CN106571103A - Bonding structure and application thereof - Google Patents
Bonding structure and application thereof Download PDFInfo
- Publication number
- CN106571103A CN106571103A CN201610959192.8A CN201610959192A CN106571103A CN 106571103 A CN106571103 A CN 106571103A CN 201610959192 A CN201610959192 A CN 201610959192A CN 106571103 A CN106571103 A CN 106571103A
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- China
- Prior art keywords
- bonding structure
- overlap joint
- structure according
- present
- pad
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention belongs to the field of electronics and discloses a bonding structure. The bonding structure comprises a plurality of lapping pads arranged in parallel on the surface of a substrate, and a plurality of golden fingers arranged in parallel on a circuit board, wherein the lapping pads are correspondingly and electrically connected with the golden fingers; and each lapping pad comprises a closed figure defined by a conductive wire and a transparent conductive sheet filling the closed figure. Light-tight lapping pads in the prior art are designed into the lapping pads with the transparent conductive sheets filling a conductive frame, so that the influence of the lapping pads on a previous laser process is effectively reduced and the product yield is increased.
Description
Technical field
The invention belongs to electronic applications, and in particular to a kind of FOG bondings structure and its application.
Background technology
Flexible PCB (Flexible Printed Circuit, FPC) is also known as FPC, flexible printed circuit board
Or flex circuit application, with Distribution density is high, lightweight, thickness of thin the characteristics of.Glass top chip encapsulation (chip-on-glass,
COG) and during FPC encapsulation technologies (FPC on glass, FOG) are widely used in display module on glass.This mounting means can
To greatly reduce the volume of display module, and it is easy to produce in enormous quantities, it is adaptable to most of consumer electronics product.
FOG bondings pass through different side's conducting film (Anisotropic Conductive Film, ACF) by the gold at FPC bondings end
Finger bonding on COG glass, so as to realize the electrical connection of FPC and COG.
As technology develops, at present, screen body I/O (IN/OUT) the mouth PAD on FPC bondings end golden finger and COG structures top layer
The marginal dimension of (golden finger overlap joint pad) is gradually reduced, and the spacing between golden finger is also less and less.
When COG structures need with other assemblies carry out laser welding etc. other be related to the technique of laser when, be arranged on COG knot
PAD on structure will laser cause to stop, so as to affect the accuracy of manufacture of product, and then affect product yield.
The content of the invention
For this purpose, to be solved by this invention is the problem of the first laser technology of FOG structure influences in prior art.
To solve above-mentioned technical problem, the technical solution used in the present invention is as follows：
The present invention provides a kind of bonding structure, is included in some overlap joint pads (pad) of substrate surface parallel arrangement, in circuit
Some golden fingers (Golden finger) of parallel arrangement on plate, the overlap joint pad is corresponding with the golden finger to be electrically connected；It is described
Overlap joint pad includes the closed figures surrounded by conductor wire and fills the closed figures and the transparent conductive sheets being electrically connected.
Alternatively, the closed figures are bar shaped, and each overlap joint pulvilliform shape is identical.
Alternatively, two long sides of the bar shaped are curve.
Alternatively, two long sides of the bar shaped are parallel to each other.
Alternatively, the width of the bar shaped is 100 μm～150 μm.
Alternatively, the conductive line width is 5 μm～10 μm.
Alternatively, the spacing between the adjacent overlap joint pad is 150 μm～200 μm.
Alternatively, some vias for electrically connecting with the transparent conductive sheets are additionally provided with the conductor wire.
Alternatively, the transparent conductive sheets thickness is 50 μm～100 μm, and the conductor wire thickness is 200 μm～300 μm.
The present invention also provides application of the described bonding structure in display device and/or touch-control device.
The above-mentioned technical proposal of the present invention has compared to existing technology advantages below：
1st, a kind of bonding structure described in the embodiment of the present invention, be included in substrate surface parallel arrangement some overlap joint pads,
In the circuit board some golden fingers of parallel arrangement, overlap pad electrical connection corresponding with golden finger；Overlap joint pad includes being enclosed by conductor wire
Into closed figures and filling closed figures transparent conductive sheets.Lighttight overlap joint pad in prior art is designed to leading
The overlap joint pad of transparent conductive sheets is filled in electric frame, laser can effectively reduce the overlap joint pad to formerly swashing through overlap joint pad
The impact of light technique, improves the yield of product.
2nd, a kind of bonding structure described in the embodiment of the present invention, closed figures are bar shaped, and two long sides of bar shaped are song
Line.In the case where overlap joint pad spacing is not increased, the curl for overlapping pad increase effectively the horizontal area in bonding region, improve
The reliability of bonding.
3rd, a kind of bonding structure described in the embodiment of the present invention, conductive line width is 5 μm～10 μm, further reduces and takes
Stop of the connection pad to laser, reduces impact of the overlap joint pad to first laser technology.Meanwhile, the width of bar shaped is 100 μm
～150 μm, bend narrow line etc. the narrow intersection that laser energy is more beneficial for away from structure.When first laser technology is glass melting
(frit) when encapsulating, laser energy staggeredly can make encapsulating structure more complicated, higher to the barrier of steam.
Description of the drawings
In order that present disclosure is more likely to be clearly understood, the specific embodiment below according to the present invention is simultaneously combined
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the assembling schematic diagram of the bonding structure described in the embodiment of the present invention 1；
Fig. 2 is the assembling schematic diagram of the bonding structure described in the embodiment of the present invention 1；
Reference is expressed as in figure：1- substrates, 2- overlap joint pads, 21- conductor wires, 22- transparent conductive sheets, 23- vias, 3-
Wiring board, 4- golden fingers.
Specific embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with reality of the accompanying drawing to the present invention
The mode of applying is described in further detail.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.
On the contrary, there is provided these embodiments so that the disclosure will be thorough and complete, and will the present invention design be fully conveyed to
Those skilled in the art, the present invention will only be defined by the appended claims.In the accompanying drawings, for clarity, Ceng He areas can be exaggerated
The size and relative size in domain.It should be appreciated that when element such as layer, region or substrate are referred to as " being formed in " or " arrange
" another element " on " when, the element can be arranged directly on another element, or can also there is intermediary element.
Conversely, when element is referred to as on " being formed directly into " or " being set directly at " another element, there is no intermediary element.
Embodiment 1
The present embodiment provides a kind of bonding structure, as shown in figure 1, being included in some overlap joints of the surface parallel arrangement of substrate 1
Some golden fingers 4 of parallel arrangement in pad 2, assist side 3, the electrical connection corresponding with golden finger 4 of overlap joint pad 2.
Used as one embodiment of the present of invention, in the present embodiment, substrate 1 is touch-control panel substrate, and wiring board 3 is flexible circuit
Plate, overlap joint pad 2 is electrically connected with golden finger 4 by different side's conducting film.Used as the convertible embodiment of the present invention, substrate 1 can be
Arbitrarily non-conductive substrate, wiring board 3 are the arbitrarily circuit board with golden finger, and overlap joint pad 2 is not limited with the electric connection mode of golden finger 4
In any electric connection mode of the prior art, the purpose of the present invention can be realized, belong to protection scope of the present invention.
Overlap joint pad 2 includes the transparent conductive sheets 22 of the closed figures surrounded by conductor wire 21 and filling closed figures.Will
Lighttight overlap joint pad 2 is designed to fill the overlap joint pad of transparent conductive sheets 22 in conductive pane in prior art, and laser can be saturating
Overlap joint pad 2 is crossed, the impact of the first laser technology of 2 pairs, pad of overlap joint is effectively reduced, the yield of product is improve.
Used as one embodiment of the present of invention, in the present embodiment, closed figures are bar shaped, and two long sides of bar shaped are mutual
Parallel straight line.Used as the convertible embodiment of the present invention, closed figures can also be arbitrary shape, each overlap joint shape phase of pad 2
With, the purpose of the present invention can be realized, belong to protection scope of the present invention.
Conductor wire 21 is selected from, but not limited to, the conductive materials such as Mo, Ag, Ti/Al/Ti, and in the present embodiment, conductor wire 21 is Mo.
The width of bar shaped be 100 μm～150 μm, the width of conductor wire 21 be 5 μm～10 μm, it is adjacent overlap joint pad 2 between
Away from for 150 μm～200 μm.The equidistant structure of narrow line further reduces stop of the overlap joint pad 2 to laser, reduces the overlap joint pad
The impact of 2 pairs of first laser technologies.
As one embodiment of the present of invention, in the present embodiment, it is additionally provided with conductor wire 21 some for leading with transparent
The via 23 of the electrical connection of electric piece 22.As the present invention convertible embodiment, conductor wire 21 can also by other means with thoroughly
Bright conducting strip 22 is electrically connected, and can realize the purpose of the present invention, belongs to protection scope of the present invention.
Used as one embodiment of the present of invention, in the present embodiment, the thickness of transparent conductive sheets 22 is 50nm～100nm, conductive
The thickness of line 21 is 200nm～300nm.
Transparent conductive sheets 22 are selected from, but not limited to, conducting strip made by the transparent conductive materials such as ITO, transparent in the present embodiment
Conducting strip 22 is ITO conducting strips.
In the present embodiment, the design of transparent conductive sheets 22 is filled in low impedance conduction frame, be not only able to ensure light
Effectively pass through, can also reduce because of the high impact to switching performance of the impedance of transparent conductive sheets 22, with high practical value.
Used as the convertible embodiment of the present invention, the bonding structure can be with any display device and/or touch controller
Apply in part, can realize the purpose of the present invention.
Embodiment 2
The present embodiment provides a kind of bonding structure, as shown in Fig. 2 its structure is with embodiment 1, except for the difference that：The two of bar shaped
The long side of bar is curve.
When two long sides of bar shaped are curve, in the case where each overlap joint spacing of pad 2 is not increased, the song of pad 2 is overlapped
While increase effectively the horizontal area in bonding region, the reliability of bonding is improve.
Meanwhile, bend narrow line etc. the narrow intersection that laser energy is more beneficial for away from structure.When first laser technology is glass
When melting (frit) is encapsulated, laser energy staggeredly can make encapsulating structure more complicated, higher to the barrier of steam.
Obviously, above-described embodiment is only intended to clearly illustrate example, and not to the restriction of embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need to be exhaustive to all of embodiment.And the obvious change thus extended out or
Among changing still in protection scope of the present invention.
Claims (10)
1. a kind of bonding structure, is included in some overlap joint pads (2) of substrate (1) surface parallel arrangement, parallel in assist side (3)
Some golden fingers (4) of arrangement, overlap joint pad (2) is corresponding with the golden finger (4) to be electrically connected；Characterized in that, described take
Connection pad (2) includes the closed figures surrounded by conductor wire (21) and fills the closed figures and transparent leading of being electrically connected
Electric piece (22).
2. bonding structure according to claim 1, it is characterised in that the closed figures are bar shaped, each overlap joint pad
(2) shape is identical.
3. bonding structure according to claim 2, it is characterised in that two long sides of the bar shaped are curve.
4. bonding structure according to claim 3, it is characterised in that two long sides of the bar shaped are parallel to each other.
5. bonding structure according to claim 3, it is characterised in that the width of the bar shaped is 100 μm～150 μm.
6. the bonding structure according to any one of claim 1-5, it is characterised in that conductor wire (21) width is 5 μm
～10 μm.
7. bonding structure according to claim 6, it is characterised in that the spacing between adjacent overlap joint pad (2) is 150
μm～200 μm.
8. the bonding structure according to claim 1-5 or 7 any one, it is characterised in that also set on the conductor wire (21)
It is equipped with some vias (23) for electrically connecting with the transparent conductive sheets (22).
9. bonding structure according to claim 8, it is characterised in that transparent conductive sheets (22) thickness be 50nm～
100nm, conductor wire (21) thickness is 200nm～300nm.
10. application of the bonding structure described in a kind of claim 1-9 any one in display device and/or touch-control device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610959192.8A CN106571103A (en) | 2016-10-27 | 2016-10-27 | Bonding structure and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610959192.8A CN106571103A (en) | 2016-10-27 | 2016-10-27 | Bonding structure and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106571103A true CN106571103A (en) | 2017-04-19 |
Family
ID=58535666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610959192.8A Pending CN106571103A (en) | 2016-10-27 | 2016-10-27 | Bonding structure and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106571103A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100026951A1 (en) * | 2008-08-01 | 2010-02-04 | Chunghwa Picture Tubes, Ltd. | Connection structure of display panel and flexible printed circuit board |
| CN103327729A (en) * | 2012-03-22 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Flexible circuit board connected structure of electronic device |
| CN203480491U (en) * | 2013-09-25 | 2014-03-12 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN203563258U (en) * | 2013-10-21 | 2014-04-23 | 胜华科技股份有限公司 | Connecting structure of double-element substrate |
| CN104216594A (en) * | 2014-09-25 | 2014-12-17 | 福州智创触控技术有限公司 | Low-impedance capacitive touch screen and manufacturing method thereof |
| CN104317125A (en) * | 2014-11-13 | 2015-01-28 | 合肥鑫晟光电科技有限公司 | Display device |
| CN204215117U (en) * | 2014-12-02 | 2015-03-18 | 昆山国显光电有限公司 | Display device |
| CN105320317A (en) * | 2014-06-17 | 2016-02-10 | 恒颢科技股份有限公司 | Bonding structure, bonding method and touch panel |
-
2016
- 2016-10-27 CN CN201610959192.8A patent/CN106571103A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100026951A1 (en) * | 2008-08-01 | 2010-02-04 | Chunghwa Picture Tubes, Ltd. | Connection structure of display panel and flexible printed circuit board |
| CN103327729A (en) * | 2012-03-22 | 2013-09-25 | 瀚宇彩晶股份有限公司 | Flexible circuit board connected structure of electronic device |
| CN203480491U (en) * | 2013-09-25 | 2014-03-12 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN203563258U (en) * | 2013-10-21 | 2014-04-23 | 胜华科技股份有限公司 | Connecting structure of double-element substrate |
| CN105320317A (en) * | 2014-06-17 | 2016-02-10 | 恒颢科技股份有限公司 | Bonding structure, bonding method and touch panel |
| CN104216594A (en) * | 2014-09-25 | 2014-12-17 | 福州智创触控技术有限公司 | Low-impedance capacitive touch screen and manufacturing method thereof |
| CN104317125A (en) * | 2014-11-13 | 2015-01-28 | 合肥鑫晟光电科技有限公司 | Display device |
| CN204215117U (en) * | 2014-12-02 | 2015-03-18 | 昆山国显光电有限公司 | Display device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |