CN106404799A - Metallized film defect detecting and cropping device - Google Patents
Metallized film defect detecting and cropping device Download PDFInfo
- Publication number
- CN106404799A CN106404799A CN201610855477.7A CN201610855477A CN106404799A CN 106404799 A CN106404799 A CN 106404799A CN 201610855477 A CN201610855477 A CN 201610855477A CN 106404799 A CN106404799 A CN 106404799A
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- CN
- China
- Prior art keywords
- metallized film
- light
- laser
- emitting device
- passing board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011104 metalized film Substances 0.000 title claims abstract description 46
- 230000007547 defect Effects 0.000 title claims abstract description 31
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000003698 laser cutting Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 abstract description 17
- 239000010408 film Substances 0.000 abstract description 10
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 230000003760 hair shine Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention relates to a metallized film defect detecting and cropping device, and belongs to the technical field of a capacitor detecting device. The metallized film defect detecting and cropping device comprise a light transmitting plate, a light-emitting device is arranged below the light transmitting plate, the metallized film is laid on the light transmitting plate, light emitted from the light-emitting device penetrates through the light transmitting plate successively and shines the reverse side of the metallized film, a laser emitting device and a laser receiving device of the light transmitting plate are symmetrically arranged on two sides of the metallized film respectively, and the laser emitting device on one side of a detecting platform makes the laser reflected onto the laser receiving device after emitting the laser to the metallized film. According to the metallized film defect detecting and cropping device, the laser emitting device and the laser receiving device are arranged on two sides of the metallized film so as to conduct detection on film thickness, when the film thickness is abnormal, a receiving position of the laser receiving device changes, and a corresponding alarming reminding is generated so as to judge the quality of a capacitor film; then, the light-emitting device can use the backlight to show defects of the metallized film, thus distinguishing rate of the defects can be increased.
Description
Technical field
The present invention relates to a kind of metallized film defects detection-cutting means, belong to capacitor detection means technical field.
Background technology
Capacitor is widely used in fields such as power electronics, communications service and rail transport, with scientific and technological level at present
Development, capacitor relies on its good electrical performance and high reliability, become the above-mentioned industry field of promotion update can not or
Scarce electronic component, wherein thin film capacitor, due to small volume, safe, have greatly promoted sending out of capacitor technology field
Exhibition.In prior art, the general preparation method of thin film capacitor is by metallic film and poly- ethyl ester, polypropylene, polystyrene or poly- carbonic acid
The plastic sheetings such as ester, after the overlap of two ends, are wound into the metallized film electrode of cylindrical shape, are then placed in capacitor case,
Injection insulating oil and epoxy resin, then obtain thin film capacitor after assembling.Wherein, metallized film meeting during evaporation
The defects such as coating became uneven, splashing point, snake, oxide layer occur, such defect thin film is easy after being wound into membrane electrode
Appearance loss is excessive, and product quality is difficult to control to, and even causes capacitor blast when serious.
Wherein, capacitor thickness testing equipment can be divided into thickness measurement online equipment and non-thickness measurement online equipment two big class.This
If it is optimal that two class thickness-measuring equipments can use cooperatively, but thickness measurement online deice detection device is complex, and
Using non-contact detection, easily occur that film surface planarization is bad and situation that data fluctuations that cause are larger, Er Fei
Line thickness-measuring equipment can provide contact measurement method, effectively compensate for this deficiency of thickness measurement online.At present, on-line checking sets
For mostly, by manually carrying out vision-based detection, this detection method needs to put into larger manpower, and inconspicuous for thickness change
Defect be difficult to detect, there is potential safety hazard in capacitor product quality.
Content of the invention
Unresolved problems of the prior art, the invention provides a kind of metallized film defects detection-cut dress
Put, concrete technical scheme is as follows：
A kind of metallized film defects detection-cutting means, including light-passing board, are provided with light-emitting device below described light-passing board,
Metallized film is equipped with described light-passing board, the light that described light-emitting device sends sequentially passes through light-passing board and is irradiated to metallization
The thin film back side, described light-passing board is respectively arranged with symmetrical laser beam emitting device and laser pick-off positioned at metallized film both sides
Device, the laser beam emitting device of described detection platform side is to metallized film transmitting laser back reflection to laser receiver
On.
As the improvement of technique scheme, outside described light-emitting device, it is cased with the photosensitive cartridge of printing opacity, described photosensitive cartridge is located at
Below light-passing board.
As the improvement of technique scheme, described photosensitive cartridge bottom is provided with photosensitive box support.
