CN106659021A - Assembly method of an embedded part, electronic equipment shell and electronic equipment - Google Patents
Assembly method of an embedded part, electronic equipment shell and electronic equipment Download PDFInfo
- Publication number
- CN106659021A CN106659021A CN201611248739.XA CN201611248739A CN106659021A CN 106659021 A CN106659021 A CN 106659021A CN 201611248739 A CN201611248739 A CN 201611248739A CN 106659021 A CN106659021 A CN 106659021A
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- China
- Prior art keywords
- groove
- casting
- electronic device
- embedded components
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides an assembly method of an embedded part. The assembly method is applied to electronic equipment and belongs to the technical field of mobile communication. The method comprises the steps of processing an outer surface of an electronic equipment shell to obtain a first groove matched with the shape of the outer surface of the embedded part; fixing the electronic equipment shell in the first groove in the electronic equipment shell outside the first groove; processing an inner surface of the electronic equipment shell to obtain a second groove communicating with the first groove; and assembling the embedded part in a groove space formed by the first groove and the second groove. With the method disclosed by the embodiment of the invention, the problem that a product shell in the embedded part is not matched with an external product shell caused by after the product shell filled in the embedded part is easy to separate from the external product shell during the assembly process in the prior art is solved.
Description
Technical field
The present invention relates to mobile communication technology field, more particularly to a kind of assembly method of embedded components, electronics set
Standby housing and electronic equipment.
Background technology
In the assembling process of product, the situation for needing that embedded components are assembled in product surface is frequently encountered, for example：
Brand identity is set on the surface of product, with the brand promotion power of improving product.And with Closed Graph in the embedded components for assembling
The assembly method of the embedded components of shape is the most complicated.In prior art when the embedded components of closed figure are assembled, in order to
Prevent embedded components from dropping, when processing embedded components pilot hole generally on the outside manufacture housing of product, for filling
Product shell inside embedded components, processes hanging platform structure, prevents that embedded components are assembled to after product external surfaces,
There is situation about coming off in product shell inside filling embedded components.But, due to being provided with hanging platform structure, need from product
, easily there are filling embedded components in product shell inside the inner surface assembling filling embedded components of housing in assembling process
After internal product shell departs from outside manufacture housing, cause the product shell and outside manufacture housing inside embedded components
Unmatched problem.
It can be seen that, at least there is following defect in embedded components assembly method of the prior art：Embedded components were assembled
After easily occurring product shell and the disengaging of outside manufacture housing inside filling embedded components in journey, cause in embedded components
The product shell in portion and the unmatched problem of outside manufacture housing.
The content of the invention
The present invention provides a kind of assembly method of embedded mark, casting of electronic device and electronic equipment, solves existing skill
After easily occurring product shell and the disengaging of outside manufacture housing inside filling embedded components in art in assembling process, cause embedding
Enter the product shell and the unmatched problem of outside manufacture housing of formula components interior.
In a first aspect, a kind of assembly method of embedded components is embodiments provided, including：
Process in the outer surface of the casting of electronic device, obtain being matched with the embedded components external surface shape the
One groove；
The casting of electronic device of first inside grooves is fixed into the casting of electronic device of first groove periphery；
Process in the inner surface of the casting of electronic device, obtain the second groove with the first groove insertion；
The embedded components are assembled in the groove bit space formed in first groove and the second groove；
Wherein, the external diameter of second groove is more than the external diameter of first groove, and the internal diameter of second groove is more than
The internal diameter of first groove and less than the external diameter of first groove.
Second aspect, the embodiment of the present invention additionally provides a kind of electronic equipment housing, including：It is public by the embodiment of the present invention
The embedded components of the assembly method assembling opened.
The third aspect, the embodiment of the present invention additionally provides a kind of electronic equipment, including electronics disclosed in the embodiment of the present invention
Apparatus casing.
The assembly method of embedded components disclosed in the embodiment of the present invention, by the outer surface in the casting of electronic device
Processing, obtains the first groove matched with the embedded components external surface shape；The electronics of first inside grooves is set
Standby housing is fixed to the casting of electronic device of first groove periphery；Then, the inner surface in the casting of electronic device adds
Work, obtains the second groove with the first groove insertion；Finally, by embedded components assembling in first groove and
In the groove bit space that second groove is formed, solve in prior art and easily occur inside filling embedded components in assembling process
The disengaging of product shell and outside manufacture housing after, do not cause product shell inside embedded components and outside manufacture housing not
The problem matched somebody with somebody.By the casting of electronic device that the casting of electronic device of the first inside grooves is fixed to first groove periphery
On so that the product shell inside embedded components is filled during following process and is not separated with outside manufacture housing, therefore
It is not in situation that two housing sections are not matched.
Description of the drawings
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below will be to wanting needed for embodiments of the invention
The accompanying drawing for using is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, right
For those of ordinary skill in the art, without having to pay creative labor, can be with according to these accompanying drawings acquisitions
Other accompanying drawings.
Fig. 1 is the assembly method flow chart of the embedded components of the embodiment of the present invention one；
Fig. 2 is to assemble casting of electronic device profile after embedded components by the assembly method of the embodiment of the present invention one；
Fig. 3 is the assembly method flow chart of the embedded components of the embodiment of the present invention two；
Fig. 4 is the position relationship schematic diagram of the first groove and the second groove in the embodiment of the present invention two；
Fig. 5 is the casting of electronic device schematic appearance of the embodiment of the present invention three.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than the embodiment of whole.Based on this
Embodiment in bright, the every other enforcement that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
Embodiment one：
A kind of assembly method of embedded components is present embodiments provided, as shown in figure 1, the method includes：Step 100 to
Step 130.
Step 100, processes in the outer surface of the casting of electronic device, obtains and the embedded components external surface shape
First groove of matching.
The position of default assembling embedded components on the outer surface of the casting of electronic device, by Digit Control Machine Tool milling
Go out the groove of and the form fit of the embedded components, as the first groove, for embedded portion described in accommodating portion
Part.The casting of electronic device of first inside grooves is the casting of electronic device after the completion of assembling inside embedded components；Institute
The casting of electronic device for stating the first groove periphery is the casting of electronic device of embedded components periphery after the completion of assembling.With described embedding
Enter formula part and be shaped as O shapes, also, the width of first groove and assembling for as a example by O shapes, process the first groove for obtaining
The width for putting the appropriate section of embedded components to first groove is identical.The depth of first groove according to
Design it needs to be determined that：When requiring that the embedded components are assembled in first groove, the outer surface of the embedded components
When being generally aligned in the same plane with the housing outer surface of the electronic equipment, then the depth of first groove is put to described equal to assembling
The thickness of the appropriate section of the embedded components in the first groove；When requiring that the embedded components are assembled to described first
In groove, the outer surface of the embedded components higher than the electronic equipment housing outer surface when, then first groove
Depth puts the thickness of the appropriate section of the embedded components to first groove less than assembling；It is described embedded when requiring
When formula part is assembled in first groove, the outer surface of the embedded components is less than the housing appearance of the electronic equipment
During face, then the depth of first groove puts the appropriate section of the embedded components to first groove more than assembling
Thickness.
Step 110, by the casting of electronic device of first inside grooves electronics of first groove periphery is fixed to
Apparatus casing.
When being embodied as, the casting of electronic device of first inside grooves is fixed into the electricity of first groove periphery
Sub- apparatus casing, including：By injecting adhesive substance in first groove, by the electronic equipment of first inside grooves
Housing is fixed on the casting of electronic device of first groove periphery；Or, set by the electronics in first inside grooves
The casting of electronic device outer surface of standby housing outer surface and first groove periphery covers paste, by first groove
The casting of electronic device in portion is fixed to the casting of electronic device of first groove periphery.
For example, paste is covered on the outer surface of the casting of electronic device, by the electronics of first inside grooves
The casting of electronic device of apparatus casing and first groove periphery is fixed.When being embodied as, in the electronic equipment shell
One layer of pad pasting or adhesive tape with bonding force is covered on the outer surface of body, the pad pasting or adhesive tape is covered in first groove
The casting of electronic device of the casting of electronic device in portion and first groove periphery, the then electronic equipment of first inside grooves
Housing is bonded together by the casting of electronic device of the pad pasting or adhesive tape and first groove periphery.
In another specific embodiment, it is also possible to by described the by way of injecting adhesive substance in the first groove
The casting of electronic device of the casting of electronic device of one inside grooves and first groove periphery is fixed.For example, described
First inside grooves resin by injection glue, the resin glue is by the casting of electronic device of first inside grooves and described
The casting of electronic device of one groove periphery bonds together.
Step 120, processes in the inner surface of the casting of electronic device, obtains recessed with the second of the first groove insertion
Groove.
After electronic equipment outer surface processes the first groove, in the inner surface and described of the casting of electronic device
The corresponding position of one groove processes the second groove so that the second groove and the first groove insertion.When being embodied as, still with described embedding
It is as a example by O shapes, after the first groove is processed, in the inner surface in the casting of electronic device and described first to enter formula part
The corresponding position in the groove center of circle, processes an O connected in star, as the second groove.The depth of second groove is with described second
Groove at least intersecting with first groove can be defined.That is, by process on the casting of electronic device the first groove and
Second groove, can be divided into two parts by the housing of the electronic equipment.The casting of electronic device of first inside grooves is
Casting of electronic device after having assembled the embedded components, inside the embedded components；First groove periphery
Casting of electronic device is to have assembled after the embedded components, the casting of electronic device of the embedded components periphery.
When being embodied as, because the embedded components have hanging platform structure, i.e., described embedded components are assemblied in electronics
The diameter with diameter greater than the part for being assemblied in casting of electronic device outer surface of the part of apparatus casing inner surface, therefore, it is described
The shape of the groove bit space that the first groove and second groove are formed and the form fit of the embedded components.Described first
The size and dimension of groove and second groove as shown in Fig. 2 wherein, the outer diameter D of second groove20More than described first
The outer diameter D of groove10, the internal diameter D of second groove21More than the internal diameter D of first groove11And less than first groove
Outer diameter D10。
The second groove and the first groove after insertion forms a groove bit space, i.e., the space of 2011 and 2021 compositions is used
In the assembling embedded components.
Step 130, the embedded components are assembled in the groove bit space formed in first groove and the second groove.
Then, the embedded components are assembled in the groove bit space formed in first groove and the second groove.Tool
When body is assembled, need first by the casting of electronic device of the first inside grooves and the casting of electronic device of first groove periphery
Separate；Then, the embedded components are assembled to relevant position；Finally, the casting of electronic device of the first inside grooves is recovered
It is in situ.After embedded components are assembled in the groove bit space that first groove and the second groove are formed, casting of electronic device
Profile it is as shown in Figure 2.20 is casting of electronic device in figure, and 201 is the outer surface of casting of electronic device 20, and 202 is electronics
The inner surface of apparatus casing 20, oblique line portion is embedded components, and embedded components place space is first groove
2011 and the second groove 2021 formed groove bit space.Wherein, the external diameter of second groove 2021 is more than first groove
2011 external diameter, the internal diameter of second groove 2021 is more than the internal diameter of first groove 2011 and less than first groove
2011 external diameter.
The assembly method of embedded components disclosed in the embodiment of the present invention, by the outer surface in the casting of electronic device
The first groove that processing is matched with the embedded components external surface shape；By the casting of electronic device of first inside grooves
It is fixed to the casting of electronic device of first groove periphery；Then, the inner surface in the casting of electronic device is processed and institute
State the second groove of the first groove insertion；Finally, the embedded components are assembled in first groove and the second groove type
Into groove bit space in, solve in prior art the product shell easily occurred in assembling process inside filling embedded components
After departing from outside manufacture housing, cause the product shell and the unmatched problem of outside manufacture housing inside embedded components.
By the way that the casting of electronic device of the first inside grooves is fixed on the casting of electronic device of first groove periphery so that
The product shell inside embedded components is filled during following process not separate with outside manufacture housing, therefore is not in two
The situation that partial shell is not matched.
Embodiment two：
Referring to Fig. 3, a kind of assembly method of embedded components is present embodiments provided, the method includes：Step 300 is to step
Rapid 340.
Step 300, processes in the outer surface of the casting of electronic device, obtains and the embedded components external surface shape
First groove of matching.
The outer surface processing of the casting of electronic device match with the embedded components external surface shape it is first recessed
, referring to embodiment one, here is omitted for the specific embodiment of groove.
Step 310, by injecting adhesive substance in first groove, by the electronic equipment of first inside grooves
Housing is fixed on the casting of electronic device of first groove periphery.
In the present embodiment, with by way of injecting adhesive substance in the first groove by the electricity of first inside grooves
As a example by the casting of electronic device of sub- apparatus casing and first groove periphery is fixed, describe in detail first groove
Internal casting of electronic device is fixed to the concrete scheme of the casting of electronic device of first groove periphery.
The adhesive substance for being used to inject in first groove in the embodiment of the present invention can be glue, resin, resin glue
The adhesive substances such as water.When being embodied as, the cohesive force of the adhesive substance is more than the adhesive substance and the electronic equipment shell
Bonding force between body, is easy to subsequently remove adhesive substance.
When first inside grooves inject adhesive substance, it is preferred that fill sticky object in first inside grooves
Matter, is set the electronics of the casting of electronic device of first inside grooves and first groove periphery by the adhesive substance
Standby housing is strongly adhered to together.
Step 320, processes in the inner surface of the casting of electronic device, obtains recessed with the second of the first groove insertion
Groove.
When the inner surface of the casting of electronic device processes the second groove with the first groove insertion, can adopt
Cutting or the processing technology of milling, the present invention is not construed as limiting to this.Determine the mode of location and shape of the second groove position referring to enforcement
The relevant portion of example one, here is omitted.
When being embodied as, referring to Fig. 4, the depth h sum of the depth H of first groove 401 and second groove 402
More than the thickness of the casting of electronic device 40, and the bottom land 4021 of second groove 402 is outside the electronic equipment shell
Surface 403 is more than the first predeterminable range.When being embodied as, effect is assembled according to the material and embedded components of casting of electronic device
The difference of fruit, determines the first predeterminable range.For example, when casting of electronic device thicker (such as larger than 0.5 millimeter), it may be determined that the
One predeterminable range is 0.25 millimeter.The bottom land 4021 of second groove 402 is more than apart from the electronic equipment shell outer surface 403
First predeterminable range can avoid causing casting of electronic device to be deformed in processing and assembling process.
When being embodied as, between the inward flange 4011 of the inward flange 4022 of second groove and first groove away from
From more than or equal to the second predeterminable range.Second predeterminable range determines according to the physical dimension of embedded components.It is concrete real
Shi Shi, the numerical value of the second predeterminable range could be arranged to 0.15 millimeter.Usual and embedded components the size of second predeterminable range
Matching, the embedded components being so designed that have more solid frame for movement.
The second groove and the first groove after insertion forms a groove bit space, for assembling the embedded components.
Step 330, removes the adhesive substance in first groove.
Due to beforehand through adhesive substance by outside the casting of electronic device of first inside grooves and first groove
The electronic equipment in portion is fixed, therefore, after the second groove is processed, although the second groove and the first groove insertion, first
Electronic equipment outside the casting of electronic device of inside grooves and first groove is bonded in still through the adhesive substance
Together, it is to avoid the casting of electronic device of the first inside grooves departs from outside manufacture housing.Now, first groove and institute
In stating the groove bit space formed after the second groove is linked up, the glued material of part groove bit space in the first groove is filled up, therefore,
After treating that other techniques are completed, before the embedded components are assembled, need to remove the adhesive substance in first groove.
Because the cohesive force of the adhesive substance is more than the bonding force between the adhesive substance and the casting of electronic device, therefore lead to
The adhesive substance in first groove is all removed by crossing simple processing technology.
Step 340, the embedded components are assembled in the groove bit space formed in first groove and the second groove.
