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CN106906430B - 一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺 - Google Patents

一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺 Download PDF

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CN106906430B
CN106906430B CN201710273042.6A CN201710273042A CN106906430B CN 106906430 B CN106906430 B CN 106906430B CN 201710273042 A CN201710273042 A CN 201710273042A CN 106906430 B CN106906430 B CN 106906430B
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蔡安辉
胡优生
安琪
周国君
罗云
李小松
丁超义
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Hunan Institute of Science and Technology
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Abstract

本发明公开了一种Cu70Zr20Ti10/Cu/Ni‑P非晶合金复合粉末及其制备工艺。该复合粉末是通过球磨与化学镀方法联动制备，其形状为片状，平均厚度为300nm，由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni‑P非晶合金镀层组成，其分布方式为Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中，而Ni‑P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。其制备工艺为：将球形Cu70Zr20Ti10晶态合金粉末用盐酸、硝酸和氢氟酸混合溶液进行活化，放入充满化学镀液的球磨罐中，进行球磨而合成。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10‑3Ω·mm。

Description

一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺
技术领域
本发明涉及一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺。
背景技术
铜基非晶合金由于强度高、耐腐蚀、耐磨损、低温塑性、催化性以及马氏体相变，在结构与功能材料领域具有十分广阔的应用前景，然而，其室温脆性、低的导热导电系数和高温抗氧化性，限制了其应用范围。因此，本发明旨在提高铜基非晶合金的室温塑性、导电导热和高温抗氧化性，具有重要的意义。
发明内容
本发明的目的在于提供一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺。
本发明的目的是通过下述技术方案实现的：一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末，其特征在于：所述复合粉末是通过球磨与化学镀方法联动合成，其形状为片状，平均厚度为300nm，由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni-P非晶合金镀层组成，Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中，而Ni-P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。
本发明所得非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
本发明所述Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的制备工艺，其特征在于，包括如下步骤：（1）将适量的Cu70Zr20Ti10球形晶态合金粉末放入烧杯中，加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时；（2）然后用去离子水将Cu70Zr20Ti10球形晶态合金粉末清洗干净；（3）再将清洗干净的Cu70Zr20Ti10球形晶态合金粉末放入球磨罐中，然后将球磨罐充满PH值为8.0的化学镀液，在球料比为30:1、球磨速度为500转/分钟的条件下，球磨1小时后即可获得片状非晶合金粉末。
本发明所述一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺与现有相关技术相比，具有如下显著的不同特征：（1）将球磨和化学镀两种技术联合一步合成Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末；（2）利用球磨过程所产生的热量保证化学镀所需的温度；（3）利用钢质磨球作为化学镀的引渡源，激发化学镀；（4）采用本发明的球磨化学镀联动技术，克服了传统化学镀方法由于化学镀液的蒸发而引起的化学镀液PH值的变化，在化学镀过程中要随时添加酸液或碱液调整PH值保证化学镀的稳定进行的缺陷。
本发明制成的产品分别用球磨罐球磨，XRD检测Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的非晶态结构，扫描电子显微镜观察Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的形貌，透射电子显微镜观察Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末中Cu晶粒的形貌、分布和大小，EDS分析Cu晶粒的成分，激光闪光仪测量导热系数，四电极法测量电阻率。
本发明一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末是片状的，其导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
具体实施方式
下面根据具体实施例对本发明作进一步说明：
实施例1
用天平称取Cu70Zr20Ti10球形非晶粉末5g，放入烧杯中，加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时，然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净，再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中，然后将球磨罐充满PH值为8.0的化学镀液，在球料比为30:1、球磨速度为500转/分钟的条件下，球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
实施例2
用天平称取Cu70Zr20Ti10球形非晶粉末10g，放入烧杯中，加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时，然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净，再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中，然后将球磨罐充满PH值为8.0的化学镀液，在球料比为30:1、球磨速度为500转/分钟的条件下，球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
实施例3
用天平称取Cu70Zr20Ti10球形非晶粉末15g，放入烧杯中，加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时，然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净，再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中，然后将球磨罐充满PH值为8.0的化学镀液，在球料比为30:1、球磨速度为500转/分钟的条件下，球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。

Claims (3)

1.一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末，其特征在于:所述复合粉末是通过球磨与化学镀方法联动合成，其形状为片状，平均厚度为300nm，由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni-P非晶合金镀层组成，Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中，而Ni-P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。
2.权利要求1所述的一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末，其特征在于:所述复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
3.权利要求1所述的一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的制备工艺，其特征在于，包括如下步骤：（1）将适量的Cu70Zr20Ti10球形晶态合金粉末放入烧杯中，加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时；（2）然后用去离子水将Cu70Zr20Ti10球形晶态合金粉末清洗干净；（3）再将清洗干净的Cu70Zr20Ti10球形晶态合金粉末放入球磨罐中，然后将球磨罐充满PH值为8.0的化学镀液，在球料比为30:1、球磨速度为500转/分钟的条件下，球磨1小时后即可获得片状非晶合金粉末。
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