CN106550177A - A kind of photographic head and its manufacture method and terminal - Google Patents
A kind of photographic head and its manufacture method and terminal Download PDFInfo
- Publication number
- CN106550177A CN106550177A CN201610805099.1A CN201610805099A CN106550177A CN 106550177 A CN106550177 A CN 106550177A CN 201610805099 A CN201610805099 A CN 201610805099A CN 106550177 A CN106550177 A CN 106550177A
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- substrate
- fpc
- terminal
- photographic head
- heat
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Embodiments provide a kind of photographic head.Photographic head at least includes：The photographic head at least includes：Imageing sensor, flexible printed circuit (abbreviation FPC), substrate；Wherein, the FPC is placed on the substrate, and the FPC has position to hollow out；Described image sensor fixes the position for hollowing out corresponding to the FPC on the substrate；Described image sensor is connected to the FPC by signal lead.Technical solution of the present invention can be by hollowing out and being placed on substrate in the position of correspondence image sensor FPC, imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, the integral thickness of photographic head can be reduced, the height (120um) of a FPC is at least reduced.
Description
Technical field
The present invention relates to optical field, more particularly to a kind of photographic head and its manufacture method and terminal.
Background technology
" thin " has been one of main fashionable element of intelligent terminal's appearance design instantly, and terminal consumer is to " thin "
Pursue, terminal manufacturer, supplier increasingly pursue manufacture and provide thinner terminal.The thickness of terminal is generally dependent on terminal
The part of internal maximum gauge, the terminal with shooting or camera function are generally dependent on the thickness of photographic head.Due to photographic head
Comprising more part, generally, module internal be integrated with voice coil motor (Voil Coil Motor, referred to as VCM, its
In comprising the appurtenances such as coil, Magnet), filter plate, imageing sensor, printed circuit board (PCB) (Printed Circuit
Board, referred to as PCB), flexible printed circuit (Flexible Printed Circuit Board, referred to as FPC)
Deng, therefore, how to manufacture the thinner design for being critically depend on photographic head with shooting or camera function terminal.It is existing to take the photograph
As header structure is typically：Imageing sensor is connected on PCB by bonding wire, PCB bottoms connection FPC, FPC are connected to terminal master
On plate.The structure design of this photographic head causes the thickness of photographic head very big, and the whole of the terminal is necessarily affected in being assembled into terminal
Body thickness；If integrally reducing terminal and can cause photographic head evagination, the overall appearance of terminal is greatly affected again.
And, the heat consumption with shooting or the photographic head of camera function terminal is general very big, terminal enclosure correspondence photographic head
Position temperature can be very high, terminal use heat experience it is very poor, prior art typically can by increase additional assemblies photographic head is entered
Row radiating, and additional assemblies can typically increase the thickness of the whole machine of terminal.
The content of the invention
In order to solve the above problems, the embodiment of the present invention provides a kind of photographic head and its manufacture method and terminal, by inciting somebody to action
FPC (Flexible Printed Circuit Board, referred to as FPC) is hollowed out and is disposed in the position of correspondence image sensor
On substrate, imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, reduces the thickness of photographic head so that tool
The thickness for having camera function terminal reduces.
First aspect provides a kind of photographic head, it is characterised in that the photographic head at least includes：Imageing sensor, can
Flexible print wiring board (abbreviation FPC), substrate；
Wherein, the FPC is placed on the substrate, and the FPC has position to hollow out；
Described image sensor fixes the position for hollowing out corresponding to the FPC on the substrate；
Described image sensor is connected to the FPC by signal lead.
With reference in a first aspect, in the first possible implementation of first aspect, the substrate is a kind of high heat conduction
Substrate, the high thermal conductive substrate heat conductivity are greater than 40W/mk.
With reference to the first possible implementation of first aspect, in second possible implementation of first aspect
In, described image sensor is adhesive on the high thermal conductive substrate using high-heat-conductivity glue, and the high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；Described image sensor is connected to the FPC by gold thread.
With reference to second possible realization of the first possible implementation or first aspect of first aspect or first aspect
Mode, in the third possible implementation kind of first aspect, can be fixed on above-mentioned signal lead on substrate, for consolidating
Signal lead is in case stop signal walks thread breakage
FPC is hollowed out and is placed in the position of correspondence image sensor by a kind of photographic head provided in an embodiment of the present invention
On substrate, imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, can reduce the integral thickness of photographic head, extremely
The height (120um) of a FPC is reduced less, reduces the thickness with camera function terminal；Further, substrate is led using height
Hot material makes, and the heat that imageing sensor is produced can be passed by substrate, it is possible to increase the heat dispersion of photographic head.
Second aspect provides a kind of terminal, at least includes：A kind of photographic head；Wherein, photographic head at least includes：Image is passed
Sensor, FPC, substrate；
Wherein, the FPC is placed on the substrate, and the FPC has position to hollow out；
Described image sensor fixes the position for hollowing out corresponding to the FPC on the substrate；
Described image sensor is connected to the FPC by signal lead；
The FPC is connected with the mainboard of the terminal；
The substrate is fixedly connected with the screen or center of the terminal；Or using the screen or center of the terminal as
Substrate, the center of the terminal are the frame structure for supporting terminal.
With reference to second aspect, in the first possible implementation of second aspect, the substrate has at least one
Extend side；The side of the screen opens up fluted, and the substrate is by way of the prolongation side is embedded in the groove
It is fixedly connected with the screen；Or, the side of the center opens up fluted, and the substrate is embedded into by the prolongation side
Mode in the groove is fixedly connected with the center.
With reference to the first possible implementation of second aspect or second aspect, second in second aspect may
Implementation in, pit, the bottom surface area of the pit and the substrate have been dug on the screen inner surface or center
Lower surface area match, the substrate is by being embedded in the pit on the screen inner surface or center of the terminal
Mode be fixed on the screen inner surface or center of the terminal.
Can with reference to second of the first possible implementation or second aspect of second aspect or second aspect
Can implementation, in the third possible implementation of second aspect, the substrate is a kind of high thermal conductive substrate, the height
Heat-conducting substrate heat conductivity is greater than 40W/mk.
With reference to the third possible implementation of second aspect, in the 4th kind of possible implementation of second aspect
In, described image sensor is adhesive on the high thermal conductive substrate using high-heat-conductivity glue, and the high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；Described image sensor is connected to the FPC by gold thread, carries out signal transmission.
A kind of terminal provided in an embodiment of the present invention, by FPC to be placed on substrate and hollow out FPC certains, figure
As sensor is fixed on substrate the position hollowed out corresponding to FPC, the integral thickness of photographic head can be reduced, at least reduce by one
The height (120um) of FPC so that the super thick degree with camera function terminal is reduced；Further, substrate adopts highly heat-conductive material
Make, substrate is fixedly connected with terminal screen or center, it is possible to increase the diffusion of photographic head heat consumption；It is further that substrate is embedding
Enter the thickness that the structure design in the screen or center of terminal reduces photographic head, while can pass through what photographic head was produced by substrate
Heat consumption is conducted to the screen inner surface or center of terminal, then is uniformly spread by screen or center.
The third aspect provides a kind of manufacture method of photographic head, it is characterised in that include：
Position at the FPC mono- is hollowed out, and the FPC is placed on the substrate；
Described image sensor is fixed on the substrate corresponding to the position that the FPC is hollowed out；
Described image sensor is connected to into the FPC by signal lead.
With reference to the third aspect, in the first implementation of the third aspect, make described using a kind of highly heat-conductive material
Substrate, the heat conductivity of highly heat-conductive material are greater than 40W/mk；
Using high-heat-conductivity glue by it is described image sensor viscous on the substrate, the high-heat-conductivity glue heat conductivity be higher than or
Person is equal to 0.2W/mk.
A kind of shooting method for making head provided in an embodiment of the present invention, the position of FPC correspondence image sensors is hollowed out simultaneously
It is placed on substrate, imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, at least one FPC can be reduced
Height photographic head integral thickness, reduce the thickness of the terminal with camera function.
Fourth aspect provides a kind of installation method of photographic head, it is characterised in that the method includes：
Pit, the bottom surface area of above-mentioned pit and treating for photographic head have been dug on the screen inner surface or center of terminal
The lower surface area of embedded substrate matches；Match refer to substrate be embedded in pit enable to substrate and terminal screen or
Center firmly fixes connection；
Substrate to be embedded is embedded into into above-mentioned pit.
With reference to fourth aspect, in the first attainable mode of fourth aspect, substrate to be embedded is being embedded in into pit
Before, coating viscosity glue on the face contacted with pit on substrate or the inner surface of pit；Consolidating for substrate and screen or center can be strengthened
It is fixed.
The embodiment of the present invention by the pit that digs on the screen inner surface or center by the substrate of photographic head embedded terminal,
Photographic head is arranged in terminal, the fixation of photographic head and terminal can be strengthened and can be reduced or even be saved the assembling such as screw
Part.
A kind of method that photographic head is installed is provided in terms of 5th, it is characterised in that the method includes：
The size of the substrate to be embedded of groove, above-mentioned groove and photographic head is opened up on the side of the screen or center of terminal
Match, matching is referred to that substrate is embedded in groove and enable to substrate and firmly fixed with terminal screen or center be connected；
Substrate to be embedded is embedded into into above-mentioned groove.
It is in terms of the 5th, in the first mode in the cards in terms of the 5th, recessed substrate to be embedded is embedded in
Before groove, coating viscosity glue on the face contacted with groove on substrate or the inner surface of groove；Substrate and screen or center can be strengthened
It is fixed.
The embodiment of the present invention by the groove that digs the screen or center of the substrate of photographic head embedded terminal, by photographic head
In terminal, the fixation of photographic head and terminal can be strengthened and can be reduced or even be saved the Assembly parts such as screw.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are these
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 a：The embodiment of the present invention provides a kind of side view of camera structure；
Fig. 1 b：The embodiment of the present invention provides a kind of top view of camera structure；
Fig. 2：The embodiment of the present invention provides a kind of schematic diagram of intelligent terminal；
Fig. 3 a：The embodiment of the present invention provides the side view that a kind of photographic head is fixedly connected with the screen or center of terminal；
Fig. 3 b：The embodiment of the present invention provides the top view that a kind of photographic head is fixedly connected with the screen or center of terminal；
Fig. 4 a：The embodiment of the present invention provides the side view that a kind of photographic head is fixedly connected with terminal screen or center；
Fig. 4 b：The embodiment of the present invention provides the top view that a kind of photographic head is fixedly connected with the screen or center of terminal；
Fig. 5 a：The embodiment of the present invention provides a kind of side view of terminal screen or center as substrate；
Fig. 5 b：The embodiment of the present invention provides a kind of top view of terminal screen or center as substrate；
Fig. 6：The embodiment of the present invention provides a kind of flow chart of shooting method for making head；
Fig. 7:The embodiment of the present invention provides a kind of flow chart of photographic head installation method；
Fig. 8:The embodiment of the present invention provides a kind of flow chart of photographic head installation method.
Specific embodiment
To make purpose, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
The a part of embodiment of the present invention, rather than the embodiment of whole.It should be noted that based on the embodiment in the present invention, ability
Every other embodiment that domain those of ordinary skill is obtained under the premise of creative work is not made and do not conflicting
In the case of the present invention in embodiment and being mutually combined for various modes in embodiment belong to the scope of protection of the invention.
Fig. 1 a and Fig. 1 b provides a kind of camera structure schematic diagram for the embodiment of the present invention, and Fig. 1 a are the camera structure
Side view, Fig. 1 b are the top view of the camera structure.What photographic head involved in the present invention was not limited to that the present embodiment takes takes the photograph
As header structure.As illustrated in figs. ia and ib, a kind of photographic head is present embodiments provided, is at least included：It is imageing sensor 1, flexible
Property printed circuit board (PCB) 2 (Flexible Printed Circuit Board, referred to as FPC), substrate 3, above-mentioned FPC 2 be used for scheme
As the data transfer between sensor 1 and terminal mainboard, aforesaid substrate 3 refers to that playing support photographic head other assemblies or substrate makees
Plate-like structure, for example, play the PCB (Printed Circuit Board, referred to as PCB) of support or substrate effect；
Wherein, FPC 2 is placed on substrate 3, and FPC 2 has position to hollow out, and shape and the imageing sensor 1 at the place of hollowing out keep
Unanimously, the size for hollowing out place is more somewhat larger than imageing sensor 1；Imageing sensor 1 is fixed on substrate 3 and hollows out corresponding to FPC 2
Position at, thus do not interfere with the light path for being delivered to imageing sensor 1, and photographic head can be caused to reduce a FPC 2
Height (about 120um)；Imageing sensor 1 is connected to FPC 2 by signal lead, realizes that signal is transmitted mutually；Further,
Above-mentioned signal lead can be fixed on the substrate 3, for consolidating signal lead in case stop signal walks thread breakage.
The embodiment of the present invention provides a kind of photographic head, and imageing sensor is fixed on the position that substrate is hollowed out corresponding to FPC
Place, is not interfered with imageing sensor and processes the image information that imageing sensor is passed to by the FPC places of hollowing out.
Optionally, substrate 3 is made using a kind of material with high thermal conductivity, that is, high thermal conductive substrate, this height
The heat conductivity of heat-conducting substrate is greater than 40W/mk, the heat conductivity of the PCB used in prior art 40W/mk with
Under, by contrast, the heat dispersion using the photographic head of high thermal conductive substrate is naturally more preferable.
Optionally, imageing sensor 1 is adhesive on high thermal conductive substrate using high-heat-conductivity glue, and high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；Imageing sensor 1 is connected with FPC 2 by gold thread 4, carries out signal transmission.
Optionally, high thermal conductive substrate can be that any substrate and heat conductivity of being suitable as is greater than 40W/mk
Material, is such as made metal basal board, carbon fiber reinforced substrate is made of carbon fiber, is made composite substrate with composite with metal
Deng.By the optimization of above-mentioned material intensity and substrate design structure, it is possible to decrease high thermal conductive substrate thickness, shooting is further reduced
The integral thickness of head, makes the lower thickness of the terminal with camera function.
FPC is hollowed out and is placed in the position of correspondence image sensor by a kind of photographic head provided in an embodiment of the present invention
On substrate, imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, can reduce the integral thickness of photographic head, extremely
The height (120um) of a FPC is reduced less so that the thickness with camera function terminal reduces；Further, substrate is using high
Heat Conduction Material makes, and the heat that imageing sensor is produced can be delivered to terminal screen or center, Neng Gouti by high thermal conductive substrate
The heat dispersion of high photographic head.
One of ordinary skill in the art will appreciate that：The photographic head that above-described embodiment is provided can apply to any tool
Have shooting, take pictures, image acquisition or the equipment with similar functions structure, product, terminal etc., such as panel computer, driving note
Record instrument etc.；Equally, the photographic head that the present embodiment is provided can apply to any one with multiple photographic head to be had shooting, claps
According to, image acquisition or the equipment with similar functions structure, product, terminal etc., such as mobile phone with dual camera, no matter two
Individual photographic head is to share a FPC, substrate or each use FPC, a substrate, and the camera structure that the present embodiment is provided can
To be applied to the mobile phone of dual camera.
Fig. 2 is a kind of structural representation of intelligent terminal in the embodiment of the present invention；Wherein the intelligent terminal includes RF circuits
1201st, Wi-Fi module 1202, display unit 1203, input block 1204, first memory 1205, second memory 1206, place
The hardware modules such as reason device 1207, power supply 1208, photographic head 1209, GPS module 1210, the terminal 1200 can be mobile phone, flat board
Computer, PDA (Personal Digital Assistant, personal digital assistant), or vehicle-mounted computer etc..
Wherein, RF circuits 1201 are used for receiving and dispatching signal of communication；
Wi-Fi module 1202 is used for connecting network and scanning network signal.RF circuits 1201 and/or Wi-Fi module
1202 can contact the current position coordinates for obtaining the intelligent terminal with wireless base station.