Then, the embedded components are assembled in the groove bit space formed in first groove and the second groove.Tool
When body is assembled, need first by the casting of electronic device of the first inside grooves and the casting of electronic device of first groove periphery
Separate；Then, the embedded components are assembled to relevant position；Finally, the casting of electronic device of the first inside grooves is recovered
It is in situ.
The assembly method of embedded components disclosed in the embodiment of the present invention, by the outer surface in the casting of electronic device
The first groove that processing is matched with the embedded components external surface shape；By injecting sticky object in first groove
Matter, by the casting of electronic device of first inside grooves casting of electronic device of first groove periphery is fixed on；Then,
The second groove with the first groove insertion is processed in the inner surface of the casting of electronic device；Finally, described first is removed
Adhesive substance in groove, the embedded components are assembled the groove bit space formed in first groove and the second groove
It is interior, solve the product shell and outside manufacture shell easily occurred in assembling process in prior art inside filling embedded components
After body departs from, cause the product shell and the unmatched problem of outside manufacture housing inside embedded components.By recessed by first
Casting of electronic device inside groove is fixed on the casting of electronic device of first groove periphery so that in following process process
Product shell inside middle filling embedded components is not separated with outside manufacture housing, therefore is not in that two housing sections are unworthy of
The situation of set.By the way that adhesive substance is injected in the first groove to the casting of electronic device of first inside grooves and described the
The casting of electronic device of one groove periphery is fixed, and effectively prevent after the second groove position is processed, first inside grooves
Casting of electronic device and outside manufacture housing depart from, cause the product shell inside embedded components with outside manufacture housing not
The problem of matching.
Embodiment three：
With reference to Fig. 5, correspondingly, the embodiment of the invention also discloses a kind of electronic equipment housing 50.The electronic equipment shell
Body 50, including：Embedded components 501, described embedded components 501 are embedding according to disclosed in previous embodiment one and embodiment two
Enter formula component mounting method to be assembled on the casting of electronic device 50.
When being embodied as, the outer surface first in the casting of electronic device is processed and the embedded components outer surface shape
First groove of shape matching；By injecting adhesive substance or the appearance in the casting of electronic device in first groove
Face covers the electronic equipment that the casting of electronic device of first inside grooves is fixed to paste first groove periphery
Housing；Then, the inner surface in the casting of electronic device processes the second groove with the first groove insertion；Finally, will
The embedded components are assemblied in the groove bit space that first groove and the second groove are formed, and are solved in prior art and are filled
After easily occurring product shell and the disengaging of outside manufacture housing inside filling embedded components during matching somebody with somebody, cause embedded portion
Product shell inside part and the unmatched problem of outside manufacture housing.By the way that the casting of electronic device of the first inside grooves is consolidated
On the fixed extremely casting of electronic device of first groove periphery so that fill inside embedded components during following process
Product shell is not separated with outside manufacture housing, therefore is not in the situation that two housing sections are not matched.
Example IV：
Accordingly, the embodiment of the present invention is also disclosed a kind of electronic equipment, and the electronic equipment includes the embodiment of the present invention three
Described casting of electronic device.The electronic equipment includes mobile phone, E-book reader, panel computer, notebook computer, individual
Digital assistants, music player or navigator.
The housing of the electronic equipment includes embedded components, and the assembly method of the embedded components is referring to of the invention real
The assembly method of example one and embedded components disclosed in embodiment two is applied, here is omitted.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, all should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Each embodiment in this specification is described by the way of progressive, what each embodiment was stressed be with
The difference of other embodiment, between each embodiment identical similar part mutually referring to.For electronic equipment reality
For applying example, due to itself and embodiment of the method basic simlarity, so description is fairly simple, related part is referring to embodiment of the method
Part explanation.
