CN106569632A - Touch module and fabrication method therefor - Google Patents
Touch module and fabrication method therefor Download PDFInfo
- Publication number
- CN106569632A CN106569632A CN201610915944.0A CN201610915944A CN106569632A CN 106569632 A CN106569632 A CN 106569632A CN 201610915944 A CN201610915944 A CN 201610915944A CN 106569632 A CN106569632 A CN 106569632A
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- Prior art keywords
- touch
- patterned circuit
- control
- patterned
- control sensing
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention relates to a fabrication method for a touch module. The fabrication method comprises the steps of providing a base material comprising a sub substrate, wherein the sub substrate comprises a touch sensing region, a peripheral region and a touch sensing electrode arranged on the touch sensing region; forming a patterned circuit group on the peripheral region of the sub substrate, wherein the patterned circuit group comprises a first patterned circuit and a second patterned circuit; forming a depletion region between the adjacent two ends of the first patterned circuit and the second patterned circuit to insulate the first patterned circuit and the second patterned circuit; enabling the other end of the first patterned circuit to be connected to the touch sensing electrode; configuring the other end of the second patterned circuit to be connected to a control chip; continuously performing the front end progress; and forming a conductive characteristic on the depletion region of the patterned circuit group, and enabling the conductive characteristic to be lap jointed between the first patterned circuit and the second patterned circuit. By adoption of the method, damage to the touch sensing electrode caused by accumulated to-be-released electrostatic charges can be avoided.
Description
Technical field
This exposure relates to a kind of manufacture method of touch-control module, in particular to a kind of touch-control module that is formed in
The manufacture method of the transmission cabling on base material.
Background technology
For the electronic product of common tool touch-control module, the demand lightening to electronic product to meet user, contracting
The manufacture method of the thickness for subtracting pixel control layer and the touch-control module of the size of the feature being formed thereon also gradually universalness.So
And, in the thickness and the size of the Eigen Structure being formed thereon of pursuing the lightening of touch-control module and reduction pixel control layer
Meanwhile, can also make pixel control layer more fragile.More specifically, pixel control layer can it is more sensitive to electric current, noise etc. and
Yi Shouqi is damaged.But during assembling touch-control module, front end of line can manufacture substantial amounts of static charge buildup in electric conductivity
On poor substrate, and electrostatic charge and cannot lead off with the interface of air through substrate, on the contrary, the electrostatic charge meeting of accumulation
Flow to the component for having preferable electric conductivity on substrate.For example, seem pixel control layer and/or with pixel control layer be electrically connected with
Metallic circuit etc..That is, the electrostatic charge do not led off in a large number may be directly entered pixel control layer or pixel control layer with gold
The intersection of category circuit, and cause excessive electrical injuries pixel control layer.It is event, aforesaid problem can reduce manufacturing touch-control mould
The yield of block, and the required time cost paid and cost of material when increasing manufacture touch-control module.And this problem needs phase
Pass field those of ordinary skill proposes improved method, to make up the deficiency of existing framework.
The content of the invention
The technical scheme of one of the present invention relates to a kind of manufacture method of touch-control module, and it is by touch-control module
In manufacture process, exhaustion region is initially formed on the connection circuit between touch-control sensing electrode and other assemblies (such as control chip), with
The electric connection of insulation touch-control sensing electrode and other assemblies.Further, can be reduced or avoided in FEOL accumulate wait declare
Let out electrostatic charge to enter touch-control sensing electrode through connection circuit and damage touch-control sensing electrode.Successively, present segment processing procedure knot
Shu Hou, then conductive features are formed in exhaustion region, connection connection circuit, to conduct the electricity between touch-control sensing electrode and other assemblies
Signal.Consequently, it is possible to through the touch-control module manufactured by the present invention except can in addition to normal operation, meanwhile, touch-control is also reduced or avoided
The situation that sensing electrode is damaged in the fabrication process, increases the yield of touch-control module, further reduces manufacturing cost.