Display unit 1203 is used for showing User Interface that the display unit 1203 can be used to show by user input
Information is supplied to the information of user and the various menu interfaces of the intelligent terminal.The display unit 1203 may include display surface
Plate, optionally, can adopt LCD (Liquid Crystal Display, liquid crystal display) or OLED (Organic Light-
Emitting Diode, Organic Light Emitting Diode) etc. form configuring display floater.In implementing, above-mentioned contact panel
The display floater is covered, touch display screen is formed, processor 1207 is provided according to the type of touch event in touch display screen
Corresponding visual output.
Input block 1204 can be used for the numeral or character information of receives input, receive user switching Application Program Interface behaviour
Make, and produce switching signal, and produce the signal input relevant with the user of terminal setting and function control.Specifically,
In the embodiment of the present invention, the input block 1204 can include contact panel, also referred to as touch screen, user can be collected thereon or
Neighbouring touch operation (such as user is operated on contact panel using any suitable objects such as finger, stylus or adnexa),
Contact panel can be realized using polytypes such as resistance-type, condenser type, infrared ray and surface acoustic waves.Except contact panel,
Input block 1204 can also include other input equipments, and including but not limited to (such as volume control is pressed for physical keyboard, function key
Key, switch key etc.), trace ball, mouse, one or more in action bars etc..
Wherein, first memory 1205 stores the APP and interface information of the terminal predetermined number；It should be understood that the
Two memorizeies 1206 can be the external memory of the terminal 1200, and first memory 1205 can be the internal memory of the intelligent terminal.First
Memorizer 1205 can be NVRAM nonvolatile storages, DRAM dynamic RAMs, SRAM SRAMs, Flash
One of flash memory etc.；The operating system run on the intelligent terminal is typically mounted on first memory 1205.Second storage
Device 1206 can be hard disk, CD, USB disk, floppy disk or magnetic tape controller, Cloud Server etc..Alternatively, it is third-party now with some
APP can also be arranged on second memory 1206.
Processor 1207 is the control centre of intelligent terminal, using various interfaces and each portion of the whole terminal of connection
Point, software program and/or module in the first memory 1205 are stored in by running or performing, and call and be stored in this
Data in second memory 1206, perform the various functions and processing data of the intelligent terminal.Optionally, the processor 1207
May include one or more processing units.
Power supply 1208 can be powered for whole terminal, including the lithium battery of various models.
GPS module 1210 is used for the position coordinateses for obtaining the intelligent terminal.
Further, as illustrated in figs. ia and ib, photographic head 1209 at least includes：Imageing sensor 1, FPC 2, substrate
3；Wherein, FPC 2 is placed on substrate 3, and FPC 2 has position to hollow out, and shape and the imageing sensor 1 at the place of hollowing out are protected
Hold consistent, the size for hollowing out place can be more somewhat larger than imageing sensor 1；Imageing sensor 1 is fixed on substrate 3 corresponding to FPC
At 2 positions for hollowing out, the light path for being delivered to imageing sensor 1 is not so interfered with, photographic head can be caused to reduce a FPC 2
Height (120um)；Imageing sensor 1 is connected to FPC 2 by signal lead, realizes that signal is transmitted mutually；Further, will
Above-mentioned signal lead is fixed on the substrate 3, for consolidating signal lead in case stop signal walks thread breakage；The master of FPC 2 and terminal
Plate connects, and carries out data signal transmission；Further, as shown in Figure 3 a and Figure 3 b shows or shown in Fig. 4 a and Fig. 4 b, substrate 3 and terminal
Screen or center be fixedly connected, wherein, center be support terminal frame structure；Optionally, as shown in figure 5a and 5b, can be with
Using the screen of terminal or center 5 as substrate 3.
Further, as shown in Figure 3 a and Figure 3 b shows, a pit 501 has been dug on the screen inner surface or center 5 of terminal,
The bottom surface area of pit 501 is matched with the lower surface area of substrate 3, substrate 3 be embedded into the screen inner surface of terminal or in
In the pit 501 dug on frame 5, as the bottom surface area of pit 501 is matched with the lower surface area of substrate 3, substrate 3 is embedding
Entering pit 501 can be such which is fixedly connected with terminal screen or center and firmly.
Optionally, as shown in figures 4 a and 4b, substrate 3 extends side 301 with least one；Open the side of terminal screen 5
Groove 502 is provided with, substrate 3 is by way of extending the groove 502 that the side of the screen 5 that side 301 is embedded into terminal opens up and shields
Curtain 5 is fixedly connected, and groove 502 is matched with substrate prolongation side 301 and enables to substrate 3 and be fixedly connected with screen 5 and firmly；Or
Person, the side of center 5 open up fluted 502, and substrate 3 is embedded into the groove 502 that the side of center 5 opens up by extending side 301
Mode be fixedly connected with center 5, groove 502 and substrate are extended side 301 and match and enable to substrate 3 and fixed with center 5 connect
Connect and firmly.Optimum, the thickness of substrate 3 is less than the height of the groove 502 that the screen of terminal or 5 side of center open up, groove
Height be, in the size of screen or center upper surface to lower surface vertical direction, can thus to reduce the thickness of a substrate 3
Degree so that the thickness of the terminal with camera function reduces；Meanwhile, substrate 3 is fixed on can on the screen 5 or center of terminal
Increase the steadiness of photographic head, and the heat consumption of photographic head 1209 can carry out uniform thermal expansion by the screen of terminal or center 5
Dissipate, it is to avoid the position temperature of terminal enclosure correspondence photographic head 1209 is high, improves the hot experience level of terminal use.Optionally, substrate
Can extend two or three or four prolongation sides, and by extending side and being embedded into the screen of terminal or that center side opens up is recessed
The mode of groove is fixedly connected with the screen of terminal or center.
Further, the screen or center of terminal is that directly photographic head 1209 is produced in the screen of terminal as substrate
On surface or center 5.As shown in figure 5 a and 5b, wherein Fig. 5 a are produced on the screen inner surface or center of terminal for photographic head
Structure side view, Fig. 5 b are produced on the top view of the structure on the screen inner surface or center of terminal for photographic head.To take the photograph
As head is produced on the screen inner surface or center 5 of terminal, that is, the screen inner surface with terminal or center 5 substitute such as Fig. 1 a
With the substrate 3 in Fig. 1 b.Such design at least reduces the thickness of a substrate 3；It is possible to further by the FPC2 of photographic head
It is embedded in the pit on terminal screen inner surface or center 5 with imageing sensor 1, by reducing FPC 2 and image sensing
The thickness of device further reduces the thickness of photographic head.
Optionally, substrate 3 is made using a kind of material with high thermal conductivity, that is, high thermal conductive substrate；This height
The heat conductivity of heat-conducting substrate is greater than 40W/mk, the heat conductivity of the PCB used in prior art 40W/mk with
Under, by contrast, the heat dispersion using the photographic head of high thermal conductive substrate is naturally more preferable.
Optionally, imageing sensor 1 is adhesive on high thermal conductive substrate using high-heat-conductivity glue, and high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；Imageing sensor 1 is connected with FPC 2 by gold thread 4, carries out signal transmission.
Optionally, high thermal conductive substrate can be that any substrate and heat conductivity of being suitable as is greater than 40W/mk
Material, is such as made metal basal board, carbon fiber reinforced substrate is made of carbon fiber, is made composite substrate with composite with metal
Deng.Being optimized by the strength of materials reduces the thickness of high thermal conductive substrate, further reduces the integral thickness of photographic head, makes with shooting
The thickness of the terminal of function reduces.
A kind of terminal provided in an embodiment of the present invention, by FPC to be placed on substrate and hollow out FPC certains, figure
As sensor is fixed on substrate the position hollowed out corresponding to FPC, the integral thickness of photographic head can be reduced, at least reduce by one
The height (120um) of FPC so that the super thick degree with camera function terminal is reduced；Further, substrate adopts highly heat-conductive material
Make, substrate is fixedly connected with terminal screen or center, it is possible to increase the diffusion of photographic head heat consumption；It is further that substrate is embedding
Enter the thickness that the structure design in the screen or center of terminal reduces photographic head, while can pass through what photographic head was produced by substrate
Heat consumption is conducted to the screen inner surface or center of terminal, then is uniformly spread by screen or center.
A kind of manufacture method of photographic head is embodiments provided, as shown in fig. 6, the method includes：.
S100, hollows out position at FPC mono-, and the FPC is placed on the substrate；
S110, imageing sensor is fixed on the substrate corresponding to the position that FPC is hollowed out；
Imageing sensor is connected to FPC by signal lead by S120.
Optionally, substrate is made using a kind of highly heat-conductive material；The heat conductivity of highly heat-conductive material is greater than
40W/mk；
Optionally, imageing sensor 1 is bonded on substrate using high-heat-conductivity glue；The high-heat-conductivity glue heat conductivity be higher than or
Person is equal to 0.2W/mk.
Optionally, above-mentioned high thermal conductive substrate can be any material for being suitable as substrate and heat conductivity higher than 40W/mk
Material, is such as made metal basal board, carbon fiber reinforced substrate is made of carbon fiber, is made composite substrate with composite with metal
Deng.FPC is placed on substrate and hollows out FPC certains by a kind of manufacture method of photographic head provided in an embodiment of the present invention,
Imageing sensor is fixed on substrate the position hollowed out corresponding to FPC, can reduce the integral thickness of photographic head, at least reduces by one
The height (120um) of individual FPC, reduces the thickness with camera function terminal；Substrate is made using highly heat-conductive material, Ke Yiti
The high heat dispersion of photographic head.
The invention provides a kind of installation method of photographic head, as shown in fig. 7, the method includes：
S210, digs pit, the bottom surface area and photographic head of above-mentioned pit on the screen inner surface or center of terminal
The lower surface area of substrate to be embedded match；Match and refer to that substrate is embedded in pit and enable to substrate and end panel
Curtain or center firmly fix connection；
Substrate to be embedded is embedded into above-mentioned pit by S220.
Optionally, before by substrate to be embedded embedded pit, the face contacted with pit on substrate or the inner surface of pit
Upper coating viscosity glue；The fixation of substrate and screen or center can be strengthened.
The embodiment of the present invention by the pit that digs on the screen inner surface or center by the substrate of photographic head embedded terminal,
Photographic head is arranged in terminal, the fixation of photographic head and terminal can be strengthened and can be reduced or even be saved the assembling such as screw
Part.
The invention provides a kind of installation method of photographic head, as shown in figure 8, the method includes：
S310, opens up the substrate to be embedded of groove, above-mentioned groove and photographic head on the side of the screen or center of terminal
Size match, matching is referred to that substrate is embedded in groove and enables to substrate and firmly fixed with terminal screen or center
Connection；
Substrate to be embedded is embedded into above-mentioned groove by S320.
Optionally, before by substrate to be embedded embedded groove, the face contacted with groove on substrate or the inner surface of groove
Upper coating viscosity glue；The fixation of substrate and screen or center can be strengthened.
The embodiment of the present invention by the groove that digs the screen or center of the substrate of photographic head embedded terminal, by photographic head
In terminal, the fixation of photographic head and terminal can be strengthened and can be reduced or even be saved the Assembly parts such as screw.
Finally it should be noted that：Various embodiments above only to illustrate technical scheme, rather than a limitation；To the greatest extent
Pipe has been described in detail to the present invention with reference to foregoing embodiments, it will be understood by those within the art that：Its according to
So the technical scheme described in foregoing embodiments can be modified, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of photographic head, it is characterised in that the photographic head at least includes：Imageing sensor, flexible printed circuit
FPC, substrate；
Wherein, the FPC is placed on the substrate, and the FPC has position to hollow out；
Described image sensor fixes the position for hollowing out corresponding to the FPC on the substrate；
Described image sensor is connected to the FPC by signal lead.
2. photographic head as claimed in claim 1, it is characterised in that：The substrate is a kind of high thermal conductive substrate, the high heat conduction
The heat conductivity of substrate is greater than 40W/mk.
3. photographic head as claimed in claim 2, it is characterised in that：
Described image sensor is adhesive on the high thermal conductive substrate using high-heat-conductivity glue, and the high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；
Described image sensor is connected to the FPC by gold thread.
4. a kind of terminal for being equipped with photographic head, it is characterised in that the photographic head includes：Imageing sensor, FPC, substrate；
Wherein, the FPC is placed on the substrate, and the FPC has position to hollow out；
Described image sensor fixes the position for hollowing out corresponding to the FPC on the substrate；
Described image sensor is connected to the FPC by signal lead；
The FPC is connected with the mainboard of the terminal；
The substrate is fixedly connected with the screen or center of the terminal；Or using the screen or center of the terminal as base
Plate, the center are the frame structure for supporting terminal.
5. terminal as claimed in claim 4, it is characterised in that：The substrate extends side with least one；
The side of the screen opens up fluted, and the substrate is by way of the prolongation side is embedded in the groove and institute
State screen to be fixedly connected；
Or, the side of the center opens up fluted, and the substrate is embedded into the side in the groove by the prolongation side
Formula is fixedly connected with the center.
6. terminal as claimed in claim 4, it is characterised in that：Pit has been dug on the screen inner surface or center, it is described
The bottom surface area of pit is matched with the lower surface area of the substrate, and the substrate is by being embedded into the screen of the terminal
The mode in the pit on inner surface or center is fixed on the screen inner surface or center of the terminal.
7. the terminal as described in claim 4-6 optional one, it is characterised in that：The substrate is a kind of high thermal conductive substrate, described
High thermal conductive substrate heat conductivity is greater than 40W/mk.
8. terminal as claimed in claim 7, it is characterised in that：
Described image sensor is adhesive on the high thermal conductive substrate using high-heat-conductivity glue, and the high-heat-conductivity glue heat conductivity is higher than
Or it is equal to 0.2W/mk；
Described image sensor is connected to the FPC by gold thread.
9. the method for a kind of manufacture photographic head as claimed in claim 1, it is characterised in that include：
Position at the FPC mono- is hollowed out, and the FPC is placed on the substrate；
Described image sensor is fixed on the substrate corresponding to the position that the FPC is hollowed out；
Described image sensor is connected to into the FPC by signal lead.
10. a kind of method as claimed in claim 9, it is characterised in that the substrate, high heat conduction are made using highly heat-conductive material
The heat conductivity of material is greater than 40W/mk；
Described image sensor is glued on the substrate using high-heat-conductivity glue, the high-heat-conductivity glue heat conductivity is higher than or waits
In 0.2W/mk.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610805099.1A CN106550177A (en) | 2016-09-06 | 2016-09-06 | A kind of photographic head and its manufacture method and terminal |
| PCT/CN2017/080478 WO2018045751A1 (en) | 2016-09-06 | 2017-04-13 | Camera and manufacturing method thereof, and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610805099.1A CN106550177A (en) | 2016-09-06 | 2016-09-06 | A kind of photographic head and its manufacture method and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550177A true CN106550177A (en) | 2017-03-29 |
Family
ID=58367820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610805099.1A Pending CN106550177A (en) | 2016-09-06 | 2016-09-06 | A kind of photographic head and its manufacture method and terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106550177A (en) |
| WO (1) | WO2018045751A1 (en) |
Cited By (3)
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| WO2018045751A1 (en) * | 2016-09-06 | 2018-03-15 | 华为技术有限公司 | Camera and manufacturing method thereof, and terminal |
| CN109688301A (en) * | 2017-10-18 | 2019-04-26 | 宁波舜宇光电信息有限公司 | Photosensory assembly array and corresponding camera module array |
| CN109803493A (en) * | 2019-03-18 | 2019-05-24 | 深圳市沃特沃德股份有限公司 | Circuit board assemblies and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021102703A1 (en) | 2019-11-26 | 2021-06-03 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electric apparatus |
| CN114125233B (en) * | 2021-11-19 | 2024-07-02 | 维沃移动通信有限公司 | Electronic equipment |
| US11669937B2 (en) | 2022-02-28 | 2023-06-06 | Huajie ZENG | Method and system for enhancing image captured by on-board camera, and computing device |
| CN114549936B (en) * | 2022-02-28 | 2022-12-23 | 曾华杰 | Method, system and computing device for enhancing images shot by camera of vehicle |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018045751A1 (en) | 2018-03-15 |
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