Claims (10)
1. a kind of assembly method of embedded components, is applied to electronic equipment, it is characterised in that include：
Process in the outer surface of the casting of electronic device, obtain being matched with the embedded components external surface shape first is recessed
Groove；
The casting of electronic device of first inside grooves is fixed into the casting of electronic device of first groove periphery；
Process in the inner surface of the casting of electronic device, obtain the second groove with the first groove insertion；
The embedded components are assembled in the groove bit space formed in first groove and the second groove；
Wherein, more than the external diameter of first groove, the internal diameter of second groove is more than described for the external diameter of second groove
The internal diameter of the first groove and less than the external diameter of first groove.
2. method according to claim 1, it is characterised in that the casting of electronic device by first inside grooves
The step of being fixed to the casting of electronic device of first groove periphery, including：
By injecting adhesive substance in first groove, the casting of electronic device of first inside grooves is fixed on into institute
State the casting of electronic device of the first groove periphery.
3. method according to claim 2, it is characterised in that the cohesive force of the adhesive substance is more than the adhesive substance
And the bonding force between the casting of electronic device.
4. method according to claim 2, it is characterised in that described that the embedded components are assembled into recessed described first
Before the step in groove bit space that groove and the second groove are formed, also include：
Remove the adhesive substance in first groove.
5. method according to claim 1, it is characterised in that the casting of electronic device by first inside grooves
The step of being fixed to the casting of electronic device of first groove periphery, including：
By the casting of electronic device outer surface in first inside grooves and the electronic equipment shell of first groove periphery
External surface covers paste, and the casting of electronic device of first inside grooves is fixed into the electricity of first groove periphery
Sub- apparatus casing.
6. the method according to claim 1 to 5 any one, it is characterised in that the depth of first groove with it is described
The depth sum of the second groove is more than the thickness of the casting of electronic device, and the bottom land of second groove is apart from the electronics
Equipment shell outer surface is more than the first predeterminable range.
7. the method according to claim 1 to 5 any one, it is characterised in that the inward flange of second groove and institute
The distance between inward flange of the first groove is stated more than or equal to the second predeterminable range.
8. a kind of electronic equipment housing, it is characterised in that include on the casting of electronic device arbitrary according to claim 1 to 7
The embedded components of the assembly method assembling described in.
9. a kind of electronic equipment, it is characterised in that including the casting of electronic device described in claim 8.
10. electronic equipment according to claim 9, it is characterised in that the electronic equipment includes mobile phone, e-book reading
Device, panel computer, notebook computer, personal digital assistant, music player or navigator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611248739.XA CN106659021B (en) | 2016-12-29 | 2016-12-29 | A kind of assembly method of embedded components, casting of electronic device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611248739.XA CN106659021B (en) | 2016-12-29 | 2016-12-29 | A kind of assembly method of embedded components, casting of electronic device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN106659021A true CN106659021A (en) | 2017-05-10 |
| CN106659021B CN106659021B (en) | 2019-08-20 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3996066A (en) * | 1975-07-22 | 1976-12-07 | Eleanor & Wilson Greatbatch Foundation | Lithium-iodine battery |
| US20110122595A1 (en) * | 2009-11-25 | 2011-05-26 | Kabushiki Kaisha Toshiba | Electronic device |
| WO2016032564A1 (en) * | 2014-08-29 | 2016-03-03 | Apple Inc. | Housing features including logo features of an electronic device |
| CN205321213U (en) * | 2016-01-06 | 2016-06-22 | 卓尔悦（常州）电子科技有限公司 | Nebulizer and electronic cigarette with same |
-
2016
- 2016-12-29 CN CN201611248739.XA patent/CN106659021B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3996066A (en) * | 1975-07-22 | 1976-12-07 | Eleanor & Wilson Greatbatch Foundation | Lithium-iodine battery |
| US20110122595A1 (en) * | 2009-11-25 | 2011-05-26 | Kabushiki Kaisha Toshiba | Electronic device |
| WO2016032564A1 (en) * | 2014-08-29 | 2016-03-03 | Apple Inc. | Housing features including logo features of an electronic device |
| CN205321213U (en) * | 2016-01-06 | 2016-06-22 | 卓尔悦（常州）电子科技有限公司 | Nebulizer and electronic cigarette with same |
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| Publication number | Publication date |
|---|---|
| CN106659021B (en) | 2019-08-20 |
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