CN106764532A - A kind of LED core support and its manufacture method - Google Patents
A kind of LED core support and its manufacture method Download PDFInfo
- Publication number
- CN106764532A CN106764532A CN201710078406.5A CN201710078406A CN106764532A CN 106764532 A CN106764532 A CN 106764532A CN 201710078406 A CN201710078406 A CN 201710078406A CN 106764532 A CN106764532 A CN 106764532A
- Authority
- CN
- China
- Prior art keywords
- led lamp
- led
- parts
- core support
- lamp panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention relates to a kind of LED core support, LED lamp panel including center bearing bracket and centrally disposed support, LED lamp panel includes main part and coupling part, main part is used to install light source, coupling part includes first end and the second end, first end is embedded in center bearing bracket and is integrally formed with center bearing bracket, and the second end links together with main part.This kind of LED lamp is stereochemical structure, and effective area of dissipation is big so that the amount of required radiating is less in unit area, and inside configuration is divulged information, and is conducive to distributing for heat energy.In addition, LED lamp panel is directly embedded into center bearing bracket, be conducive to the conduction of heat energy, be easy to distributing for heat energy, can effectively extend the service life of LED;And this kind of LED lamp branch is three-dimensional light source, illumination range is wide.Method present invention also offers above-mentioned LED core support is manufactured, the method can efficiently produce this kind of LED core support.
Description
Technical field
The invention belongs to LED field, it is related to the heat dissipation design of LED, more particularly to a kind of LED core support and its manufacturer
Method.
Background technology
LED is a kind of New Solid light source, and since the advent of the world has been a great concern.Its luminescence mechanism is by PN junction
In electronics can band-to-band transition produce luminous energy.In the presence of external electric field, there is electroluminescent work in electronics with the radiation recombination in hole
With the energy of a part is converted into luminous energy, and its complementary energy is converted into heat energy by the concussion of the lattice of radiationless compound generation.At present
The luminous efficiency of LED is only 20%-30%, therefore most of energy of LED can all be converted into heat energy, substantial amounts of heat energy need and
When distribute, will otherwise shorten the service life of LED.So, while LED is fast-developing, people also constantly enter
Go the research of LED heat dissipation technologys.
In existing LED lamp, light emitting host is LED lamp, and LED lamp includes wick supporting rack and installed in wick supporting rack
On light source, i.e. LED lamp bead or LED chip;Wick supporting rack is provided with circuit, the circuit on light source connection wick supporting rack.
In existing LED lamp, made using the pcb board (printed circuit board printed circuit board (PCB)s) of monoblock more
It is wick supporting rack, after light source is installed on pcb board, pcb board is directly installed in LED lamp by screw.In this kind of LED lamp
In, the heat produced by light source is largely transferred on pcb board, and radiating is responsible for by pcb board.And when the quantity of light source is more,
The distribution of light sources that limited surface area can not be met in radiating requirements, and pcb board on pcb board is intensive, and ventilation effect is not good,
Also radiating can be influenceed, shortens the service life of LED.Therefore, regarding to the issue above, it is necessary to design a kind of new structure
LED core support.
The content of the invention
It is an object of the invention to provide the manufacture of the LED core support and kind LED core support of a kind of good heat dissipation effect
Method.
One of to achieve these goals, the present invention is achieved by the following technical solutions:
A kind of LED core support of the invention, including column center bearing bracket and be uniformly distributed around the center bearing bracket
Multiple LED lamp panels, the LED lamp panel includes substrate and the LED chip and circuit that are arranged on substrate, and the substrate includes length
The main part of strip and the coupling part of strip, the coupling part constitutes the structure of " y " shape with the main part;Institute
Main part is stated for installing the LED chip;The coupling part includes first end and the second end, the first end
For the LED lamp panel to be fixed on into the center bearing bracket, the second end is connected in the main part
Portion.
Further, the tow sides of the substrate are mounted on LED chip, are offered on the substrate through positive and negative two
At least one through hole in face, the circuit on the substrate tow sides is connected with each other by the through hole.
Further, the coupling part of the LED lamp panel is substantially vertical with the central axis of the center bearing bracket, described
The tow sides of the substrate of LED lamp panel are symmetrical relative to the central axis of the center bearing bracket.
Further, the center bearing bracket is composite ceramics injection molding body, the first end of the coupling part of the LED lamp panel
The insertion composite ceramics injection molding body.
Further, the bottom of the composite ceramics injection molding body is provided with connection terminal, a part for the connection terminal
The insertion composite ceramics injection molding body, another part stretch out the composite ceramics injection molding body, the composite ceramics injection molding body it is interior
Portion is provided with wire, and described wire one end is connected with the connection terminal, the other end is connected with the circuit in the LED lamp panel.
In order to achieve the above object two, the present invention is achieved by the following technical solutions:
The invention provides this kind of manufacture method of LED core support, comprise the following steps:Prepare injected plastics material;According to
The shape requirements of LED core support prepare mould, and fixed structure is set on mould, and the fixed structure is used to fix subsequently to be needed
The parts of the injection molding body are embedded in, the electrical connection to the electric components of the LED core support is completed, and wire is put
Enter within the mould;LED lamp panel by fixed structure is fixed on mould and the second end of LED lamp panel is stretched into mould
Die cavity;Injected plastics material is injected mould, the demoulding obtains integrally formed LED core support.
Further, the step 1) in injected plastics material be composite ceramic material, the composite ceramic material is by with lower section
Method is obtained:47-54 parts of composite ceramic, 43-49 parts of composite polymeric resin and 1-5 parts of tetraethyl orthosilicate are added, stirring is obtained
Ceramic material A;The composite ceramic is mixed by 47-53 parts of aluminium oxide ceramics powder and 47-53 parts of boron nitride ceramics powder;Institute
Composite polymeric resin is stated to be mixed by 97-99 parts of E03 types epoxy resin and 1-3 parts of mellophanic acid acid anhydride;Add described in 81-85 parts
Ceramic material A, 13-18 part low density polyethylene (LDPE) and 1-2 parts of oxalic acid, stirring obtain the composite ceramic material.
Further, the step 4) in, the preset temperature of injecting machine material tube is set to 130-150 DEG C before injection;
The composite ceramic material is injected mould by injection machine under 80-110MPa pressure;After injecting the composite ceramic material, mould
Tool is cooled to the demoulding after room temperature pressurize 1-3 minutes under 30-50MPa pressure.
Further, in the step 4) step is added afterwards:5) to the demoulding after ceramic blank carry out ungrease treatment;6) it is right
Ceramic blank is sintered, and the temperature of sintering is 170-190 DEG C, and sintering time is 15-20 minutes.
Further, the step 5) in, using aqueous extraction debinding, the ratio setting of ceramic blank and ionized water is 1:
65-1:Between 70, aqueous extraction debinding temperature setting is 50-80 DEG C, and the aqueous extraction debinding time is 10-20 minutes;Described
Step 5) and step 6) between add step:Impregnation process is carried out to ceramic blank, dip time is 18-23 minutes;Maceration extract
Include following composition by weight:43 parts of ceramic powders, 43 parts of polymer resins and 14 parts of polyethylene solvents.
The beneficial effects of the present invention are:
The LED core support that the present invention is provided, it includes center bearing bracket and LED lamp panel, and center bearing bracket is obtained for injection,
LED lamp panel is fixed on mould before center bearing bracket injection, and a part for LED lamp panel is inserted the die cavity of mould, injection moulding
A part of LED lamp panel of the insertion die cavity is just directly embedded into and is fixed on center bearing bracket afterwards, and is in outside center bearing bracket
LED lamp panel is then used to install light source.This kind of LED lamp is stereochemical structure, and effective area of dissipation is big so that required in unit area
The amount of radiating is less, and inside configuration is divulged information, and is conducive to distributing for heat energy.In addition, LED lamp panel is directly embedded into center bearing bracket
In, be conducive to the conduction of heat energy, it is easy to distributing for heat energy, can effectively extend the service life of LED;And this kind of LED lamp branch is
Three-dimensional light source, illumination range is wide.
Method present invention also offers above-mentioned LED core support is manufactured, its technique for using integrated injection molding.Pass through
Fixed structure is set on injection mold, LED lamp panel is fixed on fixed structure before injection, and the type of mould is stretched into part
In chamber, and when being molded, injected plastics material will cover that part for stretching into die cavity of LED lamp panel, after the completion of injection, LED lamp panel
Just it is directly embedded into injection molding body, subsequent treatment is carried out afterwards and just can obtain integrally formed LED core support.Using this kind of side
Method in high volume can quickly produce LED core support, reduce the manufacturing cost of single led wick supporting rack, be adapted to popularization and application
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, together with embodiments of the present invention for explaining the present invention,
It is not construed as limiting the invention
The structural representation of Tu1Shi LEDs core support.
The internal wiring schematic diagram of Tu2Shi LEDs core support.
Fig. 3 is the structural representation of LED lamp panel.
Fig. 4 is the structural representation of another angle of LED lamp panel.
Fig. 5 is structural representation when LED lamp panel is obliquely installed relative to the axis of center bearing bracket.
Reference in accompanying drawing includes:
1 --- center bearing bracket;
2 --- LED lamp panel, 21 --- substrate, 22 --- circuit, 23 --- main part, 24 --- coupling part,
25 --- through hole;
3 --- connection terminal, 31 --- wires.
Specific embodiment
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that preferred reality described herein
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
A kind of LED core support of the invention, as shown in Figures 1 to 4, it includes the center bearing bracket 1 of column and in
The equally distributed multiple LED lamp panels 2 of cardiac skeleton 1.Each several part is explained in detail below to this kind of LED core support.
The structure of LED lamp panel
As shown in Figure 3 and Figure 4, LED lamp panel 2 includes substrate 21 and setting LED chip and circuit 22 on the base plate (21, base
Plate 21 includes the main part 23 of strip and the coupling part 24 of strip, and main part 23 is used to install LED chip, main body
The length direction per the multiple LED chips in one side along main part 23 of part 23 is arranged, it is preferable that be uniformly distributed.Even
Socket part point 24 includes first end and the second end, and first end is used to the substrate 21 install fixation, the second end and main body
The middle part of part 23 connection, the middle part of main part 23 here is not strictly limited at the midpoint of main part 23, but relatively
For two ends, in location roughly halfway up.From the point of view of the preferred embodiments of the present invention, main part 23 and coupling part 24
Link position can in the middle of main part 23, or to one of two ends deviate a segment distance.Coupling part 24 is relative
Certain angle is inclined in main part 23, coupling part 24 constitutes the structure of " y " shape with main part 23.Inclination is in order to more
Big degree land productivity light source, the scope for enabling light to cover is bigger.Inclined angle is the specific lighting angle according to light source
Depending on, as shown in Figure 1 to Figure 3, coupling part 24 is preferably 70-85 degree relative to the inclined angle of main part 23.
In the present embodiment, the tow sides of substrate 21 are provided with circuit and are provided with LED chip, are opened on substrate 21
At least one through hole 25 through tow sides is provided with, the circuit 22 on the tow sides of substrate 21 is connected with each other by through hole 25.
It is further preferred that the composite ceramic substrate that substrate 21 is structure as a whole, the positive circuit 22 of composite ceramic substrate is by logical
Hole 25 is connected with the circuit 22 of the reverse side of composite ceramic substrate, so that power supply can simultaneously drive composite ceramic substrate positive and negative
The LED chip on two sides lights.
The structure of center bearing bracket
In the present embodiment, center bearing bracket 1 can be the cylinder that cylinder, cone, prism, pyramid or middle part are heaved, but
It is not limited to above-mentioned shape.
In the present embodiment, as depicted in figs. 1 and 2, center bearing bracket 1 is composite ceramics injection molding body, the heat conduction of composite ceramics
Property and thermal diffusivity it is good, improve radiating efficiency, extend LED service lifes;And the good insulating of composite ceramic material, it is ensured that use
When security.Before injection, first prepare mould according to the shape requirements of LED core support, and fixed structure be set on mould,
The fixed structure is used to fix subsequently to be needed to be embedded in the parts of the injection molding body, and the fixed structure can be clip, for such as
LED lamp panel 2 and connection terminal 3 position as required and angle are clamped;Electric zero to LED core support is completed afterwards
The electrical connection of part, such as electrically connects connection terminal 3 and LED lamp panel 2 using wire, and put the wires within the mould;Most
It is molded again afterwards.So, after the completion of injection, LED lamp panel 2 and connection terminal 3 are just integrally formed in injection molding body, while wire is hidden
Within injection molding body.
The first end insertion center bearing bracket 1 of the coupling part 24 of LED lamp panel 2.This kind of LED core support is by being molded into
Type is obtained, and LED lamp panel 2 is fixed on mould before injection, and the first end of the coupling part 24 of LED lamp panel 2 is inserted mould
The die cavity of tool, the first end of the coupling part 24 of LED lamp panel 2 is just directly embedded into and is fixed on center bearing bracket 1 after injection moulding
On, the main part 23 for overhanging then installs light source.This kind of structure LED lamp core support, in tree-shaped, is stereochemical structure, is effectively dissipated
Hot area is big so that the amount of required radiating is less in unit area;And, its inner ventilation is good, is conducive to heat energy by fast speed belt
Walk;Further, LED lamp panel 2 is directly embedded into center bearing bracket 1, it is easy to the conduction of heat energy, is conducive to distributing for heat energy.
In the present embodiment, as depicted in figs. 1 and 2, the bottom of center bearing bracket 1 is provided with connection terminal 3, connection terminal 3
The embedded center bearing bracket 1 of a part, another part stretches out center bearing bracket 1, and center bearing bracket 1 is internally provided with wire 31, wire
31 one end are connected with connection terminal 3, and the other end is connected with the circuit 22 in LED lamp panel 2.The connection terminal 3 is embedded in center bearing bracket 1
Method it is consistent with the method that LED lamp panel 2 is fixed on center bearing bracket 1.In terms of the position setting of connection terminal 3, connection end
Son 3 is arranged on the surface of installation end and stretches out a part, i.e., the bottom surface of the centrally disposed support 1 in Fig. 1 and Fig. 2, because should
Bottom surface is the mounting surface of LED core support, so the connection terminal 3 can serve the function of dual-use material:Both electricity can be connected
Source can be inserted in hole as the positioning element of LED core support as conductive component again.In addition, connection terminal 3 can be also laid out
Into standard plug, for coordinating with standard jacks, the LED core support is set to turn into the standard component with quick connection.Preferably,
In order to not influence the outward appearance of LED core support, wire 31 is arranged within center bearing bracket 1, can be specifically molded in center bearing bracket 1
Preceding elder generation is arranged at wire 31 in the die cavity of mould, and wire 31 is just wrapped within center bearing bracket 1 after injection moulding, so
Wire 31 can be protected.Certainly, wire nor is it necessary that and be arranged in center bearing bracket 1, also can be in follow-up use again wire
It is connected to 22 layers of circuit.
The installation of LED lamp panel
The one of which mounting means of LED lamp panel 2 is as shown in Figure 1:The coupling part 24 of LED lamp panel 2 and center bearing bracket 1
Central axis is substantially vertical, and the tow sides of the substrate 21 of LED lamp panel 2 are symmetrical relative to the central axis of center bearing bracket 1.LED
Lamp plate 2 is provided with four pieces, and four pieces of main parts of LED lamp panel 2 23 limit a frusto-conical surface, and frusto-conical surface is from center bearing bracket 1
Bottom reduced to top because structure of the LED lamp panel 2 for " y " shape, when coupling part 24 and the center bearing bracket 1 of LED lamp panel 2
Central axis it is substantially vertical when, the main part 23 of LED lamp panel 2 will incline certain relative to the central axis of wick supporting rack
Angle, that is, define frusto-conical surface, depending on the inclined angle is the specific lighting angle according to LED chip, inclination be in order to
Light source is utilized to a greater degree, makes the arrangement of light source relative to datum level into a specific angle of inclination, its light is covered
The scope of lid is bigger, can not only cover 360 ° in horizontal direction, moreover it is possible to cover the Partial angle in vertical direction.
Another mounting means of LED lamp panel 2 is as shown in Figure 5:In the coupling part 24 of LED lamp panel 2 and center bearing bracket 1
Heart axis is substantially vertical, and the plane of symmetry of the tow sides of the substrate 21 of LED lamp panel 2 is linear relative to the central shaft of center bearing bracket 1
Be not more than 10 degree of angle ∠ 1 into one, i.e. the front or back of LED lamp panel 2 has simultaneously somewhat upwardly, and another side slightly offset towards
Under, so also reach the purpose of the Partial angle for allowing light to cover in vertical direction.LED lamp panel 2 is provided with four pieces, four pieces
The main part 23 of LED lamp panel 2 limits a frusto-conical surface, and frusto-conical surface reduces from the bottom of center bearing bracket 1 to top.
The manufacture of LED core support
Embodiment 1
Present invention also offers a kind of method for manufacturing above-mentioned LED core support, following steps are specifically included:
1st, the injected plastics material for being molded is prepared.In the present invention, injected plastics material uses a kind of composite ceramic material, and this is answered
Ceramic material is closed to be prepared by the following method:50 parts of composite ceramics, 48 parts of composite polymeric resins, 2 parts of orthosilicic acid are used first
Tetra-ethyl ester, carries out high-speed stirred and is mixed to get ceramic material A;Composite ceramic therein is by 50 parts of aluminium oxide ceramics powder and 50 parts
Boron nitride ceramics powder is mixed;Composite polymeric resin therein is mixed by 98 parts of E03 types epoxy resin and 2 parts of mellophanic acid acid anhydrides
Form;83.5 parts of ceramic material A, 1.5 parts of oxalic acid, 15 parts of low density polyethylene (LDPE)s are used afterwards, carry out high-speed stirred mixing
Obtain this kind of composite ceramic material;It is last to store for convenience and transport, above-mentioned composite ceramic material is carried out in comminutor
Extruding pelletization, obtains granular composite ceramic material.Composite ceramic material obtained from being matched by this kind, it is adaptable to be molded,
And finished product radiating efficiency obtained in the material, up to 30-40W/MK, withstand voltage value >=4300V meets LED core support to material
The performance requirement of material;The composite ceramic material being mixed to get is stirred by above-mentioned order, good mixing effect, material is uniformly dispersed,
The quality of product can be improved.
2nd, the shape requirements according to LED core support prepare mould.Specifically, manufacture cylinder LED as shown in Figure 1
Core support, need to manufacture the mould that die cavity is cylindrical cavity, while the surrounding in the upper part of die cavity opens up four for placing
With the groove or fixed structure of fixed LED lamp panel, the side for LED lamp panel being fixed on before injection die cavity;Equally, need to also be
The lower surface of die cavity sets multiple for placing and the groove or fixed structure for being fixedly connected terminal.
3rd, LED lamp panel is fixed on the surrounding of the die cavity of mould and die cavity is stretched into part, connection terminal is fixed on mould
Die cavity lower surface and partly stretch into die cavity, and the circuit layer and connection terminal of LED lamp panel are connected with wire, wire is placed
Within die cavity.
4th, composite ceramic material is injected mould.Before injection, the preset temperature of injecting machine material tube is first set to 140 DEG C;
Composite ceramic material is injected mould by injection machine under 100MPa pressure;After injection composite ceramic material, mould is pressed in 40MPa
Pressurize 2 minutes under power, the demoulding obtains ceramic blank after being cooled to room temperature.
5th, ungrease treatment is carried out to ceramic blank.The present embodiment carries out degreasing to ceramic blank using water base extraction, ceramics
The ratio setting of blank and ionized water is 1:70, aqueous extraction debinding temperature setting is 65 DEG C, and the aqueous extraction debinding time is 15
Minute.Degreasing can guarantee that the qualification rate of the finished product after sintering.
6th, in order to improve sintering after finished product quality, this method ceramic blank sintering before be additionally added impregnation process.Dipping
Liquid includes following composition by weight:43 parts of ceramic powders, 43 parts of polymer resins and 14 parts of polyethylene solvents;Dip time is 20 points
Clock.
7th, finally ceramic blank is sintered.The temperature setting of sintering furnace is 180 DEG C, and sintering time is 17 minutes, is gone out
Stove cooling can obtain this kind of LED core support.
Due to being provided with wire in injection molding body, it is contemplated that expand with heat and contract with cold rate and the composite ceramic material of wire expand with heat and contract with cold
Rate is inconsistent, and need protection wire, therefore manufacture method of the invention in, the temperature to injecting machine material tube is needed before injection
It is controlled, reaches to the pre-warmed purpose of composite ceramic material, the sintering temperature and sintering time in sintering is also carried out control
System, makes the internal structure of the LED core support that sintering goes out more excellent.
Additionally, also can specifically be needed before injection first light-source encapsulation in LED using this kind of method manufacture LED lamp
On plate, and before follow-up aqueous extraction debinding, it is necessary on covering protective case to protect light source, it is necessary to take before last sintering
Re-sintered after lower protective case.
Embodiment 2
In the present embodiment, in addition to the preparation method of composite ceramic material, other aspects are with embodiment 1.In this reality
Apply in example, composite ceramic material is prepared by the following method:53 parts of composite ceramics, 45 parts of composite polymeric resins, 2 are used first
Part tetraethyl orthosilicate, carries out high-speed stirred and is mixed to get ceramic material A;Composite ceramic therein is by 47 parts of aluminium oxide ceramics
Powder and 53 parts of boron nitride ceramics powder are mixed;Composite polymeric resin therein is by 97 parts of E03 types epoxy resin and 3 parts of inclined benzene four
Acid anhydrides is mixed;85 parts of ceramic material A, 2 parts of oxalic acid, 13 parts of low density polyethylene (LDPE)s are used afterwards, carry out high-speed stirred mixing
This kind of composite ceramic material can be obtained.
Embodiment 3
In the present embodiment, in addition to the preparation method of composite ceramic material, other aspects are with embodiment 1.In this reality
Apply in example, composite ceramic material is prepared by the following method:47 parts of composite ceramics, 49 parts of composite polymeric resins, 4 are used first
Part tetraethyl orthosilicate, carries out high-speed stirred and is mixed to get ceramic material A;Composite ceramic therein is by 53 parts of aluminium oxide ceramics
Powder and 47 parts of boron nitride ceramics powder are mixed;Composite polymeric resin therein is by 99 parts of E03 types epoxy resin and 1 part of inclined benzene four
Acid anhydrides is mixed;81 parts of ceramic material A, 2 parts of oxalic acid, 17 parts of low density polyethylene (LDPE)s are used afterwards, carry out high-speed stirred mixing
This kind of composite ceramic material can be obtained.
Finally it should be noted that:Above-described each embodiment is merely to illustrate technical scheme, rather than to it
Limitation;Although being described in detail to the present invention with reference to the foregoing embodiments, it will be understood by those within the art that:
It can still modify to the technical scheme described in previous embodiment, or which part or all technical characteristic are entered
Row equivalent;And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technical side
The scope of case.
Claims (10)
1. a kind of LED core support, it is characterised in that center bearing bracket including column and be uniformly distributed around the center bearing bracket
Multiple LED lamp panels, the LED lamp panel includes substrate and the LED chip and circuit that are arranged on substrate, and the substrate includes length
The main part of strip and the coupling part of strip, the coupling part constitutes the structure of " y " shape with the main part;Institute
Main part is stated for installing the LED chip;The coupling part includes first end and the second end, the first end
For the LED lamp panel to be fixed on into the center bearing bracket, the second end is connected in the main part
Portion.
2. LED core support according to claim 1, it is characterised in that the tow sides of the substrate are mounted on LED
Chip, offers at least one through hole through tow sides on the substrate, the circuit on the substrate tow sides passes through
The through hole is connected with each other.
3. LED core support according to claim 1, it is characterised in that the coupling part of the LED lamp panel with it is described in
The central axis of cardiac skeleton is substantially vertical, the center of the tow sides relative to the center bearing bracket of the substrate of the LED lamp panel
Axisymmetrical.
4. LED core support according to claim 1, it is characterised in that the center bearing bracket is composite ceramics injection molding body,
The first end of the coupling part of the LED lamp panel is embedded in the composite ceramics injection molding body.
5. LED core support according to claim 4, it is characterised in that the bottom of the composite ceramics injection molding body is set
There is connection terminal, a part for the connection terminal is embedded in the composite ceramics injection molding body, another part and stretches out the composite ceramic
Porcelain injection molding body, the composite ceramics injection molding body is internally provided with wire, and described wire one end is connected with the connection terminal, separately
One end is connected with the circuit in the LED lamp panel.
6. the method for the LED core support in a kind of manufacturing claims 1-5 described in any one, it is characterised in that including with
Lower step:
1) injected plastics material is prepared;
2) shape requirements according to LED core support prepare mould, and fixed structure is set on mould, and the fixed structure is used for
It is fixed subsequently to need to be embedded in the parts of the injection molding body, the electrical connection to the electric components of the LED core support is completed,
And put the wires within the mould;
3) LED lamp panel by fixed structure is fixed on mould and the second end of LED lamp panel is stretched into the die cavity of mould;
4) injected plastics material is injected mould, the demoulding obtains integrally formed LED core support.
7. manufacture method according to claim 6, it is characterised in that the step 1) in injected plastics material be composite ceramics
Material, the composite ceramic material is obtained by following methods:
A) 47-54 parts of composite ceramic, 43-49 parts of composite polymeric resin and 1-5 parts of tetraethyl orthosilicate are added, stirring is made pottery
Ceramic material A;The composite ceramic is mixed by 47-53 parts of aluminium oxide ceramics powder and 47-53 parts of boron nitride ceramics powder;It is described
Composite polymeric resin is mixed by 97-99 parts of E03 types epoxy resin and 1-3 parts of mellophanic acid acid anhydride;
B) 81-85 parts of ceramic material A, 13-18 part of low density polyethylene (LDPE) and 1-2 parts of oxalic acid are added, stirring obtains described multiple
Close ceramic material.
8. manufacture method according to claim 7, it is characterised in that the step 4) in, injection machine material before injection
The preset temperature of cylinder is set to 130-150 DEG C;The composite ceramic material is injected mould by injection machine under 80-110MPa pressure
Tool;After injecting the composite ceramic material, mould is cooled to the demoulding after room temperature pressurize 1-3 minutes under 30-50MPa pressure.
9. manufacture method according to claim 7, it is characterised in that in the step 4) step 5 is added afterwards) and 6):
5) to the demoulding after ceramic blank carry out ungrease treatment;
6) ceramic blank is sintered, the temperature of sintering is 170-190 DEG C, and sintering time is 15-20 minutes.
10. manufacture method according to claim 9, it is characterised in that the step 5) in, using aqueous extraction debinding,
The ratio setting of ceramic blank and ionized water is 1:65-1:Between 70, aqueous extraction debinding temperature setting is 50-80 DEG C, water base
Extraction degreasing time is 10-20 minutes;In the step 5) and step 6) between add step:Ceramic blank is carried out at dipping
Reason, dip time is 18-23 minutes;Maceration extract includes following composition by weight:43 parts of ceramic powders, 43 parts of polymer resins and 14
Part polyethylene solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710078406.5A CN106764532A (en) | 2017-02-14 | 2017-02-14 | A kind of LED core support and its manufacture method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710078406.5A CN106764532A (en) | 2017-02-14 | 2017-02-14 | A kind of LED core support and its manufacture method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106764532A true CN106764532A (en) | 2017-05-31 |
Family
ID=58956084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710078406.5A Pending CN106764532A (en) | 2017-02-14 | 2017-02-14 | A kind of LED core support and its manufacture method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106764532A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107816705A (en) * | 2017-11-29 | 2018-03-20 | 苏州晶品新材料股份有限公司 | A kind of LED illumination lamp |
CN112503406A (en) * | 2020-11-05 | 2021-03-16 | 深圳市乐事达灯饰有限公司 | Pin type LED lamp cap and manufacturing method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101968167A (en) * | 2010-05-10 | 2011-02-09 | 郑榕彬 | High-power LED illuminating lamp |
WO2011140720A1 (en) * | 2010-05-14 | 2011-11-17 | Qin Biao | Heat dissipation-optimized led lamp and light fitting thereof |
CN105987295A (en) * | 2015-02-05 | 2016-10-05 | 佛山市禾才科技服务有限公司 | Novel all-around light LED (Light Emitting Diode) lamp |
CN106195862A (en) * | 2016-08-31 | 2016-12-07 | 南宁燎旺车灯股份有限公司 | A kind of brand-new LED distance-light one headlamp projection lamp core |
CN206439655U (en) * | 2017-02-14 | 2017-08-25 | 广东昭信照明科技有限公司 | A kind of LED core support |
-
2017
- 2017-02-14 CN CN201710078406.5A patent/CN106764532A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101968167A (en) * | 2010-05-10 | 2011-02-09 | 郑榕彬 | High-power LED illuminating lamp |
WO2011140720A1 (en) * | 2010-05-14 | 2011-11-17 | Qin Biao | Heat dissipation-optimized led lamp and light fitting thereof |
CN105987295A (en) * | 2015-02-05 | 2016-10-05 | 佛山市禾才科技服务有限公司 | Novel all-around light LED (Light Emitting Diode) lamp |
CN106195862A (en) * | 2016-08-31 | 2016-12-07 | 南宁燎旺车灯股份有限公司 | A kind of brand-new LED distance-light one headlamp projection lamp core |
CN206439655U (en) * | 2017-02-14 | 2017-08-25 | 广东昭信照明科技有限公司 | A kind of LED core support |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107816705A (en) * | 2017-11-29 | 2018-03-20 | 苏州晶品新材料股份有限公司 | A kind of LED illumination lamp |
CN112503406A (en) * | 2020-11-05 | 2021-03-16 | 深圳市乐事达灯饰有限公司 | Pin type LED lamp cap and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102620154B (en) | LED lamp | |
CN102011952A (en) | Method for making LED (Light Emitting Diode) light resource module and product made by the method | |
CN101419962B (en) | LED, production method therefore and illuminator manufactured by the LED | |
CN102741607B (en) | Led light source lamp | |
CN103730565B (en) | A kind of method for packing of aluminium nitride COB LED light source | |
CN103791286A (en) | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source | |
US20100327303A1 (en) | Light-emitting diode lamp with uniform resin coating | |
CN101656290A (en) | Process for encapsulating light-emitting diode | |
CN106764532A (en) | A kind of LED core support and its manufacture method | |
CN101894765A (en) | Manufacturing method of LED device | |
CN103151434B (en) | A kind of method improving LED fluorescent material distributing homogeneity | |
CN205979632U (en) | Integrated LED lamp | |
CN107768366A (en) | A kind of COB encapsulation for filling Thermal protection IC and its method for packing | |
CN206439655U (en) | A kind of LED core support | |
CN105609496A (en) | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof | |
CN102891141A (en) | Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same | |
CN207394458U (en) | L ED lamp string, circuit board and tool for manufacturing the same | |
CN103296178A (en) | Light emitting diode assembly and packaging method thereof | |
US20150014733A1 (en) | Led lighting apparatus and method for fabricating wavelength conversion member for use in the same | |
CN202203704U (en) | Light emitting diode (LED) lamp group with fluorescent cover | |
CN202252967U (en) | Lighting device | |
CN102800664A (en) | LED (light-emitting diode) single lamp used for promoting plant growth and production process thereof | |
CN207542245U (en) | A kind of COB encapsulation for filling Thermal protection IC | |
CN203162616U (en) | Light emitting diode lamp source plate | |
CN205678450U (en) | Illumination light source and illuminator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20230516 |
|
AD01 | Patent right deemed abandoned |