CN106643425B - A kind of indirect equivalent measurement method in equipped gap - Google Patents
A kind of indirect equivalent measurement method in equipped gap Download PDFInfo
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- CN106643425B CN106643425B CN201611091887.5A CN201611091887A CN106643425B CN 106643425 B CN106643425 B CN 106643425B CN 201611091887 A CN201611091887 A CN 201611091887A CN 106643425 B CN106643425 B CN 106643425B
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- mold
- ruler
- gap
- measurement
- bar molds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/14—Measuring arrangements characterised by the use of mechanical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The invention discloses a kind of indirect equivalent measurement method in equipped gap, include the following steps: to design and make ruler mold, folding rule mold and bar molds;According to the equipped gap of pcb board difference component, ruler mold, folding rule mold and bar molds are selected;Pcb board electrical safety is carried out respectively with ruler mold, folding rule mold and the bar molds after selection is equipped with clearance measurement.The present invention converts mold definite value for measurement request, has achieved the effect that static measurement, solve the problems, such as that traditional measurement mode cannot achieve small space measurement by designing and making Measurement die;By selecting suitable Measurement die, indirect equivalent measurement safety clearance is realized, overcomes traditional measurement mode not enough accurately problem;It is measured by using suitable Measurement die, shortens measurement period, compensate for the lower defect of traditional measurement mode efficiency.
Description
Technical field
The present invention relates to a kind of indirect equivalent measurement methods in equipped gap, are particularly suitable for pcb board related components electricity
Gas is equipped with safely gap, belongs to component and is equipped with clearance measurement technical field.
Background technique
In space product, the structural member for being related to pcb board is more and more, in order to make pcb board design safety performance touch the mark,
Each component there must be electric clearance, i.e., the space minimum linear distance between exposed energized conductor, but in actual design and life
During production because design and control it is not in place, cause short circuit phenomenon to happen occasionally.This requires technical staff to set in early period
During meter, the safety clearance of the good all parts of stringent control, in later period production process, precise measurement safety clearance, and and
When judge and adjust accordingly.
Due to the diversity and particularity of space product structure, lead to that peace can be fast implemented currently without suitable tool
The measurement work in full gap.
In the prior art, it generallys use traditional vernier caliper and Steel Ruler to measure, there are the following problems:
The first, it cannot achieve small space measurement, be easy to interfere with other components in measurement process.
The second, measurement is not accurate enough, is largely as caused by human factor, technical staff holds Steel Ruler and measures
When, error is larger.
Third, measurement efficiency are lower, and when measuring to the safety clearance between complex structural member, technical staff is often needed
It takes multiple measurements, causes measurement period too long.
Summary of the invention
Technical problem solved by the present invention is overcome the deficiencies in the prior art, the present invention provides a kind of equipped gaps
Indirect equivalent measurement method converts mold definite value for measurement request, has reached static survey by designing and making Measurement die
The effect of amount solves the problems, such as that traditional measurement mode cannot achieve small space measurement;It is real by selecting suitable Measurement die
Show indirect equivalent measurement safety clearance, overcomes traditional measurement mode not enough accurately problem;By using suitable measurement
Mold measures, and shortens measurement period, compensates for the lower defect of traditional measurement mode efficiency.
