CN106884195A - A kind of plated film magnesium and its alloy and preparation method thereof - Google Patents
A kind of plated film magnesium and its alloy and preparation method thereof Download PDFInfo
- Publication number
- CN106884195A CN106884195A CN201710091725.XA CN201710091725A CN106884195A CN 106884195 A CN106884195 A CN 106884195A CN 201710091725 A CN201710091725 A CN 201710091725A CN 106884195 A CN106884195 A CN 106884195A
- Authority
- CN
- China
- Prior art keywords
- magnesium
- alloy
- plated film
- insulating barrier
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/30—Anodisation of magnesium or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
It is Surface Machining, the coating technology of a kind of magnesium and its alloy, in particular to a kind of plated film magnesium and its alloy and preparation method thereof the present invention relates to Surface Machining, coatings art.A kind of plated film magnesium and its alloy, including the magnesium and its alloy substrate and conductive film layer of electric isolution are formed by insulating barrier, insulating barrier is attached to magnesium and its alloy substrate surface, and conductive film layer is attached to surface of insulating layer.A kind of preparation method of plated film magnesium and its alloy, including：Insulating barrier is formed in magnesium and its alloy substrate surface, then conducting film is formed in surface of insulating layer.Plated film magnesium and its alloy that the present invention is provided pass through the synergy between insulating barrier and conductive film layer, enable plated film magnesium and its alloy in the case where good electric conductivity is ensured while having stronger decay resistance.
Description
Technical field
It is Surface Machining, the coating technology of a kind of magnesium and its alloy, specifically the present invention relates to Surface Machining, coatings art
For, it is related to a kind of plated film magnesium and its alloy and preparation method thereof.
Background technology
Magnesium and its alloy have that specific strength is high, good heat conductivity, have in fields such as Aeronautics and Astronautics, military affairs, automobiles important
Application.
Many colleges and universities both domestic and external and scientific research institutions have all carried out the research of magnesium and its alloy surface functional coating, but conductive
The research of functional membrane is still in enlightening stage.The preparation research of the surface conductance film of major part research institution is confined to use at present
Traditional plating, method of chemical plating, one layer of copper, nickel etc. are plated in magnesium and its alloy surface；Part research institution is in magnesium and its conjunction
Gold surface prepares conductive organic layer, and main component is polyaniline film；Part body uses phosphorization technology, prepares stannate conversion
The weakly conducting functional membrane such as film, Molybdate Conversion Film.It is conductive but above-mentioned conducting function film directly overlays magnesium and its alloy surface
Functional membrane and magnesium and its alloy substrate directly contact；It is known that magnesium and its alloy chemistry are active, it is very easy to corruption
Erosion, in the case where magnesium is contacted with dissimilar metal, forms galvanic corrosion system, and magnesium can preferentially corrode as negative electrode, this
Conventional method is caused to prepare magnesium and its alloy substrate perishable, short life the critical defect of military service of functional membrane.
With the complicated applications such as the increase of magnesium and its alloy engineer applied, especially ocean, Aero-Space, communication lightweight
It is high to magnesium and its alloy anticorrosion performance requirement in the case of environment, exploitation Corrosion Protection good magnesium and its alloy conductive work(
Energy membrane technology, has positive meaning to developing and developing novel light labyrinth conducting function part.
The content of the invention
It is an object of the invention to provide a kind of plated film magnesium and its alloy, alloy conductive functional membrane anticorrosive property can be improved
Can, and communication, navigation, Aero-Space are met to electromagnetic shielding, electric conductivity, anticorrosive property, light-weighted engineer applied demand.
What the present invention was realized in：
A kind of plated film magnesium and its alloy, including the magnesium and its alloy substrate and conductive film layer of electric isolution are formed by insulating barrier,
Insulating barrier is attached to magnesium and its alloy substrate surface, and conductive film layer is attached to surface of insulating layer.
Present invention also offers a kind of above-mentioned plated film magnesium and its preparation method of alloy, by conductive functional layers and magnesium and
Increase by one layer of ceramic insulating layer between its alloy substrate, greatly improve conducting function film Corrosion Protection.
What the present invention was realized in：
A kind of preparation method of above-mentioned plated film magnesium and its alloy, including：Insulating barrier is formed in magnesium and its alloy substrate surface,
Again conducting film is formed in surface of insulating layer.
The beneficial effect of such scheme：
The invention provides a kind of plated film magnesium and its alloy, set by between conductive film layer and magnesium and its alloy basic unit
There is insulating barrier, significantly improve the Corrosion Protection of the conductive film layer of magnesium and its alloy.And in the present invention, conductive film layer is
Ag films, conductive capability is good, disclosure satisfy that communication, navigation, Aero-Space to electromagnetic shielding, electric conductivity, anticorrosive property, lightweight
Engineer applied demand.
A kind of plated film magnesium and its alloy preparation method that the present invention is provided, insulation is preferentially formed in magnesium and its alloy surface
Layer, then prepares conductive film layer by reaction solution in surface of insulating layer.By differential arc oxidation first in magnesium and its alloy in the present invention
Surface forms insulation porous oxidation film layer, the insulation porous oxidation film layer of formation can block corrosion galvanic cell loop and with preparation
Conductive film layer formed collaboration overcoat, plated film magnesium and its alloy anticorrosion performance is greatly improved.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be attached to what is used needed for embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, thus be not construed as it is right
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
The structural representation of the plated film magnesium alloy that Fig. 1 is provided for the present invention；
Fig. 2 shows the open-celled structure schematic diagram of the porous ceramics insulating barrier of the plated film magnesium alloy of present invention offer；
Fig. 3 is porous ceramics insulating barrier microstructure schematic diagram of the present invention.
Wherein：100- magnesium and its alloy substrate；110- insulating barriers；120- conductive film layers；111- perforates.
Specific embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but those skilled in the art will
Understand, the following example is merely to illustrate the present invention, and is not construed as limiting the scope of the present invention.It is unreceipted specific in embodiment
Condition person, the condition advised according to normal condition or manufacturer is carried out.Agents useful for same or the unreceipted production firm person of instrument, are
The conventional products that can be obtained by commercially available purchase.
Plated film magnesium and its alloy below for the embodiment of the present invention are specifically described：
Refering to Fig. 1, a kind of plated film magnesium and its alloy, including the magnesium and its alloy substrate that electric isolution is formed by insulating barrier 110
100 and conductive film layer 120, insulating barrier 110 is attached to magnesium and its surface of alloy substrate 100, and conductive film layer 120 is attached to insulating barrier
110 surfaces.
Magnesium in the present embodiment can be magnesium plate or be MAG block, and magnesium alloy substrate can be closed for almag matrix, zinc-magnesium
Auri body can also be other magnesium alloy substrates.
The material of the insulating barrier 110 in the present embodiment is ceramics, is further insulating oxide film layer.Understood refering to Fig. 2, absolutely
Edge layer 110 is provided with perforate 111 to open cavernous structure on its surface.The diameter and hole depth of perforate 111 are according to actual conditions
It is fixed.The thickness of insulating barrier 110 is at 3~30 μm in the present embodiment.
Insulating barrier 110 in the present embodiment is used as the surfacecti proteon film of magnesium and its alloy substrate 100, and its setting can be significantly
The raising magnesium and its alloy corrosion current potential of degree, and then improve its Corrosion Protection.And the porous ceramics insulation in the present embodiment
Layer is loose structure, with good tack, makes it relatively stable with connection between magnesium and its surface of alloy substrate 100,
And also make it and stable connection between conductive film layer 120 in its surface is set.
The material of the conductive film layer 120 in the present embodiment is mainly one or more in silver, copper, nickel, further preferably
It is silver.Conductive film layer 120 can be covered in the surface of insulating barrier 110, and the perforate 111 of insulating barrier 110 is blocked, finally with absolutely
Edge layer 110 forms collaboration overcoat, it is to avoid corrosive ions such as chlorion of external world's contact etc. enters perforate 111 to magnesium alloy substrate
Corrosion.And conductive film layer 120 is silverskin, conductive capability is good, disclosure satisfy that communication, navigation, Aero-Space to being electromagnetically shielded,
Electric conductivity, anticorrosive property, light-weighted engineer applied demand.
The present embodiment by by the synergy of insulating barrier 110 and conductive film layer 120, in magnesium and its alloy substrate 100
Surface forms multi-layer film structure, makes magnesium and its alloy substrate 100 while Corrosion Protection is improved, and also has magnesium and its alloy
There is good electric conductivity.The characteristic of the high impedance insulator of insulating barrier 110 enters magnesium and its alloy substrate 100 with conductive film layer 120
Row isolation, has cut off the conductive channel of magnesium alloy and extraneous UNICOM, prevents the generation of galvanic corrosion, it is notable that this reality
Galvanic corrosion includes contact corrosion or bimetallic corrosion in applying example.The surface of insulating barrier 110 is porous structure, and this is differential of the arc oxygen
Change film layer design feature in itself, differential arc oxidation is out just presented loose structure.Loose structure can provide very good table
Face adhesion property, is conducive to silverskin to adhere to, and increases interface binding power.
It should be noted that in the embodiment of the present invention, plated film magnesium and its alloy are the slab construction with stratiform, wherein,
Magnesium and its alloy substrate 100, insulating barrier 110 and conductive film layer 120 are rectangular slab.It is understood that of the invention
In other embodiment, plated film magnesium and its alloy can also be other shapes, and e.g. core shell structure is spherical, i.e. magnesium and its alloy
Matrix 100 is spherical structure, and spherical insulating barrier 110 is attached to magnesium and its surface of alloy substrate 100, spherical conducting film attachment
In the surface of insulating barrier 110.
The preparation method of above-mentioned plated film magnesium and its alloy, comprises the following steps：
Insulating barrier is formed in magnesium and its surface of alloy substrate 100, then conducting film is formed on the surface of insulating barrier 110.
The insulating barrier 110 on magnesium and its surface of alloy substrate 100 is attached to for oxide-film, and the method for forming oxidation film layer
It is：
Differential arc oxidation is carried out to magnesium and its alloy substrate 100.The present embodiment is processed by differential arc oxidation makes magnesium and its alloy
The surface of matrix 100 forms the insulating barrier 110 with loose structure., it is necessary to magnesium and its conjunction in differential arc oxidation processing procedure
The surface of auri body 100 carries out starting the arc treatment, and electric shock hole, i.e. this implementation can be formed on the surface of insulating barrier 110 after starting the arc treatment
Insulating barrier 110 in example.
The method that magnesium and its alloy substrate 100 carry out differential arc oxidation treatment is included：
Electrolysis treatment is carried out to magnesium and its alloy substrate 100 by electrolyte, the electrolyte in the present embodiment is main by 0.1
~10g/L NaOH, 5~15g/L Na2SiO3, 5~15g/L NaF composition.Electrolyte is more preferably 0.5~7g/L
NaOH, 8~10g/L Na2SiO3, 8~10g/L NaF composition.
In the present embodiment, the voltage for being electrolysed treatment is 250~600V, current density 0.5-10A/dm2, process time 1-
20min.Further to be preferably, voltage is 350~500V, current density 0.8-7A/dm2, process time 5-15min.This reality
Apply in example, electrolysis treatment can be completed in a cell, and electrolyte is loaded with electrolytic cell.In the present embodiment, electrolyte must flood
Do not have magnesium and its alloy substrate 100, and the surface of magnesium and its alloy substrate 100 is goed deep into the liquid level of electrolyte at least
10cm。
The method for forming conductive film layer 120 on the surface of insulating barrier 110 has various, in the embodiment of the present invention, conductive film layer 120
Material be preferably silver, therefore form the method for conductive film layer 120 of silver-colored material and include：
Reaction solution is scattered in the surface of insulating barrier 110, and is heated.Reaction solution in the present embodiment is main by silver nitrate, ammonia
Water, reducing agent, NaOH and sodium thiosulfate composition.In the present embodiment, the formation of insulating barrier 110 is mainly anti-by silver mirror
Should, form silver coating in insulating barrier 110.
In silver mirror reaction, silver nitrate provides the silver ion formed for silver coating, during ammoniacal liquor is used to separate out silver nitrate
Silver ion, the silver ion reduction that reducing agent is used to be separated out in solution is silver, is further formed and is attached to porous ceramics insulating barrier
110 conductive film layer 120.Further, reducing agent is glucose, tartrate, hydrazine sulfate, glyoxal, sodium borohydride, diformazan
Base amine borine, triethanolamine any one composition with glycerine.
NaOH is used to adjust alkaline environment in the solution, that is, adjust solubility hydroxy in solution, so as to increase also
The reproducibility of former agent, enables reducing agent to be preferably argent by the silver ion reduction in silver nitrate solution.But it is noticeable
It is, in other embodiments, it is also possible to add other alkali compounds, such as KOH.In the present embodiment, sodium thiosulfate
Effect is exactly for fixing and soluble in water with silver nitrate reaction generation complex.In the present embodiment, glucose contains aldehyde
Base, with reproducibility, can be by the silver ion reduction in silver nitrate solution into argent.In the present embodiment, tartrate enters
One step is preferably sodium potassium tartrate tetrahydrate, equally by the silver ion reduction in silver nitrate solution into argent.
Further, in other embodiments of the invention, reaction solution can also be preferably it is main by silver nitrate, ammoniacal liquor and
Reducing agent is constituted；The reducing agent is the composition of NaOH and sodium thiosulfate.In the present embodiment, hydroxide in reaction solution
The mass ratio of sodium, silver nitrate, sodium thiosulfate, ammoniacal liquor and reducing agent is 2~4：1：0.25~1：1~5：0.5~1, it is preferred that
The mass ratio of NaOH, silver nitrate, sodium thiosulfate, ammoniacal liquor and reducing agent is 2~3：1：0.5~1:1.5~4：0.7~
0.8.In the present embodiment, gone beyond the scope when NaOH quality and during less than value range, can all reduce the reproducibility of reducing agent, from
And reduce the also commercial weight of argent in silver nitrate solution.When the amount of sodium thiosulfate is too low, it is impossible to which complete carrying out is fixed, make
The argent that part separates out cannot be firmly adhered to surface of insulating layer, when the amount of sodium thiosulfate is too high, be reacted
The acid-base balance that can destroy in solution of sodium thiosulfate so as to influence the reduction of reducing agent.In the present embodiment, work as ammoniacal liquor
During beyond highest scope, ionization equilibrium in the silver nitrate solution can be made to be moved to back reaction direction, it is suppressed that ionization, in making solution
Concentration of silver ions accordingly reduces, same because reaction not exclusively reduces the effect of silver mirror reaction when ammoniacal liquor is less than minimum zone,
So as to influence the film-formation result of conductive film layer.
In the present embodiment, differential arc oxidation before processing is also selectable to be pre-processed being carried out to magnesium and its alloy, pre- place
The step of reason, includes：
The oxide skin on demagging and its surface of alloy substrate 100 is gone by way of polishing.
The mode of the polishing in the present embodiment may include that manual grinding and machine are polished, can be according to magnesium and its alloy-based
The size of body 100 come select polishing mode.When magnesium and its larger volume of alloy substrate 100, can by machine by magnesium and
The actual conditions of its alloy substrate 100 carry out setting polishing thickness and are polished, when magnesium and its small volume of alloy substrate 100
When, by manually being polished using 80#~2000# sand paper.By polishing the oxide skin of magnesium and its surface of alloy substrate 100
Be removed, make magnesium and its surface of alloy substrate 100 smooth and smooth, enable insulating barrier 110 it is complete be attached to magnesium and its
The surface of alloy substrate 100, realizes complete laminating between magnesium and its alloy substrate 100.
Below in conjunction with to be embodiment make to high-temperature-resistant antistatic material of the invention and preparation method thereof it is further in detail
Description.
Embodiment 1
A kind of plated film magnesium alloy, including insulating barrier, magnesium alloy substrate and conductive film layer.Insulating barrier is attached to magnesium alloy base
Body surface face, conductive film layer is attached to porous ceramics surface of insulating layer, is formed by insulating barrier between magnesium alloy substrate and conductive film layer
Electric isolution.Wherein, insulating barrier is that the ceramic material with loose structure is formed, and the thickness of many insulating barriers is 3 μm.It is conductive
The material of film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 80# sand paper, its surface scale is come off, surface is smooth.
Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.1g/L NaOH, 5g/L
Na2SiO3, 5g/L NaF compositions, and electrolyte floods magnesium alloy substrate 10cm, and decomposition voltage is 250V, and current density is
0.5A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 1min.By 0.4L NaOH, 0.2L
Silver nitrate, 0.08L sodium thiosulfate, 0.2L ammoniacal liquor, 0.06L glucose, the reactive spray of 0.06L glycerine composition are in porous exhausted
The surface of edge ceramic layer and heating, drying, ultimately form conductive film layer, obtain plated film magnesium alloy, and the concentration of wherein glucose is
5%.
Embodiment 2
A kind of plated film magnesium alloy, including the magnesium alloy substrate and conductive film layer of electric isolution are formed by porous ceramics insulating barrier,
Porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous ceramics
The thickness of insulating barrier is 15 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 500# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.5g/L NaOH, 8g/L
Na2SiO3, 8g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 350V, and current density is
0.8A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 5min.By 0.36L NaOH,
The reactive spray of 0.18L silver nitrates, 0.09L sodium thiosulfate, 0.27L ammoniacal liquor, 0.05L glucose and 0.05L glycerine composition
In the surface of porous insulating ceramic layer and heating, drying, conductive film layer is ultimately formed, obtain plated film magnesium alloy, wherein glucose
Concentration is 3.7%.
Embodiment 3
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 25 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 1000# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH, 10g/L
Na2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and current density is 7A/
dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.306L NaOH, 0.102L
Silver nitrate, 0.102L sodium thiosulfate, 0.408L ammoniacal liquor, 0.036L glucose and 0.036L glycerine composition reactive spray in
The surface of porous insulating ceramic layer and heating, drying, ultimately form conductive film layer, obtain plated film magnesium alloy, and wherein glucose is dense
Spend is 3.5%.
Embodiment 4
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 30 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 2000# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH, 10g/L
Na2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and current density is 7A/
dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.335L NaOH, 0.085L
The reactive spray of silver nitrate, 0.085L sodium thiosulfate, 0.42L ammoniacal liquor, 0.0425L glucose and 0.0425L glycerine composition
In the surface of porous insulating ceramic layer and heating, drying, conductive film layer is ultimately formed, obtain plated film magnesium alloy.
Embodiment 5
A kind of plated film magnesium alloy, including the magnesium alloy substrate and conductive film layer of electric isolution are formed by porous ceramics insulating barrier,
Porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous ceramics
The thickness of insulating barrier is 3 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 80# sand paper, its surface scale is come off, surface is smooth.
Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.1g/L NaOH, 5g/L
Na2SiO3, 5g/L NaF compositions, and electrolyte floods magnesium alloy substrate 10cm, and decomposition voltage is 250V, and current density is
0.5A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 1min.By 0.4L NaOH, 0.2L
Silver nitrate, 0.08L sodium thiosulfate, 0.2L ammoniacal liquor, 0.03L glucose, 0.03L triethanolamines and 0.06L glycerine composition
Reactive spray ultimately forms conductive film layer in the surface of porous insulating ceramic layer and heating, drying, obtains plated film magnesium alloy, wherein
The concentration of glucose is 5%.
Embodiment 6
A kind of plated film magnesium alloy, including the magnesium alloy substrate and conductive film layer of electric isolution are formed by porous ceramics insulating barrier,
Porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous ceramics
The thickness of insulating barrier is 15 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 500# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.5g/L NaOH, 8g/L
Na2SiO3, 8g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 350V, and current density is
0.8A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 5min.By 0.36L NaOH,
0.18L silver nitrates, 0.09L sodium thiosulfate, 0.27L ammoniacal liquor, 0.025L glucose, 0.025L triethanolamines and 0.05L the third three
The reactive spray of alcohol composition ultimately forms conductive film layer in the surface of porous insulating ceramic layer and heating, drying, obtains plated film magnesium
The concentration of alloy, wherein glucose is 3.7%.
Embodiment 7
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 25 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
The magnesium alloy panel of unit area is taken, it is polished by 1000# sand paper, its surface scale is come off,
Surface is smooth.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH,
The Na of 10g/L2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and electric current is close
It is 7A/dm to spend2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.306L hydroxides
Sodium, 0.102L silver nitrates, 0.102L sodium thiosulfate, 0.408L ammoniacal liquor, 0.018L glucose, 0.018L triethanolamines and
The reactive spray of 0.036L glycerine composition ultimately forms conductive film layer in the surface of porous insulating ceramic layer and heating, drying,
Plated film magnesium alloy is obtained, the wherein concentration of glucose is 3.5%.
Embodiment 8
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 30 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 2000# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH, 10g/L
Na2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and current density is 7A/
dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.335L NaOH, 0.085L
Silver nitrate, 0.085L sodium thiosulfate, 0.42L ammoniacal liquor, 0.02125L glucose, 0.2125L triethanolamines and 0.0425L the third three
The reactive spray of alcohol composition ultimately forms conductive film layer in the surface of porous insulating ceramic layer and heating, drying, obtains plated film magnesium
Alloy.
Embodiment 9
A kind of plated film magnesium alloy, including the magnesium alloy substrate and conductive film layer of electric isolution are formed by porous ceramics insulating barrier,
Porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous ceramics
The thickness of insulating barrier is 3 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 80# sand paper, its surface scale is come off, surface is smooth.
Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.1g/L NaOH, 5g/L
Na2SiO3, 5g/L NaF compositions, and electrolyte floods magnesium alloy substrate 10cm, and decomposition voltage is 250V, and current density is
0.5A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 1min.By 0.4L NaOH, 0.2L
Silver nitrate, 0.08L sodium thiosulfate, 0.2L ammoniacal liquor, 0.045L tartrates, the reactive spray of 0.075L glycerine composition are in more
The surface of hole dielectric ceramic layer and heating, drying, ultimately form conductive film layer, obtain plated film magnesium alloy.
Embodiment 10
A kind of plated film magnesium alloy, including the magnesium alloy substrate and conductive film layer of electric isolution are formed by porous ceramics insulating barrier,
Porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous ceramics
The thickness of insulating barrier is 15 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 500# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 0.5g/L NaOH, 8g/L
Na2SiO3, 8g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 350V, and current density is
0.8A/dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 5min.By 0.36L NaOH,
The reaction of 0.18L silver nitrates, 0.09L sodium thiosulfate, 0.27L ammoniacal liquor, 0.035L tartrates and 0.065L glycerine composition
Surface and the heating, drying of porous insulating ceramic layer are sprayed at, conductive film layer is ultimately formed, plated film magnesium alloy is obtained.
