CN106338011A - LED with heat and electricity separation - Google Patents
LED with heat and electricity separation Download PDFInfo
- Publication number
- CN106338011A CN106338011A CN201610785404.5A CN201610785404A CN106338011A CN 106338011 A CN106338011 A CN 106338011A CN 201610785404 A CN201610785404 A CN 201610785404A CN 106338011 A CN106338011 A CN 106338011A
- Authority
- CN
- China
- Prior art keywords
- led
- heat
- heat sink
- shape groove
- bowl shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED with heat and electricity separation. The LED with heat and electricity separation comprises an LED bracket and an LED chip; the LED chip is composed of an LED main body; a heat sink is arranged at the bottom of the LED main body; electrodes are arranged on the two sides of the LED main body; a sunken bowl cup type groove is formed in the upper surface of the LED bracket; a radiator is arranged at the bottom of the LED bracket; the bottom surface of the bowl cup type groove is provided with a heat conduction block which is connected with the radiator and two electrode contacts; an insulation layer for partitioning the heat conduction block from the electrode contacts is arranged in the LED bracket; the LED chip is arranged on the bottom surface of the bowl cup type groove; the heat sink is arranged on the top of the heat conduction block and is in contact to the heat conduction block; and the electrodes on the two sides of the LED main body are electrically connected with the two electrode contacts respectively. With adoption of the LED with heat and electricity separation, the heat dissipation performance is good, the use reliability of the LED is improved, and the service life of the LED is prolonged.
Description
Technical field
The present invention relates to led technical field, more particularly, to a kind of thermoelectricity separation led.
Background technology
With the continuous development of semiconductor, led has the advantages such as environmental protection, long-life, high brightness with it, just in recent years
It is widely used in industry-by-industry, reliability when led is used and service life require more and more higher so as to led's
Radiating treatment is put forward higher requirement, particularly to high-power led.Traditional led radiating mode is that led is welded on electricity
On the sheet material of road, then by sheet material shape on heat abstractor, between led and heat abstractor, clip a layer circuit board material, the biography of sheet material
Thermal effect is not good, leads to led radiating effect bad.
Content of the invention
The purpose of the present invention is to overcome existing thermoelectricity to separate the bad technical problem of led radiating, there is provided a kind of thermoelectricity divides
From led, its perfect heat-dissipating, improve dependability and the service life of led.
In order to solve the above problems, the present invention employs the following technical solutions and is achieved:
A kind of thermoelectricity of the present invention separates led, and including led support and led chip, described led chip includes led main body, described
Led bottom part body is provided with heat sink, and described led main body both sides are provided with electrode, and described led rack upper surface is provided with recessed bowl shape
Groove, described led frame bottom is provided with radiator, and the bottom surface of described bowl shape groove is provided with the heat-conducting block connecting radiator, institute
The bottom surface stating bowl shape groove is additionally provided with two electrode contacts, is provided with and separates heat-conducting block with electrode contacts in described led support
Insulating barrier, described led chip is arranged on the bottom surface of bowl shape groove, described heat sink connects positioned at heat-conducting block top and with heat-conducting block
Touch, the electrode of described led main body both sides is electrically connected with two electrode contacts respectively.
In the technical program, heat that led chip sends passes sequentially through heat sink, heat-conducting block and is delivered to radiator, leads to and dissipates
Hot device exhales.Separated by insulating barrier between heat-conducting block and electrode contacts, realize thermoelectricity and separate.
Preferably, described radiator includes heat sink, described heat sink lower surface is provided with several radiating fins, radiating
Fin is perpendicular with heat sink, and described radiating fin is provided with several the first louvres.First louvre is favorably improved scattered
The thermal efficiency.
Preferably, described heat sink is provided with several the second louvres.Second louvre is favorably improved radiating effect
Rate.
Preferably, the first louvre and the second louvre are all horizontally disposed through hole.All first louvres and
Two louvres are all interconnected.
Heat sink it is provided with heat-conducting cream preferably, described.
Preferably, described bowl shape groove top is provided with ring-shaped step.It is provided with ring-shaped step in bowl shape groove top,
Reduce stress in use caused by high temperature for the led support, prevent led to lose efficacy.