The technical solution of the invention is as follows:
A kind of indirect equivalent measurement method in equipped gap is equipped with gap, pcb board packet for detecting pcb board electrical safety
Include component body, cover board, component lead leg, small cavity casing cover board, device body, beams of metal, device solder joint, fastener and
Pad includes the following steps:
The first step designs and makes ruler mold, folding rule mold and bar molds;
Second step carries out ruler mold, folding rule mold and bar molds according to the equipped gap of pcb board difference component
Selection;
It is equipped to carry out pcb board electrical safety with ruler mold, folding rule mold and the bar molds after selection respectively for third step
Clearance measurement.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the first step, ruler mold is L shape
Plate, ruler mold are equipped with the step surface for conjunction measuring;Folding rule mold is Z-shaped plate, and folding rule both mold ends, which are equipped with, to be used for
The rectangle extended surface of conjunction measuring;Bar molds are cylindrical body, and bar molds one end is equipped with the socket cap for conjunction measuring, stick
The shape mold other end is equipped with the semicircle boss for conjunction measuring.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the second step, component body and lid
It is measured with ruler mold between plate, between cover board and component lead leg.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the second step, device body and metal
It is measured with folding rule mold between beam, between beams of metal and device solder joint.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the second step, component lead leg with it is small
It is measured with bar molds between cavity casing cover board, between fastener and pad.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the third step, by the platform of ruler mold
Terrace is horizontal positioned on the cover board, and whether observation ruler mold contacts with component body or component lead leg, if contact, matches
Dress gap meet design requirements, if not contacting, equipped gap reaches design requirement.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the third step, by the square of folding rule mold
Shape extended surface is horizontally inserted into device body, beams of metal, between device solder joint, observation folding rule mold whether with device body, metal
Beam, the contact of device solder joint, if contact, equipped gap meet design requirements, if not contacting, equipped gap reaches design and wants
It asks.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, in the third step, by the half of bar molds
Round boss is lain in a horizontal plane on small cavity casing cover board, and whether the semicircle boss for observing bar molds connects with component lead leg
Touching, if contact, equipped gap meet design requirements, if not contacting, equipped gap reaches design requirement;Again by rodlike mould
The cylindrical body of tool is inserted perpendicularly between fastener and pad, and whether the cylindrical body for observing bar molds connects with fastener or pad
Touching, if contact, equipped gap meet design requirements, if not contacting, equipped gap reaches design requirement.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, the ruler mold includes big ruler mold and small
The surrounding of ruler mold, big ruler mold and small ruler mold is respectively equipped with four step surfaces, and the length range of big ruler mold is 40~
The length range of 120mm, small ruler mold are 20~40mm, the width range of big ruler mold and small ruler mold is 0.64~
The thickness of 1.6mm, big ruler mold and small ruler mold is 2mm;The length of the folding rule mold, width, thickness are set to
60mm, 8mm, 5mm, the length and thickness of the rectangle extended surface are set as 5mm, and the width range of the rectangle extended surface is
0.64~1.6mm;The length and diameter of the bar molds is set to 50mm and 6mm, and the length of the socket cap is set as
10mm, the diameter range of the socket cap are 0.64~1.6mm, and the diameter of the semicircle boss is set as 6mm, the semicircle
The thickness of boss is set as 0.64~1.6mm.
In a kind of indirect equivalent measurement method in above-mentioned equipped gap, the ruler mold, folding rule mold and rodlike
Mold is all made of Cr18Ni9Ti CB/T3280-92 material.
Compared with the prior art, the invention has the advantages that:
[1] present invention converts mold definite value for measurement request, has reached static survey by designing and making Measurement die
The effect of amount solves the problems, such as that traditional measurement mode cannot achieve small space measurement.
[2] present invention realizes indirect equivalent measurement safety clearance, overcomes tradition by selecting suitable Measurement die
Measurement method not enough accurately problem.
[3] by the present invention in that being measured with suitable Measurement die, measurement period is shortened, traditional measurement is compensated for
The lower defect of mode efficiency.
[4] step of the present invention is simplified, mode is various, easy to implement, is not related to the complex technologies such as image procossing, is had wide
Wealthy application prospect.
[5] logic smoothness of the present invention, clear thinking, design rationally, those skilled in the art's step according to the invention into
Row experiment, can rapid survey go out all parts on pcb board electrical safety be equipped with gap.
Detailed description of the invention
Fig. 1 is flow chart of the present invention
Fig. 2 is ruler die structure dwg of the present invention
Fig. 3 is folding rule die structure dwg of the present invention
Fig. 4 is bar molds structure chart of the present invention
Fig. 5 is the clearance measurement schematic diagram of component body of the present invention and cover board
Fig. 6 is the clearance measurement schematic diagram of cover board of the present invention and component lead leg
Fig. 7 is the clearance measurement schematic diagram of device body of the present invention and beams of metal
Fig. 8 is the clearance measurement schematic diagram of beams of metal of the present invention and device solder joint
Fig. 9 is the clearance measurement schematic diagram of component lead leg of the present invention and small cavity casing cover board
Figure 10 is the clearance measurement schematic diagram of fastener of the present invention and pad
Wherein: 1 ruler mold;2 folding rule molds;3 bar molds;4 component bodies;5 cover boards;6 component lead legs;7 is small
Cavity casing cover board;8 device bodies;9 beams of metals;10 device solder joints;11 fasteners;12 pads;
Specific embodiment
The invention will be further described with specific embodiment for explanation with reference to the accompanying drawing:
As shown in Figure 1, a kind of indirect equivalent measurement method in equipped gap, for detect pcb board electrical safety it is equipped between
Gap, pcb board include component body 4, cover board 5, component lead leg 6, small cavity casing cover board 7, device body 8, beams of metal 9,
Device solder joint 10, fastener 11 and pad 12, include the following steps:
The first step designs and makes ruler mold 1, folding rule mold 2 and bar molds 3;
Second step, according to the equipped gap of pcb board difference component, to ruler mold 1, folding rule mold 2 and bar molds 3 into
Row selection;
Third step carries out pcb board electrical safety with ruler mold 1, folding rule mold 2 and the bar molds 3 after selection respectively
Equipped clearance measurement.
As shown in figs. 2 to 4, in the first step, ruler mold 1 is L shaped plate, and ruler mold 1, which is equipped with, is used for conjunction measuring
Step surface;Folding rule mold 2 is Z-shaped plate, and 2 both ends of folding rule mold are equipped with the rectangle extended surface for conjunction measuring;Rodlike mould
Tool 3 is cylindrical body, and 3 one end of bar molds is equipped with the socket cap for conjunction measuring, and 3 other end of bar molds is equipped with for cooperating
The semicircle boss of measurement.
In second step, between component body 4 and cover board 5, ruler mold 1 is used between cover board 5 and component lead leg 6
It measures.
In second step, between device body 8 and beams of metal 9, folding rule mold is used between beams of metal 9 and device solder joint 10
2 measure.
In second step, used between component lead leg 6 and small cavity casing cover board 7, between fastener 11 and pad 12
Bar molds 3 measure.
As shown in Fig. 5~6, in the third step, the step surface of ruler mold 1 is lain in a horizontal plane on cover board 5, observes ruler
Whether mold 1 contacts with component body 4 or component lead leg 6, if contact, equipped gap meet design requirements, if not
Contact is then equipped with gap and reaches design requirement.
As shown in Fig. 7~8, in the third step, the rectangle extended surface of folding rule mold 2 is horizontally inserted into device body 8, metal
Between beam 9, device solder joint 10, whether observation folding rule mold 2 contacts with device body 8, beams of metal 9, device solder joint 10, if connecing
Touching is then equipped with gap and meet design requirements, if not contacting, equipped gap reaches design requirement.
As shown in Fig. 9~10, in the third step, the semicircle boss of bar molds 3 is lain in a horizontal plane in into small cavity casing
On cover board 7, whether the semicircle boss of observation bar molds 3 contacts with component lead leg 6, if contact, equipped gap does not reach
To design requirement, if not contacting, equipped gap reaches design requirement;The cylindrical body of bar molds 3 is inserted perpendicularly into fastening again
Between part 11 and pad 12, whether the cylindrical body of observation bar molds 3 contacts with fastener 11 or pad 12, if contact, matches
Dress gap meet design requirements, if not contacting, equipped gap reaches design requirement.
