CN106695145A - Welding method for target material - Google Patents
Welding method for target material Download PDFInfo
- Publication number
- CN106695145A CN106695145A CN201510789592.4A CN201510789592A CN106695145A CN 106695145 A CN106695145 A CN 106695145A CN 201510789592 A CN201510789592 A CN 201510789592A CN 106695145 A CN106695145 A CN 106695145A
- Authority
- CN
- China
- Prior art keywords
- target material
- welding
- backboard
- target
- material body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 75
- 239000013077 target material Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052738 indium Inorganic materials 0.000 claims description 10
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 10
- 230000001680 brushing effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 abstract description 8
- 238000010923 batch production Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a welding method for a target material. The welding method includes the following steps that a preset number of copper wires are arranged on the connecting face of a target material body and a backboard; the target material body and the backboard are welded into a whole by means of manual operation; and pressure is applied to the target material body and the backboard which are welded together twice. According to the welding method for welding the target material, the mode of manual operation replaces a mechanical welding operation mode, the using amount of solder can be decreased obviously, and production cost is reduced. Moreover, the phenomena that breakage and waste of the solder used in welding are excessive, client-side using of the target material is influenced by repeated welding, the dimension of target material products offsets due to the fact that thermal expansion deformation is increased after repeated welding, crystal orientation of crystalline grains inside the target material is changed for the reason that the target material is excessively heated through repeated welding, and client-side target material sputtering is abnormal because of the changed crystal orientation of the crystalline grains are avoided. Therefore, the welding percent of pass is further increased, and the welding percent of pass of the target material products in batch production can reach 98% or above.
Description
Technical field
The present invention relates to LCD manufacturing technology fields, more particularly to a kind of welding method of target.
Background technology
LCD is the abbreviation of English Liquid Crystal Display, i.e. liquid crystal display, is a kind of numeral
Display Technique, can filter light source by liquid crystal and coloured filter, and image is produced on flat panel.
, it is necessary to form the film for meeting job requirement using sputtering technology in the manufacturing process of LCD.Splash
Penetrate the target used in technology to be welded on backboard, that is to say, that in the production process of target product
Need to carry out the welding operation of target and backboard.
In the prior art, target is usually that reverse welding is carried out using welding equipment, but uses weldering
The equipment of connecing is subjected to, and not only the amount of coming into operation of target is larger causes production cost high, and weldering
Connect qualification rate relatively low, it is necessary to carry out repeatedly returning weldering, and then generate to weld to be lost using solder and discarded
The client of many, multiple welding influence target is caused using making thermal expansion deformation amount increase after, multiple welding
Target product size occurs deviation, multiple welding makes that target is heated to cause target internal grain crystal orientation to change more
Become, the change of crystal grain crystal orientation causes many defects such as the target as sputter exception of client, has had a strong impact on target
The quality of product.
Therefore, how further to improve the quality of production of target product, be current those skilled in the art urgently
Problem to be solved.
The content of the invention
In view of this, the present invention is directed to propose a kind of new target material welding method, whole steps of the method
It is rapid by manually being operated, it is to avoid the use of welding equipment, reduce the amount of coming into operation of target,
Solder yield is also improved, so as to further increase the quality of production of target product.
In order to achieve the above object, the technical proposal of the invention is realized in this way：
A kind of welding method of target, for target material body and backboard to be welded together, it includes following
Step：
1) copper wire of predetermined quantity is set on the joint face of the target material body and the backboard；
2) target material body and the backboard are welded as a whole by artificial operation；
3) second pressure is applied to the target material body for connecting as one and the backboard.
Further, in the welding method of above-mentioned target, welded in the target material body and the backboard
During, specifically include：
21) when the target material body and the backboard start contact, the target material body is applied to make institute
State the first time pressure that the gas between target material body and the backboard is all discharged；
22) target material body and the backboard and then are at the uniform velocity overturn, until welding is completed.
Further, in the welding method of above-mentioned target, the predetermined number of the copper wire is 7-11 roots.
Further, in the welding method of above-mentioned target, second pressure being continuously applied after the completion of welding
It is 7350N-12250N to be worth.
Further, in the welding method of above-mentioned target, weld the target material body and the backboard is used
Solder be pure indium solder.
Further, in the welding method of above-mentioned target, it is subjected to using the pure indium solder
Before, also including the oxide skin for brushing the pure indium solder using wire brush the step of.
The welding method of the target that the present invention is provided, first before welding starts, in target material body and backboard
Between the copper wire of predetermined quantity is set, copper wire is located on joint face between target material body and backboard, so
After start welding operation, this welding operation is completed by artificial operation, again to target sheet after the completion of welding
Body and backboard are continuously applied second pressure, and pressure value is to meet the pre- of technological requirement by what experiment drew
If pressure value.The welding method of above-mentioned welding target, machinery welding is replaced using manually-operated mode
Mode of operation, can substantially reduce the usage amount of solder, make production cost be minimized, but also in target
A number of copper wire, and target material body and the back of the body to connecting as one are provided between material body and backboard
Plate applies pressure, can further improve solder yield, makes product quality be improved.
Additionally, while target material body and backboard is welded, the wink of contact is started in target material body and backboard
Between, i.e. the starting stage of welding operation, by manually applying first time pressure to target material body, make target
The oxide skin of air and residual between body and backboard is all discharged, and in the follow-up phase of welding, then is delayed
Slowly upset target material body and backboard, at the uniform velocity is until welding completion, can further improve welding matter
Amount, the reasonable rate of order welding is significantly improved, so that the target solder yield of batch production reaches 98%
More than.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to reality
The accompanying drawing to be used needed for example or description of the prior art is applied to be briefly described, it should be apparent that, below
Accompanying drawing in description is only embodiments of the invention, for those of ordinary skill in the art, not
On the premise of paying creative work, other accompanying drawings can also be obtained according to the accompanying drawing for providing.
Fig. 1 is the integrated operation flow chart of the welding method of target provided in an embodiment of the present invention；
Fig. 2 is the operational flowchart of welding step.
Specific embodiment
The present invention is directed to propose a kind of new target material welding method, the Overall Steps of the method are by people
Work is operated, it is to avoid the use of welding equipment, reduces the amount of coming into operation of target, is also improved
Solder yield, so as to further increase the quality of production of target product.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of protection of the invention.
As depicted in figs. 1 and 2, the welding method of target provided in an embodiment of the present invention, completely using people
Work is operated, and it comprises the following steps：
S101, on the joint face of target material body and backboard set predetermined quantity copper wire；
S102, target material body and backboard are welded as a whole by artificial operation, it specifically includes two behaviour
Make step：S201 target material body and backboard start contact when, to target material body apply make target material body with
The first time pressure that gas between backboard is all discharged；S202 and then at the uniform velocity upset target material body and backboard,
Until welding is completed；
S103, target material body and backboard to connecting as one apply second pressure.
The specific operation process of the above method is：Copper wire is set first, by the copper wire of predetermined quantity set with
Between target material body and backboard so that copper wire can after welding be located at the joint face of target material body and backboard
On；Then target material body and backboard are welded as solder from the pure indium without other materials,
In the moment that the starting stage that welding operation starts, i.e. target material body and backboard start to contact, to target sheet
Body is downwardly applied to first time pressure, the size of the first time pressure of applying with ensure target material body and backboard it
Between air and oxide skin by discharge all of standard, in the follow-up phase after the starting stage, to target sheet
Body and backboard carry out turning operation, and slow, being carried out to target material body and backboard at the uniform velocity is needed in upset
Upset；It is continuously applied again after target material body and backboard are welded as a whole second of a period of time
Pressure, whole welding operation is fully completed.
The welding method of above-mentioned welding target, the operation side of machinery welding is replaced using manually-operated mode
Formula, can substantially reduce the usage amount of solder, make production cost be minimized, and also avoid welding
Heat is made after losing discarded excessive, multiple welding influence target client use, multiple welding using solder
The increase of dilatancy amount causes target product size generation deviation, multiple welding to make, and target is heated to be caused more
Situations such as target internal grain crystal orientation changes, crystal grain crystal orientation changes the target as sputter exception for causing client
Occur, so as to further increase solder yield, make product quality be improved.
Additionally, while target material body and backboard is welded, the wink of contact is started in target material body and backboard
Between, i.e. the starting stage of welding operation, by manually applying first time pressure to target material body, make target
The oxide skin of air and residual between body and backboard is all discharged, and in the follow-up phase of welding, then is delayed
Slowly upset target material body and backboard, at the uniform velocity is until welding completion, can further improve welding matter
Amount, the reasonable rate of order welding is significantly improved, so that the target Product jointing qualification rate of batch production reaches
To more than 98%.
In this example, the setting quantity of copper wire can be according to the different size of target product, by experiment
Different optimal number scopes are drawn, the present embodiment is preferred, for the target product of model G4.5, copper
The setting quantity of silk is 7-9 roots, more preferably 7；For the target product of model G5, copper wire
Setting quantity is 9-11 roots, more preferably 9.
In the welding method of the target that the present embodiment is provided, target material body and backboard are applied in final step
Plus the concrete operations of second pressure are to place briquetting in target material body and backboard, by setting briquetting
Weight makes target material body and backboard bear default second pressure, and the span of pressure value is
7350N-12250N.The present embodiment it is also preferred that for the target product of model G4.5, briquetting
Weight is that the pressure that 750kg-800kg, i.e. target material body and backboard bear is 7350N-7840N, more preferably
The weight of briquetting is that the pressure that 750kg, i.e. target material body and backboard bear is 7350N；For model
The target product of G5, the weight of briquetting is the pressure that 1200kg-1250kg, i.e. target material body and backboard bear
Power is 11760N-12250N, and more preferably the weight of briquetting is that 1200kg, i.e. target material body and backboard bear
Pressure be 11760N.
Preferably, the welding method of the target that the present embodiment is provided, welding behaviour is being carried out using pure indium solder
Before work, also including the oxide skin for brushing pure indium solder using wire brush the step of.In the present embodiment, indium weldering
Expect the oxide skin on surface, be manually to be scraped using wire brush, brush operation and remove, this and existing skill
The mode eliminated using steel knife in art is compared, and can more save solder, reduces production cost, also more
Plus it is adapted to follow-up operating procedure, make the effect of subsequent operation more protrude.
Each embodiment is described by the way of progressive in this specification, and each embodiment is stressed
The difference with other embodiment, between each embodiment remaining identical similar portion mutually referring to
.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use
The present invention.Various modifications to these embodiments will be for those skilled in the art aobvious and easy
See, generic principles defined herein can without departing from the spirit or scope of the present invention,
Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein,
And it is to fit to the most wide scope consistent with principles disclosed herein and features of novelty.
Claims (6)
1. a kind of welding method of target, for target material body and backboard to be welded together, its feature exists
In comprising the following steps：
1) copper wire of predetermined quantity is set on the joint face of the target material body and the backboard；
2) target material body and the backboard are welded as a whole by artificial operation；
3) second pressure is applied to the target material body for connecting as one and the backboard.
2. the welding method of target according to claim 1, it is characterised in that in the target sheet
During body and the backboard are welded, specifically include：
21) when the target material body and the backboard start contact, the target material body is applied to make institute
State the first time pressure that the gas between target material body and the backboard is all discharged；
22) target material body and the backboard and then are at the uniform velocity overturn, until welding is completed.
3. the welding method of target according to claim 1, it is characterised in that the copper wire it is pre-
If quantity is 7-11 roots.
4. the welding method of target according to claim 1, it is characterised in that held after the completion of welding
Continuous second pressure value for applying is 7350N-12250N.
5. the welding method of the target according to any one in claim 1-4, it is characterised in that
It is pure indium solder to weld the solder that the target material body and the backboard use.
6. the welding method of target according to claim 5, it is characterised in that using described pure
Before indium solder is subjected to, also including brushing the step of the oxide skin of the pure indium solder using wire brush
Suddenly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510789592.4A CN106695145A (en) | 2015-11-17 | 2015-11-17 | Welding method for target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510789592.4A CN106695145A (en) | 2015-11-17 | 2015-11-17 | Welding method for target material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106695145A true CN106695145A (en) | 2017-05-24 |
Family
ID=58932465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510789592.4A Pending CN106695145A (en) | 2015-11-17 | 2015-11-17 | Welding method for target material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106695145A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108544045A (en) * | 2018-04-20 | 2018-09-18 | 宁波江丰电子材料股份有限公司 | A kind of tungsten target material welding method and tungsten target material component |
| CN108790365A (en) * | 2018-06-07 | 2018-11-13 | 苏州精美科光电材料有限公司 | A kind of device and method ensureing indium layer thickness evenness |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317668A (en) * | 1987-06-18 | 1988-12-26 | Seiko Epson Corp | Target for sputtering |
| JPH03111564A (en) * | 1989-06-15 | 1991-05-13 | Hitachi Metals Ltd | Target assembly for vapor deposition and its production |
| JPH1046327A (en) * | 1996-07-31 | 1998-02-17 | Sumitomo Chem Co Ltd | Sputtering target and method for manufacturing the same |
| US6085966A (en) * | 1996-12-04 | 2000-07-11 | Sony Corporation | Sputtering target assembly production method |
| EP1473105A2 (en) * | 2003-04-28 | 2004-11-03 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation |
| CN1986133A (en) * | 2006-07-28 | 2007-06-27 | 宁波江丰电子材料有限公司 | Soldering process |
| CN102039459A (en) * | 2010-11-18 | 2011-05-04 | 宁波江丰电子材料有限公司 | Target material welding method |
-
2015
- 2015-11-17 CN CN201510789592.4A patent/CN106695145A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63317668A (en) * | 1987-06-18 | 1988-12-26 | Seiko Epson Corp | Target for sputtering |
| JPH03111564A (en) * | 1989-06-15 | 1991-05-13 | Hitachi Metals Ltd | Target assembly for vapor deposition and its production |
| JPH1046327A (en) * | 1996-07-31 | 1998-02-17 | Sumitomo Chem Co Ltd | Sputtering target and method for manufacturing the same |
| US6085966A (en) * | 1996-12-04 | 2000-07-11 | Sony Corporation | Sputtering target assembly production method |
| EP1473105A2 (en) * | 2003-04-28 | 2004-11-03 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation |
| CN1986133A (en) * | 2006-07-28 | 2007-06-27 | 宁波江丰电子材料有限公司 | Soldering process |
| CN102039459A (en) * | 2010-11-18 | 2011-05-04 | 宁波江丰电子材料有限公司 | Target material welding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108544045A (en) * | 2018-04-20 | 2018-09-18 | 宁波江丰电子材料股份有限公司 | A kind of tungsten target material welding method and tungsten target material component |
| CN108790365A (en) * | 2018-06-07 | 2018-11-13 | 苏州精美科光电材料有限公司 | A kind of device and method ensureing indium layer thickness evenness |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170714 Address after: The New District of Hefei City, Anhui Province, East Road and road intersection southwest corner station Yu Industrial Park A District E group dormitory building 15 Applicant after: Hefei Jiang Feng Electronic Materials Co., Ltd. Address before: 315400 Ningbo, Yuyao province science and Technology Industrial Park Road, No. 198, No. Applicant before: NINGBO JIANGFENG ELECTRONIC MATERIAL CO., LTD. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |