CN106684077A - RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process - Google Patents
RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process Download PDFInfo
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- CN106684077A CN106684077A CN201710123580.7A CN201710123580A CN106684077A CN 106684077 A CN106684077 A CN 106684077A CN 201710123580 A CN201710123580 A CN 201710123580A CN 106684077 A CN106684077 A CN 106684077A
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- Prior art keywords
- chip
- rgbled
- pole
- chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an RGBLED (Red Green Blue Light Emitting Diode) structure. The RGBLED structure comprises a shell, chips, guide wires, a glue layer, bracket pins, polar posts and a conducting layer, wherein the bracket pins are inserted at the four corners of the shell; the chips are arranged in the shell and are connected by the guide wires; and the polar posts are fixedly arranged on the conducting layer. A preparation process comprises the following steps: step (1) fixed installation of the chips; step (2) connection of the chips; step (3) fixed package of the chips; step (4) peeling of resin sheets; step (5) bonding of the conducting layer and the polar posts; step (6) removal of the conducting layer; and step (7) cutting and molding. According to the RGBLED structure and the preparation process disclosed by the invention, the smallest size of a product can be achieved, the reliability of the product is enhanced, the cost is reduced and the pollution is alleviated.
Description
Technical field
The present invention relates to RGB lamp bead technical fields, and in particular to a kind of RGBLED structures and preparation technology.
Background technology
RGB lamp beads are three kinds of chips of red, green, blue to be bonded on support by glue,（Wherein due to commonly using red light chips
One side only has single polarity, and its glue of bonding is conducting resinl, except bonding, it may also be used for conductive；And it is blue, green with according to applied field
The change of demand in one's power, insulating cement and conducting resinl may be used, and the electrode and support of chip then be connected by lead, finally
Glue protection chip and lead are injected in the bracket.
In prior art, RGBLED structures and preparation technology have the following disadvantages：
1：Long the production cycle；
2：Equipment cost is high；
3：It is relatively costly after product miniaturization；
4：The production procedure of support can produce plating pollution；
5：Reliability is relatively poor（The main cause that lamp bead fails is caused to be bad caused by bonding wire）；
6：Single process automation degree is very high, but cannot realize automatization's line.
Therefore, design is with a kind of simple structure, and it is that prior art needs to solve that reduces cost reduces the RGB lamp beads for polluting
Technical problem.
The content of the invention
It is an object of the invention to provide a kind of RGBLED structures and its preparation technology, its product size can accomplish more
Little, the reliability of product strengthens, and cost reduces and reduce pollution.
For achieving the above object, the present invention provides following technical scheme：A kind of RGBLED structures, including shell, chip, lead
Line, glue layer, support pin, pole and conductive layer；The support pin is plugged in the corner location of shell；The chip is arranged
In inside the shell, and chip is connected by wire；The pole is fixedly mounted on the electrically conductive.
Further, the wire is provided with altogether 5.
Further, chip includes two edematus chips and a brown chip.
A kind of preparation technology of RGBLED structures, comprises the following steps：Step one, chip fixed installation；Step 2,
Chip connects；Step 3, chip fixes encapsulation；Step 4, resin sheet is peeled off；Step 5, conductive layer is combined with pole；Step
Six, conductive layer is removed；Step 7, excision forming；
Wherein in described step one, multigroup chip is fixed on patch double-side membrane carrier, wherein every group of chip includes 3 cores
Piece and 1 pole；The electrode of the chips of red, green, blue three down, increases a pole newly；
In described step two, the bottom of the red light chips of every group of chip is connected with pole using conducting resinl；
In described step three, the carrier for securing multigroup chip is put into mould inclosure transparent resin and fixes chip；
The resin sheet of the multigroup chip of band after solidification is peeled off from carrier in described step four；
In described step five, growing conductive layer in chip electrode face makes it combine closely with chip electrode and pole；
In described step six, conductive layer redundance is removed, leave appropriate circuitry conductive as " pin " or growth
Grow according to initialization circuit during layer.
In described step seven, the resin sheet of the multigroup chip of band is become into single group resin sheet by cutting mode.
As the further technical scheme of the present invention, in described step one, the newly-increased bottom for red light chips with
The connection of blue, green chip same sex electrode.
Compared with prior art, the invention has the beneficial effects as follows：The present invention, product size can accomplish less, product
Reliability strengthens, and cost reduces and reduce pollution.
Description of the drawings
Fig. 1 is the internal structure schematic diagram of the present invention；
Fig. 2 is the external structure schematic diagram of the present invention；
Fig. 3 is the explosive view of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1-3 are referred to, the present invention provides a kind of technical scheme：A kind of RGBLED structures, including shell 1, chip 2, lead
Line 3, glue layer 4, support pin 5, pole 6 and conductive layer 7；The support pin 5 is plugged in the corner location of shell 1；It is described
Chip 2 is arranged in shell 1, and chip 2 is connected by wire 3；The pole 6 is fixedly mounted on conductive layer 7.
Further, the wire 3 is provided with altogether 5.
Further, chip 2 includes two edematus chips and a brown chip.
