CN106636829B - Self-packaging liquid metal pen and manufacturing method thereof - Google Patents
Self-packaging liquid metal pen and manufacturing method thereof Download PDFInfo
- Publication number
- CN106636829B CN106636829B CN201510744766.5A CN201510744766A CN106636829B CN 106636829 B CN106636829 B CN 106636829B CN 201510744766 A CN201510744766 A CN 201510744766A CN 106636829 B CN106636829 B CN 106636829B
- Authority
- CN
- China
- Prior art keywords
- liquid metal
- indium
- gallium
- alloy
- pen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 8
- 229910000846 In alloy Inorganic materials 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000013019 agitation Methods 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 8
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
- B43K—IMPLEMENTS FOR WRITING OR DRAWING
- B43K19/00—Non-propelling pencils; Styles; Crayons; Chalks
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Pens And Brushes (AREA)
Abstract
The invention provides a novel self-packaging liquid metal pen and a manufacturing method thereof. The refill is made of gallium-indium alloy, gallium-indium-tin alloy or bismuth-indium-tin alloy, and the viscosity of the refill is 650 Pa.s. In the writing process, the high polymer flexible material can cover the surface of the liquid metal, so that the process of writing and packaging while writing is realized, additional packaging operation is omitted, the production cost is reduced, and the liquid metal can be conveniently and quickly written and packaged.
Description
Technical field
The present invention relates to material engineering field, specifically, is related to a kind of new encapsulation liquid metal pen and making certainly
Method.
Background technology
Liquid metal can be written on PVC (polyvinyl chloride) surface by special pen, so as to form the electricity that can be write
Road.Yet with the special wellability of liquid metal, it is impossible to infiltrate many surfaces, need to be modified it for this, with side
Just practical application in industry.
The content of the invention
The present invention's is directed to poor compatibility between liquid metal and a variety of substrates, causes to realize in a variety of substrate surfaces
The problem of writing, there is provided a kind of new being realized in a variety of substrate surfaces or wall is write, while the liquid of banding dress
Metal pen and preparation method.
In order to realize the object of the invention, present invention firstly provides a kind of liquid metal core, the material of the pen core is gallium
Indium alloy, gallium-indium-tin alloy or bismuth indium stannum alloy, its viscosity are 500-650Pa.s (about 578Pa.s).
In the gallium-indium alloy mass percent of gallium be 75.5%-90%, the mass percent of indium be 10%-
24.5%；Mass percent >=75.5% of gallium, the mass percent of indium are 10%-24.5%, tin in the gallium-indium-tin alloy
Mass percent≤5%；Mass percent >=75.5% of bismuth, the mass percent of indium are in the bismuth indium stannum alloy
10%-24.5%, tin mass percent≤5%.
The present invention also provides the preparation method of the liquid metal core, by the gallium-indium alloy of liquid, gallium-indium-tin alloy or
Bismuth indium stannum alloy is carried out magnetic agitation 3-6 hours, mixing speed 200-500r/min, liquid alloy is changed from flow regime
Into paste, (i.e. liquid metal partial oxidation, 10%) oxide content is no more than in alloy.
The present invention also provides a kind of encapsulation liquid metal pen certainly, and it is to be used as pen core, high score using above-mentioned liquid metal core
Lettering pen of the sub- flexible material as consumption-type shell penholder.
The macromolecule flexible material includes wax, grease (animal tallow) etc..
The present invention further provides the preparation method from liquid metal pen is encapsulated, the liquid metal core is extruded
Or it is injected into and (uses streamer method) inside of hollow penholder.
Liquid metal core is expelled among the solid polymer materials such as hollow wax crayon or grease, in writing process
Exterior material is consumed, while liquid metal has been written on any substrate surface or wall.In writing process, wax crayon material or
Other encapsulating materials, liquid metal surface can be covered in, realize the process that banding dress is write on side.Different color can also be used
Wax shell, so as to realize the writing of color liquid metal and encapsulation.
The present invention makes liquid metal become paste by liquid, facilitates actual work by being modified to liquid metal
Industry application.In writing process, it is possible to achieve side is write, and banding dress, is eliminated extra encapsulation process, is reduced production cost.
