CN106711353B - The packaging method of AMOLED structure and AMOLED display device - Google Patents
The packaging method of AMOLED structure and AMOLED display device Download PDFInfo
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- CN106711353B CN106711353B CN201510427614.2A CN201510427614A CN106711353B CN 106711353 B CN106711353 B CN 106711353B CN 201510427614 A CN201510427614 A CN 201510427614A CN 106711353 B CN106711353 B CN 106711353B
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Abstract
The present invention relates to luminous semiconductor device encapsulation fields, more specifically, it is the packaging method of a kind of AMOLED structure and AMOLED display device, it coats to form the solidification glue-line with closed figures by the edge in cover board, and the thermotropic dilatancy or photoexpansion having using the solidification glue-line, hole caused by foreign particles to be filled, and then maintain atmosphere in version constant before glass cream packaging technology, and the probability of subsequent glass cream laser package failure can also be effectively reduced, to improve the performance and yield of product.
Description
Technical field
The present invention relates to luminous semiconductor device encapsulation fields, more precisely, being AMOLED display device and reduction
The method of AMOLED display device package failure.
Background technique
Currently, applying the OLED packaged type on flexible base plate is mainly thin-film package, atomic layer deposition is usually utilized
Long-pending mode (Atomic Layer Deposition, ALD) either direct modes such as coating (Coating), will for example propylene
Some films such as acid esters (Acryl ate) and silica, are deposited in a manner of alternate multilayer and are made in such as organic light emission
On the luminescent devices such as diode (Organic Light-Emitting Diodes, OLED).To reach barrier environmental gas and water
The good result of vapour etc., sometimes needs also to use that multilayer is organic and/or inorganic barrier layer in thin-film packing structure
(barrier layer).A principal contradiction of the existing technology is AMOLED material pair used in vapor deposition step
Yu Shui, oxygen extreme sensitivity, it usually needs the fabulous material of being sealed property and corresponding mode carry out device after the vapor deposition
Encapsulation, but measure effect and bad of the prior art in terms of stopping oxygen-containing gas and stopping aqueous vapor.
It is traditional when being packaged to AMOLED display device as shown in Figure 1A~1B, it needs outer prior to cover board 101
It encloses after coating inner ring UV glue 102 and outer ring UV glue 103, then cover board 101 and setting backboard (being not shown in Figure 1A) is bonded,
And single display unit device is packaged using glass cream (Frit) 104, but device encapsulation is being carried out to glass cream 104
Its preceding measure effect in terms of using blocking oxygen-containing gas and stopping aqueous vapor is undesirable, i.e., during future technique, if
There are undesirable foreign particles (particle) 106 to be blown into or fall on cover board 101 because of a variety of causes to need to coat originally
At the position of inner ring UV glue 102 and/or outer ring UV glue 103, once continue to be coated with UV glue in the case where there being foreign matter,
The atmosphere in substrate can then be destroyed.
Referring in (the case where only being shown in Figure 1B in outer ring UV glue 103 doped with foreign particles 106) shown in Figure 1B, if
When foreign particles 106 are entrained in outer ring UV glue 103, nationality is by external foreign particles 106 between cover board 101 and backboard 105
And outer ring UV glue 103 is caused to be no longer the state that preferably fits closely with the surface of cover board 101, that is, it is clamped in cover board 101 and back
The meeting physical support of foreign particles 106 between plate 105 plays local 103 region of outer ring UV glue square on top of this, and in foreign matter
106 lateral wall circumference of particle is formed about the gap 107 being located between outer ring UV glue 103 and cover board 101 (i.e. through the gap
107 contact inner ring UV glue 102 and/or glass cement 104 with extraneous severe atmosphere), in other words, foreign particles 106
It induces confined space or chamber inside outer ring UV glue 103 to be connected to external environment by gap 107, corresponding cover board 101, back
A default chamber being confined between plate 105 be no longer it is closed, cause outer ring UV glue 103 bind it is bad so that seal atmosphere
It wrecks, subsequent glass cream laser sintering process failure is resulted even in, so one of current industry problems faced is
How the external severe atmosphere of erosion to(for) thin-film device is stopped under the premise of not increasing technology difficulty.
Summary of the invention
In one embodiment of the invention, a kind of packaging method of AMOLED display device, the method packet are provided
It includes:
The backboard for being provided with display device area is provided, and is provided on the backboard being located in the display device area
Several display units；
The cover board for being provided with display seal area corresponding with the display device area on the backboard is provided, and described aobvious
Show that the cover board in seal area is provided with and several display units several display unit seal areas correspondingly；
Coating forms the glass cement with closed figures in display unit seal area described each of on the cover board；
In the edge of the display seal area on cover board coating the first solidification glue-line to form a closed figures；
Solidify on the cover board on the outside of glue-line the second solidification of coating glue-line described first to form a closed figures, and
Described second material for solidifying glue-line is different from the described first material for solidifying glue-line；
The cover board is conformed on the backboard, makes described first to solidify glue-line and is sheathed on several display units
Periphery, and each display unit is surrounded by the glass cement；And
Solidify the first solidification glue-line and the second solidification glue-line.
As a preferred embodiment, in above-mentioned packaging method:
The first solidification glue-line is ultraviolet curing glue.
As a preferred embodiment, in above-mentioned packaging method:
The second solidification glue-line is thermotropic swelling agent；
After the first solidification curable adhesive layer, continue to carry out the technique that is heating and curing to the thermotropic swelling agent.
As a preferred embodiment, in above-mentioned packaging method:
The thermotropic swelling agent is azo-compound, sulfonyl hydrazines compound or nitroso compound.
As a preferred embodiment, in above-mentioned packaging method:
The second solidification glue-line is photoexpansion agent；
After the first solidification curable adhesive layer, continue to carry out the photoexpansion agent light irradiation curing process.
As a preferred embodiment, above-mentioned packaging method further include:
After solidifying the first solidification glue-line and the second solidification glue-line, the glass cement is solidified, so that
Each display unit is independent sealed.
Present invention also provides a kind of AMOLED structures, comprising:
Backboard has upper face and the lower surface relative to the upper face, and the top of the backboard
There is the display device area for being provided with several display units on surface；
Cover board has bottom surface and the top surface relative to the bottom surface, the bottom table of the cover board
The display device area on the backboard is corresponded on face is provided with display seal area, and the display seal area of the cover board
In be provided with and several display units several display unit seal areas correspondingly；
Glass cement is set in the display unit seal area of the cover board, so that each display unit quilt
It is independent sealed；And
The edge of the cover board and the backboard passes through the first solidification glue-line and the second solidification glue-line sealing, and described the
One material for solidifying glue-line is different from the described second material for solidifying glue-line.
As a preferred embodiment, in above-mentioned AMOLED structure:
The first solidification glue-line is ultraviolet curing glue.
As a preferred embodiment, in above-mentioned AMOLED structure:
The second solidification glue-line is thermotropic swelling agent or photoexpansion agent.
As a preferred embodiment, in above-mentioned AMOLED structure:
The thermotropic swelling agent is azo-compound, sulfonyl hydrazines compound or nitroso compound.
As a preferred embodiment, in above-mentioned AMOLED structure:
The first solidification glue-line surrounds several described display units, and it is solid that the second solidification glue-line surrounds described first
Change glue.
Shown in sum up, the packaging method of one of the application AMOLED structure and AMOLED display device can pass through
The solidification glue-line to be formed with closed figures, and the thermotropic dilatancy having using the solidification glue-line are coated in the edge of cover board
Or photoexpansion, hole caused by foreign particles is filled, and then atmosphere in version is maintained before glass cream packaging technology
Environment is constant, and the probability of subsequent glass cream laser package failure can also be effectively reduced, to improve the performance and yield of product.
Detailed description of the invention
Read it is described further below and referring to the following drawings after, feature and advantage of the invention will be evident:
Figure 1A is traditional AMOLED display device encapsulating structure figure；
Figure 1B is the schematic diagram of the section structure in Figure 1A at A-A；
Fig. 2A is the structural schematic diagram in the embodiment of the present application after coating solidification glue on cover board；
Fig. 2 B is the schematic diagram of the section structure in Fig. 2A at A-A；
Fig. 2 C is the schematic diagram of the section structure in Fig. 2A at B-B；
Fig. 3 A be in the embodiment of the present application on cover board solidify adhesive curing after structural schematic diagram；
Fig. 3 B is the schematic diagram of the section structure in Fig. 3 A at A-A；
Fig. 3 C is the schematic diagram of the section structure in Fig. 3 A at B-B.
Specific embodiment
Embodiment one
A~3C referring to fig. 2, one for encapsulating active matrix organic light emitting diode (AMOLED, Active-matrix
Organic light emitting diode) device substrate or cover board (cover glass) 201 top views, although scheming
Without showing backboard (OLED LTPS) 205 in 2A and 3A it should be appreciated that a substrate corresponding with cover board 201 or lining
Bottom or backboard (such as LTPS substrate) 205 with cover board 201 will be bonded or are bonded or be covered conjunction, with realize by cover board 201,
Backboard 205 the rwo be bonded and give mechanical combination/link together.Purpose is organic light emitting diode device (OLED) device
Part can be arranged among the crack between cover board 201, backboard 205 and give it is hermetically sealed, this hereafter will also will continue in detail
It introduces.
Firstly, as known to Fig. 2A~2C, it is desirable to provide one is prepared with the backboard 205 of display unit (or bonding) to be fit,
The backboard 205 has upper face (i.e. the lower surface of backboard 205 shown in Fig. 2 B) and relative under the upper face
Portion surface (i.e. the upper surface of backboard 205 shown in Fig. 2 B), and display is provided on the upper face for being located at backboard 205
Part area (does not indicate) in figure, and it is above-mentioned aobvious to be provided on the upper face of the backboard in the display device area 205 several
Show unit (not indicating in figure).
Based on above-mentioned backboard 205, the cover board 201 that (or bonding) is bonded with the backboard 205 is provided, which has
Top surface (i.e. one side of the cover board 201 shown in Fig. 2A backwards to reader, the lower surface of cover board 201 shown in Fig. 2 B) and phase
For lower surface (i.e. one side of the cover board 201 towards reader shown in Fig. 2A, the cover board shown in Fig. 2 B of the top surface
201 upper surface), and the display device area corresponded on backboard 205 on the cover board 201 is provided with display seal area, to be used for
Above-mentioned display device area is sealed after fitting (or bonding) technique；Equally, corresponding several above-mentioned display units
It is provided in the bottom surface of the cover board 201 in display device area single with several the one-to-one displays of above-mentioned display unit
First seal area, it is to be used for subsequent after fitting (or bonding) technique and glass cream sealing technology, each display unit is equal
Individually seal.
Secondly, all being known according to the usual skill in this field, used material is deposited for water, oxygen etc. in AMOLED device
External environmental factor is extreme sensitivity, and then they need to execute the fabulous encapsulation process of leakproofness after vapor deposition, to come
Ensure that the external environmental factors such as water, oxygen are unlikely to each sensitive material part of attack device.A is it is found that in fig. 2 referring to fig. 2
Top view in, we execute industry routine sintering bonding program before, need the periphery edge in the cover board 201 of whole big version
The first solidification glue-line of place's setting or coating (such as ultraviolet curing glue (Ultraviolet Rays, UV) is also called UV glue for short)
202, i.e., glass cream (Frit) 204 is applied in the display unit seal area of above-mentioned cover board 201, so that each display unit
It is (such as annular, rectangular and round close-shaped that glass cream 204 in area is respectively formed a closed figures；It should be noted that this
It is to be illustrated with annular, but it should not be construed as the limitation to the technical solution in the present embodiment in the attached drawing of embodiment),
For each display unit individually to be surrounded in subsequent fitting (or bonding) technique；Meanwhile it being shown in above-mentioned
The first solidification glue-line 202 (such as UV glue) of edge coating for showing device sealing area, i.e., (setting in the outermost of cover board 201
It is equipped at the position except several OLED display unit areas) use the ultraviolet curing UV glue with closed figures as inside casing
Sealant, to be mainly used for the support between cover board 201 and backboard 205；And it is located in the bottom surface of above-mentioned cover board 201
First solidify glue-line 202 outside coating second solidification glue-line 203 (such as thermotropic swelling agent or photoexpansion agent, i.e., this second
Solidify the material of glue-line 203 and above-mentioned first to solidify the material of glue-line 202 different), which also has
Closed figures are (such as annular, rectangular and round close-shaped；It should be noted that be in the attached drawing of the present embodiment with annular into
What row illustrated, but it should not be construed as the limitation to the present embodiment technical solution) the first above-mentioned solidification glue-line 202 to be given
It surrounds, i.e., solidify glue-line 202 for above-mentioned first and the display device unit seal area that glue-line 202 surrounded first is solidified by this
It is surrounded, to be sealed the area of space in it as outline border sealant.So the first above-mentioned solidification glue-line
202 and second solidify glue-line 203 purpose be that temporary fixing cover board 201, backboard 205 prevent them to be excessively close to and can be with
The atmosphere of cover board 201, the crack inner sealing between the two of backboard 205 is maintained, ultraviolet curing UV glue is as inside casing sealing here
Glue plays backboard 205 and while cover board 201 playing physical support, can also be achieved between backboard 205 and the sealing of cover board 201 and
Area of space positioned at display device seal area is sealed.
Referring specifically to shown in Fig. 2A~2C, in order to be located at cover board 201 and backboard 205 after being bonded cover board 201 with backboard 205
Between display unit be in preferable closed environment, need first in 201 bottom surface of cover board (i.e. towards reader's in Fig. 2A
One side surface) periphery edge position at coating in closed hoop first solidification glue-line 202, this point is critically important, Ke Yi
It is readily observed in the top view of Fig. 2A, because of a circle ultraviolet curing UV glue (the i.e. first solidification glue-line of closed hoop
It 202) is exactly to be used to that each LED device of receiving to be disposed (to correspond to above-mentioned in the middle position that 201 top surface of cover board surrounds
The display area for being provided with several OLED display units), so the central interior region for solidifying glue-line 202 once circle first
It can be to water, oxygen extreme sensitivity.This first solidify glue-line 202 should as close as possible near the periphery edge of cover board 201 so as to
Biggish intermediate space is reserved to avoid impacting AMOLED device.According to the conventional encapsulation process of AMOLED, in cover board
Coating is formed after the adhesive material of glass cream (Frit) 204 etc on 201, it is also necessary to which backboard 205 and cover board 201 are utilized glass
The bonding effect of glass cream (Frit) 204 is bonded or lid is combined, if the vertical cross-sectional view along A-A in Fig. 2A is observed,
I.e. as shown in Figure 2 B, backboard 205 corresponding with cover board 201 and cover board 201 have been fitted in together, and a circle first of closure is solid
Change glue-line 202 central interior region be also in fact several prepsetting gaps by being confined between backboard 205, cover board 201 or
Say it is hollow chamber, to be used to accommodate each active matrix organic light-emitting diode AMOLED device of setting.
Very unfortunately, in fig. 2b, if there is undesirable foreign particles (particle) 206 to be blown into or because of various
The script that reason falls in 201 bottom surface of cover board needs to coat at the position of the first solidification glue-line 202, once there being foreign matter
In the case where and continue to be coated with the first solidification glue-line 202, then first solidify between glue-line 202 and the top surface of cover board 201 nationality by
External foreign particles 206 and cause the first solidification glue-line 202 to be no longer preferably to fit closely shape with the top surface of cover board 201
State.Things turn out contrary to one's wishes, and true situation is to be clamped in 206 meeting of foreign particles between 201 top surface of the first solidification glue-line 202 and cover board
The part first that physical support plays its over top solidifies 202 region of glue-line, and is formed about in 206 lateral wall circumference of foreign particles
(make glass cement through the gap 207 positioned at the gap 207 solidified between glue-line 202 and the top surface of cover board 201 first
204 contact with ambient atmosphere environment), in other words, the induction of foreign particles 206 first solidifies the confined space inside glue-line 202
Or chamber is connected to external environment by gap 207, the default chamber of be confined between backboard 205, cover board 201 is no longer
Closed, cause ultraviolet curing UV glue 202 to bind bad and then sealing atmosphere and wrecks.
Likewise, in fig. 2 c, if there is undesirable foreign particles (particle) 206 to be blown into or because of a variety of causes
When falling in the script of 201 bottom surface of cover board and needing to coat at the position of the second solidification glue-line 203, once there being foreign matter
In the case of and continue to be coated with the second solidification glue-line 203, then second solidifies between glue-line 203 and the top surface of cover board 201 nationality by outer
Come foreign particles 206 and cause the second solidification glue-line 203 to be no longer preferably to fit closely state with the top surface of cover board 201.
So be clamped between 201 top surface of the second solidification glue-line 203 and cover board foreign particles 206 also can physical support rise on its top
The part second of side solidifies glue-line 203, and is formed about to be located in 206 lateral wall circumference of foreign particles and solidifies glue-line 203 second
Gap 207 between the top surface of cover board 201 makes the first solidification glue-line 202 and ambient atmosphere environment through the gap 207
Contact, and if can make glass cream 204 when being also formed with gap 207 on the first solidification glue-line 202 simultaneously and its be surrounded
Display device unit can be contacted with external environment；In short, foreign particles 206 are likely to induce in the first solidification glue-line 202
The confined space or chamber in portion and/or the second solidification 203 inside confined space of glue-line can be connected by gap 207 and external environment
Logical, i.e., backboard 205, a default chamber being confined between cover board 201 are no longer closed, lead to the first solidification glue-line 202
Bind it is bad, and then seal atmosphere wreck so that subsequent laser package (Laser sealing) fail, even more so that
Glass cream 204 and its display device unit of inside may reacts with external water, oxygen etc. so that full page because of water oxygen invasion or
Atmosphere fails to form Newton's ring and scrap.
Finally, being effectively prevented from the generation of above-mentioned many defects such as Fig. 3 A~3C, the second solidification glue-line 203 is carried out
Curing process, if the second solidification glue-line 203 is thermotropic swelling agent (such as azo-compound, sulfonyl hydrazines compound or nitroso
Compound etc.) when, then using heating process the second solidification glue-line 203 is solidified, and due to meeting when heated of thermotropic swelling agent
Expansion, that is, close on the second solidification meeting expanded by heating of glue-line 203 of above-mentioned foreign particles 206, and then will fill up into gap 207
In so that second solidification glue-line 203 have Packed performance (i.e. by first solidification glue-line 202 and ambient atmosphere environment every
From so that solidifying the structures such as glass cream 204, the display device unit in glue-line 202 positioned at first is in a sealing
Environment in)；In addition, being based on approximate technology, if the second solidification glue-line 203 is photoexpansion agent, then illumination can be used
Penetrating curing process solidifies the second solidification glue-line 203, and same photoexpansion agent can also be expanded when illuminated, that is, be closed on
Second solidification glue-line 203 of the foreign particles 206 stated can be illuminated by the light and expand, and then will fill up into gap 207, thus can also
So that the second solidification glue-line 203 has Packed performance, as long as enabling to the second solidification glue-line 203 to have by curing process
Sealing can be filled up for gap 207 by having the effect of expansion, so that glass cream 204 gives each display device unit
Individually after sealing, cutting technique is carried out, to complete the preparation process of the panel (panel) of display device.
Referring to shown in Fig. 3 B, second after demonstrating the solidification referred in the present invention well solidifies the inside of glue-line 2031
Region is how effectively to completely cut off external moisture environment, in whole big version before glass cream Frit is binded two editions sintering using laser
Outermost does outline border sealant using the first solidification glue-line 202 and the second solidification glue-line 203 and temporarily fixes backboard 205 and lid
Plate 201 and the atmosphere for keeping backboard and cover board inner sealing.Even if there is undesirable foreign particles as shown in Figure 3B
(particle) 206 scripts for being blown into or falling in 201 bottom surface of cover board because of a variety of causes need to coat the second solidification glue
At the position of layer 203, although continuing to be coated with the second solidification glue-line 203 in the case where there being foreign matter, nationality by it is external Lai
Foreign particles 206 and to result in the second solidification glue-line 203 be no longer the state that preferably fits closely with the top surface of cover board 201,
It is formed about to be located in 206 lateral wall circumference of foreign particles and solidifies the gap between glue-line 203 and the top surface of cover board 201 second.
At this point, the second solidification glue-line 203 for closing on gap 207 can be induced since the second solidification glue-line 203 can be expanded in curing process
Dilation can squeeze gap 207 until the disappearance of gap 207, i.e., the second solidification glue-line induced originally by foreign particles 206
The connected pathways (such as gap 207 in Fig. 2 C) of confined space and external environment inside 203 is full of and is disappeared by compression, then
Even if there are in the case where foreign particles (particle) 206, a default chamber being confined between the backboard 205, cover board 201
Room is still a closed environment, and extraneous vapour atmosphere will not invade among this closed space, in other words, foreign particles
206 destructions caused are suppressed.In this way, execute the package sealing with laser (Laser sealing) of glass cream Frit again then
It need not worry the destruction of steam, this scheme bring beneficial effect is that the prior art can not reach.
So the second solidification glue-line 203 just has good leakproofness, i.e. backboard after carrying out above-mentioned curing process
205, a default chamber being confined between cover board 201 be still it is closed, to ensure 202 adhesion of the first solidification glue-line
Can, it improves subsequent laser package (Laser sealing) and resists the range of foreign body intrusion, and then effectively avoid glass cream
204 and its internal display device unit reacted since sealing effect is bad with external water, oxygen etc. so that full page is because of water oxygen
Invasion or atmosphere fail the generation of the defects of forming Newton's ring and scrapping.
In addition, in order to avoid because of frame glue external caused by foreign body intrusion (the first such as above-mentioned solidification glue-line and/or second
Solidify glue-line) reduction of sealing performance, can also coat sealing material in the inside and or outside of said external frame glue (can be heat
Cause the setting expansions such as swelling agent or photoexpansion agent materials), and using the sealing material by it is above-mentioned because foreign particles there are due to
Caused gap is sealed, and specific operating procedure those skilled in the art can solidify the swollen of glue-line based on above-mentioned second
Swollen sealing is operated, therefore just not tires out state herein；Certainly, other materials also can be used in above-mentioned sealing material, as long as that is,
Gap can be given sealing by above-mentioned sealing material.
It should be pointed out that the in the present embodiment second material for solidifying glue-line and sealing material may each be diversification
, in some embodiments, thermotropic swelling agent (such as azo-compound, sulfonyl hydrazines compound, nitroso compound can be used
Deng) or the similar gap filling material such as photoexpansion agent.In one alternate embodiment, when using thermotropic swelling agent
When, be suitably to carry out heating process, then thermotropic swelling agent will squeeze into or among the gap of Fig. 2 C 207 and can because by
Heat and further solidify, firmly gap 207 is filled full, and can ensure that being not easy to get through foreign particles 206 again is induced
The second connected pathways for solidifying confined space and external environment inside glue-line 203.In another alternative embodiment, when adopting
It is suitably to be irradiated using light when with photic swelling agent, then photoexpansion agent can squeeze into or into the gap of Fig. 2 C
Can solidify among 207 and further because of irradiation, firmly gap 207 is filled it is full, and can ensure be not easy to get through again it is different
The second connected pathways for solidifying confined space and external environment inside glue-line 203 that composition granule 206 is induced.In gap 207
The laser sintered of glass cream Frit can be executed after being filled again.It is clear that in the present invention, the outline border for changing outer ring is close
Adhesive material, the gap filling materials such as the thermotropic expansion of use or photoexpansion, and then fill up by foreign particles Particle
Caused by hole, maintain version be used for dispose AMOLED device internal chamber sealing atmosphere, plurality of advantages can be brought,
Such as: the failure of outline border sealant caused by preventing because of foreign matter, so that entire chamber fails because of water oxygen invasion or atmosphere and to form newton
Ring is scrapped.And the failure effect journey that strong can be reduced glass cream Frit and execute package sealing with laser (Laser sealing)
Degree can control negative effect range near foreign matter.