Preferably, being provided with transparent colloid layer in described bowl shape groove, it is provided with the cavity that described ring-shaped step surrounds
Low reflective colloid layer.The cavity that ring-shaped step surrounds is the cavity between annular table terrace place plane and led rack upper surface,
It is filled with low reflective colloid layer in this cavity, low reflective colloid layer is located at the top of transparent colloid layer.Low reflective colloid layer energy
Effectively reducing the reflection of the light projecting its surface, thus improving gray scale and the contrast of led, solving led diplopia, dazzle institute
The visual effect causing is not good enough.The thinner thickness of low reflective colloid layer is it is ensured that the brightness of led.
Preferably, the upper surface of described low reflective colloid layer is uneven.Light projects the surface of colloid, a part
Part reflection can be absorbed and be scattered, also part is reflected by colloid, reflects through colloid, low reflective colloid layer table again
Less, the gray scale of raising led and contrast further is then reflected in face more out-of-flatness.
Preferably, undulate on the upper surface microcosmic of described low reflective colloid layer.
The invention has the beneficial effects as follows: (1) perfect heat-dissipating, improve dependability and the service life of led.(2)
It is provided with ring-shaped step in bowl shape groove top, reduce stress in use caused by high temperature for the led support, prevent
Led lost efficacy.(3) pass through to arrange, in rack upper surface, the reflection that one layer low reflective colloid layer reduces the light projecting its surface,
Thus improving gray scale and the contrast of led, the visual effect solving caused by led diplopia, dazzle is not good enough.
Brief description
Fig. 1 is a kind of structural representation of the present invention.
In figure: 1, led support, 2, led main body, 3, heat sink, 4, electrode, 5, bowl shape groove, 6, heat-conducting block, 7, electrode touches
Point, 8, insulating barrier, 9, heat sink, 10, radiating fin, the 11, first louvre, the 12, second louvre, 13, ring-shaped step, 14,
Transparent colloid layer, 15, low reflective colloid layer.
Specific embodiment
Below by embodiment, and combine accompanying drawing, technical scheme is described in further detail.
Embodiment: a kind of thermoelectricity of the present embodiment separates led, as shown in figure 1, include led support 1 and led chip, led
Chip includes led main body 2, and led main body 2 bottom is provided with heat sink 3, led main body 2 both sides and is provided with electrode 4, and led support 1 upper surface sets
There is recessed bowl shape groove 5, led support 1 bottom is provided with radiator, the bottom surface of bowl shape groove 5 is provided with and connects radiator
Heat-conducting block 6, the bottom surface of bowl shape groove 5 is additionally provided with two electrode contacts 7, and two electrode contacts 7 are located at the two of heat-conducting block 6 respectively
Side, is provided with the insulating barrier 8 separating heat-conducting block 6 with electrode contacts 7 between heat-conducting block 6 and electrode contacts 7, led chip is arranged on
The bottom surface of bowl shape groove 5, heat sink the 3 of led chip is located at heat-conducting block 6 top and is in close contact with heat-conducting block 6, sets on heat sink 3
There is heat-conducting cream, the electrode 4 of led main body 2 both sides is electrically connected with two electrode contacts 7 respectively.
Radiator includes heat sink 9, and heat sink 9 lower surface is provided with several radiating fins 10, radiating fin 10 and radiating
Plate 9 is perpendicular, and radiating fin 10 is provided with several the first louvres 11, and heat sink 9 is provided with several the second louvres 12,
First louvre 11 and the second louvre 12 are all horizontally disposed through hole, and all first louvres 11 and the second louvre 12 are all
It is interconnected.The first louvre being interconnected and the second louvre are favorably improved radiating efficiency.
The heat that led chip sends passes sequentially through heat sink, heat-conducting block and is delivered to radiator, and logical radiator exhales.Lead
Separated by insulating barrier between hot block and electrode contacts, the positive and negative electrode of led chip is connected energising with electrode contacts, realizes thermoelectricity
Separate.Led support is respectively provided on two sides with electrode pin, and two electrode contacts pass through the conductive channel and two in led support respectively
Individual electrode pin electrical connection, conductive channel is separated by insulating barrier with heat-conducting block.
Bowl shape groove 5 top is provided with ring-shaped step 13, is provided with transparent colloid layer 14, ring-shaped step in bowl shape groove 5
It is provided with low reflective colloid layer 15 in 13 cavitys surrounding.
Be provided with ring-shaped step in bowl shape groove top, reduce led support in use caused by high temperature should
Power, prevents led to lose efficacy.The cavity that ring-shaped step surrounds is the sky between annular table terrace place plane and led rack upper surface
Chamber, is filled with low reflective colloid layer in this cavity, and low reflective colloid layer is located at the top of transparent colloid layer.Low reflective colloid layer
The reflection of the light projecting its surface effectively being reduced, thus improving gray scale and the contrast of led, solving led diplopia, dazzle
Caused visual effect is not good enough.The thinner thickness of low reflective colloid layer is it is ensured that the brightness of led.
The upper surface of low reflective colloid layer 15 is uneven, undulate on microcosmic.Light projects the surface of colloid, and one
Part can be absorbed part reflection and be scattered, and also part is reflected by colloid, reflects through colloid, low reflective colloid again
Less, the gray scale of raising led and contrast further is then reflected in layer surface more out-of-flatness.
Claims (9)
1. a kind of thermoelectricity separate led it is characterised in that: include led support (1) and led chip, described led chip includes led master
Body (2), described led main body (2) bottom is provided with heat sink (3), and described led main body (2) both sides are provided with electrode (4), described led support
(1) upper surface is provided with recessed bowl shape groove (5), and described led support (1) bottom is provided with radiator, described bowl shape groove
(5) bottom surface is provided with the heat-conducting block (6) connecting radiator, and the bottom surface of described bowl shape groove (5) is additionally provided with two electrode contacts
(7), it is provided with the insulating barrier (8) that heat-conducting block (6) and electrode contacts (7) are separated in described led support (1), described led chip sets
Put the bottom surface in bowl shape groove (5), described heat sink (3) are located at heat-conducting block top and are contacted with heat-conducting block (6), described led master
The electrode (4) of body (2) both sides is electrically connected with two electrode contacts (7) respectively.
2. a kind of thermoelectricity according to claim 1 separate led it is characterised in that: described radiator includes heat sink (9),
Described heat sink (9) lower surface is provided with several radiating fins (10), and radiating fin (10) is perpendicular with heat sink (9), described
Radiating fin (10) is provided with several the first louvres (11).
3. a kind of thermoelectricity according to claim 2 separate led it is characterised in that: described heat sink (9) is provided with several
Second louvre (12).
4. a kind of thermoelectricity according to claim 3 separate led it is characterised in that: described first louvre (11) and second
Louvre (12) is all horizontally disposed through hole.
5. a kind of thermoelectricity according to claim 1 or 2 or 3 or 4 separate led it is characterised in that: set on described heat sink (3)
There is heat-conducting cream.
6. a kind of thermoelectricity according to claim 1 or 2 or 3 or 4 separate led it is characterised in that: described bowl shape groove
(5) top is provided with ring-shaped step (13).
7. a kind of thermoelectricity according to claim 6 separate led it is characterised in that: be provided with described bowl shape groove (5)
Bright colloid layer (14), is provided with low reflective colloid layer (15) in the cavity that described ring-shaped step (13) surrounds.
8. a kind of thermoelectricity according to claim 7 separate led it is characterised in that: described low reflective colloid layer (15) upper
Surface irregularity.
9. a kind of thermoelectricity according to claim 8 separate led it is characterised in that: described low reflective colloid layer (15) upper
Undulate on surface microscopic.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610785404.5A CN106338011A (en) | 2016-08-31 | 2016-08-31 | LED with heat and electricity separation |
Applications Claiming Priority (1)
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---|---|---|---|
CN201610785404.5A CN106338011A (en) | 2016-08-31 | 2016-08-31 | LED with heat and electricity separation |
Publications (1)
Publication Number | Publication Date |
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CN106338011A true CN106338011A (en) | 2017-01-18 |
Family
ID=57822357
Family Applications (1)
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CN201610785404.5A Pending CN106338011A (en) | 2016-08-31 | 2016-08-31 | LED with heat and electricity separation |
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110000001A (en) * | 2009-06-24 | 2011-01-03 | 주식회사 이그잭스 | A led array board and a preparing method therefor |
CN102130268A (en) * | 2010-01-19 | 2011-07-20 | 富士迈半导体精密工业(上海)有限公司 | Solid-state light-emitting component and light source module |
WO2011136404A1 (en) * | 2010-04-28 | 2011-11-03 | 주식회사 웨이브닉스이에스피 | Photonic device package module and manufacturing method thereof |
CN202056669U (en) * | 2011-03-31 | 2011-11-30 | 陈希林 | Led street lamp |
CN102354725A (en) * | 2011-10-29 | 2012-02-15 | 华南师范大学 | High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material |
CN103148411A (en) * | 2013-02-05 | 2013-06-12 | 毕振华 | Energy-saving explosion-proof LED (light emitting diode) lamp for mines |
CN104100951A (en) * | 2014-08-05 | 2014-10-15 | 东莞市闻誉实业有限公司 | Combined radiator |
CN204372746U (en) * | 2015-01-16 | 2015-06-03 | 浙江紫金光伏科技有限公司 | A kind of LED street lamp radiator |
CN105042544A (en) * | 2015-08-31 | 2015-11-11 | 江苏翠钻照明有限公司 | Heat dissipation device for LED lamp |
CN205065472U (en) * | 2015-10-19 | 2016-03-02 | 天津天新世纪照明工程有限公司 | A superconductive aluminium base board of thermoelectric separation for projecting lamp |
CN105627196A (en) * | 2016-02-17 | 2016-06-01 | 苏州佳亿达电器有限公司 | Efficient radiating LED street lamp |
CN105684170A (en) * | 2013-08-09 | 2016-06-15 | 株式会社光波 | Light emitting device |
CN206116456U (en) * | 2016-08-31 | 2017-04-19 | 长兴友畅电子有限公司 | LED of thermoelectric separation encapsulation |
-
2016
- 2016-08-31 CN CN201610785404.5A patent/CN106338011A/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110000001A (en) * | 2009-06-24 | 2011-01-03 | 주식회사 이그잭스 | A led array board and a preparing method therefor |
CN102130268A (en) * | 2010-01-19 | 2011-07-20 | 富士迈半导体精密工业(上海)有限公司 | Solid-state light-emitting component and light source module |
WO2011136404A1 (en) * | 2010-04-28 | 2011-11-03 | 주식회사 웨이브닉스이에스피 | Photonic device package module and manufacturing method thereof |
CN202056669U (en) * | 2011-03-31 | 2011-11-30 | 陈希林 | Led street lamp |
CN102354725A (en) * | 2011-10-29 | 2012-02-15 | 华南师范大学 | High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material |
CN103148411A (en) * | 2013-02-05 | 2013-06-12 | 毕振华 | Energy-saving explosion-proof LED (light emitting diode) lamp for mines |
CN105684170A (en) * | 2013-08-09 | 2016-06-15 | 株式会社光波 | Light emitting device |
CN104100951A (en) * | 2014-08-05 | 2014-10-15 | 东莞市闻誉实业有限公司 | Combined radiator |
CN204372746U (en) * | 2015-01-16 | 2015-06-03 | 浙江紫金光伏科技有限公司 | A kind of LED street lamp radiator |
CN105042544A (en) * | 2015-08-31 | 2015-11-11 | 江苏翠钻照明有限公司 | Heat dissipation device for LED lamp |
CN205065472U (en) * | 2015-10-19 | 2016-03-02 | 天津天新世纪照明工程有限公司 | A superconductive aluminium base board of thermoelectric separation for projecting lamp |
CN105627196A (en) * | 2016-02-17 | 2016-06-01 | 苏州佳亿达电器有限公司 | Efficient radiating LED street lamp |
CN206116456U (en) * | 2016-08-31 | 2017-04-19 | 长兴友畅电子有限公司 | LED of thermoelectric separation encapsulation |
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Application publication date: 20170118 |
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RJ01 | Rejection of invention patent application after publication |