It is provided by the invention that there is advantages below from encapsulation liquid metal pen：
(1) the invention provides a kind of simple, low cost from encapsulation liquid metal lettering pen.
(2) present invention solves the problems, such as that liquid metal can not fluently be write on paper surface, realizes rapid writing.
(3) present invention can be realized in printing paper surface rapid writing, and realizes the encapsulation process in writing, high
Molecular flexibility material (such as wax crayon material) is covered in liquid metal line surface, effectively prevent the further oxygen of liquid metal
Change.
(4) present invention is simple from the manufacturing process of encapsulation liquid metal pen, is provided the foundation for large-scale production.
Brief description of the drawings
Fig. 1 is paste liquid metal schematic diagram in the embodiment of the present invention 1.
Fig. 2 is the manufacturing process schematic diagram for writing wax crayon in the embodiment of the present invention 1 from encapsulation liquid metal.
Fig. 3 is wax crayon (a and b), rear state (c) and writing state before pouring in liquid metal in the embodiment of the present invention 1
(d) schematic diagram.
Fig. 4 is from the section of encapsulation liquid metal pen and front schematic view in the embodiment of the present invention 3.
Embodiment
Following examples are used to illustrate the present invention, but are not limited to the scope of the present invention.Unless otherwise specified, embodiment
In the conventional meanses that are well known to those skilled in the art of used technological means, raw materials used is commercial goods.
Making of the embodiment 1 from encapsulation liquid metal pen
1st, 20ml liquid metals (mass percent of gallium is 75.5%, the mass percent of indium is 24.5%) are taken to be put into burning
In cup, by magnetic agitation 3-6 hours, mixing speed 500r/min, make liquid metal partial oxidation, change from flow regime
Into paste, its viscosity is about 578Pa.s.
2nd, a wax crayon is taken, will be got through among it by electric drill, is prepared for the filling of liquid metal.
3rd, using streamer method, the liquid metal of paste is injected into by wax crayon center by syringe, formed from encapsulation liquid
Metal pen.
4th, by being write on paper surface, liquid metal effectively prevent liquid gold in the vestige centre position that wax crayon leaves
The further oxidation of category, it is achieved thereby that side writing banding dress.
Fig. 1 is paste liquid metal schematic diagram in embodiment 1.
Fig. 2 is the manufacturing process schematic diagram for writing wax crayon in embodiment 1 from encapsulation liquid metal.
Fig. 3 is wax crayon (a and b), rear state (c) and writing state (d) signal before pouring in liquid metal in embodiment 1
Figure.
Making of the embodiment 2 from encapsulation liquid metal pen
1st, taking 20ml liquid metals, (mass percent of gallium is 75.5%, the mass percent of indium is 19.5%, tin quality
Percentage is 5%) to be put into beaker, by magnetic agitation 3-6 hours, mixing speed 400r/min, makes liquid metal part
Oxidation, is transformed into paste, its viscosity is about 525Pa.s from flow regime.
2nd, a wax crayon is taken, will be got through among it by electric drill, is prepared for the filling of liquid metal.
3rd, by syringe, the liquid metal of paste is injected into wax crayon center, formed from encapsulation liquid metal pen.
4th, by being write on paper surface, liquid metal effectively prevent liquid gold in the vestige centre position that wax crayon leaves
The further oxidation of category, it is achieved thereby that side writing banding dress.
Making of the embodiment 3 from encapsulation liquid metal pen
1st, taking 20ml liquid metals, (mass percent of bismuth is 75%, the mass percent of indium is 24%, the quality of tin hundred
Divide than 1%) to be put into beaker, by magnetic agitation 3-6 hours, mixing speed 200r/min, making liquid metal part oxygen
Change, be transformed into paste from flow regime, its viscosity is about 600Pa.s.
2nd, candle is taken, it is become sticky mass by heating, is that standard is done in the making from encapsulation liquid metal pen
It is standby.
3rd, by extruding and heater, the liquid metal of paste is squeezed into bar column, then liquid wax is pressed into recessed
Channel-shaped, liquid metal are placed on centre, in 80 DEG C of compactings, are formed from encapsulation liquid metal pen (Fig. 4).
