CN106712737A - Crystal oscillator and production method thereof - Google Patents
Crystal oscillator and production method thereof Download PDFInfo
- Publication number
- CN106712737A CN106712737A CN201611184165.4A CN201611184165A CN106712737A CN 106712737 A CN106712737 A CN 106712737A CN 201611184165 A CN201611184165 A CN 201611184165A CN 106712737 A CN106712737 A CN 106712737A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- crystal oscillator
- compensation circuit
- chip
- encapsulation cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 55
- 238000005538 encapsulation Methods 0.000 claims description 39
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 230000035939 shock Effects 0.000 description 5
- 238000011900 installation process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a crystal oscillator. The crystal oscillator comprises a compensating circuit, a wafer, a pedestal and a packaging cavity. The wafer is arranged in the packaging cavity. A lower surface of the packaging cavity is firmly contacted with the pedestal. An upper surface of the packaging cavity is firmly contacted with the compensating circuit. The wafer is electrically connected to the pedestal. The compensating circuit is electrically connected to the pedestal. The invention provides the crystal oscillator and a production method thereof so that a problem that temperature compensating precision is not high because temperature sensing speeds of the wafer and the compensating circuit are not consistent can be effectively solved.
Description
Technical field
The present invention relates to technical field of electronic components, more particularly to a kind of crystal oscillator and its production method.
Background technology
Existing crystal oscillator is mainly made up of the base of ceramic of attached cavity, chip, compensation circuit and crown cap；In pottery
There are chip weld zone and compensation circuit weld zone in porcelain pedestal, compensation circuit is typically connected by reverse installation process and base of ceramic,
Chip and base of ceramic are connected by way of chip weld zone point elargol.
The structure following points are not enough：
1) there is space between the compensation circuit and chip of the structure, belong to radiant heat transfer, heat transfer rate is slower；And compensate
Circuit then with base of ceramic directly contact, be transmission of heat by contact, heat transfer rate is very fast.Therefore, compensation circuit is fast with the temperature-sensitive of chip
Degree is inconsistent, so that the temperature compensation data of compensation circuit output is inconsistent with the temperature data of chip, deposits temperature-compensating
In error, temperature-compensating precise decreasing is ultimately resulted in.
2) two electrodes that chip only has one end are connected by way of an elargol with base of ceramic, and the other end is hanging, its
Shock resistance is poor.
3) compensation circuit of the structure needs to be mounted in base of ceramic at first by reverse installation process, for assembling process
The bad products None- identified of middle generation, only after whole crystal oscillator is all packaged, just may be used in last detection process
Identification.
The content of the invention
It is an object of the present invention to：A kind of crystal oscillator is provided, it can be effectively solved due to chip and compensation
The temperature-sensitive speed of circuit is inconsistent and causes temperature-compensating precision problem not high.
It is another object of the present invention to：A kind of production method of crystal oscillator is provided, can produce chip and
The temperature-sensitive speed of compensation circuit is consistent, the crystal oscillator of temperature-compensating high precision.
It is that, up to this purpose, the present invention uses following technical scheme：
On the one hand, there is provided a kind of crystal oscillator, including compensation circuit, chip and pedestal, it is described also including encapsulation cavity
Chip is arranged in the package cavity body；The lower surface of the encapsulation cavity is fitted with the pedestal, described to encapsulate the upper of cavity
Fitted with the compensation circuit on surface；The chip is electrically connected with the pedestal；The compensation circuit is electric with the pedestal
Connection.
Specifically, chip one end of current crystal oscillator is connected with pedestal, and the other end is hanging.The chip of hanging structure
Not only temperature is difficult to consistent with compensation circuit, and is easily fractureed during vibrations.And pedestal of the invention, chip and
Compensation circuit can quickly be reached unanimity by direct contact heat transfer, temperature, so that the offset data of compensation circuit output is more smart
Really, compensation precision higher is reached.Further, chip is first encapsulated in package cavity body, without hanging structure, encapsulation cavity with
Bottom surface directly contact connection, the shock resistance of chip is fully enhanced.
Preferred embodiment the upper surface of the encapsulation cavity is provided with the first electric connection part as a kind of, and described the
One electric connection part is electrically connected with the pedestal by bonding line；First electric connection part also electrically connects with the chip
Connect.
As one kind preferred embodiment, the compensation circuit is provided with the second electric connection part, and described second is electric
Connecting portion, away from the side of the encapsulation cavity, is electrically connected with the pedestal in the compensation circuit by bonding line.
Specifically, compensation circuit is fixed on away from the side of the second electric connection part the upper surface of encapsulation cavity, compensation
The side that circuit is provided with the second electric connection part is exposed, and electrical connection, electrical connection are realized by bonding line and pedestal
Reliability can be detected directly, just bad products can be gone out with Direct Recognition in this operation.
As one kind preferred embodiment, the material of the encapsulation cavity is ceramics.
Specifically, when the material for encapsulating cavity is for ceramics, efficient heat transfer can be both realized, internal unit's device can be prevented again
Part short circuit.
As one kind preferred embodiment, also including upper lid, the first groove, the upper lid are provided with the middle part of the pedestal
Lower surface fitted with the bottom land of first groove.
Further, the bottom land of first groove is additionally provided with the second groove, and the aperture area of second groove is less than
The aperture area of first groove, the encapsulation cavity and compensation circuit are arranged in second groove.
On the other hand, there is provided a kind of production method of crystal oscillator, including：
S10：Chip is packaged with encapsulation cavity；
S20：The lower surface of the encapsulation cavity is attached with pedestal；
S30：Compensation circuit is attached with the encapsulation cavity；
S40：Chip and pedestal are electrically connected by bonding line；Compensation circuit is electrically connected with pedestal by bonding line
Connect；
S50：Upper lid is connected with pedestal, encapsulation is completed.
Further, the S20 is specially：The lower surface of the encapsulation cavity is carried out with pedestal by mode for dispensing glue
Connection.
Further, the S30 is specially：By the side in compensation circuit away from its second electric connection part and package cavity
The upper surface of body is attached.
Preferably, by mode for dispensing glue by compensation circuit away from its second electric connection part side with encapsulation cavity
Upper surface be attached.
As one kind preferred embodiment, also include between the S40 and S50：
S41：Electrical connection between electrical connection between chip and pedestal and compensation circuit and pedestal is detected.
Specifically, compensation circuit is fixed on away from the side of the second electric connection part the upper surface of encapsulation cavity, compensation
The side that circuit is provided with the second electric connection part is exposed, and electrical connection, electrical connection are realized by bonding line and pedestal
Reliability can be detected directly, just bad products can be gone out with Direct Recognition in this operation.
Beneficial effects of the present invention are：A kind of crystal oscillator and its production method are provided, envelope is arranged on by by chip
It behave affectedly in vivo, is then electrically connected by bonding line, following beneficial effect can be reached：
1), by transmission of heat by contact, temperature can quickly reach unanimity for base of ceramic, chip and compensation circuit, so that compensation electricity
The offset data of road output is more accurate, reaches compensation precision higher；
2) chip is first encapsulated in package cavity body, encapsulation cavity is directly fitted with pedestal, improves the shock resistance of chip；
3) reverse installation process need not be used, just bad products can be gone out with Direct Recognition in the operation of bonding line connection.
Brief description of the drawings
The present invention is described in further detail below according to drawings and Examples.
Fig. 1 is the explosive view of the crystal oscillator described in embodiment one；
Fig. 2 is the production method block diagram of the crystal oscillator described in embodiment two.
In Fig. 1~Fig. 2：
1st, pedestal；
2nd, cavity is encapsulated；201st, the first electric connection part；
3rd, chip；
4th, compensation circuit；401st, the second electric connection part；
5th, upper lid.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment one
As shown in figure 1, a kind of crystal oscillator, including compensation circuit 4, chip 3, pedestal 1 and ceramic material package cavity
Body 2.Chip 3 is arranged in encapsulation cavity 2, and the upper surface for encapsulating cavity 2 is provided with the first electrical connection being electrically connected with chip 3
Portion 201；The lower surface for encapsulating cavity 2 is fitted with pedestal 1, and the first electric connection part 201 is realized electric with pedestal 1 by bonding line
Connection；The upper surface for encapsulating cavity 2 is fitted with compensation circuit 4, and compensation circuit 4 is provided with the second electric connection part 401, the second electricity
Gas connecting portion 401 is located at side of the compensation circuit 4 away from encapsulation cavity 2, is electrically connected by bonding line with pedestal 1.
