CN106332464A - Manufacturing process of plating gold capable of saving gold salt - Google Patents
Manufacturing process of plating gold capable of saving gold salt Download PDFInfo
- Publication number
- CN106332464A CN106332464A CN201610783890.7A CN201610783890A CN106332464A CN 106332464 A CN106332464 A CN 106332464A CN 201610783890 A CN201610783890 A CN 201610783890A CN 106332464 A CN106332464 A CN 106332464A
- Authority
- CN
- China
- Prior art keywords
- gold
- plating
- saving
- plated
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 title claims abstract description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 10
- 229910052737 gold Inorganic materials 0.000 title abstract description 10
- 239000010931 gold Substances 0.000 title abstract description 10
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 238000007747 plating Methods 0.000 title abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000002390 adhesive tape Substances 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 235000003392 Curcuma domestica Nutrition 0.000 claims description 8
- 235000003373 curcuma longa Nutrition 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 8
- 235000013976 turmeric Nutrition 0.000 claims description 8
- 244000008991 Curcuma longa Species 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 238000005253 cladding Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 235000015598 salt intake Nutrition 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- 244000163122 Curcuma domestica Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a manufacturing process of plating gold capable of saving gold salt. The process includes specific steps: units discarded in the former process are selected from to-be-plated large gold plates, wrapped by high-temperature-resistant adhesive tapes, and compressed by employing a pressing and sealing machine, gold plating is performed after inspection and confirmation of the wrapping, and the discarded plates without gold plating are selected after the forming process. By employing the process, discard of plating gold can be avoided, the consumption of the gold salt is reduced, and the production cost can be lowered.
Description
Technical field
The present invention relates to the heavy gold-plated process that pcb board manufactures, be specifically related to the processing technology of a kind of heavy gold-plated saving gold salt.
Background technology
Pcb board, also known as printed circuit board (PCB), printed substrate, is called for short printed board, with insulation board as base material, is cut into a scale
Very little, at least with a conductive pattern on it, and cloth is porose, face (PAD) convenient patch components and parts, and realizes between electronic devices and components
Be connected with each other.
Along with market development, by chemical nickel and gold or the side of electronickelling gold on more customer requirement printed circuit board aperture, face
Formula one layer of gold of plating, protects nickel face, meets good upper stannum.In each operation manufacturing process, certain fraction defective can be there is, produce
Life is scrapped.Gold salt is expensive, and in heavy gold-plated batch production, the written-off unit of front operation is left intact can be because reporting
Gold on useless plate, causes waste.
Summary of the invention
The technical problem to be solved is to provide one and avoids scrapping turmeric, saves gold salt consumption, can reduce raw
Produce the processing technology of the heavy gold-plated saving gold salt of cost.
The technical solution adopted for the present invention to solve the technical problems is: the processing technology of a kind of heavy gold-plated saving gold salt,
Concretely comprise the following steps: from after heavy gold-plated big sheet being selected front operation and scraps unit, be first coated with by High temperature-resistanadhesive adhesive tape, then use
Glue pressing machine compresses, and confirms that cladding carries out turmeric after good on inspection, after molding procedure (big sheet is divided into small pieces needed for client),
Non-turmeric is scrapped plate select.
Utilize the present invention can avoid scrapping turmeric, save gold salt consumption, production cost can be reduced.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment
The processing technology of the heavy gold-plated saving gold salt of the present embodiment, concretely comprises the following steps: select heavy gold-plated big sheet from treating
After front operation scraps unit, first it is coated with by High temperature-resistanadhesive adhesive tape, then compresses with glue pressing machine, confirm that cladding is carried out after good on inspection
Turmeric, after molding procedure (big sheet is divided into small pieces needed for client), scraps plate by non-turmeric and selects.
Utilize the present invention can avoid scrapping turmeric, save gold salt consumption, production cost can be reduced.
Claims (2)
1. the processing technology of a heavy gold-plated saving gold salt, it is characterised in that concretely comprise the following steps: from treating choosing heavy gold-plated big sheet
Go out after front operation scraps unit, be first coated with by High temperature-resistanadhesive adhesive tape, then compress with glue pressing machine, confirm that cladding is good the most laggard on inspection
Row turmeric, after molding procedure, scraps plate by non-turmeric and selects.
The processing technology of heavy gold-plated saving gold salt the most according to claim 1, it is characterised in that molding procedure refers to greatly
Sheet is divided into small pieces needed for client.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783890.7A CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783890.7A CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106332464A true CN106332464A (en) | 2017-01-11 |
Family
ID=57789080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610783890.7A Pending CN106332464A (en) | 2016-08-31 | 2016-08-31 | Manufacturing process of plating gold capable of saving gold salt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106332464A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
| CN115151063A (en) * | 2022-07-25 | 2022-10-04 | 胜宏科技（惠州）股份有限公司 | Gold finger processing method, PCB board and display screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237506A (en) * | 2000-02-21 | 2001-08-31 | Sanyo Electric Co Ltd | Mounting substrate, and device and method for detecting bad mark |
| CN202738276U (en) * | 2011-06-13 | 2013-02-13 | 松下电器产业株式会社 | Electronic component installation system |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
-
2016
- 2016-08-31 CN CN201610783890.7A patent/CN106332464A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237506A (en) * | 2000-02-21 | 2001-08-31 | Sanyo Electric Co Ltd | Mounting substrate, and device and method for detecting bad mark |
| CN202738276U (en) * | 2011-06-13 | 2013-02-13 | 松下电器产业株式会社 | Electronic component installation system |
| CN105517350A (en) * | 2015-11-27 | 2016-04-20 | 北大方正集团有限公司 | Manufacturing method for printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050491A (en) * | 2019-12-19 | 2020-04-21 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN111050491B (en) * | 2019-12-19 | 2021-07-20 | 广州兴森快捷电路科技有限公司 | Leadless four-side gold-coating process manufacturing method |
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
| CN115151063A (en) * | 2022-07-25 | 2022-10-04 | 胜宏科技（惠州）股份有限公司 | Gold finger processing method, PCB board and display screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106332464A (en) | Manufacturing process of plating gold capable of saving gold salt | |
| CN105142352A (en) | Making method of circuit board | |
| CN104125763B (en) | The production and processing method of use for electronic products an insulating shroud | |
| CN206402516U (en) | A kind of multi-disc printed circuit board structure for reducing burr burr | |
| CN106211630A (en) | A kind of circuit board manufacturing jig of brown copper billet | |
| CN103316980A (en) | Reinforcement piece processing device | |
| CN206237686U (en) | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device | |
| CN106376227A (en) | Manufacturing process for insulation shielding case | |
| CN111740209A (en) | Preparation method of FPC die-cutting antenna | |
| CN112752405B (en) | Processing method of PCB connecting sheet of 5G base station calibration network board | |
| CN102300408A (en) | Tray for bearing jointed PCB (Printed Circuit Board) | |
| CN108631051B (en) | Antenna structure, intelligent terminal device and manufacturing method of antenna structure | |
| CN205726646U (en) | A kind of Rigid Flex of anti-cover plate fracture | |
| CN115955786A (en) | Production process of three-side wrapped Jin Dujin finger | |
| CN203407083U (en) | A LED wire circuit board with one insulation bearing layer and a LED lamp belt | |
| CN103730375A (en) | OSP surface treatment package substrate forming milling method | |
| KR100646452B1 (en) | FPC Blade Mold | |
| CN206743639U (en) | A kind of high frequency mixed pressure multilayer circuit board of super radius-thickness ratio | |
| CN201563291U (en) | Inner layer structure of circuit board | |
| CN113658789B (en) | Preparation method for improving current resistance of sheet type multi-layer thick silver magnetic beads | |
| CN204166509U (en) | The contact panel that Flim functional sheet is integrated with flexible circuit board | |
| CN106385768A (en) | Transparent medium circuit board and manufacturing method therefor | |
| CN114571527A (en) | Anti-falling piece manufacturing method of conductive foam die-cut piece | |
| CN105430943B (en) | The method that monitoring printed circuit board multilayer inner cord is scrapped | |
| CN201467559U (en) | Micro connection structure for flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |
|
| RJ01 | Rejection of invention patent application after publication |