4th, by being write on paper surface, liquid metal effectively prevent liquid gold in the vestige centre position that wax crayon leaves
The further oxidation of category, it is achieved thereby that side writing banding dress.
Although above the present invention is described in detail with a general description of the specific embodiments,
On the basis of the present invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Cause
This, these modifications or improvements, belong to the scope of protection of present invention without departing from theon the basis of the spirit of the present invention.
Claims (4)
1. from encapsulation liquid metal pen, it is characterised in that using liquid metal core as pen core, macromolecule flexible material, which is used as, to disappear
The lettering pen of consumption type shell penholder；
Wherein, the material of the pen core is gallium-indium alloy, gallium-indium-tin alloy or bismuth indium stannum alloy, and its viscosity is 500-
650Pa·s；
The macromolecule flexible material is wax or grease.
It is 2. according to claim 1 from encapsulation liquid metal pen, it is characterised in that the quality hundred of gallium in the gallium-indium alloy
Ratio is divided to be 75.5%-90%, the mass percent of indium is 10%-24.5%；The mass percent of gallium in the gallium-indium-tin alloy
>=75.5%, the mass percent of indium is 10%-24.5%, mass percent≤5% of tin；Bismuth in the bismuth indium stannum alloy
Mass percent >=75.5%, the mass percent of indium are 10%-24.5%, mass percent≤5% of tin.
3. the encapsulation liquid metal pen certainly described in claim 1 or 2, it is characterised in that the preparation side of the liquid metal core
Method is：The gallium-indium alloy of liquid, gallium-indium-tin alloy or bismuth indium stannum alloy are subjected to magnetic agitation 3-6 hours, mixing speed is
200-500r/min, liquid alloy is set to be transformed into paste from flow regime.
4. from the preparation method for encapsulating liquid metal pen described in claim any one of 1-3, it is characterised in that by described liquid
Metal core extrudes or is injected into the inside of hollow penholder, produces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510744766.5A CN106636829B (en) | 2015-11-04 | 2015-11-04 | Self-packaging liquid metal pen and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510744766.5A CN106636829B (en) | 2015-11-04 | 2015-11-04 | Self-packaging liquid metal pen and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106636829A CN106636829A (en) | 2017-05-10 |
| CN106636829B true CN106636829B (en) | 2018-04-06 |
Family
ID=58850830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510744766.5A Active CN106636829B (en) | 2015-11-04 | 2015-11-04 | Self-packaging liquid metal pen and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106636829B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107244159B (en) * | 2017-06-15 | 2019-01-08 | 汪继珩 | A kind of metal pen pen core |
| CN110306091B (en) * | 2019-07-18 | 2021-01-08 | 深圳前海量子翼纳米碳科技有限公司 | High-wettability low-thermal-resistance liquid metal sheet and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102317031A (en) * | 2009-02-25 | 2012-01-11 | 旭化成电子材料株式会社 | Metal filler, low-temperature-bonding lead-free solder and bonded structure |
| CN103740995A (en) * | 2013-12-04 | 2014-04-23 | 曹帅 | Gallium-based liquid alloy material and preparation method thereof |
| CN104593656A (en) * | 2015-02-13 | 2015-05-06 | 杭州龙灿液态金属科技有限公司 | Ga-based liquid alloy with low-temperature fluidity, preparation process and thermometer |
-
2015
- 2015-11-04 CN CN201510744766.5A patent/CN106636829B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102317031A (en) * | 2009-02-25 | 2012-01-11 | 旭化成电子材料株式会社 | Metal filler, low-temperature-bonding lead-free solder and bonded structure |
| CN103740995A (en) * | 2013-12-04 | 2014-04-23 | 曹帅 | Gallium-based liquid alloy material and preparation method thereof |
| CN104593656A (en) * | 2015-02-13 | 2015-05-06 | 杭州龙灿液态金属科技有限公司 | Ga-based liquid alloy with low-temperature fluidity, preparation process and thermometer |
Non-Patent Citations (2)
| Title |
|---|
| 低熔点金属3D打印技术研究与应用;王磊 等;《新材料产业》;20150131;第27-31页 * |
| 液态金属粘滞性的研究进展;周晓薇 等;《沈阳师范大学学报(自然科学版)》;20031031;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106636829A (en) | 2017-05-10 |
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