Embodiment 11
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 25 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 1000# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH, 10g/L
Na2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and current density is 7A/
dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.306L NaOH, 0.102L
The reactive spray of silver nitrate, 0.102L sodium thiosulfate, 0.408L ammoniacal liquor, 0.021L tartrates and 0.051L glycerine composition
In the surface of porous insulating ceramic layer and heating, drying, conductive film layer is ultimately formed, obtain plated film magnesium alloy.
Embodiment 12
A kind of plated film magnesium and its alloy, including the magnesium alloy substrate and conducting film of electric isolution are formed by porous ceramics insulating barrier
Layer, porous ceramics insulating barrier is attached to magnesium alloy matrix surface, and conductive film layer is attached to porous ceramics surface of insulating layer, porous pottery
The thickness of porcelain insulating layer is 30 μm, and the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium alloy, comprises the following steps：
Magnesium alloy panel is taken, it is polished by 2000# sand paper, its surface scale is come off, surface is smooth flat
It is whole.Be electrolysed being positioned in electrolytic cell through the magnesium alloy panel after polishing, electrolyte by 7g/L NaOH, 10g/L
Na2SiO3, 10g/L NaF compositions, and electrolyte floods magnesium alloy substrate 12cm, and decomposition voltage is 500V, and current density is 7A/
dm2, porous insulating ceramic layer is formed in magnesium alloy matrix surface by the treatment of 15min.By 0.335L NaOH, 0.085L
Silver nitrate, 0.085L sodium thiosulfate, 0.42L ammoniacal liquor, 0.04L tartrates and 0.045L glycerine composition reactive spray in
The surface of porous insulating ceramic layer and heating, drying, ultimately form conductive film layer, obtain plated film magnesium alloy.
Embodiment 13
A kind of plated film magnesium plate, including the magnesium plate and conductive film layer of electric isolution, porous ceramics are formed by porous ceramics insulating barrier
Insulating barrier is attached to magnesium plate surface, and conductive film layer is attached to porous ceramics surface of insulating layer, and the thickness of porous ceramics insulating barrier is
30 μm, the material of conductive film layer is silver.
The preparation method of above-mentioned plated film magnesium plate, comprises the following steps：
Magnesium plate is taken, it is polished by 2000# sand paper, its surface scale is come off, surface is smooth.Will be through
Magnesium plate after polishing is positioned in electrolytic cell and is electrolysed, electrolyte by 7g/L NaOH, 10g/L Na2SiO3, 10g/L
NaF is constituted, and electrolyte floods magnesium plate 12cm, and decomposition voltage is 500V, and current density is 7A/dm2, by the treatment of 15min
Porous insulating ceramic layer is formed in magnesium alloy matrix surface.By 0.335L NaOH, 0.085L silver nitrates, the thio sulphur of 0.085L
The reactive spray of sour sodium, 0.42L ammoniacal liquor, 0.04L tartrates and 0.045L glycerine composition is in the table of porous insulating ceramic layer
Face and heating, drying, ultimately form conductive film layer, obtain plated film magnesium plate.
Comparative example 1
The uncoated magnesium alloy substrate (CS-01) with same size, and the embodiment of the present invention 1 to 13 are carried respectively
The plated film magnesium and its alloy of confession carry out corrosion resistance test, and experimental result is shown in Table 1.In this contrast test, CS-01 with
Embodiment 1~13 is tested under identical environment according to identical method of testing, and uncoated magnesium alloy substrate rule
Lattice are 100cm × 100cm × 20cm.
In this contrast test, corrosion resistance test is tested by potentiodynamic polarization and salt spray test is measured, and moves electricity
Pole polarization test is measured by dynamic scan test system, and the dynamic scan test system in this comparative example is by constant potential
Instrument, signal generator, recorder etc. are constituted.Salt spray test is tested according to GB/T6461-20022 standards.
Table 1
It can be seen from table 1, by the magnesium alloy substrate and magnesium plate after plated film in corrosion electric current density and corrosion coverage number
According to upper all than having obvious reduction without the magnesium alloy substrate of coating film treatment, illustrate by the magnesium alloy base after coating film treatment
Body and magnesium plate are while ensure that good conductance or rate of corrosion has obtained significantly reducing, and realize magnesium alloy base
The lifting of the corrosion resistance of body and magnesium plate.
Although illustrate and describing the present invention with specific embodiment, but will be appreciated that without departing substantially from of the invention
Many other changes and modification can be made in the case of spirit and scope.It is, therefore, intended that in the following claims
Including belonging to all such changes and modifications in the scope of the invention.
Claims (10)
1. a kind of plated film magnesium and its alloy, it is characterised in that including formed by insulating barrier electric isolution magnesium and its alloy substrate and
Conductive film layer, the insulating barrier is attached to the magnesium and its alloy substrate surface, and the conductive film layer is attached to the insulating barrier
Surface.
2. plated film magnesium according to claim 1 and its alloy, it is characterised in that the material of the insulating barrier is ceramics.
3. plated film magnesium according to claim 1 and 2 and its alloy, it is characterised in that the material of the conductive film layer is main
It is one or more in silver, copper, nickel.
4. the preparation method of plated film magnesium and its alloy described in a kind of claims 1 to 3 any one, it is characterised in that including：
The magnesium and its alloy substrate surface form insulating barrier, then form the conductive film layer in the surface of insulating layer.
5. the preparation method of plated film magnesium according to claim 4 and its alloy, it is characterised in that the insulating barrier is ceramics
Oxide-film, be in the method for the magnesium and its alloy substrate surface formation ceramic alumina film layer：To the magnesium and its alloy substrate
Carry out differential arc oxidation.
6. the preparation method of plated film magnesium according to claim 5 and its alloy, it is characterised in that to the magnesium and its alloy
The method that matrix carries out differential arc oxidation treatment includes：Electrolysis treatment, institute are carried out to the magnesium and its alloy substrate by electrolyte
State NaOH, the Na2SiO3 of 5~15g/L, the NaF of 5~15g/L that electrolyte contains 0.1~10g/L.
7. the preparation method of plated film magnesium according to claim 6 and its alloy, it is characterised in that the electricity of the electrolysis treatment
It is 250~600V to press, current density 0.5-10A/dm2, process time 1-20min.
8. the preparation method of plated film magnesium according to claim 5 and its alloy, it is characterised in that in the conductive film layer
Material is mainly silver, and the method that the surface of insulating layer forms the conductive film layer includes：Reaction solution is scattered in the insulation
Layer surface, and heating response makes silver ion reduction be silver-colored simple substance, the reaction solution is main by silver nitrate, ammoniacal liquor, reducing agent, hydrogen-oxygen
Change sodium and sodium thiosulfate composition.
9. the preparation method of plated film magnesium according to claim 8 and its alloy, it is characterised in that the reducing agent is the third three
Alcohol and selected from any in glucose, tartrate, hydrazine sulfate, glyoxal, sodium borohydride, dimethyamine borane and triethanolamine
A kind of composition of composition.
10. the preparation method of plated film magnesium according to claim 4 and its alloy, it is characterised in that in the magnesium and its conjunction
Golden matrix surface also includes carrying out pre-treatment before forming insulating barrier；The pre-treatment is included to the magnesium and its alloy-based body surface
Polished in face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710091725.XA CN106884195B (en) | 2017-02-20 | 2017-02-20 | A kind of plated film magnesium and its alloy and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710091725.XA CN106884195B (en) | 2017-02-20 | 2017-02-20 | A kind of plated film magnesium and its alloy and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106884195A true CN106884195A (en) | 2017-06-23 |
| CN106884195B CN106884195B (en) | 2019-08-02 |
Family
ID=59180645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710091725.XA Active CN106884195B (en) | 2017-02-20 | 2017-02-20 | A kind of plated film magnesium and its alloy and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106884195B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108441922A (en) * | 2018-03-29 | 2018-08-24 | 山西银光华盛镁业股份有限公司 | A kind of magnesium alloy hub process of surface treatment |
| CN110714219A (en) * | 2019-11-04 | 2020-01-21 | 吉林大学 | Method for electroplating nickel on magnesium alloy micro-arc oxidation surface |
| CN112064037A (en) * | 2020-10-13 | 2020-12-11 | 贵州电网有限责任公司 | Preparation method of corrosion-resistant magnesium alloy sacrificial anode |
| CN113463160A (en) * | 2021-07-02 | 2021-10-01 | 索罗曼(常州)合金新材料有限公司 | Method for realizing titanium alloy wear-resistant coating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101760733A (en) * | 2010-01-28 | 2010-06-30 | 西安理工大学 | Magnesium alloy chemical nickel-plating surface treatment method taking microarc oxidation process as pretreatment |
| CN102181859A (en) * | 2011-03-29 | 2011-09-14 | 桂林电子科技大学 | Light metal and silver-base-loaded composite antibacterial layer and preparation method thereof |
| CN104120415A (en) * | 2014-07-09 | 2014-10-29 | 陈徐丰 | Mirror-surface nanometer spraying solution and spraying method |
| CN105543920A (en) * | 2015-12-10 | 2016-05-04 | 嘉瑞科技（惠州）有限公司 | Treatment method for preparing electric conducting coating layer on surface of magnesium alloy micro-arc oxidation layer |
| CN105803457A (en) * | 2014-12-30 | 2016-07-27 | 宁波瑞隆表面技术有限公司 | Preparation method of magnesium alloy surface micro-arc oxidation and chemical copper plating composite coating |
-
2017
- 2017-02-20 CN CN201710091725.XA patent/CN106884195B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101760733A (en) * | 2010-01-28 | 2010-06-30 | 西安理工大学 | Magnesium alloy chemical nickel-plating surface treatment method taking microarc oxidation process as pretreatment |
| CN102181859A (en) * | 2011-03-29 | 2011-09-14 | 桂林电子科技大学 | Light metal and silver-base-loaded composite antibacterial layer and preparation method thereof |
| CN104120415A (en) * | 2014-07-09 | 2014-10-29 | 陈徐丰 | Mirror-surface nanometer spraying solution and spraying method |
| CN105803457A (en) * | 2014-12-30 | 2016-07-27 | 宁波瑞隆表面技术有限公司 | Preparation method of magnesium alloy surface micro-arc oxidation and chemical copper plating composite coating |
| CN105543920A (en) * | 2015-12-10 | 2016-05-04 | 嘉瑞科技（惠州）有限公司 | Treatment method for preparing electric conducting coating layer on surface of magnesium alloy micro-arc oxidation layer |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108441922A (en) * | 2018-03-29 | 2018-08-24 | 山西银光华盛镁业股份有限公司 | A kind of magnesium alloy hub process of surface treatment |
| CN108441922B (en) * | 2018-03-29 | 2020-12-11 | 山西银光华盛镁业股份有限公司 | Magnesium alloy hub surface treatment process |
| CN110714219A (en) * | 2019-11-04 | 2020-01-21 | 吉林大学 | Method for electroplating nickel on magnesium alloy micro-arc oxidation surface |
| CN112064037A (en) * | 2020-10-13 | 2020-12-11 | 贵州电网有限责任公司 | Preparation method of corrosion-resistant magnesium alloy sacrificial anode |
| CN113463160A (en) * | 2021-07-02 | 2021-10-01 | 索罗曼(常州)合金新材料有限公司 | Method for realizing titanium alloy wear-resistant coating |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106884195B (en) | 2019-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106884195B (en) | A kind of plated film magnesium and its alloy and preparation method thereof | |
| EP2902514A1 (en) | Metallic porous body, and method for producing same | |
| EP3012893B1 (en) | Porous metal body and method for producing same | |
| JPS59500869A (en) | Metallizing solutions and methods | |
| KR20170130618A (en) | Highly corrosion-resistant porous metal body and method for producing the same | |
| CN103242063B (en) | Preparation method of piezoelectric ceramic surface electrode | |
| TW200901539A (en) | Process for the preparation of electrodes for use in a fuel cell | |
| Larson et al. | Recent trends in metal alloy electrolytic and electroless plating research: a review | |
| CN110607540A (en) | Zinc-nickel-micro-nano ceramic composite film layer and its preparation method under low current density | |
| CN105839153B (en) | The preparation method of Mg alloy surface high conductivity high IR emissivity film layer | |
| CN106591897A (en) | Cyanide-free ionic-liquid copper-plating solution and copper plating process | |
| CN103741148B (en) | A kind of honeycomb fiber glass epoxy antenna metal metallization processes | |
| WO2025021208A1 (en) | Nickel-copper-nickel corrosion-resistant composite layer and aluminum terminal | |
| Wu et al. | Ultralow Pt-loading bimetallic nanoflowers: fabrication and sensing applications | |
| WO2025021207A1 (en) | Multifunctional composite layer and aluminum terminal | |
| WO2025021202A1 (en) | Corrosion-resistant and thermal-shock-resistant composite layer based on tin layer, corrosion-resistant and thermal-shock-resistant treatment method for aluminum substrate, and aluminum terminal | |
| Hu et al. | Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating | |
| CN107681268A (en) | A kind of antenna structure, preparation method and mobile terminal | |
| Shao et al. | Preparation and performance of electroless nickel on AZ91D magnesium alloy | |
| KR20100033625A (en) | Manufacturing process of high conductive glass fibers by ni electroless plating | |
| CN106835235B (en) | A kind of dissimilar metal connector and its processing method | |
| Babu et al. | Electroless Ni–P coated on graphite as catalyst for the electro-oxidation of dextrose in alkali solution | |
| JPH02500602A (en) | Method for depositing composite oxide-nickel coating on metal substrate and oxide-nickel electrode | |
| Ling et al. | Mesoporous nickel electrodes plated with gold for the detection of glucose | |
| CN100562603C (en) | A kind of iron-boron alloy electroless plating solution and its iron-boron alloy coating material and preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |