CN106463589A

CN106463589A - LED light source and LED lamp

Info

Publication number: CN106463589A
Application number: CN201480076757.7A
Authority: CN
Inventors: 杜鹏
Original assignee: Shenzhen Goym Photoelectric Technology Co ltd
Current assignee: Shenzhen Goym Photoelectric Technology Co ltd
Priority date: 2014-07-23
Filing date: 2014-07-23
Publication date: 2017-02-22
Also published as: WO2016011609A1

Abstract

An LED light source and an LED lamp. The LED lamp comprises the LED light source. The LED light source comprises a light-emitting unit and an encapsulation layer. The light-emitting unit comprises a substrate, and an epitaxial structure (A1), a first connecting unit and a second connecting unit manufactured on the substrate. The epitaxial structure (A1) is provided with at least one end portion N-type semiconductor layer and at least one end portion P-type semiconductor layer. The first connecting unit is electrically connected to each end portion N-type semiconductor layer, the second connecting unit is electrically connected to each end portion P-type semiconductor layer, and the first and second connecting units are also used for accessing an external circuit. The encapsulation layer (220) is obtained by performing adhesive sealing on the light-emitting unit on a portion of the light-emitting unit excluding areas connecting the first and second connecting units to the external circuit or on the whole area. The present structure solves the problems that existing LED light source structures are complex, and costs are high.

Description

LED light source and LED lamp

Technical Field

The invention relates to the technical field of LEDs, in particular to an LED light source and an LED lamp.

Background

Currently, the following processes are generally adopted for LED packaging: the manufacturing method comprises the steps of manufacturing an epitaxial layer on a substrate by adopting a chemical deposition method, arranging electrodes on the epitaxial layer to obtain an LED chip, fixedly arranging the LED chip on a substrate in an inverted or normal installation mode, fixedly arranging a cup-shaped support on the substrate, connecting the electrodes of the LED chip with related circuits by gold wires, injecting glue into the cup-shaped support, and forming a hemispherical packaging layer on the surface of the lED chip by virtue of the cup-shaped support. The existing process needs a substrate, a flip-chip or a normal-mount process to be installed on the substrate, a gold wire needs to be connected, a support needs to be arranged, and the manufactured LED light source comprises a substrate, an epitaxial layer, an electrode, a substrate, a cup-shaped support, a gold wire and a packaging layer. The prior art has the disadvantages of complicated process, high cost, low efficiency, and complicated structure and high cost of the manufactured LED light source.

Technical problem

The invention provides an LED light source and an LED lamp, and solves the problems of complex structure and high cost of the existing LED light source.

Technical solution

In order to solve the technical problems, the invention adopts the following technical scheme:

an LED light source comprising a light emitting unit and an encapsulation layer, wherein,

the light-emitting unit comprises a substrate, an epitaxial structure manufactured on the substrate, a first connecting unit and a second connecting unit; the epitaxial structure comprises a single light-emitting epitaxial layer structure or at least two electrically connected light-emitting epitaxial layer structures, and the epitaxial structure is provided with at least one end N-type semiconductor layer and at least one end P-type semiconductor layer; the first connecting unit is electrically connected with each end N-type semiconductor layer, the second connecting unit is electrically connected with each end P-type semiconductor layer, and the first connecting unit and the second connecting unit are also used for accessing an external circuit;

the packaging layer is obtained by sealing local or whole areas of the light-emitting unit except for the connection areas of the first connection unit, the second connection unit and the external circuit on the light-emitting unit, wherein the sealing area at least comprises a main light-emitting area of the light-emitting unit.

Preferably, the light emitting epitaxial layer structure includes at least: the N-type semiconductor layer, the light emitting layer and the P-type semiconductor layer are far away from the substrate from the near side; or at least comprises: the N-type semiconductor layer, the light emitting layer, the P-type semiconductor layer and the metal reflecting layer are arranged from near to far away from the substrate; or at least comprises: the N-type semiconductor layer is far away from the substrate from the near side, the light emitting layer and the P-type semiconductor layer with the reflection function.

Preferably, the first connection unit includes a first connection end disposed on the epitaxial structure and electrically connected to each of the end N-type semiconductor layers, and a second connection end extending out of the epitaxial structure and used for connecting the first connection end to the external circuit; the second connection unit comprises a third connection end arranged on the epitaxial structure and electrically connected with the end P-type semiconductor layers, and a fourth connection end extending out of the epitaxial structure and used for connecting the third connection end into the external circuit.

Preferably, the first connection end is arranged on the epitaxial structure through metal paste and electrically connected with the end N-type semiconductor layers; and/or the third connecting end is arranged on the epitaxial structure through metal paste and is electrically connected with the end P-type semiconductor layers.

Preferably, the second connection end and/or the fourth connection end extend out of the epitaxial structure to form a suspended end, or extend out of the epitaxial structure and attach to a region outside a part occupied by the epitaxial structure on the substrate; or extend out of the epitaxial structure and are fixedly arranged on the substrate in the area except the occupied part of the epitaxial structure through an intermediate structure.

Preferably, the shape of the second connection end and/or the fourth connection end is one or more of a Z shape, a T shape, an L shape, a cross shape, a square shape, an oval shape, a round shape and an irregular shape.

Preferably, the first connecting unit and/or the second connecting unit are of an integral sheet structure.

Preferably, the inscribed circle of the connection region of the first connection unit and/or the second connection unit with the external circuit has a diameter of 200 to 1500 micrometers.

Preferably, the substrate is one of sapphire, silicon, glass and silicon carbide materials.

Preferably, the encapsulation layer is used for encapsulating regions of the main light emitting surface of the light emitting unit except for the connection regions of the first connection unit, the second connection unit and the external circuit; or a main light emitting surface for packaging the light emitting unit, and an area on the opposite surface of the main light emitting surface except for the connection area of the first connection unit, the second connection unit and the external circuit; or the area except the connection area of the first connection unit, the second connection unit and the external circuit is used for packaging the main light-emitting surface of the light-emitting unit, the opposite surface of the main light-emitting surface and part or all of the side surfaces between the main light-emitting surface and the opposite surface.

Preferably, the packaging layer is a one-piece packaging layer.

Preferably, the encapsulation layer is arc-shaped.

An LED lamp comprises at least one LED light source and at least two metal connecting pieces for supplying power to the LED light sources; the LED light source is any one of the LED light sources.

Preferably, the LED lamp comprises at least two of said LED light sources; the at least two LED light sources are arranged in parallel or in a linear or folded shape, and the main light emitting surface of each LED light source faces outwards.

Preferably, the LED lamp comprises at least three of said LED light sources; the at least three LED light sources are enclosed into a polygon, and the main light emitting surface of each LED light source faces outwards; or the at least three LED light sources are arranged in a star shape, and the main light emitting surface of each LED light source faces outwards.

Preferably, the main light emitting surface of at least one of the LED light sources of the LED lamp forms an included angle of 20 to 60 degrees with the horizontal plane.

Preferably, the main light emitting surface of at least one of the LED light sources of the LED lamp forms a 45-degree included angle with the horizontal plane.

Preferably, the LED lamp further comprises a housing for accommodating each of the LED light sources and the at least two metal connectors.

Preferably, the LED lamp further comprises a power supply module and/or a bracket; the power supply module is connected with the at least two metal connecting pieces and used for supplying power to the LED light sources through the at least two metal connecting pieces; the bracket is used for supporting at least one of the LED light sources, the metal connecting piece and the power supply module; the housing is also used for accommodating the power supply module and/or the bracket.

Preferably, the shell is also filled with protective gas.

Preferably, the LED lamp further comprises a main control module electrically connected to the at least two metal connectors, and configured to control the metal connectors to supply power to the LED light sources.

Preferably, the LED lamp comprises at least two LED light sources, and the at least two LED light sources generate light with different colors after being electrified.

Preferably, the LED light sources generating different color lights after being energized are connected in parallel, and the LED light sources generating the same color light after being energized are connected in series.

Preferably, the LED lamp further comprises a communication module electrically connected to the main control module, and configured to receive a control instruction from an external control terminal and transmit the control instruction to the main control module, and the main control module is configured to control the power supply of the metal connecting piece to each LED light source according to the control instruction.

Advantageous effects

The invention provides an LED light source and an LED lamp, wherein a packaging layer is obtained by directly sealing a light-emitting unit without a substrate and a support, so that compared with the conventional LED light source, the LED light source provided by the invention does not comprise the substrate and the support, the composition structure of the LED light source is simplified, and the cost is reduced.

Furthermore, the first connecting unit and the second connecting unit extend out of the epitaxial structure, and the second connecting end and the fourth connecting end are used for being connected with an external circuit, so that a gold wire does not need to be connected; the first connecting end and the third connecting end are arranged on the epitaxial structure and are electrically connected with the N-type semiconductor layer at the end part and the P-type semiconductor layer at the end part respectively, so that electrodes do not need to be additionally manufactured on the light-emitting epitaxial layer structure. Therefore, the composition structure of the LED light source can be further simplified, and the cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a light emitting unit according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another light-emitting unit according to a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of another light-emitting unit according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of another light-emitting unit according to a first embodiment of the present invention;

fig. 5 is a schematic structural diagram of another light-emitting unit according to a first embodiment of the present invention;

fig. 6 is a schematic structural diagram of another light-emitting unit according to a first embodiment of the present invention;

fig. 7 is a schematic structural diagram of an LED light source according to a second embodiment of the present invention;

fig. 8 is a schematic structural diagram of another LED light source according to a second embodiment of the present invention;

fig. 9 is a schematic structural diagram of another LED light source according to a second embodiment of the present invention;

fig. 10 is a schematic structural diagram of an LED lamp according to a third embodiment of the present invention;

FIG. 11 is a schematic view of the connection between the LED light source and the metal connector of the LED lamp shown in FIG. 10;

fig. 12 is a schematic structural diagram of another LED lamp according to a third embodiment of the present invention;

fig. 13 is a schematic structural diagram of another LED lamp according to a third embodiment of the present invention;

fig. 14 is a schematic structural diagram of another LED lamp according to a third embodiment of the present invention;

fig. 15 is a schematic structural diagram of another LED lamp according to a third embodiment of the present invention;

fig. 16 is a schematic structural diagram of another LED lamp according to a third embodiment of the present invention.

Modes for carrying out the invention

The invention provides an LED light source which comprises a light-emitting unit and an encapsulation layer, and does not comprise a substrate and a support. Preferably, the LED light source is composed of a light emitting unit and an encapsulation layer. The light-emitting unit comprises a substrate, an epitaxial structure manufactured on the substrate, a first connecting unit and a second connecting unit; the epitaxial structure comprises a single light-emitting epitaxial layer structure or at least two electrically connected light-emitting epitaxial layer structures, and the at least two electrically connected light-emitting epitaxial layer structures are electrically connected in a serial, parallel or serial-parallel mixed connection mode; the epitaxial structure has at least one terminal N-type semiconductor layer and at least one terminal P-type semiconductor layer; the first connecting unit is electrically connected with each end N-type semiconductor layer, the second connecting unit is electrically connected with each end P-type semiconductor layer, and the first connecting unit and the second connecting unit are also used for accessing an external circuit; the packaging layer is obtained by sealing a local or whole area of the light-emitting unit except for a connecting area of the first connecting unit, the second connecting unit and an external circuit on the light-emitting unit, wherein the sealing area at least comprises a main light-emitting area of the light-emitting unit.

The light-emitting epitaxial layer structure has the following four structures:

a first, comprising at least: the LED light-emitting diode comprises an N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer and a metal reflecting layer, wherein the N-type semiconductor layer, the light-emitting layer, the P-type semiconductor layer and the metal reflecting layer are sequentially laminated on a substrate from near to far away from the substrate; the metal reflective layer has a light reflective function.

A second, comprising at least: the N-type semiconductor layer, the light emitting layer and the P-type semiconductor layer with the reflection function are sequentially stacked on the substrate from near to far away from the substrate; the P-type semiconductor layer having a reflective function has a light reflective function.

If the light-emitting epitaxial layer structure in the epitaxial structure is the first or second structure, the substrate is a transparent substrate, light emitted by the light-emitting layer is reflected by the metal reflective layer or the P-type semiconductor layer having a reflective function, and an opposite surface of the side of the substrate having the epitaxial structure (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite surface is the back side of the substrate) is the main light-emitting surface.

And thirdly, the LED light-emitting diode at least comprises an N-type semiconductor layer, a light-emitting layer and a P-type semiconductor layer, and does not have a light-emitting function, wherein the N-type semiconductor layer, the light-emitting layer and the P-type semiconductor layer are sequentially laminated on the substrate from near to far away from the substrate.

Fourth, the light emitting epitaxial layer structure is a vertical structure, the substrate is a metal substrate, and the light emitting epitaxial layer structure at least comprises: the LED light-emitting diode comprises a P-type semiconductor layer, a light-emitting layer and an N-type semiconductor layer, wherein the P-type semiconductor layer, the light-emitting layer and the N-type semiconductor layer are sequentially stacked on a metal substrate from near to far away from the metal substrate.

If the epitaxial structure includes at least two electrically connected light emitting epitaxial layer structures, preferably, each light emitting epitaxial layer structure is the same, and may be the first, second, or third light emitting epitaxial layer structures.

If the epitaxial structure comprises a single light-emitting epitaxial layer structure, the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer, the end N-type semiconductor layer is the N-type semiconductor layer of the single light-emitting epitaxial layer structure, and the end P-type semiconductor layer is the P-type semiconductor layer of the single light-emitting epitaxial layer structure.

For the case that the epitaxial structure comprises at least two electrically connected light-emitting epitaxial layer structures, if all the light-emitting epitaxial layer structures are electrically connected in series, the epitaxial structure is provided with an end N-type semiconductor layer and an end P-type semiconductor layer, the N-type semiconductor of the light-emitting epitaxial layer structure positioned at one end of the series circuit is used as the end N-type semiconductor layer of the epitaxial structure, and the P-type semiconductor layer of the light-emitting epitaxial layer structure at the other end is used as the end P-type semiconductor layer of the epitaxial structure; if all the light-emitting epitaxial layer structures are electrically connected in parallel, the N-type semiconductor layer of each light-emitting epitaxial layer structure is used as an end N-type semiconductor layer of the epitaxial structure, and the P-type semiconductor layer is used as an end P-type semiconductor layer of the epitaxial structure, that is, the epitaxial structure has the same number of end N-type semiconductor layers and end P-type semiconductor layers as the number of the light-emitting epitaxial layer structures. In short, the N-type semiconductor of the light-emitting epitaxial layer structure at one end of the entire circuit, which is formed by all the light-emitting epitaxial layers, is used as the end N-type semiconductor layer of the epitaxial structure, and the P-type semiconductor layer of the light-emitting epitaxial layer structure at the other end is used as the end P-type semiconductor layer of the epitaxial structure.

The forming method of the first connecting unit and the second connecting unit is not limited, and includes but is not limited to: the first connecting unit and the second connecting unit are manufactured firstly, then the first connecting unit is electrically connected with the N-type semiconductor layer at each end part, the second connecting unit is electrically connected with the P-type semiconductor layer at each end part, and a part of the second connecting unit is reserved for being connected into an external circuit. Or the first connecting unit and the second connecting unit are directly manufactured on the epitaxial structure.

If the light-emitting epitaxial layer structure in the epitaxial structure is the first, second or third type, the first connection unit and the second connection unit are manufactured on the same side of the substrate. If the light-emitting epitaxial layer structure in the epitaxial structure is the fourth structure, preferably, the metal substrate is simultaneously used as the second connection unit, and no second connection unit is additionally arranged, wherein a part of the metal substrate occupied by the P-type semiconductor layer of the light-emitting epitaxial layer structure of the vertical structure is electrically connected with the P-type semiconductor layer, and a part of the metal substrate extending out of the light-emitting epitaxial layer structure of the vertical structure is used for connecting an external circuit.

The first connecting unit and the second connecting unit can be electrically connected with an external circuit in an electric welding mode; or is electrically connected with an external circuit through the connecting terminal.

Preferably, the connection region of the first connection unit and the external circuit and the connection region of the second connection unit and the external circuit have one or more shapes of a Z shape, a T shape, an L shape, a ten shape, a square shape, an oval shape, a circle shape and an irregular shape.

Preferably, the first connecting unit and/or the second connecting unit are of an integral sheet structure. The first connecting unit and the second connecting unit of the integrated sheet structure can be manufactured firstly, then one end of the first connecting unit and the second connecting unit is arranged on the epitaxial structure through metal paste and is electrically connected with the N-type semiconductor layer and the P-type semiconductor layer of each end portion respectively, and the other end of the first connecting unit and the second connecting unit is reserved to extend out of the epitaxial structure and is used for being connected with an external circuit.

Preferably, the inscribed circle diameter of the connection region of the first connection unit and the external circuit is 200 to 1500 micrometers. And/or the diameter of an inscribed circle of a connecting area of the second connecting unit and the external circuit is 200-1500 micrometers. This size is different from the electrode size of existing LED chips, and the connection area of this size can be directly and securely connected to an external circuit.

Preferably, the substrate is one of sapphire, silicon, glass and silicon carbide materials. Wherein the sapphire substrate is a transparent substrate.

The light emitting region of the light emitting unit refers to a region where light is actually emitted from the light emitting unit, and preferably includes an outer surface of the light emitting epitaxial layer structure, and if the light emitting epitaxial layer structure is a transparent substrate, a mapping region where the light emitting epitaxial layer structure is mapped on the other surface of the substrate. The main light emitting area refers to an area with the highest light emitting efficiency, and the surface where the main light emitting area is located is the main light emitting surface of the light emitting unit.

For a light-emitting unit with an epitaxial structure composed of the first and second light-emitting epitaxial layers, since light emitted from the light-emitting layer is reflected, the opposite surface of the surface with the epitaxial structure on the substrate (assuming that the surface with the epitaxial structure is the front surface of the substrate, the opposite surface is the back surface of the substrate) is the main light-emitting surface of the light-emitting unit; for the light emitting unit with the epitaxial structure composed of the third and the fourth light emitting epitaxial layer structures, the fourth light emitting epitaxial layer structure is opaque, and the third light emitting epitaxial layer structure has no light emission function because the substrate is transparent or not, and the surface of the substrate with the epitaxial structure is the main light emitting surface of the light emitting unit.

Preferably, the encapsulation layer is used for encapsulating the areas of the main light emitting surface of the light emitting unit except the connection areas of the first connection unit, the second connection unit and the external circuit; or a main light emitting surface for packaging the light emitting unit, and an area excluding the connection area of the first connection unit, the second connection unit and the external circuit on two opposite surfaces of the main light emitting surface; or the main light emitting surface for packaging the light emitting unit, the opposite surface of the main light emitting surface, and part or all of the side surfaces between the main light emitting surface and the opposite surface thereof, that is, at least three surfaces except the connection regions of the first connection unit, the second connection unit and the external circuit. Preferably, the packaging layer is a one-piece packaging layer. Specific encapsulation processes include, but are not limited to: mobile continuous glue injection, mold pressing glue sealing, printing glue sealing, wherein,

the continuous glue injection is carried out in a moving mode, namely, the continuous glue injection is carried out in a moving mode along the arrangement track of the structure of the light-emitting epitaxial layer in the area (the main light-emitting surface, the opposite surface or the side surface) of the current surface of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit, a connected packaging layer is formed on the current surface after curing, even if glue injection operation is carried out on only one surface or two surfaces, the packaging layers on all the surfaces can be connected into a whole finally due to the fact that the glue is in a fluid shape, and the connected packaging layer is finally formed into a large connected packaging layer.

And (2) mould pressing and sealing, namely putting the light-emitting units into a mould, closing the upper and lower moulds by using a hydraulic press and vacuumizing, then putting solid epoxy into an inlet of a glue injection channel to be heated to be changed into liquid, pressing the liquid epoxy into the mould glue channel by using a hydraulic ejector rod to rotate from top to bottom, enabling the epoxy to enter each light-emitting unit forming groove of the mould along the glue channel, covering the area of the current surface of each light-emitting unit except the connection area of the first connecting unit, the second connecting unit and an external circuit, and curing and forming the sealing glue by using a certain mould closing pressure and temperature to obtain a connected packaging layer. The molding and sealing method is particularly suitable for sealing the whole area of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit.

Printing the sealant, namely printing the fluorescent glue layer by layer in the current surface of the light-emitting unit except the connection area of the first connection unit, the second connection unit and the external circuit by adopting a printing technology, wherein the adjacent light-emitting epitaxial layer structures can be continuously printed or discontinuously printed, and if the continuous printing is adopted, a connected packaging layer is formed after curing.

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. The proportions of the parts in the drawings are not intended to be limiting, in order to better illustrate the constituent structures.

The first embodiment is as follows:

the embodiment provides a light emitting cell, comprising a substrate, An epitaxial structure fabricated on the substrate, a first connection unit and a second connection unit, wherein the epitaxial structure comprises a single light emitting epitaxial layer structure A1 or at least two electrically connected light emitting epitaxial layers structures (A1 to An), and the epitaxial structure is provided with at least one end N-type semiconductor layer and at least one end P-type semiconductor layer; the first connecting unit comprises a first connecting end and a second connecting end, the first connecting end is arranged on the epitaxial structure and electrically connected with the N-type semiconductor layers at the end parts, the second connecting end extends out of the epitaxial structure and is used for connecting the first connecting end into an external circuit, the second connecting unit comprises a third connecting end and a fourth connecting end, the third connecting end is arranged on the epitaxial structure and is electrically connected with the P-type semiconductor layers at the end parts, and the fourth connecting end extends out of the epitaxial structure and is used for connecting the third connecting end into the external circuit.

There are four light emitting epitaxial layer structures described above. If the epitaxial structure includes at least two electrically connected light emitting epitaxial layer structures, preferably, each light emitting epitaxial layer structure is the same, and may be the first, second, or third light emitting epitaxial layer structures.

If the light-emitting epitaxial layer structures in the epitaxial structure are the first, second or third light-emitting epitaxial structures, the first connection end and the third connection end are disposed on the same side of the substrate, and the first connection end and the third connection end may be formed in a manner that refers to electrodes fabricated on an epitaxial layer of an existing LED chip, including but not limited to: after the first connecting end is manufactured, the first connecting end is arranged on the epitaxial structure through metal paste and is electrically connected with the N-type semiconductor layer at each end, or the first connecting end is directly deposited on the epitaxial structure and is electrically connected with the N-type semiconductor layer at each end; and the third connecting end is arranged on the epitaxial structure through metal paste and electrically connected with the P-type semiconductor layer at each end after being manufactured, or the third connecting end is directly deposited on the epitaxial structure and electrically connected with the P-type semiconductor layer at each end. The metal paste includes, but is not limited to, gold, silver, copper, aluminum, tin, or a metal alloy in a paste form.

If the light-emitting epitaxial layer structure in the epitaxial structure is the fourth one, preferably, the metal substrate is simultaneously used as the second connection unit without additionally providing the second connection unit, wherein a part of the metal substrate occupied by the P-type semiconductor layer of the fourth light-emitting epitaxial layer structure is the third connection end, and a part of the metal substrate extending out of the light-emitting epitaxial layer structure of the vertical structure is used as the fourth connection end.

As shown in fig. 1, the epitaxial structure includes a single light emitting epitaxial layer structure a1, and is the third light emitting epitaxial layer structure, the epitaxial structure has an end N-type semiconductor layer and an end P-type semiconductor layer, the N-type semiconductor layer of the single light emitting epitaxial layer structure a1 is the end N-type semiconductor layer of the epitaxial structure, the P-type semiconductor layer is the end P-type semiconductor layer of the epitaxial structure, the first connection end 2121 is disposed on the light emitting epitaxial layer structure a1 and electrically connected to the N-type semiconductor layer thereof, the third connection end 2131 is disposed on the light emitting epitaxial layer structure a1 and electrically connected to the P-type semiconductor layer thereof, and the second connection end 2122 and the fourth connection end 2132 extend out of the light emitting epitaxial layer structure a1 and are used for connecting the first connection end 2121 and the third connection end 2131 to an external circuit.

As shown in fig. 2, the epitaxial structure includes at least two light-emitting epitaxial layers (a 1-An) electrically connected in series, and each of the light-emitting epitaxial layers (a 1-An) is of the third kind, and adjacent light-emitting epitaxial layers are connected in series through An electrical connection structure B fabricated on the substrate. Since all the light emitting epitaxial layers (a 1-An) are connected in series, the epitaxial structure has only one end N-type semiconductor layer and one end P-type semiconductor layer, the N-type semiconductor of the light emitting epitaxial layer structure a1 at one end of the series circuit serves as the end N-type semiconductor layer of the epitaxial structure, the P-type semiconductor layer of the light emitting epitaxial layer structure An at the other end serves as the end P-type semiconductor layer of the epitaxial structure, the first connection end 2121 is disposed on the light emitting epitaxial layer structure a1 and electrically connected to the N-type semiconductor layer of the light emitting epitaxial layer structure a1, the third connection end 2131 is disposed on the light emitting epitaxial layer structure An and electrically connected to the P-type semiconductor layer of the light emitting epitaxial layer structure An, the second connection end 2122 and the fourth connection end 2132 extend out of the light emitting epitaxial layer structures a1 and An respectively and are used for connecting the first connection end 2121 and the third connection end 2131 to An external circuit.

If all the light-emitting epitaxial layers (a 1-An) in the epitaxial structure are electrically connected in parallel, and each light-emitting epitaxial layer (a 1-An) is the third type. The epitaxial structure has N end N-type semiconductor layers and N end P-type semiconductor layers, the N-type semiconductor layer of each light-emitting epitaxial layer structure (a1 to An) serves as An end N-type semiconductor layer of the epitaxial structure, the P-type semiconductor layer is An end P-type semiconductor layer of the epitaxial structure, the first connection end includes N first connection portions, and the third connection end includes N third connection portions, wherein each light-emitting epitaxial layer structure (a1 to An) has one first connection portion and one third connection portion, the first connection portion is disposed on the light-emitting epitaxial layer structure and electrically connected to the N-type semiconductor layer of the light-emitting epitaxial layer structure, the third connection portion is disposed on the light-emitting epitaxial layer structure and electrically connected to the P-type semiconductor layer of the light-emitting epitaxial layer structure, and the second connection end extends out of the epitaxial structure and is used for all the N first connection portions to enter An external circuit, one end of the second connecting end is electrically connected with the n first connecting parts respectively, and the other end of the second connecting end is connected with an external circuit; the fourth connection end extends out of the epitaxial structure and is respectively used for connecting the n third connection parts into an external circuit, namely one end of the fourth connection end is electrically connected with the n third connection parts respectively, and the other end is connected into the external circuit.

The second connecting end and the fourth connecting end can extend out of the epitaxial structure to form a suspended end; or extend out of the epitaxial structure and attach to the region outside the portion occupied by the epitaxial structure on the substrate; or extend out of the epitaxial structure and are fixedly arranged on the substrate in the area except the occupied part of the epitaxial structure through the intermediate structure. As shown in fig. 1 and 2, the second connecting end 2122 and the fourth connecting end 2132 extend out of the epitaxial structure to form a suspended end, and are horizontally suspended; as shown in fig. 3, second connection end 2122 and fourth connection end 2132 hang downward; as shown in fig. 4, second connection end 2122 and fourth connection end 2132 are upwardly cantilevered; as shown in fig. 5, the second connection end 2122 and the fourth connection end 2132 extend out of the epitaxial structure and are attached to the substrate in a region except the portion occupied by the epitaxial structure; as shown in fig. 6, the second connection end 2122 and the fourth connection end 2132 extend out of the epitaxial structure and are fixed on the substrate through the middle structure 214 in a region outside the portion occupied by the epitaxial structure, and the middle structure 214 may be a floating point, or may also be an extra epitaxial layer when the epitaxial structure is fabricated on the substrate.

Preferably, the second connecting end and the fourth connecting end are electrically connected with an external circuit in an electric welding mode; or is electrically connected with an external circuit through the connecting terminal. For example, the connection terminal has one end electrically connected to the external circuit and the other end having a connection port, which can be matched to the shape of the second connection terminal to accommodate the second connection terminal therein and electrically connect it to the external circuit, or the connection port accommodates the second connection terminal therein together with a portion of the substrate under the second connection terminal and electrically connects the second connection terminal to the external circuit.

Preferably, the shapes of the second connecting end and the fourth connecting end are one or more of Z shape, T shape, U shape, L shape, ten shape, square shape, oval shape, round shape and irregular shape.

Preferably, the first connecting unit and the second connecting unit are of an integrated sheet structure.

Preferably, the diameter of the inscribed circle of the connecting region of the second connecting terminal and the external circuit is 200 to 1500 micrometers. And/or the diameter of an inscribed circle of a connecting area of the fourth connecting end and the external circuit is 200-1500 microns. The size of the second connecting end and the fourth connecting end is different from the size of the electrode of the existing LED chip, and the second connecting end and the fourth connecting end of the size can be directly and firmly connected into an external circuit.

In the light emitting unit provided in the first embodiment, the first connection unit, the second connection end and the fourth connection end of the second connection unit extend out of the epitaxial structure and are used for being connected with an external related circuit, so that a gold wire does not need to be connected; the first connecting end and the third connecting end are arranged on the epitaxial structure and are respectively and electrically connected with the N-type semiconductor layer and the P-type semiconductor layer of each end, so that electrodes do not need to be additionally manufactured on the light-emitting epitaxial layer structure. The light emitting unit can be directly sealed, so that a substrate and a bracket are not needed.

Example two:

the present embodiment provides an LED light source, including a light emitting unit and a package layer, where the light emitting unit is in any one of the structures in the first embodiment, and the package layer is obtained by sealing a local or entire region of the light emitting unit assembly on the light emitting unit except for connection regions of the second connection end, the fourth connection end, and an external circuit, where the sealing region at least includes a main light emitting region of the light emitting unit. In the packaging step, a substrate, a support and a gold wire do not need to be connected before sealing glue, and accordingly, the obtained LED light source does not have the substrate, the support and the gold wire. Preferably, the LED light source is composed of a light emitting unit and an encapsulation layer 220 formed by molding the light emitting unit.

For a light-emitting unit with an epitaxial structure composed of the first and second light-emitting epitaxial layers, since light emitted from the light-emitting layer is reflected, the opposite surface of the surface with the epitaxial structure on the substrate (assuming that the surface with the epitaxial structure is the front surface of the substrate, the opposite surface is the back surface of the substrate) is the main light-emitting surface of the light-emitting unit; for the light emitting unit with the epitaxial structure composed of the third and the fourth light emitting epitaxial layer structures, since the light emitted from the light emitting layer is not reflected, the surface of the substrate with the epitaxial structure is the main light emitting surface of the light emitting unit.

Preferably, the encapsulation layer is used for encapsulating the regions of the main light emitting surface of the light emitting unit except the connection regions of the second connection end, the fourth connection end and the external circuit, that is, no encapsulant is applied to the other surfaces of the light emitting unit assembly, as shown in fig. 7 and 8; or the packaging layer is used for packaging the main light-emitting surface of the light-emitting unit and the areas except the connection areas of the second connection end, the fourth connection end and the external circuit on the opposite surface of the main light-emitting surface; or a main light emitting surface for packaging the light emitting unit, an opposite surface of the main light emitting surface, and a region excluding a connection region of the second connection terminal, the fourth connection terminal and the external circuit on a part or all of the side surface between the main light emitting surface and the opposite surface thereof, as shown in fig. 9.

The LED light sources shown in fig. 7 and 8 are all obtained by the following manufacturing method: in the areas of the main light emitting surface of the light emitting unit except the connection areas of the second connection end 2122, the fourth connection end 2132 and the external circuit, glue is continuously injected in a moving manner along the arrangement tracks of the light emitting epitaxial layer structures (a1 to An), and a connected package layer 220 is formed after curing. In contrast, the substrate in fig. 7 is a transparent substrate, and each of the light-emitting epitaxial layers (a1 to An) connected in series includes a metal mirror layer or a P-type semiconductor layer having a reflective function, so that the opposite surface of the side of the substrate having the epitaxial structure (assuming that the side having the epitaxial structure is the front side of the substrate, the opposite surface is the back side of the substrate) is the main light-emitting surface of the light-emitting unit. While the substrate in fig. 8 is a non-transparent substrate (or each light emitting epitaxial layer structure (a 1-An) has no light emitting function, e.g. no metal mirror layer, and the P-type semiconductor layer also has no reflection function), the side of the substrate having the epitaxial structure is the main light emitting surface of the light emitting unit. Therefore, the LED light source shown in fig. 7 is formed by performing a moving continuous glue injection on the opposite surface of the surface having the epitaxial structure on the substrate, and the cured connected encapsulation layer 220 encapsulates the area of the opposite surface except for the connection area of the second connection end 2122, the fourth connection end 2132 and the external circuit. The LED light source shown in fig. 8 is formed by continuously injecting glue on the side of the substrate having the epitaxial structure in a moving manner, and the connected encapsulation layer 220 formed after curing encapsulates the area of the side having the epitaxial structure except for the connection area of the second connection end 2122, the fourth connection end 2132 and the external circuit.

Of course, in other embodiments, the main light emitting surface of each light emitting epitaxial layer structure (a 1-An) may be packaged separately to form a plurality of independent packaging layers.

The LED light source shown in fig. 9 is obtained by the following manufacturing method: firstly, placing the main light-emitting surface or one of the opposite surfaces of the light-emitting unit face upwards; continuously injecting glue in a moving mode along the arrangement tracks of the light-emitting epitaxial layer structures (A1-An) in the areas of the upward surface except for the connection areas of the second connection end 2122, the fourth connection end 2132 and An external circuit, and forming a connected packaging layer on the surface after curing; turning the light-emitting unit by 180 degrees, namely enabling the other surface of the main light-emitting surface or the opposite surface of the light-emitting unit to be upward, and fixing the light-emitting unit by matching the bracket with the region which is not injected with glue on the light-emitting unit so as to suspend the region which is injected with glue; and continuously injecting glue in a moving manner along the arrangement tracks of the light-emitting epitaxial layer structures (A1 to An) on the upward surface (the other surface of the main light-emitting surface or the opposite surface of the light-emitting unit) except for the connection areas of the second connecting end 2122 and the fourth connecting end 2132 with the external circuit, wherein the main light-emitting surface and the connected encapsulating layer formed on the opposite surface are connected into a whole due to the fluidity of the glue, and finally a connected encapsulating layer 220 wrapping 4 surfaces of the light-emitting unit is formed, and the whole of the light-emitting unit except for the connection areas of the second connecting end 2122 and the fourth connecting end 2132 with the external circuit is encapsulated into a whole.

The LED light source provided in the second embodiment includes the light emitting unit provided in the first embodiment and the encapsulation layer directly obtained by encapsulating the light emitting unit, and does not require a gold wire, a substrate, a support, or even an additional electrode for each light emitting epitaxial layer structure, thereby simplifying the composition structure of the LED light source and reducing the cost.

Example three:

the invention further provides an LED lamp, which comprises at least one LED light source and at least two metal connecting pieces for supplying power to the LED light sources, wherein the LED light source is any one of the LED light sources in the second embodiment. If the LED lamp comprises two or more LED light sources, the LED light sources can be connected in series, in parallel or in series-parallel, so as to form at least one circuit, and each circuit of the at least two metal connecting pieces is connected to the power supply module, so as to realize power supply. The power supply module can be an integral part of the LED lamp, and can also be an external module independent of the LED lamp.

Preferably, the metal connecting member is made of a rigid material, and is used for supporting each LED light source while supplying power to each LED light source, thereby keeping each LED light source at a fixed position. Preferably, at least two metal connectors are made of a material with high thermal conductivity, and heat of the LED light source connected with the metal connectors can be dissipated to the lamp cap through the metal connectors. A material with high thermal conductivity such as copper.

Preferably, the main light emitting surface of at least one of the LED light sources forms an included angle of 20 to 60 degrees with the horizontal plane, and more preferably, forms an included angle of 45 degrees. Therefore, the light emitted by the main light emitting surface can be emitted at a preset angle, and the target area corresponding to the whole angle is illuminated.

If the LED lamp includes at least two LED light sources, preferably, the at least two LED light sources are arranged in parallel, or arranged in a line shape or a folded shape, and the main light emitting surface of each LED light source faces outward. The colors of the at least two LED light sources after being electrified can be the same or different. If the LED lamp comprises at least three LED light sources, preferably, the at least three LED light sources surround a polygon, and the main light-emitting surface of each LED light source faces the outside of the ring; or the at least three LED light sources are arranged in a star shape, and the main light emitting surface of each LED light source faces outwards. The main light-emitting surface faces outwards, so that light emitted by the main light-emitting surface can be emitted outwards, and the illumination brightness is improved.

Preferably, the LED lamp further comprises a power supply module connected to the at least two metal connectors, and configured to supply power to each of the LED light sources through the at least two metal connectors. Preferably, the power supply module includes a power converter for converting an external ac power into a dc power.

Preferably, the LED lamp further comprises a bracket for supporting at least one of the LED lamp source, the metal connector and the power supply module. So that the supported part is fixed in position. Preferably, the holder is made of soft glass that is transparent to visible light, so that light from the LED light source can be prevented from being lost by the holder, and the LED light source can be prevented from forming a shadow by the holder.

Preferably, the LED lamp further comprises a housing for receiving each of the LED lamp sources and the at least two metal connectors. Furthermore, the power supply module and/or the bracket are also used for accommodating the power supply module and/or the bracket. Preferably, the shell is also filled with protective gas.

Preferably, the housing includes a lamp cap and a hollow and light-transmitting lamp housing, one end of the lamp housing is closed, the other end of the lamp housing has an opening, each of the LED light sources is arranged in a hollow state at a substantially central position in the hollow lamp housing through at least two metal connectors made of a rigid material, so that each of the LED light sources is held in the lamp housing in a hollow state, that is, each of the LED light sources is in a suspended state in the lamp housing with respect to an inner surface of the lamp housing, the lamp cap is mounted in the opening of the lamp housing in a manner of being blocked, and the lamp cap includes a threaded portion on a side surface and an eyelet portion on; if the LED lamp further comprises a power supply module, the power supply module is contained in the lamp cap, the at least two metal connecting pieces extend into the lamp cap from the opening part of the lampshade to be connected with the power supply module, the power supply module is also respectively connected with the threaded part and the eyelet part of the lamp cap, an external direct current power supply is connected through the threaded part and the eyelet part of the lamp cap, and the LED light sources are supplied with power through the at least two metal connecting pieces after conversion; if the LED lamp is not provided with the power supply module, the at least two metal connecting pieces are directly connected with the thread part and the eyelet part of the lamp holder and are connected to the external power supply module through the thread part and the eyelet part. If the LED lamp further includes a holder which is extended from the opening of the lamp housing into the lamp housing, and the holder, the opening of the lamp housing, and the base are attached so that the opening of the lamp housing is closed, the LED lamp sources are arranged in a hollow state at substantially the center in the hollow lamp housing via the holder, and in this case, the metal connector does not need to support other members.

Preferably, the LED lamp further comprises a main control module electrically connected to the at least two metal connectors, and configured to control the metal connectors to supply power to the LED light sources, including controlling power on, power off, and brightness of the LED light sources. Under the control of the main control module, the LED lamp can emit monochromatic light and can mix light, and the color, the brightness, the saturation and the like of the LED lamp are controllable.

Preferably, the LED lamp comprises at least two LED light sources, the at least two LED light sources generate light with different colors after being electrified, and the switching of the light emitting colors of the LED lamp can be realized by controlling the power supply of each LED light source through the main control module. Preferably, among the at least two LED light sources, the LED light sources that generate different color lights after being energized are connected in parallel, and the LED light sources that generate the same color light after being energized are connected in series.

Preferably, the LED lamp further comprises a communication module electrically connected to the main control module, and configured to receive a control instruction from an external control terminal and transmit the control instruction to the main control module, and the main control module is configured to control the power supply of the metal connecting member to each LED light source according to the control instruction. Including controlling the power on, power off, brightness, etc. of the various LED light sources. Preferably, the external control terminal is a mobile phone, a remote controller and the like. Preferably, the communication module is a WIFI module, a bluetooth module, a ZigBee communication module, or the like.

Taking a bulb lamp as an example, as shown in fig. 10 to 16.

Fig. 10 and 11 show an embodiment of the present invention, an LED lamp includes a housing, two metal connectors (321 and 322), a power supply module 33, a first LED light source 34, a second LED light source 35, and a bracket 36. The housing includes a lamp holder 311 and a lamp cover 312, the lamp cover 312 is hollow and light-transmitting, one end is closed, the other end has an opening, the lamp holder 311 is installed in the opening of the lamp cover 312 in a manner of being blocked, the lamp cover 312 is filled with a protective gas, and the lamp holder 311 includes a screw portion 3111 on a side surface and an eyelet portion 3112 at a bottom of the lamp holder 311. The first LED light source 34 and the second LED light source 35 are supported by the bracket 36 at substantially central positions in the lamp cover 312 and are arranged in a straight line, in this embodiment, the substrates of the first LED light source 34 and the second LED light source 35 are transparent substrates, so that six surfaces of the substrates emit light (only arrows show light emitting conditions of four surfaces, and front and back surfaces of the LED lamp are not shown in the figure), the main light emitting surfaces of the first LED light source 34 and the second LED light source 35 are back surfaces of the substrates, the main light emitting surfaces face the closed end of the lamp cover 312, when the LED lamp is installed in a vertical horizontal plane, the main light emitting surfaces of the first LED light source 34 and the second LED light source 35 are parallel to the horizontal plane, in this embodiment, the bracket 36 is T-shaped, and a portion connected between the first LED light source 34 and the second LED light source 35 is a hollow structure for routing wires to electrically connect the first LED light source 34. As shown in fig. 11, the fourth connecting end 2132 of the first LED light source 34 on the front surface of the substrate is electrically connected to the second connecting end 2122 'of the second LED light source 35 on the front surface of the substrate, and the first metal connecting part 321 is electrically connected to the second connecting end 2122 of the first LED light source 34 on the front surface of the substrate, and the second metal connecting part 322 is electrically connected to the fourth connecting end 2132' of the second LED light source 35 on the front surface of the substrate, so that the first LED light source 34 and the second LED light source 35 are connected in series through two metal connecting parts (321, 322). The power supply module 3 is accommodated in the lamp holder 311, two metal connectors (321, 322) extend into the lamp holder 311 from the opening portion of the lamp cover 312 to be connected with the power supply module 33, the power supply module 33 is further connected with the screw portion 3111 and the eyelet portion 3112 of the lamp holder 311, an external direct current power supply is connected through the screw portion 3111 and the eyelet portion 3112 of the lamp holder, and the power supply module is converted to supply power to the first LED light source 34 and the second LED light source 35 through the two metal connectors (321, 322).

As shown in fig. 12, another embodiment is different from the above-mentioned embodiment shown in fig. 10 in that the LED lamp further includes a third LED light source 37, the bracket 36 has an umbrella-shaped structure, the first LED light source 34, the second LED light source 35 and the third LED light source 37 are supported by the bracket 36 at a substantially central position in the lamp housing 312, and are enclosed into a triangle, and the 3 LED light sources are connected in series by two metal connectors (321, 322). The main light emitting surfaces of the three LED light sources face the closed end of the lampshade 312, and when the LED lamp is installed perpendicular to the horizontal plane, the main light emitting surfaces of the 3 LED light sources form an angle of 45 degrees with the horizontal plane.

As shown in fig. 13, another embodiment is different from the embodiment shown in fig. 10 in that the LED lamp further includes a third LED light source 37 and a fourth LED light source 38, the support 36 has an umbrella-shaped structure, the first LED light source 34, the second LED light source 35, the third LED light source 37 and the fourth LED light source 38 are supported by the support 36 at substantially central positions in the lamp housing 312 and are arranged in a star shape, the embodiment is arranged in a special star shape, i.e., a cross shape, the LED lamp shown in this embodiment includes a parallel circuit, and the first LED light source 34 and the second LED light source 35 are connected in series through two metal connectors (321, 322) and are connected in parallel with the third LED light source 37 and the fourth LED light source 38 connected in series through another two metal connectors (323, 324). The main light emitting surfaces of the four LED light sources face the closed end of the lampshade 312, and when the LED lamp is installed in a vertical horizontal plane, the main light emitting surfaces of the 4 LED light sources are horizontal to the horizontal plane.

As shown in fig. 14, another embodiment is different from the embodiment shown in fig. 10 in that the LED lamp further includes a third LED light source 37, a fourth LED light source 38, a fifth LED light source 39 and a sixth LED light source 40, and 6 LED light sources in total are supported in a substantially central position in the lamp housing 312 through the bracket 36 having an umbrella structure with the first LED light source 34 and the second LED light source 35, and enclose a hexagon. The LED lamp shown in this embodiment is connected to two parallel circuits by two metal connectors (321, 322), one of the first LED light source 34, the second LED light source 35, and the third LED light source 37 connected in series is connected in parallel to the other of the fourth LED light source 38, the fifth LED light source 39, and the sixth LED light source 40 connected in series. The main light emitting surfaces of the 6 LED light sources face the closed end of the lampshade 312, and when the LED lamp is installed in a vertical horizontal plane, the main light emitting surfaces of the 6 LED light sources are horizontal to the horizontal plane.

As shown in fig. 15, another embodiment is different from the embodiment shown in fig. 10 in that the LED lamp further includes a third LED light source 37, and 3 LED light sources in total, together with the first LED light source 34 and the second LED light source 35, are supported in the substantially central position in the lamp housing 312 by two metal connectors (321, 322) made of a rigid material and are arranged in parallel. The 3 LED light sources are connected in series by two metal connectors (321, 322). The respective main light emitting surface faces the closed end of the lampshade 312, and when the LED lamp is installed perpendicular to the horizontal plane, the respective main light emitting surfaces of the 3 LED light sources are horizontal to the horizontal plane. The present embodiment does not require an additional bracket.

As shown in fig. 16, another embodiment is different from the embodiment shown in fig. 15 in that 3 LED light sources in total, namely, the third LED light source 37, the first LED light source 34 and the second LED light source 35, are supported at substantially central positions in the lamp housing 312 by two metal connectors (321, 322) made of rigid materials and are arranged in a folding shape. The 3 LED light sources are connected in series by two metal connectors (321, 322). The respective main light emitting surface faces the closed end of the lampshade 312, and when the LED lamp is installed perpendicular to the horizontal plane, the respective main light emitting surfaces of the 3 LED light sources are horizontal to the horizontal plane. The present embodiment also does not require additional brackets.

The LED lamp provided by the invention adopts the LED light source provided by the invention, the composition structure is simplified, the installation is simple, and the cost is reduced.

The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and the practice of the invention is not to be considered limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Industrial applicability

Sequence Listing free content

Claims

An LED light source comprising a light emitting unit and an encapsulation layer, wherein,

the light-emitting unit comprises a substrate, an epitaxial structure manufactured on the substrate, a first connecting unit and a second connecting unit; the epitaxial structure comprises a single light-emitting epitaxial layer structure or at least two electrically connected light-emitting epitaxial layer structures, and the epitaxial structure is provided with at least one end N-type semiconductor layer and at least one end P-type semiconductor layer; the first connecting unit is electrically connected with each end N-type semiconductor layer, the second connecting unit is electrically connected with each end P-type semiconductor layer, and the first connecting unit and the second connecting unit are also used for accessing an external circuit;

the packaging layer is obtained by sealing local or whole areas of the light-emitting unit except for the connection areas of the first connection unit, the second connection unit and the external circuit on the light-emitting unit, wherein the sealing area at least comprises a main light-emitting area of the light-emitting unit.
The LED light source of claim 1 wherein the light emitting epitaxial layer structure comprises at least: the N-type semiconductor layer, the light emitting layer and the P-type semiconductor layer are far away from the substrate from the near side; or at least comprises: the N-type semiconductor layer, the light emitting layer, the P-type semiconductor layer and the metal reflecting layer are arranged from near to far away from the substrate; or at least comprises: the N-type semiconductor layer is far away from the substrate from the near side, the light emitting layer and the P-type semiconductor layer with the reflection function.
The LED light source of claim 1 wherein the first connection unit includes a first connection terminal disposed on the epitaxial structure and electrically connected to each of the end N-type semiconductor layers, and a second connection terminal extending outside the epitaxial structure for connecting the first connection terminal to the external circuit; the second connection unit comprises a third connection end arranged on the epitaxial structure and electrically connected with the end P-type semiconductor layers, and a fourth connection end extending out of the epitaxial structure and used for connecting the third connection end into the external circuit.
The LED light source of claim 3 wherein a first connection terminal is disposed on the epitaxial structure by a metal paste and electrically connected to each of the end N-type semiconductor layers; and/or the third connecting end is arranged on the epitaxial structure through metal paste and is electrically connected with the end P-type semiconductor layers.
The LED light source of claim 3 wherein the second and/or fourth connection terminals extend beyond the epitaxial structure to form a free end or extend beyond the epitaxial structure and attach to an area of the substrate outside of the portion of the epitaxial structure occupied by the substrate; or extend out of the epitaxial structure and are fixedly arranged on the substrate in the area except the occupied part of the epitaxial structure through an intermediate structure.
The LED light source of claim 3 wherein the second connection end and/or the fourth connection end is one or more of Z-shaped, T-shaped, L-shaped, ten-shaped, square-shaped, oval-shaped, circular, and irregular.
The LED light source of claim 1 wherein the first connection unit and/or the second connection unit is a unitary sheet structure.
The LED light source according to claim 7, wherein the inscribed circle diameter of the connection region of the first connection unit and/or the second connection unit with the external circuit is 200 to 1500 micrometers.
The LED light source of claim 1 wherein the substrate is one of sapphire, silicon, glass, and silicon carbide material.
The LED light source according to any of claims 1 to 9, wherein the encapsulation layer is used to encapsulate an area on the main light emitting surface of the light emitting unit except for the connection area of the first connection unit, the second connection unit and the external circuit; or a main light emitting surface for packaging the light emitting unit, and an area on the opposite surface of the main light emitting surface except for the connection area of the first connection unit, the second connection unit and the external circuit; or the area except the connection area of the first connection unit, the second connection unit and the external circuit is used for packaging the main light-emitting surface of the light-emitting unit, the opposite surface of the main light-emitting surface and part or all of the side surfaces between the main light-emitting surface and the opposite surface.
The LED light source of claim 10 wherein the encapsulant layer is a monolithic encapsulant layer.
The LED light source of claim 11 wherein the encapsulant layer is arcuate.
An LED lamp is characterized by comprising at least one LED light source and at least two metal connecting pieces for supplying power to the LED light sources; the LED light source is as claimed in any one of claims 1 to 12.
The LED lamp of claim 13, comprising at least two of said LED light sources; the at least two LED light sources are arranged in parallel or in a linear or folded shape, and the main light emitting surface of each LED light source faces outwards.
The LED lamp of claim 13, comprising at least three of said LED light sources; the at least three LED light sources are enclosed into a polygon, and the main light emitting surface of each LED light source faces outwards; or the at least three LED light sources are arranged in a star shape, and the main light emitting surface of each LED light source faces outwards.
The LED lamp of claim 13, wherein the main exit surface of at least one of the LED light sources forms an angle of 20 to 60 degrees with the horizontal plane.
The LED lamp of claim 16, wherein the main exit surface of at least one of the LED light sources forms a 45 degree angle with the horizontal plane.
The LED lamp of claim 13, further comprising a housing for receiving each of said LED light sources and said at least two metal connectors.
The LED lamp of claim 18, further comprising a power module and/or a bracket; the power supply module is connected with the at least two metal connecting pieces and used for supplying power to the LED light sources through the at least two metal connecting pieces; the bracket is used for supporting at least one of the LED light sources, the metal connecting piece and the power supply module; the housing is also used for accommodating the power supply module and/or the bracket.
The LED lamp of claim 18, wherein the housing is further filled with a protective gas.
The LED lamp of any one of claims 13 to 20, further comprising a master control module electrically connected to the at least two metal connectors for controlling the metal connectors to power each of the LED light sources.
The LED lamp of claim 21, comprising at least two of said LED light sources that produce different colors of light when energized.
The LED lamp of claim 22, wherein the LED light sources that produce different colors of light when energized are connected in parallel and the LED light sources that produce the same color of light when energized are connected in series.
The LED lamp of claim 21, further comprising a communication module electrically connected to the main control module, configured to receive a control command from an external control terminal and transmit the control command to the main control module, wherein the main control module is configured to control the metal connector to supply power to each of the LED light sources according to the control command.