CN106753135A - For the additive material formula of TG polyimide copper clad laminations high - Google Patents
For the additive material formula of TG polyimide copper clad laminations high Download PDFInfo
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- CN106753135A CN106753135A CN201611268681.5A CN201611268681A CN106753135A CN 106753135 A CN106753135 A CN 106753135A CN 201611268681 A CN201611268681 A CN 201611268681A CN 106753135 A CN106753135 A CN 106753135A
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- Prior art keywords
- parts
- hydroxide powder
- additive
- copper clad
- aluminium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of additive material formula for TG polyimide copper clad laminations high, by by additive by aluminium-hydroxide powder, dimethylformamide, magnesium hydroxide powder, polyvinylpyrrolidone, polyvinyl alcohol, calcium hydroxide powder and polyacrylamide are constituted, and by the additive of these species prepare in accordance with the appropriate ratio at high temperature melting stirring mix, the additive that will be obtained is applied in the middle of the production technology of polyimide copper clad lamination, compatibility of such additive when in use on the one hand with epoxy resin is fine, on the other hand compensate for the poor shortcoming of the toughness of phenolic cure, therefore product is fine in hot lower electrical property, the stability under its normal temperature can be improved.
Description
Technical field
The present invention relates to copper-clad plate production technical field, more particularly to a kind of addition for TG polyimide copper clad laminations high
Agent material is formulated.
Background technology
Also known as base material, it is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., is soaked with resin, and single or double covers for copper-clad plate
With Copper Foil, through a kind of board-like material of hot pressing, referred to as copper-clad laminate.It is the stock for being PCB, is often base
Material, when it is produced for multi-layer sheet, is also core plate.Copper-clad plate is divided into according to mechanical rigid：Rigid plate, flex plate；According to not
It is divided into insulating material structure：The copper-clad plate of organic resin class, metal-based copper-clad plate, ceramic base copper-clad plate；It is divided into according to thickness：Often
What straightedge and thin plate, wherein thickness were less than 0.5mm is thin plate；It is divided into according to reinforcing material：The copper-clad plate of glass cloth base, paper substrate cover copper
Plate, composite-based copper clad plate；It is divided into according to some properties：TG plates high, high dielectric property are done, uv blocking plate.Copper-clad plate is mainly used
In printed circuit board is made, for the manufacture such as various Military Electronic Equipments, communication equipment, computer, automotive electronics, household electrical appliance
Industry.With the development of global electronic information industry, to the demand rapid growth of copper-clad plate, the high-speed developing period is entered.
Deliver the patent of the two-layer method FCCL being coated directly onto with polyimide resin prepolymer on Copper Foil earliest, be
The Japanese disclosed clear 61-275325 that gone through in 1986；The patent of invention that relative PI resins are delivered earliest is clear 60-
243100（Go through disclosure for 1985）.Disclosed in July, 1993 is ratified in the patent of " Unexamined Patent 5-175634 ", Nippon Steel
The rubbing method 2L-FCCL manufacturing technology comparative maturities that side still waits five research and development people to propose cross in chemical company.Nippon Steel Corp is thus
The leading position in terms of 2L-FCCL is established.The disclosed patent numbers in this respect of chemical company of Nippon Steel approved, with
The patent of 2005~2006 years is most.In the R＆D process of application type two-layer method polyimide material, to be faced most
Important problem has：1st, PI thermal coefficient of expansions and Copper Foil difference are larger, need to solve the dimensionally stable of the two-layer FCCL of final gained
Property, especially curling problem；2nd, ensure there are enough adhesion strengths between polyimides and Copper Foil；3rd, using liquid crystalline polymer film
To improve the performance of FCCL.The preparation process of two-layer method polyimide material and corresponding flexibility coat copper plate, typically selects
The combination of suitable dianhydride and diamines is selected, synthesis of polyimides acid, is then coated on copper by polyamic acid under normal temperature or low temperature
On paper tinsel, the treatment of solvent and high temperature imidization is then carried out, while polyamic acid is converted into polyimides
Obtain two-layer flexibility coat copper plate.In order to further improve the heat resistance and dimensional stability of PI, add in synthesizing polyamides acid
It is a kind of effective means to enter filler.Current polyimide copper clad lamination is in process of production, it is necessary to first carry out glue, it is necessary to first will
Curing agent dissolves, and is subsequently adding additive after fully dissolving and being thoroughly mixed uniformly, allows glue to cure some hours,
Allow each component to have contact with each other enough, interpenetrate, colloid is reached a stability through a period of time.In glue mistake
, it is necessary to add additive in journey, the component of current additive is more single, and when polyimide copper clad lamination is made, heat is steady
It is qualitative poor, while electric conductivity is nor very well, further raising is needed with the compatibility of resin.
The content of the invention
The present invention is in order to overcome deficiency of the prior art, there is provided a kind of addition for TG polyimide copper clad laminations high
Agent material is formulated.
The present invention is to be achieved through the following technical solutions：
A kind of additive material formula for TG polyimide copper clad laminations high, described copper-clad plate includes adhesive layer, glass
Fiber cloth, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin
Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component
Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, described additive is by such as
The component of lower weight portion is made：Aluminium-hydroxide powder 10-20 parts, dimethylformamide 3-7 parts, magnesium hydroxide powder 2-5 parts, it is poly-
Vinylpyrrolidone 3-5 parts, polyvinyl alcohol 3-6 parts, 3-6 parts and polyacrylamide 4-8 parts of calcium hydroxide powder.
Further, described additive is made up of the component of following weight portion：10 parts of aluminium-hydroxide powder, dimethyl methyl
3 parts of acid amides, 2 parts of magnesium hydroxide powder, 3 parts of polyvinylpyrrolidone, 3 parts of polyvinyl alcohol, 3 parts of calcium hydroxide powder and polypropylene
4 parts of acid amides.
Further, described additive is made up of the component of following weight portion：20 parts of aluminium-hydroxide powder, dimethyl methyl
7 parts of acid amides, 5 parts of magnesium hydroxide powder, 5 parts of polyvinylpyrrolidone, 6 parts of polyvinyl alcohol, 6 parts of calcium hydroxide powder and polypropylene
8 parts of acid amides.
Further, described additive is made up of the component of following weight portion：15 parts of aluminium-hydroxide powder, dimethyl methyl
5 parts of acid amides, 4 parts of magnesium hydroxide powder, 4 parts of polyvinylpyrrolidone, 5 parts of polyvinyl alcohol, 5 parts of calcium hydroxide powder and polypropylene
6 parts of acid amides.
The chemical formula Al (OH) of aluminium hydroxide3, it is the hydroxide of aluminium.Aluminium hydroxide can generate salt and water with acid reaction
Salt and water can be generated with highly basic reaction again, therefore be also a kind of amphoteric hydroxide.Chemical formula Al (OH)3, it is the hydroxide of aluminium
Thing.Due to showing certain acidity again, so aluminic acid can be referred to as again（H3AlO3）, but actual generate when being reacted with alkali is four hydroxyls
Base closes aluminate（[Al(OH)4]-）.
Dimethylformamide（DMF）It is a kind of transparency liquid, can be dissolved each other with water and most of organic solvent.It is chemical anti-
The common solvent answered.Absolute dimethylformamide is that do not have odorous, but technical grade or rotten dimethylformamide then have fish raw meat
Taste, the impurity of dimethyl amine is contained because of it.Title source is because it is formamide（The acid amides of formic acid）Dimethyl substitution
Thing, and two methyl are all located at N（Nitrogen）On atom.Dimethylformamide is high boiling polarity（Hydrophily）Aprotic is molten
Agent, can promote the carrying out of SN2 reaction mechanisms.Dimethylformamide is manufactured using methyl formate and dimethyl amine.Dimethyl
Formamide is unstable in the presence of highly basic such as NaOH or strong acid such as hydrochloric acid or sulfuric acid（Especially at high temperature）, and water
Solve is formic acid and dimethyl amine.
Magnesium hydroxide alias causticity magnesite, caustic-calcined magnesite etc., suspension of the magnesium hydroxide in water is referred to as hydroxide magnesia magma
Agent, abbreviation magnesia magma, magnesium hydroxide is colourless hexagonal prism crystal or white powder, is insoluble in water and alcohol, is dissolved in diluted acid and ammonium salt is molten
Liquid, the aqueous solution is in alkalescent.Solubility very little in water, but be dissolved in the part of water and ionize completely.The natural ore deposit of magnesium hydroxide
Thing shepardite.Can be used for sugaring and magnesia etc..Because magnesium hydroxide is abundant in the Nature comparision contents, and its chemical property and aluminium
It is more close, therefore user starts to be replaced with magnesium hydroxide aluminium chloride for fragrant body product.Chemical formula Mg (OH)2, formula weight
58.32.White amorphous powder.Water is insoluble in, diluted acid and ammonium salt solution is soluble in.The concentration of saturated aqueous solution be 1.9 milligrams/
Rise (18 DEG C), in alkalescence.It is heated to 350 DEG C and loses water generation magnesia.
Polyvinylpyrrolidone abbreviation PVP, is a kind of non-ionic macromolecule compound, is N- vinylamide Type of Collective
It is most characteristic in thing, and it is studied most deep, extensive fine chemicals kind.Have evolved into nonionic, cation, it is cloudy from
Sub 3 major classes, technical grade, pharmaceutical grade, 3 kinds of specifications of food-grade, relative molecular mass from it is thousands of to more than 1,000,000 homopolymers, altogether
Polymers and crosslinking series of polymers product.
Polyvinyl alcohol, organic compound, white plates, cotton-shaped or pulverulent solids are tasteless.It is dissolved in (more than 95 DEG C of water）,
Dimethyl sulfoxide (DMSO) is slightly soluble in, insoluble in gasoline, kerosene, vegetable oil, benzene, toluene, dichloroethanes, carbon tetrachloride, acetone, acetic acid second
Ester, methyl alcohol, ethylene glycol etc..Polyvinyl alcohol is important industrial chemicals, for manufacturing Pioloform, polyvinyl acetal, resistance to gasoline pipeline and dimension
Nylon synthetic fibers, fabric-treating agent, emulsifying agent, paper coating, adhesive, glue etc..
Calcium hydroxide is a kind of white powdery solids.Chemical formula Ca (OH)2, white lime, calcium hydroxide are commonly called as, add water
Afterwards, in upper and lower two-layer, the upper strata aqueous solution is referred to as clarification limewash, and lower floor's suspension is referred to as milk of lime or lime white.Supernatant liquor
Clarification limewash can check carbon dioxide, and lower floor's troubled liquor milk of lime is a kind of construction material.Calcium hydroxide is a kind of white
Color pulverulent solids, are slightly soluble in water.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention by by additive by aluminium-hydroxide powder,
Dimethylformamide, magnesium hydroxide powder, polyvinylpyrrolidone, polyvinyl alcohol, calcium hydroxide powder and polyacrylamide
Constitute, and the additive of these species is prepared into melting stirring at high temperature in accordance with the appropriate ratio and mix, will obtain
Additive apply in the middle of the production technology of polyimide copper clad lamination, such additive when in use on the one hand and ring
The compatibility of oxygen tree fat very well, on the other hand compensate for the poor shortcoming of the toughness of phenolic cure, therefore product in hot lower electricity
Performance is fine, it is possible to increase the stability under its normal temperature.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, the present invention is carried out further below
Describe in detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to limit this hair
It is bright.
Embodiment one：
A kind of additive material formula for TG polyimide copper clad laminations high, described copper-clad plate includes adhesive layer, glass
Fiber cloth, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin
Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component
Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, described additive is by such as
The component composition of lower weight portion：10 parts of aluminium-hydroxide powder, 3 parts of dimethylformamide, 2 parts of magnesium hydroxide powder, polyethylene pyrrole
4 parts of 3 parts of pyrrolidone, 3 parts of polyvinyl alcohol, 3 parts of calcium hydroxide powder and polyacrylamide.
Embodiment two：
A kind of additive material formula for TG polyimide copper clad laminations high, described additive by following weight portion component
Composition：20 parts of aluminium-hydroxide powder, 7 parts of dimethylformamide, 5 parts of magnesium hydroxide powder, 5 parts of polyvinylpyrrolidone, poly- second
8 parts of 6 parts of enol, 6 parts of calcium hydroxide powder and polyacrylamide.
Embodiment three：
A kind of additive material formula for TG polyimide copper clad laminations high, described additive by following weight portion component
Composition：15 parts of aluminium-hydroxide powder, 5 parts of dimethylformamide, 4 parts of magnesium hydroxide powder, 4 parts of polyvinylpyrrolidone, poly- second
6 parts of 5 parts of enol, 5 parts of calcium hydroxide powder and polyacrylamide.
When glue is completed, it is necessary to carry out impregnation drying, applied using the back of the body plus full leaching mode, at twice use glass fabric
Gumming device with unidirectional movement impregnation, then dries to prepreg；Described gumming device with unidirectional movement includes steeping vat,
The edge of the steeping vat is respectively equipped with glue-feeder and overflow launder, and described glue-feeder is slightly above the overflow launder, in the leaching
Live-roller is provided with glue groove, driven roller is provided with the steeping vat, the driven roller is a pair roller；The glass fabric
Steeping vat is entered by the steeping vat epimere, the driven roller is then passed through through the live-roller.Then overlapped again and layer
Pressure, using it is dustless from fold it is equipped put with vacuum hot pressing device the prepreg and Copper Foil are fitted over from fold together with, in institute
State and be provided with heat-conducting oil heating part and wet cleaner in vacuum hot pressing device.
The present invention by by additive by aluminium-hydroxide powder, dimethylformamide, magnesium hydroxide powder, polyvinyl pyrrole
Alkanone, polyvinyl alcohol, calcium hydroxide powder and polyacrylamide composition, and by the additive of these species according to appropriate ratio
Example prepares melting stirring at high temperature and mixes, and the additive that will be obtained applies to the production technology of polyimide copper clad lamination
Central, compatibility of such additive when in use on the one hand with epoxy resin is fine, on the other hand compensate for phenolic aldehyde
The poor shortcoming of the toughness of solidification, therefore product is fine in hot lower electrical property, it is possible to increase the stability under its normal temperature.
General principle of the invention, principal character and advantages of the present invention has been shown and described above.The technology of the industry
It should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is only the present invention to personnel
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (4)
1. the additive material formula of TG polyimide copper clad laminations high is used for, and described copper-clad plate includes adhesive layer, glass fibers
Wei Bu, copper foil layer, the adhesive layer is coated on glass fabric, more than 50 DEG C that curing agent is molten with epoxy resin
Solution, be subsequently adding additive by fully dissolve and be thoroughly mixed it is uniform after, allow glue curing some hours, allow each component
Have and contact with each other enough, interpenetrate, colloid is reached a stability through a period of time, it is characterised in that described
Additive be made up of the component of following weight portion：Aluminium-hydroxide powder 10-20 parts, dimethylformamide 3-7 parts, magnesium hydroxide
Powder 2-5 parts, polyvinylpyrrolidone 3-5 parts, polyvinyl alcohol 3-6 parts, 3-6 parts and polyacrylamide 4-8 of calcium hydroxide powder
Part.
2. the additive material formula for TG polyimide copper clad laminations high according to claim 1, it is characterised in that institute
The additive stated is made up of the component of following weight portion：10 parts of aluminium-hydroxide powder, 3 parts of dimethylformamide, magnesium hydroxide powder
4 parts of 2 parts of end, 3 parts of polyvinylpyrrolidone, 3 parts of polyvinyl alcohol, 3 parts of calcium hydroxide powder and polyacrylamide.
3. the additive material formula for TG polyimide copper clad laminations high according to claim 1, it is characterised in that institute
The additive stated is made up of the component of following weight portion：20 parts of aluminium-hydroxide powder, 7 parts of dimethylformamide, magnesium hydroxide powder
8 parts of 5 parts of end, 5 parts of polyvinylpyrrolidone, 6 parts of polyvinyl alcohol, 6 parts of calcium hydroxide powder and polyacrylamide.
4. the additive material formula for TG polyimide copper clad laminations high according to claim 1, it is characterised in that institute
The additive stated is made up of the component of following weight portion：15 parts of aluminium-hydroxide powder, 5 parts of dimethylformamide, magnesium hydroxide powder
6 parts of 4 parts of end, 4 parts of polyvinylpyrrolidone, 5 parts of polyvinyl alcohol, 5 parts of calcium hydroxide powder and polyacrylamide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268681.5A CN106753135A (en) | 2016-12-31 | 2016-12-31 | For the additive material formula of TG polyimide copper clad laminations high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268681.5A CN106753135A (en) | 2016-12-31 | 2016-12-31 | For the additive material formula of TG polyimide copper clad laminations high |
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| CN106753135A true CN106753135A (en) | 2017-05-31 |
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| CN201611268681.5A Pending CN106753135A (en) | 2016-12-31 | 2016-12-31 | For the additive material formula of TG polyimide copper clad laminations high |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111154099A (en) * | 2019-12-27 | 2020-05-15 | 大连理工大学 | Polyimide mutually soluble with bisphenol epoxy resin and having biphenyl structure and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN102051026A (en) * | 2011-01-28 | 2011-05-11 | 宏昌电子材料股份有限公司 | Halogen-free flame-retardant epoxy resin composition and application thereof |
-
2016
- 2016-12-31 CN CN201611268681.5A patent/CN106753135A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101735558A (en) * | 2008-11-07 | 2010-06-16 | 福建新世纪电子材料有限公司 | Glue solution for copper-clad plate |
| CN102051026A (en) * | 2011-01-28 | 2011-05-11 | 宏昌电子材料股份有限公司 | Halogen-free flame-retardant epoxy resin composition and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111154099A (en) * | 2019-12-27 | 2020-05-15 | 大连理工大学 | Polyimide mutually soluble with bisphenol epoxy resin and having biphenyl structure and preparation method thereof |
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Application publication date: 20170531 |