A kind of preparation technology of RGBLED structures, comprises the following steps：Step one, chip fixed installation；Step 2,
Chip connects；Step 3, chip fixes encapsulation；Step 4, resin sheet is peeled off；Step 5, conductive layer is combined with pole；Step
Six, conductive layer is removed；Step 7, excision forming；
Wherein in described step one, multigroup chip is fixed on patch double-side membrane carrier, wherein every group of chip includes 3 cores
[electrode of the chips of red, green, blue three down, increases a pole newly for piece and 1 pole；
In described step two, using conducting resinl（Or bonding wire craft connects wire）By the bottom of the red light chips of every group of chip
Portion is connected with pole；
In described step three, the carrier for securing multigroup chip is put into mould inclosure transparent resin and fixes chip；
The resin sheet of the multigroup chip of band after solidification is peeled off from carrier in described step four；
In described step five, growing conductive layer in chip electrode face makes it combine closely with chip electrode and pole；
In described step six, conductive layer redundance is removed, leave appropriate circuitry conductive as " pin " or growth
Grow according to initialization circuit during layer.
In described step seven, the resin sheet of the multigroup chip of band is become into single group resin sheet by cutting mode.
As the further technical scheme of the present invention, in described step one, the newly-increased bottom for red light chips with
The connection of blue, green chip same sex electrode.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding can carry out various changes, modification, replacement to these embodiments without departing from the principles and spirit of the present invention
And modification, the scope of the present invention be defined by the appended.
Claims (5)
1. a kind of RGBLED structures, including shell, chip, wire, glue layer, support pin, pole and conductive layer；The support
Pin is plugged in the corner location of shell；The chip is arranged on inside the shell, and chip is connected by wire；The pole is fixed
Install on the electrically conductive.
2. a kind of preparation technology of RGBLED structures, comprises the following steps：Step one, chip fixed installation；Step 2, chip connects
Connect；Step 3, chip fixes encapsulation；Step 4, resin sheet is peeled off；Step 5, conductive layer is combined with pole；Step 6, it is conductive
Layer is removed；Step 7, excision forming；
Wherein in described step one, multigroup chip is fixed on patch double-side membrane carrier, wherein every group of chip includes 3 cores
Piece and 1 pole；The electrode of the chips of red, green, blue three down, increases a pole newly；
In described step two, the bottom of the red light chips of every group of chip is connected with pole using conducting resinl；
In described step three, the carrier for securing multigroup chip is put into mould inclosure transparent resin and fixes chip；
The resin sheet of the multigroup chip of band after solidification is peeled off from carrier in described step four；
In described step five, growing conductive layer in chip electrode face makes it combine closely with chip electrode and pole；
In described step six, conductive layer redundance is removed, leave appropriate circuitry conductive as " pin " or growth
Grow according to initialization circuit during layer；
In described step seven, the resin sheet of the multigroup chip of band is become into single group resin sheet by cutting mode.
3. a kind of RGBLED structures according to claim 1, it is characterised in that：The wire is provided with altogether 5.
4. a kind of RGBLED structures according to claim 1, it is characterised in that：Chip include two edematus chips and
One brown chip.
5. the preparation technology of a kind of RGBLED according to claim 2, it is characterised in that：A kind of preparation of RGBLED structures
In step one described in technique, the connection of the newly-increased bottom for red light chips and blue, green chip same sex electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710123580.7A CN106684077B (en) | 2017-03-03 | 2017-03-03 | RGBLED structure and preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710123580.7A CN106684077B (en) | 2017-03-03 | 2017-03-03 | RGBLED structure and preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106684077A true CN106684077A (en) | 2017-05-17 |
| CN106684077B CN106684077B (en) | 2023-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710123580.7A Active CN106684077B (en) | 2017-03-03 | 2017-03-03 | RGBLED structure and preparation process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108459438A (en) * | 2018-04-11 | 2018-08-28 | 陈官海 | A kind of manufacture craft of ultra-thin RGB three primary colours back light |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070194465A1 (en) * | 2006-02-20 | 2007-08-23 | Ming-Ji Dai | Light emitting diode package structure and fabricating method thereof |
| CN102544262A (en) * | 2012-01-17 | 2012-07-04 | 成都泰鼎科技有限公司 | LED (light-emitting diode) chip packaging process |
| CN102760825A (en) * | 2011-04-28 | 2012-10-31 | 株式会社东芝 | LED package and method for manufacturing same |
| CN203071066U (en) * | 2013-02-01 | 2013-07-17 | 深圳市新月光电有限公司 | Parallelly connected welding wire structure of LED lamp |
| CN104319273A (en) * | 2014-10-30 | 2015-01-28 | 夏洪涛 | Led light source |
| CN206480625U (en) * | 2017-03-03 | 2017-09-08 | 陈官海 | A kind of RGBLED structures |
-
2017
- 2017-03-03 CN CN201710123580.7A patent/CN106684077B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070194465A1 (en) * | 2006-02-20 | 2007-08-23 | Ming-Ji Dai | Light emitting diode package structure and fabricating method thereof |
| CN102760825A (en) * | 2011-04-28 | 2012-10-31 | 株式会社东芝 | LED package and method for manufacturing same |
| CN102544262A (en) * | 2012-01-17 | 2012-07-04 | 成都泰鼎科技有限公司 | LED (light-emitting diode) chip packaging process |
| CN203071066U (en) * | 2013-02-01 | 2013-07-17 | 深圳市新月光电有限公司 | Parallelly connected welding wire structure of LED lamp |
| CN104319273A (en) * | 2014-10-30 | 2015-01-28 | 夏洪涛 | Led light source |
| CN206480625U (en) * | 2017-03-03 | 2017-09-08 | 陈官海 | A kind of RGBLED structures |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108459438A (en) * | 2018-04-11 | 2018-08-28 | 陈官海 | A kind of manufacture craft of ultra-thin RGB three primary colours back light |
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| Publication number | Publication date |
|---|---|
| CN106684077B (en) | 2023-05-23 |
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