As the improvement of technique scheme, the stroke of described metallized film is located at the position after light-passing board and is provided with
Laser cutting apparatus, described laser cutting apparatus include bracing frame, and support frame as described above is provided with lever arm, on described lever arm
It is provided with laser instrument.
As the improvement of technique scheme, described lever arm side is provided with display.
As the improvement of technique scheme, the stroke of described metallized film is located at the position after laser cutting apparatus
It is provided with membrane cut mechanism, described membrane cut mechanism includes portal frame, described portal frame is hung with drive mechanism, described drive mechanism
Lower section is provided with knife rest, is fixed with cutter head below described knife rest.
Technique scheme is by being arranged on the laser beam emitting device of metallized film both sides and laser receiver to film
Thickness is detected, when thickness is normal, laser receiver will receive stable laser signal in same position, when thickness is different
Chang Shi, then the receiving position of laser receiver will change, and produce corresponding alarm sounds, and capacitor judged with this
The quality of thin film；Then show the defect of metallized film by light-emitting device backlight, improve the probability that distinguishes of defect, realize lacking
Sunken is accurately positioned, and reduces the required human input of detection, improves defect detection efficiency.
Brief description
Fig. 1 is a kind of structural representation of present invention metallized film defects detection-cutting means；
Fig. 2 is schematic diagram when a kind of present invention metallized film defects detection-cutting means are overlooked.
Specific embodiment
As shown in Figure 1 and Figure 2, the invention provides a kind of metallized film defects detection-cutting means, including light-passing board
20, it is provided with light-emitting device 31 below described light-passing board 20, described light-passing board 20 is equipped with metallized film 10, described luminous
The light that device 31 sends sequentially passes through light-passing board 20 and is irradiated to metallized film 10 back side, and described light-passing board 20 is located at metal
Change thin film 10 both sides and be respectively arranged with symmetrical laser beam emitting device 40 and laser receiver 41, described detection platform 20 side
Laser beam emitting device 40 to metallized film 10 transmitting laser back reflection on laser receiver 41.
By being arranged on laser beam emitting device 40 and the laser pick-off dress of metallized film 10 both sides in technique scheme
Put 41 pairs of thickness to detect, when thickness is normal, laser receiver 41 will receive stable laser letter in same position
Number, when thickness is abnormal, then the receiving position of laser receiver 41 will change, and produce corresponding alarm sounds, and with
This is judging the quality of capacitor film；Then show the defect of metallized film 10 by light-emitting device 31 backlight, improve and lack
Sunken distinguishes probability, realizes being accurately positioned of defect, reduces the required human input of detection, improves defect detection efficiency.
Further, it is cased with the photosensitive cartridge 30 of printing opacity outside described light-emitting device 31, described photosensitive cartridge 30 is located at light-passing board 20
Lower section, this photosensitive cartridge 30 can carry out accommodating protection, and the optically focused effect providing for light-emitting device 31 to light-emitting device 31.
Further, described photosensitive cartridge 30 bottom is provided with photosensitive box support 32, and this photosensitive box support 32 can be to sense
Light box 30, light-passing board 20 and metallized film 10 are supported.
Further, the stroke of described metallized film 10 is located at the position after light-passing board 20 and is provided with laser cutting
Device, described laser cutting apparatus include bracing frame 60, support frame as described above 60 are provided with lever arm 61, on described lever arm 61
It is provided with laser instrument 62, this preferred version carries out cutting of laser cutting apparatus after defect detection in time, due to lever arm 61
Motility is good, can carry laser instrument 62 and quickly be moved, due on one piece of metallized film 10 and have and a plurality of wait to cut
Capacitor films electrode, that capacitor films electrode region that therefore defect can be optionally located by laser instrument 62
Cut it is ensured that the seriality of metallized film 10 entirety, improve quantity-produced efficiency.
Further, described lever arm 61 side is provided with display 63, and the effect of this display 63 is to laser instrument
42 cutting operation carries out Real-time Feedback, is easy to operator's record, observes.
Further, on the stroke of described metallized film 10, the position after laser cutting apparatus is provided with and cuts film
Mechanism, described membrane cut mechanism includes portal frame 50, described portal frame 50 is hung with drive mechanism 51, under described drive mechanism 51
Side is provided with knife rest 52, is fixed with cutter head 53 below described knife rest 52.This preferred version passes through membrane cut mechanism, in defect area relatively
Can directly be blocked when big, not use laser cutting apparatus and carry out selectivity and cut, thus realizing membrane cut mechanism and swashing
The cooperating, replace use of light cutting means.
Above embodiments of the invention are described in detail, but described content have been only presently preferred embodiments of the present invention,
It is not to be regarded as the practical range for limiting the present invention, all impartial changes made according to the scope of the invention and improvement etc., all should
Still belong within covering scope of the present invention.
Claims (6)
1. a kind of metallized film defects detection-cutting means are it is characterised in that include light-passing board（20）, described light-passing board
（20）Lower section is provided with light-emitting device（31）, described light-passing board（20）On be equipped with metallized film（10）, described light-emitting device
（31）The light sending sequentially passes through light-passing board（20）It is irradiated to metallized film（10）The back side, described light-passing board（20）On be located at
Metallized film（10）Both sides are respectively arranged with symmetrical laser beam emitting device（40）And laser receiver（41）, described detection
Platform（20）The laser beam emitting device of side（40）To metallized film（10）Transmitting laser back reflection is to laser receiver
（41）On.
2. as claimed in claim 1 a kind of metallized film defects detection-cutting means it is characterised in that described luminous dress
Put（31）It is cased with outward the photosensitive cartridge of printing opacity（30）, described photosensitive cartridge（30）Positioned at light-passing board（20）Lower section.
3. as claimed in claim 2 a kind of metallized film defects detection-cutting means it is characterised in that described photosensitive cartridge
（30）Bottom is provided with photosensitive box support（32）.
4. as claimed in claim 3 a kind of metallized film defects detection-cutting means it is characterised in that described metallization
Thin film（10）Stroke on be located at light-passing board（20）Position afterwards is provided with laser cutting apparatus, and described laser cutting apparatus include
Bracing frame（60）, support frame as described above（60）On be provided with lever arm（61）, described lever arm（61）On be provided with laser instrument（62）.
5. as claimed in claim 4 a kind of metallized film defects detection-cutting means it is characterised in that described lever arm
（61）Side is provided with display（63）.
6. as claimed in claim 5 a kind of metallized film defects detection-cutting means it is characterised in that described metallization
Thin film（10）Stroke on be located at laser cutting apparatus after position be provided with membrane cut mechanism, described membrane cut mechanism includes portal frame
（50）, described portal frame（50）On be hung with drive mechanism（51）, described drive mechanism（51）Lower section is provided with knife rest（52）, institute
State knife rest（52）Lower section is fixed with cutter head（53）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610855477.7A CN106404799A (en) | 2016-09-28 | 2016-09-28 | Metallized film defect detecting and cropping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610855477.7A CN106404799A (en) | 2016-09-28 | 2016-09-28 | Metallized film defect detecting and cropping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106404799A true CN106404799A (en) | 2017-02-15 |
Family
ID=57997570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610855477.7A Pending CN106404799A (en) | 2016-09-28 | 2016-09-28 | Metallized film defect detecting and cropping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106404799A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107037060A (en) * | 2017-04-24 | 2017-08-11 | 天津创新晶彩科技有限公司 | A kind of novel glass film automatic detection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005337857A (en) * | 2004-05-26 | 2005-12-08 | Toray Ind Inc | Surface unevenness inspection method and inspection apparatus |
| CN101582361A (en) * | 2007-04-26 | 2009-11-18 | 南京华显高科有限公司 | Repairing method of aluminum film electrode broken wire |
| CN103226105A (en) * | 2012-01-25 | 2013-07-31 | 东丽工程株式会社 | Device and method for inspecting unevenness of film thickness, and coating device with inspecting device |
| CN204262592U (en) * | 2014-09-26 | 2015-04-15 | 武汉拓普银光电技术有限公司 | Automatically the laser cutting machine of cover layer can be cut |
-
2016
- 2016-09-28 CN CN201610855477.7A patent/CN106404799A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005337857A (en) * | 2004-05-26 | 2005-12-08 | Toray Ind Inc | Surface unevenness inspection method and inspection apparatus |
| CN101582361A (en) * | 2007-04-26 | 2009-11-18 | 南京华显高科有限公司 | Repairing method of aluminum film electrode broken wire |
| CN103226105A (en) * | 2012-01-25 | 2013-07-31 | 东丽工程株式会社 | Device and method for inspecting unevenness of film thickness, and coating device with inspecting device |
| CN204262592U (en) * | 2014-09-26 | 2015-04-15 | 武汉拓普银光电技术有限公司 | Automatically the laser cutting machine of cover layer can be cut |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107037060A (en) * | 2017-04-24 | 2017-08-11 | 天津创新晶彩科技有限公司 | A kind of novel glass film automatic detection device |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
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| RJ01 | Rejection of invention patent application after publication |