Specifically, one end of chip 3 of current crystal oscillator is connected with pedestal 1, and the other end is hanging.The crystalline substance of hanging structure
Not only temperature is difficult to consistent with compensation circuit 4 piece 3, and is easily fractureed during vibrations.And the pedestal of the present embodiment
1st, by direct contact heat transfer, temperature can quickly reach unanimity for chip 3 and compensation circuit 4, so that the benefit of the output of compensation circuit 4
Repay that data are more accurate, reach compensation precision higher.Further, chip 3 is first encapsulated in encapsulation cavity 2, without hanging knot
Structure, encapsulation cavity 2 is connected with bottom surface directly contact, and the shock resistance of chip 3 is fully enhanced.
Further, compensation circuit 4 is fixed on away from the side of the second electric connection part 401 upper table of encapsulation cavity 2
Face, the side that compensation circuit 4 is provided with the second electric connection part 401 is exposed, and realizes electrically connecting by bonding line and pedestal 1
Connect, the reliability of electrical connection can be detected directly, and just bad products can be gone out with Direct Recognition in this operation.
In the present embodiment, crystal oscillator also includes upper lid 5, and the middle part of pedestal 1 is provided with the first groove, under upper lid 5
Fitted with the bottom land of the first groove on surface.The bottom land of the first groove is additionally provided with the second groove, and the aperture area of the second groove is less than
The aperture area of the first groove, encapsulation cavity 2 and compensation circuit 4 are arranged in the second groove.
Embodiment two
A kind of production method of crystal oscillator, including：
S10：Chip 3 is packaged with encapsulation cavity 2, wherein, the upper surface for encapsulating one end of cavity 2 is provided with and chip
First electric connection part 201 of 3 electrical connections；
S20：The lower surface for encapsulating cavity 2 is attached with pedestal 1 by mode for dispensing glue；
S30：By mode for dispensing glue by the side in compensation circuit 4 away from its second electric connection part 401 and package cavity
The upper surface of body 2 is attached；
S40：Chip 3 is electrically connected with pedestal 1 by bonding line；It is by bonding line that compensation circuit 4 is electric with pedestal 1
Connection；
S41：Electrical connection between electrical connection between chip 3 and pedestal 1 and compensation circuit 4 and pedestal 1 is carried out
Detection；
S50：Upper lid 5 is connected with pedestal 1, encapsulation is completed.
Specifically, the crystal oscillator that the production method that the present embodiment is provided is obtained, pedestal 1, chip 3 and compensation circuit 4
By direct contact heat transfer, temperature can quickly reach unanimity, so that the offset data of the output of compensation circuit 4 is more accurate, reach
Compensation precision higher.Further, chip 3 is first encapsulated in encapsulation cavity 2, without hanging structure, encapsulates cavity 2 and bottom surface
Directly contact is connected, and the shock resistance of chip 3 is fully enhanced.
Furthermore, compensation circuit 4 is fixed on away from the side of the second electric connection part 401 upper surface of encapsulation cavity 2, mend
Repay circuit 4 and be provided with the side of the second electric connection part 401 and be exposed, electrical connection, electricity are realized by bonding line and pedestal 1
The reliability of gas connection can be detected directly, and just bad products can be gone out with Direct Recognition in this operation.
" first ", " second " herein just for the sake of being distinguish between in description, not special implication.
It is to be understood that, above-mentioned specific embodiment is only former presently preferred embodiments of the present invention and institute's application technology
Reason, in technical scope disclosed in this invention, change that any one skilled in the art is readily apparent that or
Replace, should all cover within the scope of the present invention.
Claims (10)
1. a kind of crystal oscillator, including compensation circuit, chip and pedestal, it is characterised in that
Also include encapsulation cavity, the chip is arranged in the package cavity body；
The lower surface of the encapsulation cavity is fitted with the pedestal, and the upper surface of the encapsulation cavity is pasted with the compensation circuit
Close；
The chip is electrically connected with the pedestal；
The compensation circuit is electrically connected with the pedestal.
2. crystal oscillator according to claim 1, it is characterised in that the upper surface of the encapsulation cavity is provided with the first electricity
Gas connecting portion, first electric connection part is electrically connected with the pedestal by bonding line；First electric connection part is also
It is electrically connected with the chip.
3. crystal oscillator according to claim 1, it is characterised in that the compensation circuit is provided with the second electrical connection
Portion, second electric connection part is located at side of the compensation circuit away from the encapsulation cavity, and key is passed through with the pedestal
Zygonema is electrically connected.
4. crystal oscillator according to claim 1, it is characterised in that the material of the encapsulation cavity is ceramics.
5. crystal oscillator according to claim 1, it is characterised in that also including upper lid, be provided with the middle part of the pedestal
First groove, the lower surface of the upper lid is fitted with the bottom land of first groove.
6. crystal oscillator according to claim 5, it is characterised in that it is recessed that the bottom land of first groove is additionally provided with second
Groove, the aperture area of the aperture area less than first groove of second groove, the encapsulation cavity and compensation circuit set
Put in second groove.
7. a kind of production method of crystal oscillator, it is characterised in that including：
S10：Chip is packaged with encapsulation cavity；
S20：The lower surface of the encapsulation cavity is attached with pedestal；
S30：Compensation circuit is attached with the encapsulation cavity；
S40：Chip and pedestal are electrically connected by bonding line；Compensation circuit and pedestal are electrically connected by bonding line；
S50：Upper lid is connected with pedestal, encapsulation is completed.
8. the production method of crystal oscillator according to claim 7, it is characterised in that the S20 is specially：By point
With pedestal be attached the lower surface of the encapsulation cavity by the mode of glue.
9. the production method of crystal oscillator according to claim 7, it is characterised in that the S30 is specially：Will compensation
Side on circuit away from its second electric connection part is attached with the upper surface of encapsulation cavity.
10. the production method of crystal oscillator according to claim 7, it is characterised in that between the S40 and S50 also
Including：
S41：Electrical connection between electrical connection between chip and pedestal and compensation circuit and pedestal is detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611184165.4A CN106712737A (en) | 2016-12-20 | 2016-12-20 | Crystal oscillator and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611184165.4A CN106712737A (en) | 2016-12-20 | 2016-12-20 | Crystal oscillator and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106712737A true CN106712737A (en) | 2017-05-24 |
Family
ID=58939436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611184165.4A Pending CN106712737A (en) | 2016-12-20 | 2016-12-20 | Crystal oscillator and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106712737A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428927A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
| CN1428928A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
| CN1520028A (en) * | 2003-01-23 | 2004-08-11 | 台达电子工业股份有限公司 | Device of temperature compensated oscillator and manufacturing method |
| CN1581677A (en) * | 2003-08-08 | 2005-02-16 | 台达电子工业股份有限公司 | Temperature compensating crystal oscillator structure and its manufacturing method |
| CN102882488A (en) * | 2011-07-15 | 2013-01-16 | 台湾晶技股份有限公司 | Crystal oscillator with layout structure for miniaturization size |
| CN202818244U (en) * | 2012-09-29 | 2013-03-20 | 西安深亚电子有限公司 | High-precision temperature compensation type crystal oscillator packaging structure |
| CN103444075A (en) * | 2011-02-14 | 2013-12-11 | 高通股份有限公司 | Wireless chipset with a non-temperature compensated crystal reference |
-
2016
- 2016-12-20 CN CN201611184165.4A patent/CN106712737A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428927A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
| CN1428928A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
| CN1520028A (en) * | 2003-01-23 | 2004-08-11 | 台达电子工业股份有限公司 | Device of temperature compensated oscillator and manufacturing method |
| CN1581677A (en) * | 2003-08-08 | 2005-02-16 | 台达电子工业股份有限公司 | Temperature compensating crystal oscillator structure and its manufacturing method |
| CN103444075A (en) * | 2011-02-14 | 2013-12-11 | 高通股份有限公司 | Wireless chipset with a non-temperature compensated crystal reference |
| CN102882488A (en) * | 2011-07-15 | 2013-01-16 | 台湾晶技股份有限公司 | Crystal oscillator with layout structure for miniaturization size |
| CN202818244U (en) * | 2012-09-29 | 2013-03-20 | 西安深亚电子有限公司 | High-precision temperature compensation type crystal oscillator packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
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| RJ01 | Rejection of invention patent application after publication |