology, uses simple sensitization, activation, chemical plating method, so that it may form steady
Fixed Ni-Au alloy nanotubes.
The method makes restoring for stabilized metal according to the reducing property of different metal from identical reducing agent, behaviour
Make efficient, controllability is strong.
The method solution usage is few, and the reaction time is short, takes less, consumes energy low, efficiently prepares Ni-Au alloy nanotubes, shape
Into the Ni-Au alloy nano tube materials of stabilization, the application field of metal material is widened.
The preparation method of the Ni-Au alloy nanotubes is reasonable in design, safe and reliable, easy to operate, be easy to control, with very
Good popularizing value.
Brief description of the drawings
Accompanying drawing 1 is the SEM SEM figures of Ni-Au alloy nanotubes obtained by the present invention.
Specific embodiment
The preparation method to Ni-Au alloy nanotubes of the invention is described in detail below below in conjunction with the accompanying drawings.
The preparation method of Ni-Au alloy nanotubes of the invention is：
With PETP polymer as raw material, hole is etched through sodium hydroxide solution, in SnCl2Sensitized solution condition
Lower absorption Sn2+Ion, by adding PdCl2Pd metals are displaced there is ionic reaction as nuclearing centre, additionization in activating solution
Ni plating solutions and reducing solution are learned, a small amount of chemistry Au plating solutions are then progressively added dropwise, 1 h is reacted at 50~90 DEG C, remove polymer in-mold
After plate, Ni-Au alloy nano tube materials are obtained.
The method is specifically：
From PETP polymer as template, 1~4M mol sodiums at 40~70 DEG C
Its tow sides is then carried out uviol lamp and radiates 0.5~3 h by 5~30 min of lower etching respectively, then in dimethylformamide
5~20 min are impregnated in DMF solvent；
Via SnCl2The trifluoroacetic acid 10 of ethanol 1~10 mL, titer 1.0mol/L of 50~200 mg, 90%-98wt%
~100 uL, the sensitized solution that the mL of deionized water 1~20 is mixed impregnates 1~20 min；In SnCl2Sensitized solution condition
Lower absorption Sn2+Ion；
Again via PdCl2The activated solution that 20~100mg of 100~300mg, deionized water 5~20 mL, NaCl is mixed
1~20 min of dipping；Generation ionic reaction displaces Pd metals as nuclearing centre；
Repeat sensitization, activation step 1~5 time；
By the mg of nickel sulfate 50~100；The mg of iminodiacetic acid 50~200；The μ L of NaOH solution 100~300 of 32wt%；Go from
Sub- 1~20mL of water mixes Ni plating solutions；
Reducing solution is mixed by the μ L of hydrazine hydrate 255 and the mL of deionized water 1~20 of 40%-80wt%；
By the HAuCl of titer 1.0mol/L4The μ L of solution 200~600；The mg of DMAP 10~100；Deionized water
0.2~5 mL mixes Au plating solutions；
Film after treatment is put at 50~90 DEG C in the mixture of Ni plating solutions and reducing solution, and is dripped with 200 μ L/30s speed
Plus Au plating solutions, and 0.5~3 h is reacted, after removal polymer template, obtain Ni-Au alloy nano tube materials.
Embodiment 1：
From PETP as template, 5 min are etched under 1 M sodium hydroxide solutions at 50 DEG C, then divided
The other uviol lamp that carried out to its tow sides radiates 30 min, then 5 min are impregnated in DMF solvent.Through sensitized solution（SnCl2 90
The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of mg, 90wt%, the mL of deionized water 6.7 are mixed）Leaching
The min of stain 1, then activated solution（PdCl2218 mg, deionized water 10 mL, NaCl 47 mg）1 min is impregnated, is repeated quick
Change activation step 5 times.Ni plating solutions at film after treatment is put into 50 DEG C（The mg of nickel sulfate 79；The mg of iminodiacetic acid 93；
The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mixes）And reducing solution（The μ L of hydrazine hydrate 255 and deionized water of 40wt%
3 mL）Mixture in, with 200 μ L/30s speed be added dropwise Au plating solutions（The HAuCl of titer 1.0mol/L4The μ L of solution 368；4-
The mg of dimethylamino naphthyridine 34；The mL of deionized water 1）, and react 1 h.
Embodiment 2：
From PETP as template, 15 min are etched under 2 M sodium hydroxide solutions at 60 DEG C, then divided
The other uviol lamp that carried out to its tow sides radiates 1 h, then 10 min are impregnated in DMF solvent.Through sensitized solution（SnCl2 90
The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of mg, 95wt%, the mL of deionized water 6.7 are mixed）Leaching
The min of stain 7, then activated solution（PdCl2218 mg, deionized water 10 mL, NaCl 47 mg）7 min are impregnated, is repeated quick
Change activation step 4 times.Ni plating solutions at film after treatment is put into 60 DEG C（The mg of nickel sulfate 79；The mg of iminodiacetic acid 93；
The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mixes）And reducing solution（The μ L of 60wt% hydrazine hydrates 255 and deionized water 3
mL）Mixture in, with 200 μ L/30s speed be added dropwise Au plating solutions（HAuCl4The μ L of solution 368；The mg of DMAP 34；
The mL of deionized water 1）, and react 2 h.
Embodiment 3：
From PETP as template, 20 min are etched under 3 M sodium hydroxide solutions at 40 DEG C, then divided
The other uviol lamp that carried out to its tow sides radiates 2 h, then 20 min are impregnated in DMF solvent.Through sensitized solution（SnCl2 90
The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of mg, 98wt%, the mL of deionized water 6.7 are mixed）Leaching
The min of stain 12, then activated solution（PdCl2218 mg, deionized water 10 mL, NaCl 47 mg）12 min are impregnated, is repeated
Sensitization activation step 3 times.Ni plating solutions at film after treatment is put into 70 DEG C（The mg of nickel sulfate 79；Iminodiacetic acid 93
mg；The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mixes）And reducing solution（The μ L of hydrazine hydrate 255 of 80wt% and go from
The mL of sub- water 3）Mixture in, with 200 μ L/30s speed be added dropwise Au plating solutions（The HAuCl of titer 1.0mol/L4The μ of solution 368
L；The mg of DMAP 34；The mL of deionized water 1）, and react 0.5 h.
Embodiment 4：
From PETP as template, 30 min are etched under 4 M sodium hydroxide solutions at 70 DEG C, then divided
The other uviol lamp that carried out to its tow sides radiates 2.5 h, then 15 min are impregnated in DMF solvent.Through sensitized solution（SnCl2 90
The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of mg, 90wt%, the mL of deionized water 6.7 are mixed）Leaching
The min of stain 18, then activated solution（PdCl2218 mg, deionized water 10 mL, NaCl 47 mg）18 min are impregnated, is repeated
Sensitization activation step 2 times.Ni plating solutions at film after treatment is put into 80 DEG C（The mg of nickel sulfate 79；Iminodiacetic acid 93
mg；The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mixes）And reducing solution（The μ L of hydrazine hydrate 255 of 80wt% and go from
The mL of sub- water 3）Mixture in, with 200 μ L/30s speed be added dropwise Au plating solutions（The HAuCl of titer 1.0mol/L4HAuCl4Solution
368 μL；The mg of DMAP 34；The mL of deionized water 1）, and react 2.5 h.
Embodiment 5：
From PETP as template, 25 min are etched under 2 M sodium hydroxide solutions at 40 DEG C, then divided
The other uviol lamp that carried out to its tow sides radiates 3 h, then 15 min are impregnated in DMF solvent.Through sensitized solution（SnCl2 90
The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of mg, 98wt%, the mL of deionized water 6.7 are mixed）Leaching
The min of stain 20, then activated solution（PdCl2218 mg, deionized water 10 mL, NaCl 47 mg）20 min are impregnated, is repeated
Sensitization activation step 1 time.Ni plating solutions at film after treatment is put into 90 DEG C（The mg of nickel sulfate 79；Iminodiacetic acid 93
mg；The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mixes）And reducing solution（The μ L of 80wt% hydrazine hydrates 255 and deionization
The mL of water 3）Mixture in, with 200 μ L/min speed be added dropwise Au plating solutions（The HAuCl of titer 1.0mol/L4The μ L of solution 368；
The mg of DMAP 34；The mL of deionized water 1）, and react 3 h.See accompanying drawing 1.
Claims (8)
- The preparation method of 1.Ni-Au alloy nanotubes, it is characterised in that the method includes：With PETP polymer as raw material, hole is etched through sodium hydroxide solution, in SnCl2Sensitized solution condition Lower absorption Sn2+Ion, by adding PdCl2Pd metals are displaced there is ionic reaction as nuclearing centre, additionization in activating solution Ni plating solutions and reducing solution are learned, a small amount of chemistry Au plating solutions are then progressively added dropwise, 1 h is reacted at 50~90 DEG C, remove polymer in-mold After plate, Ni-Au alloy nano tube materials are obtained.
- The preparation method of 2.Ni-Au alloy nanotubes, it is characterised in that the method includes：From PETP polymer as template, 1~4M mol sodiums at 40~70 DEG C Its tow sides is then carried out uviol lamp and radiates 0.5~3 h by 5~30 min of lower etching respectively, then in dimethylformamide 5~20 min are impregnated in DMF solvent；Via SnCl2The trifluoroacetic acid 10 of ethanol 1~10 mL, titer 1.0mol/L of 50~200 mg, 90%-98wt%~ 100 uL, the sensitized solution that the mL of deionized water 1~20 is mixed impregnates 1~20 min；In SnCl2Under the conditions of sensitized solution Absorption Sn2+Ion；Again via PdCl2The activated solution leaching that 20~100mg of 100~300mg, deionized water 5~20 mL, NaCl is mixed The min of stain 1~20；Generation ionic reaction displaces Pd metals as nuclearing centre；Repeat sensitization, activation step 1~5 time；By the mg of nickel sulfate 50~100；The mg of iminodiacetic acid 50~200；The μ L of NaOH solution 100~300 of 32wt%；Go from Sub- 1~20mL of water mixes Ni plating solutions；Reducing solution is mixed by the μ L of hydrazine hydrate 255 and the mL of deionized water 1~20 of 40%-80wt%；By the HAuCl of titer 1.0mol/L4The μ L of solution 200~600；The mg of DMAP 10~100；Deionized water 0.2~5 mL mixes Au plating solutions；Film after treatment is put at 50~90 DEG C in the mixture of Ni plating solutions and reducing solution, and is dripped with 200 μ L/30s speed Plus Au plating solutions, and 0.5~3 h is reacted, after removal polymer template, obtain Ni-Au alloy nano tube materials.
- The preparation method of 3.Ni-Au alloy nanotubes, it is characterised in that the method includes：From PETP polymer as template, etched under 1~4 M sodium hydroxide solutions at 40~70 DEG C Its tow sides is then carried out uviol lamp and radiates 0.5~3 h by 5~30 min respectively, then in dimethylformamide DMF solvent 5~20 min of middle dipping；Via SnCl2The uL of trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of 90 mg, 90%-98wt%, go from The sensitized solution that the mL of sub- water 6.7 is mixed impregnates 1~20 min；In SnCl2Sn is adsorbed under the conditions of sensitized solution2+Ion；Again via PdCl2The activated solution dipping 1~20 that 218 mg, deionized water 10 mL, NaCl 47 mg are mixed min；Generation ionic reaction displaces Pd metals as nuclearing centre；Repeat sensitization, activation step 1~5 time；By the mg of nickel sulfate 79；The mg of iminodiacetic acid 93；The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 mix and Into Ni plating solutions；Reducing solution is mixed by the μ L of hydrazine hydrate 255 and the mL of deionized water 3 of 40%-80wt%；By the HAuCl of titer 1.0mol/L4The μ L of solution 368；The mg of DMAP 34；The mL of deionized water 1 mix and Into Au plating solutions；Film after treatment is put at 50~90 DEG C in the mixture of Ni plating solutions and reducing solution, and is dripped with 200 μ L/30s speed Plus Au plating solutions, and 0.5~3 h is reacted, after removal polymer template, obtain Ni-Au alloy nano tube materials.
- 4. the sensitized solution that a kind of preparation method of Ni-Au alloy nanotubes according to claim 1 is used, its feature It is：Sensitized solution is by SnCl2The trifluoroacetic acid 46 of ethanol 3.3 mL, titer 1.0mol/L of 90 mg, 90%-98wt% UL, the mL of deionized water 6.7 is mixed.
- 5. the activated solution that a kind of preparation method of Ni-Au alloy nanotubes according to claim 1 is used, its feature It is：Activated solution is by PdCl2218 mg, deionized water 10 mL, NaCl 47 mg are mixed.
- 6. a kind of Ni plating solutions that preparation method of Ni-Au alloy nanotubes according to claim 1 is used, its feature exists In：Ni plating solutions are by the mg of nickel sulfate 79；The mg of iminodiacetic acid 93；The μ L of NaOH solution 197 of 32wt%；The mL of deionized water 3 is mixed Conjunction is formed.
- 7. a kind of Au plating solutions that preparation method of Ni-Au alloy nanotubes according to claim 1 is used, its feature exists In：Au plating solutions by titer 1.0mol/L HAuCl4The μ L of solution 368；The mg of DMAP 34；The mL of deionized water 1 Mix.
- 8. a kind of reducing solution that preparation method of Ni-Au alloy nanotubes according to claim 1 is used, its feature exists In：Reducing solution by 40%-80wt% the μ L of hydrazine hydrate 255 and the mL of deionized water 3.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0283533A (en) * | 1988-09-21 | 1990-03-23 | Hitachi Ltd | Liquid crystal display device and electrode substrate therefor |
| CN1775427A (en) * | 2005-11-21 | 2006-05-24 | 谢广文 | Method for preparing nano metal pipe by template chemical plating process |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| US20130137082A1 (en) * | 2011-11-24 | 2013-05-30 | Electronics And Telecommunications Research Institute | Biosensor, apparatus and method for detecting a biomolecule using the biosensor |
| CN103708416A (en) * | 2013-12-20 | 2014-04-09 | 武汉纺织大学 | Preparation method for electro-conductive magnetic nanotube |
| CN105163884A (en) * | 2013-04-12 | 2015-12-16 | 德克萨斯州立大学董事会 | Synthesis of bimetallic nanoparticle catalysts by using microwave irradiation |
| CN105349972A (en) * | 2015-11-25 | 2016-02-24 | 广东致卓精密金属科技有限公司 | Reduced-form composite complexing non-cyanide chemical gold plating liquid and method |
-
2017
- 2017-03-06 CN CN201710128246.0A patent/CN106917080B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0283533A (en) * | 1988-09-21 | 1990-03-23 | Hitachi Ltd | Liquid crystal display device and electrode substrate therefor |
| CN1775427A (en) * | 2005-11-21 | 2006-05-24 | 谢广文 | Method for preparing nano metal pipe by template chemical plating process |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
| US20130137082A1 (en) * | 2011-11-24 | 2013-05-30 | Electronics And Telecommunications Research Institute | Biosensor, apparatus and method for detecting a biomolecule using the biosensor |
| CN105163884A (en) * | 2013-04-12 | 2015-12-16 | 德克萨斯州立大学董事会 | Synthesis of bimetallic nanoparticle catalysts by using microwave irradiation |
| CN103708416A (en) * | 2013-12-20 | 2014-04-09 | 武汉纺织大学 | Preparation method for electro-conductive magnetic nanotube |
| CN105349972A (en) * | 2015-11-25 | 2016-02-24 | 广东致卓精密金属科技有限公司 | Reduced-form composite complexing non-cyanide chemical gold plating liquid and method |
Non-Patent Citations (1)
| Title |
|---|
| 齐世学等: "Au/NiO催化剂的XRD、TEM、TPR及XPS表征研究", 《分子催化》 * |
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