According to one or more embodiments of the invention, there is provided a kind of manufacture method of touch-control module.The manufacture of touch-control module
Method includes multiple submounts comprising base material, base material is provided, and submounts are comprising touch-control sensing area, neighboring area and are arranged on tactile
Multiple touch-control sensing electrodes of control sensing area；Successively, multiple patterned circuit groups, pattern are formed in the neighboring area of submounts
Change circuit group comprising the first patterned circuit and the second patterned circuit, the first end of the first patterned circuit is connected to touch-control
One of sensing electrode, the first end of the second patterned circuit is configured to connect to control chip, wherein the first patterned electricity
Exhaustion region is formed between second end on road and the second end of the second patterned circuit, with the first patterned circuit and the second figure of insulating
Case circuit；Successively, a FEOL is carried out；And, conductive features are formed in the exhaustion region of patterned circuit group, allow and lead
Electrical feature is overlapped between the first patterned circuit and the second patterned circuit.
It is above-mentioned to include from base material point the step of carry out FEOL in one or more embodiments of part of the present invention
Submounts are cut, to form multiple touch-control modules respectively.
In one or more embodiments of part of the present invention, it is above-mentioned can also be comprising difference the step of carry out FEOL
Multiple flexible printed wiring boards fit to multiple touch-control modules, to connect each touch-control module to control chip.
It is above-mentioned to wrap the step of formation conductive features in exhaustion region in one or more embodiments of part of the present invention
It is contained in exhaustion region and prints conductive material；And curing conductive material is forming conductive features.
In one or more embodiments of part of the present invention, above-mentioned first patterned circuit and the second patterned electricity
The material on road is different with the material of conductive material.
In one or more embodiments of part of the present invention, can also include the step of above-mentioned formation patterned circuit group
The first bonding pad is formed at the second end of the first patterned circuit of patterned circuit group；And the second of patterned circuit group
Second end of patterned circuit forms the second bonding pad.
It is above-mentioned to wrap the step of formation conductive features in exhaustion region in one or more embodiments of part of the present invention
It is overlapped between the first bonding pad of patterned circuit group and the second bonding pad containing conductive features are formed.
In one or more embodiments of part of the present invention, the first patterned circuit of above-mentioned patterned circuit group with
And second patterned circuit be respectively formed at the relative both sides of exhaustion region.
In one or more embodiments of part of the present invention, the manufacture method of above-mentioned touch-control module can also be included in base
Touch-control sensing electrode is formed on material, wherein touch-control sensing electrode is insulated from each other on base material.
According to one or more embodiments of the invention, there is provided a kind of touch-control module.Touch-control module includes touch base plate, multiple
Touch-control sensing electrode, control chip and multiple patterned circuit groups.Touch base plate has touch-control sensing area and neighboring area.
Touch-control sensing electrode is arranged in touch-control sensing area.Patterned circuit group is arranged on neighboring area, and patterned circuit group connects
Between touch-control sensing electrode and control chip.Each patterned circuit group includes the first patterned circuit, the second patterned electricity
Road and conductive features.One of first patterned circuit and touch-control sensing electrode are electrically connected with.Second patterned circuit with
Control chip is electrically connected with.Conductive features are overlapped between the first patterned circuit and the second patterned circuit, to be electrically connected with
First patterned circuit and the second patterned circuit.
In one or more embodiments of part of the present invention, between above-mentioned touch-control sensing electrode on touch base plate that
This insulation.
In one or more embodiments of part of the present invention, above-mentioned touch-control sensing electrode comprising touch-control sensing area and
Cabling.Cabling is connected between touch-control sensing area and the first patterned circuit.
In one or more embodiments of part of the present invention, above-mentioned touch-control module, wherein each on touch base plate
It is substantially insulated from each other between the first patterned circuit of patterned circuit group, and the second patterning of each patterned circuit group
It is substantially insulated from each other between circuit.
In one or more embodiments of part of the present invention, above-mentioned first patterned circuit and the second patterned electricity
The material on road is different with the material of conductive features.
In one or more embodiments of part of the present invention, above-mentioned first patterned circuit and the second patterned circuit
Positioned at the different both sides of conductive features.
In one or more embodiments of part of the present invention, above-mentioned first patterned circuit can be comprising the first connection
Area, the second patterned circuit can include the second bonding pad.Conductive features are formed in the first bonding pad and the second bonding pad at least
The top of one of which.
Description of the drawings
By being more particularly described for the preferred embodiments of the present invention shown in accompanying drawing, the above and other mesh of the present invention
, feature and advantage will become more fully apparent.The identical reference instruction identical part in whole accompanying drawings, and not
Deliberately draw accompanying drawing by actual size equal proportion scaling, it is preferred that emphasis is the purport of the present invention is shown.
Fig. 1 show the flow chart of the manufacture method according to the above-mentioned touch-control module of multiple embodiments of the invention；
Fig. 2 to Fig. 7 show the manufacture method according to the above-mentioned touch-control module of multiple embodiments of the invention in touch-control module
Different phase rough schematic；
Fig. 8 show the manufacture method according to the other above-mentioned touch-control module of multiple embodiments of the present invention in touch-control module
Different phase rough schematic；
Fig. 9 show the side cutaway view according to touch-control module shown in Fig. 7 in line segment A-A '.
Main element symbol description
100：The manufacture method of touch-control module
200：Base material
220：Submounts
222：Neighboring area
224：Touch-control sensing area
300：Touch-control module
320：Touch-control sensing electrode
322：Touch-control sensing area
324：Cabling
340：Patterned circuit group
342：First patterned circuit
342A：First end
342B：Second end
342C：First bonding pad
344：Second patterned circuit
344A：First end
344B：Second end
344C：Second bonding pad
346：Exhaustion region
350：Conductive features
370：Flexible printed wiring board
380：Control chip
A-A’：Line segment
S101～S104：Step
Specific embodiment
It is understandable to enable the above objects, features and advantages of the present invention to become apparent from, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Elaborate many details in order to fully understand this in the following description
It is bright.But the present invention can be implemented with being much different from alternate manner described here, and those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not embodied as being limited by following public.
Herein, it is for describing various elements, component, region, layer using first, second and 3rd etc. vocabulary
And/or block can be what is be understood.But these components, component, region, layer and/or block should not be by these term institutes
Limit.These vocabulary are only limited to for distinguishing single element, component, region, layer and/or block.Therefore, hereinafter
One element, component, region, layer and/or block are also referred to as the second element, component, region, layer and/or block, without deviating from
The original idea of the present invention.
Fig. 1 is the flow chart of the manufacture method 100 according to the touch-control module shown in multiple embodiments of the invention.Such as Fig. 1
Shown, the manufacture method 100 of touch-control module is from step S101.In step S101, a base material is provided.Base material can be included
Multiple submounts.Submounts include touch-control sensing area, neighboring area and are arranged on multiple touch-control sensings electricity in touch-control sensing area
Pole (with reference to Fig. 3).Successively, step S102 is carried out.In step S102, in the neighboring area of submounts multiple patternings are formed
Circuit group.In multiple embodiments, patterned circuit group includes the first patterned circuit and the second patterned circuit.First
The first end of patterned circuit is configured to connect to one of touch-control sensing electrode, the first end configuration of the second patterned circuit
To be connected to control chip.Wherein, formed between the second end of the first patterned circuit and the second end of the second patterned circuit
Exhaustion region, it is insulated from each other between the first patterned circuit and the second patterned circuit to allow.In other words, in step s 102, exist
The first patterned circuit in same patterned circuit group forms exhaustion region between the two ends adjacent with the second patterned circuit, with exhausted
The patterned circuit of edge first and the second patterned circuit.Additionally, in other multiple embodiments, patterned circuit group also may be used
It is electrically connected with comprising the 3rd patterned circuit and earth terminal.
Successively, the step of carrying out manufacture method 100 of touch-control module S103.In step S103, a leading portion system is carried out
Journey.In multiple embodiments, FEOL can be included from base material splits multiple submounts, to form multiple touch-control moulds respectively
Block.In other multiple embodiments, FEOL can also be touched comprising multiple flexible printed wiring boards of fitting respectively to multiple
Control module, to connect each touch-control module to a control chip.Successively, step S104 is carried out.In step S104, vague and general
Conductive features are formed in area, the first patterned circuit and the second patterned electricity that conductive features are overlapped in patterned circuit group is allowed
Between road.
Due in the processing procedures such as the cutting base material of FEOL, laminating flexible printed wiring board, easily manufacturing simultaneously in submounts
The substantial amounts of electrostatic charge to be led off of accumulation, substantial amounts of electrostatic charge simultaneously cannot be poor across electric conductivity from the second patterned circuit
Exhaustion region is entered in the first patterned circuit being connected with touch-control sensing electrode.Therefore, the electrostatic charge accumulated can be avoided to exist
Touch-control sensing electrode causes excessive electric current, and damages touch-control sensing electrode or touch-control sensing electrode and the friendship of the first patterned circuit
At boundary etc..It is event, the manufacture method 100 of touch-control module can be reduced or avoided touch-control sensing electrode and the first patterned circuit boundary
Trickleer structure in place or touch-control sensing electrode, because electrostatic charge by the damage that causes.Further, can allow through touch-control mould
The yield of the touch-control module manufactured by the manufacture method 100 of block is improved, and reduces manufacturing cost.
Additionally, after present segment processing procedure terminates, successively, then conductive features are formed in exhaustion region.Take through conductive features
It is connected between the first patterned circuit and the second patterned circuit, allows touch-control sensing electrode to can pass through the first patterned circuit and the
Two patterned circuits or other components (such as control chip) for being connected to the second patterned circuit are electrically connected with.Consequently, it is possible to
Can allow touch-control module normal operation.
Fig. 2 to Fig. 7 is the manufacture of the touch-control module 300 that is respectively shown according to multiple embodiments of the invention in touch-control module
The rough schematic of the different phase of method 100.As shown in Fig. 2 base material 200 is provided.In multiple embodiments, base material
200 include submounts 220.Submounts 220 include touch-control sensing area 224 and neighboring area 222.With reference to Fig. 2, Fig. 3, touch-control mould
The manufacture method 100 of block is also included in formation touch-control sensing electrode in the touch-control sensing area 224 of the submounts 220 of base material 200
320.In multiple embodiments, the touch-control sensing electrode 320 of touch-control module 300 is formed in the pixel control layer of individual layer.Change
Sentence is talked about, the pixel control layer that structure structure is submounts 220 and individual layer that changes of touch-control module 300, but not limited to this.In others
In multiple embodiments, touch-control module 300 can also have plural layer pixel control layer.
As shown in figure 3, touch-control sensing electrode 320 includes touch-control sensing area 322 and cabling 324.Cabling 324 configures to connect
It is connected between the patterned circuit 342 of touch-control sensing area 322 and first (with reference to Fig. 4).In multiple embodiments, touch-control sensing area
322 can also include suitable touch-control sensing pattern, configure to produce corresponding electrical change, ability according to the position of user's touch-control
Domain tool usually intellectual is when the kenel that touch-control sensing pattern can be selected according to actual demand.In multiple embodiments, touch-control sense
Electrode 320 is surveyed insulated from each other on submounts 220, to allow touch-control module 300 preferably to perceive the position of user's touch-control.More
Say, the touch-control sensing area 322 of single touch-control sensing electrode 320 and cabling 324 are electrically connected to each other body, and touch in different
Between control sensing electrode 320, its touch-control sensing area 322 and cabling 324 insulate each other.
With reference to Fig. 4, in multiple embodiments, in the neighboring area 222 of submounts 220 multiple patterned circuit groups are formed
340.In multiple embodiments, patterned circuit group 340 can be comprising the first patterned circuit 342 and the second patterned circuit
344.First end 342A of the first patterned circuit 342 is connected to one of touch-control sensing electrode 320.Second patterned circuit
344 first end 344A is configured to connect to control chip 380 (with reference to Fig. 7).Wherein, patterned circuit group 340 is also comprising sky
Weary area 346, be formed in the first patterned circuit 342 the second end 342B and the second patterned circuit 344 the second end 344B it
Between, with allow maintain between the first patterned circuit 342 and the second patterned circuit 344 insulate state.In multiple embodiments,
First patterned circuit 342 and the second patterned circuit 344 can be respectively formed at the relative both sides of exhaustion region 346.Additionally,
In other multiple embodiments, patterned circuit group 340 can be also initially formed, re-form touch-control sensing electrode 320, and allow touch-control
Sensing electrode 320 is electrically connected with the first patterned circuit 342, but not limited to this.
In multiple embodiments, forming patterned circuit group 340 can also be included in the second of the first patterned circuit 342
End 342B forms the first bonding pad 342C；And form the second bonding pad in the second end 344B of the second patterned circuit 344
344C, to increase the connection area of the first patterned circuit 342 and the second patterned circuit 344.
With reference to Fig. 5, in multiple embodiments, split submounts 220 from base material 200, to form touch-control module respectively
300.In multiple embodiments, can by computerization Numerical Control cutting machine (CNC) or other suitable cutting modes come
Cutting base material 200.
Due in touch-control module 300, be allow individual layer pixel control layer in different touch-control sensing electrodes 320 between
Touch-control sensing area 322 and cabling 324 can be insulated from each other, therefore, the minimum feature of touch-control module 300 needs size reduction, and
Comparatively, touch-control sensing electrode 320 is also allowed to improve the susceptibility of electric current.For example, in multiple embodiments, touch-control
The minimum feature of sensing electrode 320 is less than 400 μm.Even, in multiple embodiments of part, touch-control sensing electrode 320
Minimum feature can be 70 μm.It is event, passes through and form exhaustion region 346 in the first patterned circuit 342 and the second patterned circuit
Between 344, the electrostatic charge accumulated because cutting base material 200 or other follow-up FEOLs can be reduced or avoided, pass through second
Patterned circuit 344 causes to damage into touch-control sensing electrode 320.
With reference to Fig. 6, successively, in multiple embodiments, conductive features 350 are formed in exhaustion region 346.Conductive features
350 are overlapped between the first patterned circuit 342 in patterned circuit group 340 and the second patterned circuit 344.In others
In multiple embodiments, the conductive features 350 of formation can more be overlapped on the first bonding pad 342C of patterned circuit group 340 and
Between second bonding pad 344C, to increase the patterned circuit 342 of conductive features 350 and first and the second patterned circuit 344
Between contact area, lift the conductance of patterned circuit group 340.
In multiple embodiments, first conductive material can be printed in exhaustion region 346；Then, by conductive material solidification with
Form conductive features 350, but not limited to this.In other multiple embodiments, can further in the first bonding pad
Conductive material is printed on 342C and the second bonding pad 344C.In multiple embodiments, the conduction material of conductive features 350 is formed
Material can be different with the material of the first patterned circuit 342 and the second patterned circuit 344.For example, conductive material can be
Silver, silver alloy or other suitable conductive materials.For example, the first patterned circuit 342 and the second patterned circuit 344
Material can be copper, copper alloy or other suitable conductive materials.
With reference to Fig. 7, successively, in multiple embodiments, flexible printed wiring board 370 is can pass through by control chip 380
The second patterned circuit 344 is electrically connected to, to allow control chip 380 to pass through patterned circuit group 340 and touch-control sensing electrode
320 are electrically connected with, and thereby drive touch-control sensing electrode 320, make the touch-control module 300 can normal operation.It will be understood that this place
The connection control chip 380 of transmission flexible printed wiring board 370 stated is merely illustrative with the mode of the second patterned circuit 344, its
And be not used to limit the aspect of the present invention.In other multiple embodiments, can also be comprising leading that other are for electrically connecting to
Electrical component is connected between the patterned circuit 344 of control chip 380 and second.For example, seem anisotropic conductive film
The suitable coupling assembly such as (Anisotropic conductive film, ACF).
Fig. 8 is the manufacturer according to the touch-control module 300 shown in the other multiple embodiments of the present invention in touch-control module
The rough schematic of the different phase of method.Referring concurrently to shown in Fig. 7, Fig. 8, in other multiple embodiments, also can be first saturating
Cross the second patterned circuit 344 that control chip 380 is connected to flexible printed wiring board 370 touch-control module 300；Successively,
Conductive features 350 are formed in exhaustion region 346 again, so that control chip 380 is connected to into touch-control sense through patterned circuit group 340
Survey electrode 320.Consequently, it is possible to the Making programme for manufacturing touch-control module 300 can be avoided further in connection soft printing electricity
Produced electrostatic charge is entered in touch-control sensing electrode 320 during the plate 370 of road.Further, touch-control sensing electrode can be reduced or avoided
320 situations about sustaining damage.
Fig. 9 is the side cutaway view according to the touch-control module 300 shown in Fig. 7 in line segment A-A '.As shown in figure 9, multiple
In embodiment, conductive features 350 are formed in vague and general between the first patterned circuit 342 and the second patterned circuit 344
In area 346.In other multiple embodiments, conductive features 350 can more be formed in the first bonding pad 342C and/or second and connect
Connect on area 344C, with the first patterned circuit 342 and the mutual repeatedly structure of the second patterned circuit 344.
With reference to Fig. 7, touch-control module 300 can include touch base plate (can be by submounts 220 depending on doing touch base plate), multiple touch-controls
Sensing electrode 320, control chip 380 and multiple patterned circuit groups 340.Touch base plate have touch-control sensing area 224 and
Neighboring area 222.Wherein, touch-control sensing electrode 320 is arranged in touch-control sensing area 224.Patterned circuit group 340 is arranged on week
Border area domain 222, and patterned circuit group 340 is connected between touch-control sensing electrode 320 and control chip 380.Patterned circuit
Group 340 includes at least the first patterned circuit 342, the second patterned circuit 344 and conductive features 350.First patterned electricity
One of them electric connection of road 342 and touch-control sensing electrode 320.Second patterned circuit 344 electrically connects with control chip 380
Connect.Conductive features 350 are overlapped between the first patterned circuit 342 and the second patterned circuit 344, to be electrically connected with the first figure
The patterned circuit 344 of case circuit 342 and second.
In sum, the present invention provides a kind of manufacture method of touch-control module, and comprising base material is provided, base material includes many height
Substrate, submounts include touch-control sensing area, neighboring area and are arranged on multiple touch-control sensing electrodes in touch-control sensing area；Continue
Ground, in the neighboring area of submounts patterned circuit group is formed, and patterned circuit group includes the first patterned circuit and second
Patterned circuit, the first end of the first patterned circuit is connected to one of touch-control sensing electrode, the second patterned circuit
First end is configured to connect to control chip, wherein the second end of the second end of the first patterned circuit and the second patterned circuit
Between form exhaustion region, with insulate the first patterned circuit and the second patterned circuit；Successively, a FEOL is carried out；With
And, conductive features are formed in the exhaustion region of patterned circuit group, conductive features are overlapped on the first patterned circuit and the second figure
Between case circuit.By in the manufacture process of touch-control module, in touch-control sensing electrode and other assemblies (such as control chip)
Between connection circuit on be initially formed exhaustion region, insulate touch-control sensing electrode and the electric connection of other assemblies.Further, can reduce or
The electrostatic charge accumulated in FEOL is avoided to enter touch-control sensing electrode through connection circuit and damage touch-control sensing electrode.
Successively, after present segment processing procedure terminates, then conductive features are formed in exhaustion region, connect touch-control sensing electrode and other assemblies,
To conduct electric signal.Consequently, it is possible to through the touch-control module manufactured by the present invention except can in addition to normal operation, meanwhile, also reduce or
Avoid touch-control sensing electrode from being damaged in the fabrication process, increase the yield of touch-control module, further reduce manufacturing cost.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (16)
1. a kind of manufacture method of touch-control module, it is characterised in that include：
One base material is provided, comprising multiple submounts, these submounts of each of which comprising a touch-control sensing area, a neighboring area with
And it is arranged on multiple touch-control sensing electrodes in the touch-control sensing area；
Multiple patterned circuit groups are formed in the neighboring area of each these submounts, each of which these patterned circuit groups
Comprising one first patterned circuit and one second patterned circuit, a first end of first patterned circuit is connected to these
One of touch-control sensing electrode a, first end of second patterned circuit is configured to connect to a control chip, wherein should
An exhaustion region is formed between one second end of the first patterned circuit and one second end of second patterned circuit, is somebody's turn to do with insulating
First patterned circuit and second patterned circuit；
Carry out a FEOL；And
Form a conductive features in the exhaustion region of each these patterned circuit groups, allow the conductive features be overlapped on this first
Between patterned circuit and second patterned circuit.
2. the manufacture method of touch-control module as claimed in claim 1, it is characterised in that described the step of carry out the FEOL
Comprising：
Split these submounts from the base material, to form multiple touch-control modules respectively.
3. the manufacture method of touch-control module as claimed in claim 2, it is characterised in that described the step of carry out the FEOL
Also include：
Multiple flexible printed wiring boards are fitted respectively to these touch-control modules, to connect each these touch-control modules to the control core
Piece.
4. the manufacture method of touch-control module as claimed in claim 1, it is characterised in that the shape in each these exhaustion regions
The step of into the conductive features, includes：
A conductive material is printed in each these exhaustion regions；And
Solidify the conductive material to form the conductive features.
5. the manufacture method of touch-control module as claimed in claim 4, it is characterised in that first patterned circuit and should
The material of the second patterned circuit is different with the material of the conductive material.
6. the manufacture method of touch-control module as claimed in claim 1, it is characterised in that the formation these patterned circuit groups
The step of also include：
One first bonding pad is formed at second end of first patterned circuit of each these patterned circuit groups；And
One second bonding pad is formed at second end of second patterned circuit of each these patterned circuit groups.
7. the manufacture method of touch-control module as claimed in claim 6, it is characterised in that the shape in each these exhaustion regions
The step of into the conductive features, includes：
Formed the conductive features be overlapped on each these patterned circuit groups first bonding pad and second bonding pad it
Between.
8. the manufacture method of touch-control module as claimed in claim 1, it is characterised in that each these patterned circuit groups should
First patterned circuit and second patterned circuit are respectively formed at the relative both sides of the exhaustion region.
9. the manufacture method of touch-control module as claimed in claim 1, it is characterised in that also include：
These touch-control sensing electrodes are formed on the substrate, and wherein these touch-control sensing electrodes are insulated from each other on the substrate.