Embodiment two
Can be based on the above embodiment on the basis of one, A~3C is it is found that the application also describes a kind of AMOLED referring to fig. 2
Display device, main includes the cover board 201 and backboard 205 (such as LTPS substrate) for being provided with OLED, and the cover board 201 with it is above-mentioned
Backboard 205 be bonded.
Further, above-mentioned backboard 205 has upper face and the lower surface relative to upper face, and backboard
There is the display device area for being provided with several display units on 205 upper face；Cover board 201 then has bottom surface and phase
For the top surface of bottom surface, and the display device area then corresponded on backboard 205 in the bottom surface of cover board 201 is provided with
It shows seal area, and is provided in the display seal area of cover board 201 and several displays correspondingly of above-mentioned several display units
Unit seal area.
Preferably, the AMOLED display device in the present embodiment may include glass cement 204, and the glass cement 204 is set to
It is independent close together to give each display unit with cover board 201 and backboard 205 in the display unit seal area of cover board 201
It closes and.
Further, the AMOLED display device in the present embodiment further includes the first solidification glue-line 202 and/or the second solidification
Glue-line 203, and the edge of cover board 201 and backboard 205 passes through the first solidification glue-line 202 and/or the second solidification glue-line sealing 203
Sealing, and the first material for solidifying glue-line 202 is different from the second material for solidifying glue-line 203, such as the first solidification glue-line 202 is
Ultraviolet curing glue, and the second solidification glue-line 203 is then thermotropic swelling agent (such as azo-compound, sulfonyl hydrazines compound or Asia
Nitro compound etc.) or photoexpansion agent etc..
Preferably, above-mentioned first solidifies glue-line 202 and surrounds several above-mentioned display units, and the second solidification glue-line
203 surround the first solidification glue 202, and by the first above-mentioned solidification glue 202, glass after second solidifies 203 setting expansion of glue-line
Cream 204 and several display units are sealed.
It should be noted that due to having carried out more detailed elaboration to AMOLED display device in embodiment one,
Therefore duplicate part is not repeated herein in embodiment, but those skilled in the art should understand that, embodiment one
Described in the relevant technologies feature may be applicable in the present embodiment in the technical solution of AMOLED display device.
More than, by description and accompanying drawings, give the exemplary embodiments of the specific structure of specific embodiment, foregoing invention
Existing preferred embodiment is proposed, but these contents are not intended as limiting to.For a person skilled in the art, in reading
State it is bright after, various changes and modifications undoubtedly will be evident.Therefore, appended claims, which should be regarded as, covers the present invention
True intention and range whole variations and modifications.In Claims scope the range of any and all equivalences with it is interior
Hold, is all considered as still belonging to the intent and scope of the invention.
Claims (10)
1. a kind of packaging method of AMOLED display device, which is characterized in that the described method includes:
The backboard for being provided with display device area is provided, and several being provided on the backboard in the display device area
Display unit；
The cover board for being provided with display seal area corresponding with the display device area on the backboard is provided, and the display is close
The cover board in envelope area is provided with and several display units several display unit seal areas correspondingly；
Coating forms the glass cement with closed figures in display unit seal area described each of on the cover board；
In the edge of the display seal area on cover board coating the first solidification glue-line to form a closed figures；
Solidify on the cover board on the outside of glue-line the second solidification of coating glue-line described first to form a closed figures, and described
Second material for solidifying glue-line is different from the described first material for solidifying glue-line；
The cover board is conformed on the backboard, makes described first to solidify glue-line and is sheathed on the outer of several display units
It encloses, and each display unit is surrounded by the glass cement；And
Solidify the first solidification glue-line and the second solidification glue-line；
The second solidification glue-line is thermotropic swelling agent or photoexpansion agent.
2. packaging method according to claim 1, which is characterized in that the first solidification glue-line is ultraviolet curing glue.
3. packaging method according to claim 1, which is characterized in that when the second solidification glue-line is thermotropic swelling agent；
After the first solidification curable adhesive layer, continue to carry out the technique that is heating and curing to the thermotropic swelling agent.
4. packaging method according to claim 3, which is characterized in that the thermotropic swelling agent is azo-compound, sulphonyl
Hydrazine class compound or nitroso compound.
5. packaging method according to claim 1, which is characterized in that when the second solidification glue-line is photoexpansion agent；
After the first solidification curable adhesive layer, continue to carry out the photoexpansion agent light irradiation curing process.
6. the packaging method according to claim 3 or 5, which is characterized in that further include:
After solidifying the first solidification glue-line and the second solidification glue-line, the glass cement is solidified, so that each
The display unit is independent sealed.
7. a kind of AMOLED structure characterized by comprising
Backboard has upper face and the lower surface relative to the upper face, and the upper face of the backboard
It is upper that there is the display device area for being provided with several display units；
Cover board has bottom surface and the top surface relative to the bottom surface, in the bottom surface of the cover board
The display device area on the corresponding backboard is provided with display seal area, and sets in the display seal area of the cover board
It is equipped with and several display units several display unit seal areas correspondingly；
Glass cement is set in the display unit seal area of the cover board, so that each display unit is by independence
Sealing；And
The edge of the cover board and the backboard passes through the first solidification glue-line and the second solidification glue-line sealing, and described first is solid
The material for changing glue-line is different from the described second material for solidifying glue-line；
The second solidification glue-line is thermotropic swelling agent or photoexpansion agent.
8. AMOLED structure according to claim 7, which is characterized in that the first solidification glue-line is ultraviolet curing
Glue.
9. AMOLED structure according to claim 7, which is characterized in that the thermotropic swelling agent is azo-compound, sulphur
Hydrazide kind compound or nitroso compound.
10. AMOLED structure according to claim 7, which is characterized in that the first solidification glue-line surrounds described several
A display unit, the second solidification glue-line surround first solidification glue.
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| CN109817822B (en) * | 2019-01-09 | 2021-09-21 | 昆山工研院新型平板显示技术中心有限公司 | Film layer structure, display panel and display device |
| CN112614959B (en) * | 2020-12-16 | 2022-10-04 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN117082794A (en) * | 2023-10-13 | 2023-11-17 | 苏州熹联光芯微电子科技有限公司 | Protective structure, preparation method thereof and optical communication module |
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| KR100647713B1 (en) * | 2005-11-23 | 2006-11-23 | 삼성에스디아이 주식회사 | Organic light emitting display device |
| CN103346268A (en) * | 2013-06-24 | 2013-10-09 | 京东方科技集团股份有限公司 | Encapsulating method for encapsulating components, array substrates, display devices and OLED components |
| CN104299981A (en) * | 2014-09-22 | 2015-01-21 | 京东方科技集团股份有限公司 | OLED display panel, packaging method of OLED display panel and OLED display device |
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| KR100647713B1 (en) * | 2005-11-23 | 2006-11-23 | 삼성에스디아이 주식회사 | Organic light emitting display device |
| CN103346268A (en) * | 2013-06-24 | 2013-10-09 | 京东方科技集团股份有限公司 | Encapsulating method for encapsulating components, array substrates, display devices and OLED components |
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Address after: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |