[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN106328251A - Thick film resistor paste and preparation method thereof - Google Patents

Thick film resistor paste and preparation method thereof Download PDF

Info

Publication number
CN106328251A
CN106328251A CN201610692353.1A CN201610692353A CN106328251A CN 106328251 A CN106328251 A CN 106328251A CN 201610692353 A CN201610692353 A CN 201610692353A CN 106328251 A CN106328251 A CN 106328251A
Authority
CN
China
Prior art keywords
parts
oxide
film resistor
resistor paste
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610692353.1A
Other languages
Chinese (zh)
Inventor
邱广茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lu Chuan County Huaxin Electronics Factory
Original Assignee
Lu Chuan County Huaxin Electronics Factory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lu Chuan County Huaxin Electronics Factory filed Critical Lu Chuan County Huaxin Electronics Factory
Priority to CN201610692353.1A priority Critical patent/CN106328251A/en
Publication of CN106328251A publication Critical patent/CN106328251A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

The invention provides thick film resistor paste which is prepared from the following raw materials in parts by weight: 16-31 parts of bismuth tungstate, 21-33 parts of palladium oxide, 12-17 parts of ruthenium dioxide, 3-7 parts of gallium arsenide, 0.06-1.9 parts of carbon powder, 11-33 parts of calcium oxide, 6-12 parts of silicon dioxide, 9-14 parts of aluminum oxide, 11-17 parts of barium sulfate, 2-5 parts of kieselguhr, 3-9 parts of glass fibers, 31-52 parts of ethyl cellulose, 12-17 parts of tributyl citrate, 7-12 parts of polyvinyl alcohol, 12-25 parts of perchloroethylene resin, 7-10 parts of chlorinated paraffin, 16-28 parts of ethyl carbitol acetate, 22-62 parts of inorganic pigments, 2-7 parts of polyethylene wax, 3-15 parts of solvents, 3-6 parts of dibutyl phthalate, 6-12 parts of diboron trioxide, 2-17 parts of zinc oxide, 0.6-5.8 parts of titanium dioxide, 3-9 parts of bismuth trioxide and 2-8 parts of silver-nickel alloy powder materials. The invention provides the thick film resistor paste. A test shows that the thick film resistor paste has excellent printability and insulativity; and the resistor paste is good in performance stability, high in resistance precision and good in reproducibility.

Description

A kind of thick-film resistor paste and preparation method thereof
Technical field
The invention belongs to resistance device technical field, particularly relate to a kind of thick-film resistor paste and preparation method thereof.
Background technology
Resistor is the components and parts that each class of electronic devices is indispensable, under the background of global economic crisis, and resistor factory Family rises, in the face of production cost, the dual-pressure declined with product price, and the fierce market competition is also in the profit constantly compressing producer Profit space.Although challenge sternness, but along with whole world consumer electronics, communication, automobile, computer and the military use product need to resistor Asking and be continuously increased, producer still has an optimistic view of industry development prospect in the industry.At present, China is in a leading position ground in world's resistor industry Position, the data of China Electronics Components Industry employer's organization show, within 2008, Chinese resistor total output is 708,000,000,000, relatively 2005 410,000,000,000 only jumbo increases, the most accounted for three one-tenth of whole world overall supplies.
Resistance slurry be one melt the multidisciplinary fields such as metallurgy, chemistry, physics, electronic technology, analysis and testing technology in Technology-intensive high-tech product all over the body.For adapting to printing, sintering process requires and application request, and he must possess can Printing, functional characteristic and processing compatibility.Conventional resistance slurry is by function phase, Binder Phase and organic carrier three part, The uniform suspension liquid of a kind of thickness mixed by a certain percentage.The most critical factor affecting resistance slurry electrical property is merit Energy phase constituent, in recent years, the selection to function phase constituent is constantly expanded, and the performance of resistance slurry also steps up.
Film resistor and thick-film resistor lead to becomes membrane resistance, and the two is mainly comes in terms of preparation technology and thicknesses of layers two Carry out distinguishing.Thick-film resistor is with resistance slurry as raw material, by silk screen printing, sprays and the thick-film technique such as sintering is by group Become electronic devices and components and the line thereof of circuit, make, with the form of thick film, the integrated circuit constituted on an insulating substrate.Film Thickness is generally several to tens microns, thicker than thin film.Thick-film resistor includes traditional charcoal-epoxy resin thick-film resistor, gold Belong to organic compound thick-film resistor and polymer thick film resistor etc..Function in thick-film resistor material mostly is mutually to have and well leads Electrically and the metal of heat stability or Inorganic Non-metallic Materials, inorganic bond mainly various insulating properties and manufacturability mutually is excellent Glass or resin, conductive particle is bonded on substrate by he, makes thick-film resistor have required mechanical performance and electrical property.
Summary of the invention
For solving the technical problem of above-mentioned existence, the present invention provides a kind of thick-film resistor paste and preparation method thereof.
Technical scheme is as follows:
A kind of thick-film resistor paste, raw material forms according to following portion rate:
Bismuth tungstate 16-31 part, Palladium monoxide 21-33 part, ruthenic oxide 12-17 part, GaAs 3-7 part, carbon dust 0.06-1.9 part, oxygen Change calcium 11-33 part, silicon dioxide 6-12 part, aluminium sesquioxide 9-14 part, barium sulfate 11-17 part, kieselguhr 2-5 part, glass fibers Dimension 3-9 part, ethyl cellulose 31-52 part, tributyl citrate 12-17 part, polyvinyl alcohol 7-12 part, superchlorinated polyvinyl chloride resin 12- 25 parts, chlorinated paraffin 7-10 part, ethyl carbitol amyl acetate 16-28 part, inorganic pigment 22-62 part, Tissuemat E 2-7 part, molten Agent 3-15 part, dibutyl phthalate (DBP) 3-6 part, diboron trioxide 6-12 part, zinc oxide 2-17 part, titanium dioxide 0.6-5.8 Part, bismuth oxide 3-9 part, silver-nickel powder body material 2-8 part.
Further illustrating, described a kind of thick-film resistor paste, raw material forms according to following portion rate:
Bismuth tungstate 19 parts, Palladium monoxide 23 parts, ruthenic oxide 15 parts, GaAs 5 parts, carbon dust 0.9 part, calcium oxide 13 parts, titanium dioxide Silicon 11 parts, aluminium sesquioxide 12 parts, 15 parts of barium sulfate, 4 parts of kieselguhr, glass fibre 7 parts, ethyl cellulose 32 parts, citric acid Tributyl 16 parts, polyvinyl alcohol 11 parts, superchlorinated polyvinyl chloride resin 15 parts, chlorinated paraffin 8 parts, ethyl carbitol amyl acetate 18 parts, nothing Machine pigment 24 parts, Tissuemat E 6 parts, solvent 7 parts, dibutyl phthalate (DBP) 5 parts, diboron trioxide 11 parts, zinc oxide 14 parts, Titanium dioxide 0.8 part, bismuth oxide 8 parts, silver-nickel powder body material 6 parts.
Further illustrate, the preparation method of described a kind of thick-film resistor paste, comprise the steps:
(1) diboron trioxide, zinc oxide, titanium dioxide, bismuth oxide, bismuth tungstate, Palladium monoxide, ruthenic oxide, silver nickel are closed Gold powder material and GaAs, as in ball grinder, carry out ball milling activation with dehydrated alcohol for ball-milling medium, and mix grinding uniformly and is controlled Mean diameter processed, in 1-5 μ m, is subsequently adding water-bath at carbon dust, 80-100 DEG C and dries, and grinding distribution;
(2) step (1) scattered mixed powder being placed in chamber type electric resistance furnace sintering, controlling heating rate is 15-35 DEG C/min, rises Temperature, to 650-900 DEG C, is incubated 4-6h;It is cooled to room temperature, standby;
(3) by after calcium oxide, silicon dioxide, aluminium sesquioxide, barium sulfate, kieselguhr, glass fibre mix homogeneously at Si-Mo rod Melting in cabinet-type electric furnace, is subsequently poured in cold water, and shrend is placed in ball grinder, carries out ball milling with distilled water for ball-milling medium, After ball milling glass dust, sucking filtration, dry, disperse standby;
(4) by ethyl cellulose, tributyl citrate, polyvinyl alcohol, superchlorinated polyvinyl chloride resin, chlorinated paraffin, ethyl carbitol vinegar Acid fat, inorganic pigment, Tissuemat E, solvent, dibutyl phthalate (DBP) mix homogeneously, and add step (2) and step (3) system Material, dispersed with stirring to 10um and following, then filter through 210-260 eye mesh screen, obtain a kind of thick-film resistor through three-roll rolling Slurry.
The silver alloy that nickel is made is added in silver.Add a small amount of nickel can with crystal grain thinning, improve silver hardness, wearability and Anti-scorching ability, contact resistance also has increased slightly.Owing to silver and nickel can not dissolve each other, prepare by powder metallurgic method, general nickel content 5%~40%.Silver-nickel electric contact material has good electric conductivity and heat conductivity, and anti-metal transfer, electrical arc erosion, electricity are invaded The abilities such as erosion are relatively strong, and wearability is good, and intensity is high, and has good ductility and machining ability, and contact resistance is higher than silver, silver The physical property of nickel alloy is shown in Table.Prepare that silver-nickel in the past more uses chemical coprecipitation area method to obtain silver, nickel mixed-powder, after again Silver, nickel coated powder is made with chemical method.Chemical powdering general procedure is more complicated, and cost is the highest, along with the development of powder-making technique, In recent years use mechanical atomisation to prepare superfine powder more, then batch mixing, suppress, sinter, extrude, prepared performance silver nickel equally reliably Alloy.Having developed the most again silver, nickel spray powder and Mechanic Alloying Technology altogether, prepared material property is more excellent.At silver-nickel In can add a small amount of rare earth element and improve its performance.Silver-nickel is used in low-voltage electrical apparatus more.AgNi10 is used for below 20A A.C. contactor;AgNi (15~40) can bear bigger load.Silver-nickel is widely used in all kinds of as contact material Switch, controller, voltage regulator, chopper, electrical apparatus for vehicle use, magnetic starter etc..
Beneficial effects of the present invention is as follows:
The invention provides a kind of thick-film resistor paste, test proves that, its printing with excellence and excellent insulation Property, resistance slurry stability is good, resistance accuracy is high, and repeatability is good.The paste color wherein prepared can be white, black Color, yellow, green etc., it is possible to select suitable inorganic environment-friendly pigment as required.
Detailed description of the invention
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, Obviously, described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the reality in the present invention Execute example, the every other embodiment that field those of ordinary skill is obtained under not making creative work premise, broadly fall into The scope of protection of the invention.
Embodiment 1
A kind of thick-film resistor paste, raw material forms according to following portion rate:
Bismuth tungstate 16 parts, Palladium monoxide 21 parts, ruthenic oxide 12 parts, GaAs 3 parts, carbon dust 0.06 part, calcium oxide 11 parts, titanium dioxide Silicon 6 parts, aluminium sesquioxide 9 parts, 11 parts of barium sulfate, 2 parts of kieselguhr, glass fibre 3 parts, ethyl cellulose 31 parts, citric acid three Butyl ester 12 parts, polyvinyl alcohol 7 parts, superchlorinated polyvinyl chloride resin 12 parts, chlorinated paraffin 7 parts, ethyl carbitol amyl acetate 16 parts, inorganic face Expect 22 parts, Tissuemat E 2 parts, solvent 3 parts, dibutyl phthalate (DBP) 3 parts, diboron trioxide 6 parts, zinc oxide 2 parts, titanium dioxide Titanium 0.6 part, bismuth oxide 3 parts.
The preparation method of described a kind of thick-film resistor paste, comprises the steps:
(1) diboron trioxide, zinc oxide, titanium dioxide, bismuth oxide, bismuth tungstate, Palladium monoxide, ruthenic oxide, silver nickel are closed Gold powder material and GaAs, as in ball grinder, carry out ball milling activation with dehydrated alcohol for ball-milling medium, and mix grinding uniformly and is controlled Mean diameter processed, in 1 μ m, is subsequently adding carbon dust, and at 80 DEG C, water-bath is dried, and grinding distribution;
(2) step (1) scattered mixed powder being placed in chamber type electric resistance furnace sintering, controlling heating rate is 15 DEG C/min, heats up To 650 DEG C, it is incubated 4h;It is cooled to room temperature, standby;
(3) by after calcium oxide, silicon dioxide, aluminium sesquioxide, barium sulfate, kieselguhr, glass fibre mix homogeneously at Si-Mo rod Melting in cabinet-type electric furnace, is subsequently poured in cold water, and shrend is placed in ball grinder, carries out ball milling with distilled water for ball-milling medium, After ball milling glass dust, sucking filtration, dry, disperse standby;
(4) by ethyl cellulose, tributyl citrate, polyvinyl alcohol, superchlorinated polyvinyl chloride resin, chlorinated paraffin, ethyl carbitol vinegar Acid fat, inorganic pigment, Tissuemat E, solvent, dibutyl phthalate (DBP) mix homogeneously, and add step (2) and step (3) system Material, dispersed with stirring to 10um and following, then filter through 210 eye mesh screens, obtain a kind of thick-film resistor paste through three-roll rolling.
Embodiment 2
A kind of thick-film resistor paste, raw material forms according to following portion rate:
Bismuth tungstate 31 parts, Palladium monoxide 33 parts, ruthenic oxide 17 parts, GaAs 7 parts, carbon dust 1.9 parts, calcium oxide 33 parts, titanium dioxide Silicon 12 parts, aluminium sesquioxide 14 parts, 17 parts of barium sulfate, 5 parts of kieselguhr, glass fibre 9 parts, ethyl cellulose 52 parts, citric acid Tributyl 17 parts, polyvinyl alcohol 12 parts, superchlorinated polyvinyl chloride resin 25 parts, chlorinated paraffin 10 parts, ethyl carbitol amyl acetate 28 parts, nothing Machine pigment 62 parts, Tissuemat E 7 parts, solvent 15 parts, dibutyl phthalate (DBP) 6 parts, diboron trioxide 12 parts, zinc oxide 17 Part, titanium dioxide 5.8 parts, bismuth oxide 9 parts.
The preparation method of described a kind of thick-film resistor paste, comprises the steps:
(1) diboron trioxide, zinc oxide, titanium dioxide, bismuth oxide, bismuth tungstate, Palladium monoxide, ruthenic oxide, silver nickel are closed Gold powder material and GaAs, as in ball grinder, carry out ball milling activation with dehydrated alcohol for ball-milling medium, and mix grinding uniformly and is controlled Mean diameter processed, in 5 μ m, is subsequently adding carbon dust, and at 100 DEG C, water-bath is dried, and grinding distribution;
(2) step (1) scattered mixed powder being placed in chamber type electric resistance furnace sintering, controlling heating rate is 35 DEG C/min, heats up To 900 DEG C, it is incubated 6h;It is cooled to room temperature, standby;
(3) by after calcium oxide, silicon dioxide, aluminium sesquioxide, barium sulfate, kieselguhr, glass fibre mix homogeneously at Si-Mo rod Melting in cabinet-type electric furnace, is subsequently poured in cold water, and shrend is placed in ball grinder, carries out ball milling with distilled water for ball-milling medium, After ball milling glass dust, sucking filtration, dry, disperse standby;
(4) by ethyl cellulose, tributyl citrate, polyvinyl alcohol, superchlorinated polyvinyl chloride resin, chlorinated paraffin, ethyl carbitol vinegar Acid fat, inorganic pigment, Tissuemat E, solvent, dibutyl phthalate (DBP) mix homogeneously, and add step (2) and step (3) system Material, dispersed with stirring to 10um and following, then filter through 260 eye mesh screens, obtain a kind of thick-film resistor paste through three-roll rolling.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not by above-described embodiment Limit, the change made under other any spirit without departing from the present invention and principle, modify, substitute, combine, simplify, All should be the substitute mode of equivalence, within being included in protection scope of the present invention.

Claims (3)

1. a thick-film resistor paste, it is characterised in that raw material forms according to following portion rate:
Bismuth tungstate 16-31 part, Palladium monoxide 21-33 part, ruthenic oxide 12-17 part, GaAs 3-7 part, carbon dust 0.06-1.9 part, oxygen Change calcium 11-33 part, silicon dioxide 6-12 part, aluminium sesquioxide 9-14 part, barium sulfate 11-17 part, kieselguhr 2-5 part, glass fibers Dimension 3-9 part, ethyl cellulose 31-52 part, tributyl citrate 12-17 part, polyvinyl alcohol 7-12 part, superchlorinated polyvinyl chloride resin 12- 25 parts, chlorinated paraffin 7-10 part, ethyl carbitol amyl acetate 16-28 part, inorganic pigment 22-62 part, Tissuemat E 2-7 part, molten Agent 3-15 part, dibutyl phthalate (DBP) 3-6 part, diboron trioxide 6-12 part, zinc oxide 2-17 part, titanium dioxide 0.6-5.8 Part, bismuth oxide 3-9 part, silver-nickel powder body material 2-8 part.
A kind of thick-film resistor paste the most according to claim 1, it is characterised in that raw material is according to following portion rate group Become: bismuth tungstate 19 parts, Palladium monoxide 23 parts, ruthenic oxide 15 parts, GaAs 5 parts, carbon dust 0.9 part, calcium oxide 13 parts, silicon dioxide 11 parts, aluminium sesquioxide 12 parts, 15 parts of barium sulfate, 4 parts of kieselguhr, glass fibre 7 parts, ethyl cellulose 32 parts, citric acid three Butyl ester 16 parts, polyvinyl alcohol 11 parts, superchlorinated polyvinyl chloride resin 15 parts, chlorinated paraffin 8 parts, ethyl carbitol amyl acetate 18 parts, inorganic Pigment 24 parts, Tissuemat E 6 parts, solvent 7 parts, dibutyl phthalate (DBP) 5 parts, diboron trioxide 11 parts, zinc oxide 14 parts, two Titanium oxide 0.8 part, bismuth oxide 8 parts, silver-nickel powder body material 6 parts.
The preparation method of a kind of thick-film resistor paste the most according to claim 1, it is characterised in that comprise the steps:
(1) diboron trioxide, zinc oxide, titanium dioxide, bismuth oxide, bismuth tungstate, Palladium monoxide, ruthenic oxide, silver nickel are closed Gold powder material and GaAs, as in ball grinder, carry out ball milling activation with dehydrated alcohol for ball-milling medium, and mix grinding uniformly and is controlled Mean diameter processed, in 1-5 μ m, is subsequently adding water-bath at carbon dust, 80-100 DEG C and dries, and grinding distribution;
(2) step (1) scattered mixed powder being placed in chamber type electric resistance furnace sintering, controlling heating rate is 15-35 DEG C/min, rises Temperature, to 650-900 DEG C, is incubated 4-6h;It is cooled to room temperature, standby;
(3) by after calcium oxide, silicon dioxide, aluminium sesquioxide, barium sulfate, kieselguhr, glass fibre mix homogeneously at Si-Mo rod Melting in cabinet-type electric furnace, is subsequently poured in cold water, and shrend is placed in ball grinder, carries out ball milling with distilled water for ball-milling medium, After ball milling glass dust, sucking filtration, dry, disperse standby;
(4) by ethyl cellulose, tributyl citrate, polyvinyl alcohol, superchlorinated polyvinyl chloride resin, chlorinated paraffin, ethyl carbitol vinegar Acid fat, inorganic pigment, Tissuemat E, solvent, dibutyl phthalate (DBP) mix homogeneously, and add step (2) and step (3) system Material, dispersed with stirring to 10um and following, then filter through 210-260 eye mesh screen, obtain a kind of thick-film resistor through three-roll rolling Slurry.
CN201610692353.1A 2016-08-18 2016-08-18 Thick film resistor paste and preparation method thereof Pending CN106328251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610692353.1A CN106328251A (en) 2016-08-18 2016-08-18 Thick film resistor paste and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610692353.1A CN106328251A (en) 2016-08-18 2016-08-18 Thick film resistor paste and preparation method thereof

Publications (1)

Publication Number Publication Date
CN106328251A true CN106328251A (en) 2017-01-11

Family

ID=57744601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610692353.1A Pending CN106328251A (en) 2016-08-18 2016-08-18 Thick film resistor paste and preparation method thereof

Country Status (1)

Country Link
CN (1) CN106328251A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396467A (en) * 2017-08-03 2017-11-24 合肥市大卓电力有限责任公司 A kind of environment-friendly type resistance slurry and preparation method thereof
CN108550418A (en) * 2018-05-18 2018-09-18 苏州天鸿电子有限公司 A kind of thick-film resistor paste
CN110504075A (en) * 2017-10-23 2019-11-26 潮州三环(集团)股份有限公司 A kind of Standard resistance range is 10k Ω/ ~ 100k Ω/ thick-film resistor paste and preparation method thereof
CN112992405A (en) * 2021-04-27 2021-06-18 西安宏星电子浆料科技股份有限公司 High-pressure-resistant and bending-resistant stainless steel substrate insulating medium slurry
CN113393955A (en) * 2021-08-13 2021-09-14 西安宏星电子浆料科技股份有限公司 LTCC co-fired matching type resistance paste
CN114735944A (en) * 2022-06-10 2022-07-12 南通广欣玻璃有限公司 Optical glass coated with nano material on surface and preparation method thereof
GB2608618A (en) * 2021-07-06 2023-01-11 Ferro Techniek Bv Thick film heating element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118427A (en) * 1999-10-21 2001-04-27 Murata Mfg Co Ltd Thick film electrode paste
CN102800447A (en) * 2012-07-26 2012-11-28 彩虹集团公司 Dielectric paste for thick-film-type resistor and preparation method of dielectric paste
CN105139916A (en) * 2015-06-30 2015-12-09 苏州洋杰电子有限公司 Carbon powder doped molybdenum-based thick film resistance paste and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118427A (en) * 1999-10-21 2001-04-27 Murata Mfg Co Ltd Thick film electrode paste
CN102800447A (en) * 2012-07-26 2012-11-28 彩虹集团公司 Dielectric paste for thick-film-type resistor and preparation method of dielectric paste
CN105139916A (en) * 2015-06-30 2015-12-09 苏州洋杰电子有限公司 Carbon powder doped molybdenum-based thick film resistance paste and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
河南省电力公司新乡供电公司: "《SF6密度继电器校验及维修》", 30 November 2011 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396467A (en) * 2017-08-03 2017-11-24 合肥市大卓电力有限责任公司 A kind of environment-friendly type resistance slurry and preparation method thereof
CN110504075A (en) * 2017-10-23 2019-11-26 潮州三环(集团)股份有限公司 A kind of Standard resistance range is 10k Ω/ ~ 100k Ω/ thick-film resistor paste and preparation method thereof
CN110504075B (en) * 2017-10-23 2021-04-23 潮州三环(集团)股份有限公司 Thick film resistor paste with resistance value range of 10k omega/□ -100 k omega/□ and preparation method thereof
CN108550418A (en) * 2018-05-18 2018-09-18 苏州天鸿电子有限公司 A kind of thick-film resistor paste
CN112992405A (en) * 2021-04-27 2021-06-18 西安宏星电子浆料科技股份有限公司 High-pressure-resistant and bending-resistant stainless steel substrate insulating medium slurry
CN112992405B (en) * 2021-04-27 2021-10-08 西安宏星电子浆料科技股份有限公司 High-pressure-resistant and bending-resistant stainless steel substrate insulating medium slurry
GB2608618A (en) * 2021-07-06 2023-01-11 Ferro Techniek Bv Thick film heating element
GB2608618B (en) * 2021-07-06 2024-11-06 Ferro Techniek Bv Thick film heating element
CN113393955A (en) * 2021-08-13 2021-09-14 西安宏星电子浆料科技股份有限公司 LTCC co-fired matching type resistance paste
CN113393955B (en) * 2021-08-13 2021-11-16 西安宏星电子浆料科技股份有限公司 LTCC co-fired matching type resistance paste
CN114735944A (en) * 2022-06-10 2022-07-12 南通广欣玻璃有限公司 Optical glass coated with nano material on surface and preparation method thereof

Similar Documents

Publication Publication Date Title
CN106328251A (en) Thick film resistor paste and preparation method thereof
CN105873248B (en) A kind of heating film low-temperature sintering slurry and preparation method thereof
CN101377966B (en) Preparation method of lead-free silver electrode paste for glass substrate
KR100253633B1 (en) Gas sensor and its manufacturing method
CN106683746B (en) Plate resistor face electrode silver plasm and preparation method thereof
CN101770829B (en) Special silver electrode paste for touch screen and preparation method thereof
JPS6035405A (en) Copper conductor composition
CN109637695A (en) A kind of high-performance thick-film resistor paste composition
CN107274965A (en) Electric slurry and its manufacture method based on low-melting-point metal micro-nano powder
CN103559937A (en) Low silver content paste composition and method of making a conductive film therefrom
CN113643869B (en) High-stability resistor paste for thick-film resistor
CN101872653A (en) Nano silver conductive paste and preparation method thereof
CN102723142A (en) Preparation method of nickel-based silver conductive slurry
CN101950598A (en) Conductor pulp for printed circuit board and preparation method thereof
CN105139916B (en) Carbon dust doping molybdenio thick-film resistor paste and preparation method thereof
CN115359947A (en) Preparation method of inner electrode silver paste for chip ZnO piezoresistor
CN108117665A (en) Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof
CN103413591B (en) A kind of paster fuse fuse-link electric slurry and preparation method thereof
CN105761775A (en) Conductive silver paste for on-chip inductor external electrode and preparation method of conductive silver paste
CN112309608A (en) Heterochrosis-resistant low-temperature conductive silver paste and preparation method thereof
CN114464339B (en) Conductive gold paste, preparation method thereof and application of conductive gold paste in NTC (negative temperature coefficient) thermosensitive chip
CN104320866A (en) Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof
CN107567115A (en) A kind of doping type YBCO conductive ceramic compositions, resistance slurry, porous ceramic matrix heater and its application
CN102651247A (en) Novel conductive sizing agent for front-electrode of solar photovoltaic cell
EP0291064B1 (en) Conductive paste composition

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170111

WD01 Invention patent application deemed withdrawn after publication