10. a kind of touch-control module, it is characterised in that include：
One touch base plate, with a touch-control sensing area and a neighboring area；
Multiple touch-control sensing electrodes, are arranged in the touch-control sensing area；
One control chip；And
Multiple patterned circuit groups, are arranged on the neighboring area, and these patterned circuit groups are connected to these touch-control sensing electricity
Between pole and the control chip, each of which these patterned circuit groups are included：
One first patterned circuit, is electrically connected with one of these touch-control sensing electrodes；
One second patterned circuit, is electrically connected with the control chip；And
One conductive features, are overlapped between first patterned circuit and second patterned circuit, be electrically connected with this first
Patterned circuit and second patterned circuit.
11. touch-control modules as claimed in claim 10, it is characterised in that on the touch base plate these touch-control sensing electrodes it
Between it is insulated from each other.
12. touch-control modules as claimed in claim 10, it is characterised in that each these touch-control sensing electrodes are included：
One touch-control sensing area；And
One cabling, is connected between the touch-control sensing area and first patterned circuit.
13. touch-control modules as claimed in claim 10, it is characterised in that each these patterned circuits on the touch base plate
It is substantially insulated from each other between first patterned circuit of group, and second patterned electricity of each these patterned circuit groups
It is substantially insulated from each other between road.
14. touch-control modules as claimed in claim 10, it is characterised in that first patterned circuit and second pattern
The material for changing circuit is different with the material of the conductive features.
15. touch-control modules as claimed in claim 10, it is characterised in that first patterned circuit and second patterning
Circuit is located at the different both sides of the conductive features.
16. touch-control modules as claimed in claim 10, it is characterised in that first patterned circuit includes one first connection
Area, second patterned circuit includes one second bonding pad, wherein the conductive features be formed in first bonding pad and this
The top of two bonding pads one at least within.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610915944.0A CN106569632A (en) | 2016-10-20 | 2016-10-20 | Touch module and fabrication method therefor |
| TW105135560A TWI598790B (en) | 2016-10-20 | 2016-11-02 | Touch sensing module and method for fabricating the same |
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| CN201610915944.0A CN106569632A (en) | 2016-10-20 | 2016-10-20 | Touch module and fabrication method therefor |
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|---|---|---|---|---|
| CN101995985A (en) * | 2009-08-14 | 2011-03-30 | 义隆电子股份有限公司 | Touch pad master sheet capable of improving electrostatic discharge in manufacturing process |
| CN103365470A (en) * | 2013-07-01 | 2013-10-23 | 友达光电股份有限公司 | Touch control panel and manufacturing method thereof |
| CN103761019A (en) * | 2013-11-15 | 2014-04-30 | 友达光电股份有限公司 | Touch panel and manufacturing method thereof |
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| TW200801746A (en) * | 2006-06-02 | 2008-01-01 | Wintek Corp | A display device |
| TWI416384B (en) * | 2009-10-06 | 2013-11-21 | Wintek Corp | Mother board of touch panel and touch panel |
| KR101040846B1 (en) * | 2010-03-16 | 2011-06-14 | 삼성모바일디스플레이주식회사 | Touch screen panel and fabrication method thereof |
| JP5969961B2 (en) * | 2013-07-12 | 2016-08-17 | 富士フイルム株式会社 | Wiring board |
| KR102142855B1 (en) * | 2013-08-29 | 2020-08-31 | 미래나노텍(주) | Wired electrode for touchscreen panel, touchscreen panel using the same and manufacturing method of the same |
| KR102187807B1 (en) * | 2014-04-17 | 2020-12-07 | 엘지이노텍 주식회사 | Touch panel and touch device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101995985A (en) * | 2009-08-14 | 2011-03-30 | 义隆电子股份有限公司 | Touch pad master sheet capable of improving electrostatic discharge in manufacturing process |
| CN103365470A (en) * | 2013-07-01 | 2013-10-23 | 友达光电股份有限公司 | Touch control panel and manufacturing method thereof |
| CN103761019A (en) * | 2013-11-15 | 2014-04-30 | 友达光电股份有限公司 | Touch panel and manufacturing method thereof |
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| TW201816565A (en) | 2018-05-01 |
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