Preferably, ruler mold 1 includes big ruler mold 101 and small ruler mold 102, big ruler mold 101 and small ruler mold 102
Surrounding be respectively equipped with four step surfaces, the length range of big ruler mold 101 is 40~120mm, the length model of small ruler mold 102
Enclosing is 20~40mm, and the width range of big ruler mold 101 and small ruler mold 102 is 0.64~1.6mm, big 101 He of ruler mold
The thickness of small ruler mold 102 is 2mm.
Preferably, the length of folding rule mold 2, width, thickness are set to 60mm, 8mm, 5mm, the length of rectangle extended surface
It is set as 5mm with thickness, the width range of the rectangle extended surface is 0.64~1.6mm.
Preferably, the length and diameter of bar molds 3 is set to 50mm and 6mm, and the length of socket cap is set as 10mm, circle
The diameter range of column cap is 0.64~1.6mm, and the diameter of semicircle boss is set as 6mm, and the thickness of semicircle boss is set as 0.64
~1.6mm.
The mold of appropriate size is selected according to the characteristic of the parts to be tested, the measurement equivalence value between metal and metal is
1.6mm, metal and it is nonmetallic between equivalence value be 0.64mm, from preferably from the point of view of, can by the width of ruler mold 1,
The thickness of the semicircle boss of the width of 2 rectangle extended surface of folding rule mold, the diameter of 3 socket cap of bar molds, bar molds 3 is all provided with
Be set to two kinds of specifications, one is 0.64mm, for measure metal and it is nonmetallic between equipped gap, another kind is 1.6mm, is used
Equipped gap between measurement metal and metal.
Ruler mold 1, folding rule mold 2 and bar molds 3 are all made of Cr18Ni9Ti CB/T3280-92 material.
The content being not described in detail in description of the invention is known to the skilled person technology.
Claims (9)
1. a kind of indirect equivalent measurement method in equipped gap is equipped with gap for detecting pcb board electrical safety, pcb board includes
Component body (4), cover board (5), component lead leg (6), small cavity casing cover board (7), device body (8), beams of metal (9),
Device solder joint (10), fastener (11) and pad (12), characterized by the following steps:
The first step designs and makes ruler mold (1), folding rule mold (2) and bar molds (3);
Second step, according to the equipped gap of pcb board difference component, to ruler mold (1), folding rule mold (2) and bar molds (3)
It is selected;
Third step carries out pcb board with ruler mold (1), folding rule mold (2) and the bar molds (3) after selection respectively and electrically pacifies
Equipped clearance measurement entirely;
In the first step, ruler mold (1) is L shaped plate, and ruler mold (1) is equipped with the step surface for conjunction measuring;Folding
Ruler mold (2) is Z-shaped plate, and folding rule mold (2) both ends are equipped with the rectangle extended surface for conjunction measuring;Bar molds (3) are
Cylindrical body, bar molds (3) one end are equipped with the socket cap for conjunction measuring, and bar molds (3) other end is equipped with for cooperating
The semicircle boss of measurement.
2. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the second step
In, it is surveyed with ruler mold (1) between component body (4) and cover board (5), between cover board (5) and component lead leg (6)
Amount.
3. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the second step
In, it is carried out with folding rule mold (2) between device body (8) and beams of metal (9), between beams of metal (9) and device solder joint (10)
Measurement.
4. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the second step
In, bar molds are used between component lead leg (6) and small cavity casing cover board (7), between fastener (11) and pad (12)
(3) it measures.
5. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the third step
In, the step surface of ruler mold (1) is lain in a horizontal plane on cover board (5), observation ruler mold (1) whether with component body
(4) or component lead leg (6) contact is equipped with gap and meet design requirements if contact, if not contacting, equipped gap reaches
To design requirement.
6. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the third step
In, the rectangle extended surface of folding rule mold (2) is horizontally inserted into device body (8), beams of metal (9), between device solder joint (10), is seen
It examines whether folding rule mold (2) contacts with device body (8), beams of metal (9), device solder joint (10), if contact, is equipped with gap not
Reach design requirement, if not contacting, equipped gap reaches design requirement.
7. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the third step
In, the semicircle boss of bar molds (3) is lain in a horizontal plane on small cavity casing cover board (7), the half of observation bar molds (3)
Whether round boss contacts with component lead leg (6), if contact, equipped gap meet design requirements, if not contacting, matches
Dress gap reaches design requirement;The cylindrical body of bar molds (3) is inserted perpendicularly between fastener (11) and pad (12) again, is seen
Whether the cylindrical body for examining bar molds (3) contacts with fastener (11) or pad (12), if contact, equipped gap is not up to set
Meter requires, if not contacting, equipped gap reaches design requirement.
8. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the ruler mould
Tool (1) includes big ruler mold (101) and small ruler mold (102), the surrounding difference of big ruler mold (101) and small ruler mold (102)
If there are four step surfaces, the length range of big ruler mold (101) is 40~120mm, and the length range of small ruler mold (102) is 20
The width range of~40mm, big ruler mold (101) and small ruler mold (102) is 0.64~1.6mm, big ruler mold (101) and
The thickness of small ruler mold (102) is 2mm;The length of the folding rule mold (2), width, thickness be set to 60mm, 8mm,
5mm, the length and thickness of the rectangle extended surface are set as 5mm, and the width range of the rectangle extended surface is 0.64~
1.6mm;The length and diameter of the bar molds (3) is set to 50mm and 6mm, and the length of the socket cap is set as 10mm,
The diameter range of the socket cap is 0.64~1.6mm, and the diameter of the semicircle boss is set as 6mm, the semicircle boss
Thickness be set as 0.64~1.6mm.
9. a kind of indirect equivalent measurement method in equipped gap according to claim 1, it is characterised in that: the ruler mould
Tool (1), folding rule mold (2) and bar molds (3) are all made of Cr18Ni9Ti CB/T3280-92 material.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10103906A (en) * | 1996-09-30 | 1998-04-24 | Toyota Motor Corp | Method and implement for measurement of mold clearance |
CN201269735Y (en) * | 2008-08-06 | 2009-07-08 | 重庆长安汽车股份有限公司 | Clearance detection tool used for engine cooling nozzle |
CN202757565U (en) * | 2012-07-09 | 2013-02-27 | 中国重汽集团福建海西汽车有限公司 | Gap detection tool ruler |
CN203587010U (en) * | 2013-07-02 | 2014-05-07 | 奇瑞汽车股份有限公司 | A vehicle body vehicle door inner gap testing tool |
CN104848760A (en) * | 2015-05-15 | 2015-08-19 | 中国重汽集团济南动力有限公司 | Testing fixture and detection method for detecting inner and outer warping dimensions of vehicle door |
CN205426047U (en) * | 2016-02-02 | 2016-08-03 | 广东长虹电子有限公司 | Novel feeler gauge and combination feeler gauge are measured to dull and stereotyped fit -up gap |
-
2016
- 2016-12-01 CN CN201611091887.5A patent/CN106643425B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10103906A (en) * | 1996-09-30 | 1998-04-24 | Toyota Motor Corp | Method and implement for measurement of mold clearance |
CN201269735Y (en) * | 2008-08-06 | 2009-07-08 | 重庆长安汽车股份有限公司 | Clearance detection tool used for engine cooling nozzle |
CN202757565U (en) * | 2012-07-09 | 2013-02-27 | 中国重汽集团福建海西汽车有限公司 | Gap detection tool ruler |
CN203587010U (en) * | 2013-07-02 | 2014-05-07 | 奇瑞汽车股份有限公司 | A vehicle body vehicle door inner gap testing tool |
CN104848760A (en) * | 2015-05-15 | 2015-08-19 | 中国重汽集团济南动力有限公司 | Testing fixture and detection method for detecting inner and outer warping dimensions of vehicle door |
CN205426047U (en) * | 2016-02-02 | 2016-08-03 | 广东长虹电子有限公司 | Novel feeler gauge and combination feeler gauge are measured to dull and stereotyped fit -up gap |
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