CN106219482B - The sealing-in device and method for sealing of a kind of micro-fluidic chip - Google Patents
The sealing-in device and method for sealing of a kind of micro-fluidic chip Download PDFInfo
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- CN106219482B CN106219482B CN201610644980.8A CN201610644980A CN106219482B CN 106219482 B CN106219482 B CN 106219482B CN 201610644980 A CN201610644980 A CN 201610644980A CN 106219482 B CN106219482 B CN 106219482B
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- fluidic chip
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- inching gear
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims abstract description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000033001 locomotion Effects 0.000 claims abstract description 10
- 238000005194 fractionation Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 23
- 238000002474 experimental method Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- -1 methylsiloxane Chemical class 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 21
- 239000010408 film Substances 0.000 description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 21
- 238000011160 research Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007853 buffer solution Substances 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses the sealing-in device and its method for sealing of a kind of micro-fluidic chip.Accurate guide frame part is fixedly mounted on substrate in corresponding align member by fastener；Micro-fluidic chip is placed after one layer of polydimethylsiloxanefilm film is laminated with the substrate；The polydimethylsiloxanefilm film of the second layer is laminated with the micro-fluidic chip；Clear hard cover board is placed in the polydimethylsiloxanefilm film of the second layer, and the clear hard cover board controls position and the direction of motion by the accurate guide frame part；Inching gear installation pedestal is installed on the end of the accurate guide frame part, and inching gear is installed in the inching gear installation pedestal.After assembling each device, inching gear decrement is set, Mobile state of going forward side by side adjustment, completes the high quality sealing-in of multidimensional micro-fluidic chip, and fractionation is convenient, and each device can be reused.
Description
Technical field
The present invention relates to micro fluidic chip technical field, and in particular to a kind of sealing-in device of micro-fluidic chip and sealing-in side
Method.
Background technology
The technology manipulated in micro channel systems to fluid is referred to as microflow control technique, using microflow control technique as core
The heart, by processing the microchannel of different circulation relationships, available for the analysis and research work in the field such as biology, chemistry, biomedicine,
It is with such logical implication, micro-fluidic chip can be referred to as into the microchannel chip system of row information transmission.
The bonding sealing-in process of micro-fluidic chip can be generally divided into two kinds：Irreversible bonding sealing-in and reversible keying envelope
Connect.Irreversible bonding sealing-in reliability is high, sealing-in uniformity is good, of high cost, experiment parameter is immutable, and reversible keying sealing-in into
This is low, can be recycled, can carry out that multi-parameter experiment, reliability be low, lack of homogeneity.In existing all bonding sealing-in schemes
It is uncontrollable to the intensity and pressure of PDMS (Polydimethylsiloxane, dimethyl silicone polymer) material binds sealing-in,
Too small bonding sealing strength can cause the generation of leakage, and excessive bonding sealing strength then proposes more front end fluid driving forces
Big requirement, and the driving pressure of bigger causes rear end bonding sealing-in and the reliability of pipeline sealing to reduce.It is in conclusion micro-
The existing bonding method for sealing of fluidic chip, can not ensure high reliability and uniformly bonding sealing-in effect while realize it is low into
Originally multiple parameters experiment, is recycled and be carried out at the same time, can not meet the needs of scientific research.
With further going deep into for scientific research, one-dimensional microflow controlled chip cannot be met the requirements, multiple dimension logic relation
Circulation passage certainly will become micro-fluidic chip developing direction.Multidimensional separating micro-fluidic chip using more-dimensional channels is a kind of
Novel chip, can be integrated different separation methods, build multidimensional piece-rate system, for the separation analysis to complex sample.
In multidimensional piece-rate system, the Interface design between different dimensions separation is the key technology of piece-rate system, specifically, in multidimensional
In piece-rate system, the separated control of different dimensions and switching need to realize by pneumatic micro valve.Pneumatic micro valve is in active valve
One kind, microfluid is controlled by the use of external compressed gas (or negative pressure) as drive force micro-valve, and pneumatic micro-
Valve is that most micro-valves is applied on micro-fluidic chip, and reliability, the uniformity of para-linkage and sealing-in propose the requirement of higher, and
Tradition bonding method for sealing cannot expire the demand of scientific research, it is necessary to a set of Gao Jian dedicated for complicated micro-fluidic chip
Close sealing-in success rate, sealing-in pressure uniform, controllable, low cost, reusable sealing-in device and method for sealing.
The content of the invention
In view of this, can it is an object of the invention to provide the sealing-in device and method for sealing of a kind of micro-fluidic chip
Sealing-in is carried out to multi-dimensional complicated micro-fluidic chip, is ensureing high sealing-in quality and success rate, and sealing-in pressure is uniformly adjustable, can fit
While sealing-in for the micro-fluidic chip of different size, it can be used with circulating repetition.
To achieve the above object, the embodiment of the present invention provides a kind of sealing-in device of micro-fluidic chip, includes substrate, PDMS
Film, accurate guide frame part, clear hard cover board, fastener, inching gear installation pedestal and inching gear；The precision is led
It is fixedly mounted to structural member by the fastener in corresponding align member on the substrate；One is laminated with the substrate
The micro-fluidic chip is placed after the layer PDMS film；The PDMS that the second layer is laminated with the micro-fluidic chip is thin
Film；The clear hard cover board is placed on the PDMS film of the second layer, and the clear hard cover board is led by the precision
Position and the direction of motion are controlled to structural member；The inching gear installation pedestal is installed on the end of the accurate guide frame part
End, the inching gear are installed in the inching gear installation pedestal.
Specifically, the inching gear is superfine screw thread actuator lever or piezoelectric ceramics actuator.
Alternatively, the accurate guide frame is dovetail pair, screw thread pair, ball-screw, more bar combined mechanisms, Precision Machining
One of guide rail
Specifically, the substrate has flatness, the depth of parallelism and verticality requirement, coordinates with the accurate guide frame part
Align member has tolerance dimension requirement.
Specifically, the clear hard cover board is made of rigid transparent material, has flatness, the depth of parallelism and verticality will
Ask, have tolerance dimension requirement with the align member of the cooperation of the accurate guide frame part.
Specifically, it is both provided with micro-fluidic chip gas interface on the clear hard cover board and the substrate, liquid connects
Mouthful and electrical interface, micro-fluidic chip gas interface, liquid on the clear hard cover board of different size and the substrate
The specification of interface and electrical interface, quantity and layout are different, can according to the channel layouts of different micro-fluidic chips and/or
Experiment needs are replaced, or are customized according to the demand and/or experiment needs of certain microfluidic control chip.
Specifically, coating film treatment is passed through on the surface of the clear hard cover board.
The embodiment of the present invention also provides a kind of method for sealing of micro-fluidic chip, and this method comprises the following steps：
Step 1. assembles sealing-in device：Accurate guide frame part is fixedly mounted on corresponding positioning on substrate by fastener
In component, micro-fluidic chip is placed in and is laminated with the substrate of one layer of PDMS film, is laminated on the micro-fluidic chip
Two layers of PDMS film, clear hard cover board is capped on the second layer PDMS film, and the clear hard cover board passes through institute
Accurate guide frame part is stated to control position and the direction of motion, inching gear installation pedestal is installed on the accurate guide frame
End, inching gear are installed in the inching gear installation pedestal, and since then, whole sealing-in device is in what basic assembling finished
State；
Step 2. parameter setting and initial adjusting：According to selected or design the inching gear characteristic, to described micro-
Dynamic device carries out synchronization of returning to zero/adjust, and drives pressure size according to the passage depth, front end fluid in selected micro-fluidic chip
Etc. the decrement that factor sets the inching gear, and it is compressed；
Step 3. dynamic debugging：By required gas exterior connector, liquid external connector and electric joint outer part
The micro-fluidic chip is accessed by corresponding gas interface, fluidic interface and electrical interface, liquid channel system is opened, enters in liquid
Experiment liquid, titer are supplied at mouthful (such as：Buffer solution, eluent) etc., it is according to the micro-fluidic chip after pre- sealing-in
No leakage, the compression for feedback states the adjust in real time inching gear such as whether the micro-fluidic chip outlet liquid stream speed normal
Amount, if flow rate of liquid change is small in the micro-fluidic chip, the micro-fluidic chip No leakage, then reach optimum Working；
Afterwards, air-channel system to be opened, adjusts the inching gear so that pneumatic micro valve can be normally opened and closed, that is, be operated in optimum state,
After adjustment, the inching gear self-locking.
By above three step, the sealing-in to the micro-fluidic chip is completed, so as to carry out subsequent experimental work.
Specifically, by way of reversely adjusting the decrement of the inching gear, the micro- of sealing-in can quickly be split
Fluidic chip, and micro-fluidic chip after the fractionation and the sealing-in device can be reused.
From the above it can be seen that sealing-in device and the method for sealing behaviour of micro-fluidic chip provided in an embodiment of the present invention
Make simplicity, method for sealing step is simple, may be reused, and sealing-in pressure is uniformly adjustable, and sealing-in quality is high, while sealing-in device
In inching gear decrement it is adjustable, be applicable to the sealing-in of the micro-fluidic chip of different size.In addition, in sealing-in device
Clear hard cover board and substrate can be replaced according to demand, also can be according to the needs or reality of certain microfluidic control chip
The demand of testing is customized, to meet the sealing-in demand of multidimensional separating micro-fluidic chip.
Brief description of the drawings
Fig. 1 (a) is the front view of the sealing-in device of micro-fluidic chip of the embodiment of the present invention, and Fig. 1 (b) is the embodiment of the present invention
The top view of the sealing-in device of micro-fluidic chip；
Fig. 2 is the flow chart of the method for sealing of the micro-fluidic chip of the embodiment of the present invention.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention
The non-equal entity of a same names or non-equal parameter, it is seen that " first " " second " should not only for the convenience of statement
The restriction to the embodiment of the present invention is interpreted as, following embodiment no longer illustrates this one by one.
It is the front view of the sealing-in device of micro-fluidic chip of the embodiment of the present invention as shown in Fig. 1 (a), as shown in Fig. 1 (b),
For the top view of the sealing-in device of micro-fluidic chip of the embodiment of the present invention.The sealing-in device of the micro-fluidic chip includes micro-fluidic
Chip 1, clear hard cover board 2, substrate 3, inching gear 4, accurate guide frame part 5, fastener 7, inching gear installation pedestal
8th, PDMS film 9.Specifically, accurate guide frame part 5 is fixedly mounted by fastener 7 in align member on the substrate 3, base
One layer of PDMS film 9 is laminated with plate 3, micro-fluidic chip 1 is placed on PDMS film 9, and second is laminated with micro-fluidic chip 1
Layer PDMS film 9, clear hard cover board 2 are placed on the second layer PDMS film 9, and clear hard cover board 2 passes through the precision
Guide frame part 5 controls position and the direction of motion, and inching gear installation pedestal 8 is installed on accurate 5 end of guide frame part, micro-
Dynamic device 4 is installed in the inching gear installation pedestal 8.
The clear hard cover board 2 of the embodiment of the present invention is used to perform course of exerting pressure, pressure is uniformly applied to it is transparent hard
On the PDMS film 9 that matter cover board 2 contacts, and pass to micro-fluidic chip 1；Meanwhile clear hard cover board 2 also acts as watch window
Effect, for observing the working condition of the micro-fluidic chip 1, and the fluorescence that is produced in the observation micro-fluidic chip 1 and
Reaction result etc.；In addition, clear hard cover board 2 also has gas interface, fluidic interface and the electrical interface work(of micro-fluidic chip
Can, for installing corresponding gas exterior connector, liquid external connector and electric joint outer part.To sum up, clear hard
Cover board 2 should select rigid transparent material to be made, and have flatness, the depth of parallelism and verticality requirement, have tied with accurate be oriented to thereon
The align member that component 5 coordinates, to ensure the accuracy coordinated, the align member has tolerance dimension requirement；The present invention is implemented
In example, it is preferable that coating film treatment is passed through on 2 surface of clear hard cover board, for selecting through the particular light ray needed in experiment, filter
Unwanted veiling glare is removed, is so conducive to detection of the external system to small-signal；It is provided with clear hard cover board 2 for connecting
Connect corresponding gas exterior connector, the gas interface of liquid external connector and electric joint outer part, fluidic interface and
Electrical interface；Gas interface, fluidic interface and electrical interface layout, quantity and specification on the clear hard cover board 2 of different size
It is different, while 2 surface coating of clear hard cover board of different size is different, it is matched fixed with accurate guide frame part 5
The position of position component and size are also different, and the specification of clear hard cover board 2 can be replaced according to experiment needs, also being capable of root
It is customized according to the needs or experiment demand of certain microfluidic control chip.
The substrate 3 of the embodiment of the present invention is used to carry micro-fluidic chip 1 and PDMS film 9, which has flatness, puts down
Row degree and verticality requirement, are provided with the substrate 3 and the accurate 5 adaptable align member of guide frame part；In addition, institute
State and be additionally provided with substrate 3 for connecting corresponding gas exterior connector, liquid external connector and electric joint outer part
Gas interface, fluidic interface and electrical interface；Determine on the substrate 3 of different size with what the accurate guide frame part 5 was adapted
The position position of component and of different sizes, it is exterior for connecting corresponding gas exterior connector, liquid external connector and electricity
The gas interface of connector, the specification of fluidic interface and electrical interface, quantity and layout are also different, can be needed to carry out according to experiment
Replace, can be also customized according to the needs or experiment demand of certain microfluidic control chip.
Preferably, the inching gear 4 of the embodiment of the present invention selects the inching gear with auto-lock function as compressible drive
Device, applies pressure by providing small movements amount to clear hard cover board 2, and can be compressed according to accurate adjust is actually needed
Amount, thus ensure 2 uniform force of clear hard cover board and precisely it is controllable；After compression process is completed, by auto-lock function self-locking,
Ensure sealing-in quality.Alternatively, inching gear 4 can use superfine screw thread actuator lever or piezoelectric ceramics actuator etc..
The accurate guide frame part 5 of the embodiment of the present invention is used to determine the position of clear hard cover board 2 and limits transparent hard
The direction of motion of matter cover board 2, so as to ensure being uniformly distributed for sealing-in pressure.Provided in embodiment shown in Fig. 1 using accurate
Example of the guide rail of processing as accurate guide frame part 5, but the present invention is not limited to this.The accurate guide frame of the present invention
Part 5 can also use dovetail pair, screw thread pair, ball-screw and more bar combined mechanisms etc..For example, when secondary as accurate using dovetail
During guide frame part, four precision machined guide rails in Fig. 1 can be substituted with a dovetail is secondary, while other structures should be done accordingly
Adjustment.
6 cross section of runner in the micro-fluidic chip of the embodiment of the present invention is rectangle, but the present invention and should not be limited to
This, since the micro-channel layout of micro-fluidic chip is varied, therefore the cross section of the runner 6 in the micro-fluidic chip can be
Diamond shape, circle or other shapes.
Fastener 7 is used for realization the fastening connection between component, the connection of fastener 7 and other components in the embodiment of the present invention
Mode can be threaded connection, bonding and welding etc..
Inching gear installation pedestal 8 is used for realization the correct installation of inching gear 4 in the embodiment of the present invention, makes inching gear
The 4 compressible drive power provided are correctly transferred on clear hard cover board 2.
PDMS film 9 is used to carry out micro-fluidic chip 1 auxiliary sealing-in in the embodiment of the present invention, improve micro-fluidic chip with
The sealing-in reliability of sealing-in device contact interface, and the gas exterior connector to insertion, liquid external connector and electricity are outer
Portion's connector seals；PDMS film thickness is 50 microns to 1 millimeter in the present invention, it is preferable that the PDMS film thickness
For 50 microns.
As described above, the sealing-in device of the micro-fluidic chip based on the present invention is simple in structure, and it is easy to operate, it can repeat to make
With sealing-in pressure is uniformly adjustable, and sealing-in quality is high.
In addition, the embodiment of the present invention also provides a kind of method for sealing of micro-fluidic chip.As shown in Fig. 2, the method for sealing
Mainly include：
Step 11, sealing-in device is assembled：Accurate guide frame part 5 is fixedly mounted corresponding on the substrate 3 by fastener 7
In align member, micro-fluidic chip 1 is placed on the substrate 3 for being laminated with one layer of PDMS film 9, is laminated on micro-fluidic chip 1
Second layer PDMS film 9, is capped clear hard cover board 2, clear hard cover board 2 passes through essence on the second layer PDMS film 9
Close guide frame part 5 controls position and the direction of motion, and inching gear installation pedestal 8 is installed on the end of accurate guide frame 5,
Inching gear 4 is installed in the inching gear installation pedestal 8, and since then, whole sealing-in device is in the shape for assembling and finishing substantially
State；
Step 12, parameter setting and initial adjusting：According to selected or design inching gear characteristic, to inching gear 4
Carry out synchronization of returning to zero/adjust, and according to the passage depth, front end fluid driving pressure size etc. in selected micro-fluidic chip 1 because
Element sets the decrement of inching gear 4, and is compressed；
Step 13, dynamic debugging：By required gas exterior connector, liquid external connector and electric joint outer part
Micro-fluidic chip 1 is linked into by corresponding gas interface, fluidic interface and electrical interface, liquid channel system is opened, enters in liquid
Experiment liquid, titer are supplied at mouthful (such as：Buffer solution, eluent) etc., whether let out according to the micro-fluidic chip after pre- sealing-in
Leakage, the decrement for feedback states the adjust in real time inching gear 4 such as whether micro-fluidic chip outlet liquid stream speed normal, if micro-fluidic
Flow rate of liquid change is small in chip 1, and 1 No leakage of micro-fluidic chip, then reach optimum Working；Afterwards, air-channel system is opened,
Adjusting inching gear 4 so that pneumatic micro valve can be normally opened and closed, that is, be operated in optimum state, after adjustment, inching gear 4
Self-locking.
By three above-mentioned steps 11, step 12, step 13 steps, the sealing-in to micro-fluidic chip 1 is completed, so as to
It is normally carried out the subsequent experimental of micro-fluidic chip 1.
After the completion of experiment, by reversely adjusting the decrement of inching gear 4, the pressure of inching gear 4 is removed, can be quick
It is conveniently accomplished the fractionation of the micro-fluidic chip 1 of sealing-in.
The method for sealing step of micro-fluidic chip provided in an embodiment of the present invention is simple, easy to operate, passes through above three
Step can quickly and easily complete the sealing-in to micro-fluidic chip, and sealing-in process is reversible, and all components are reusable, energy
Enough meet the sealing-in demand of multidimensional micro-fluidic chip.
Those of ordinary skills in the art should understand that：The discussion of any of the above embodiment is exemplary only, not
It is intended to imply that the scope of the present disclosure (including claim) is limited to these examples；Under the thinking of the present invention, above example
Or can also be combined between the technical characteristic in different embodiments, step can be realized with random order, and be existed such as
Many other changes of the upper different aspect of the invention, for simplicity, they are not provided in details.
The embodiment of the present invention be intended to fall within the broad range of appended claims it is all it is such replace,
Modifications and variations.Therefore, within the spirit and principles of the invention, any omission, modification, equivalent substitution, the improvement made
Deng should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of sealing-in device of micro-fluidic chip, it is characterised in that led comprising substrate, polydimethylsiloxanefilm film, precision
To structural member, clear hard cover board, fastener, inching gear installation pedestal and inching gear；The precision guide frame part leads to
The fastener is crossed to be fixedly mounted in corresponding align member on the substrate；One layer described poly- two is laminated with the substrate
The micro-fluidic chip is placed after methylsiloxane film；The poly dimethyl of the second layer is laminated with the micro-fluidic chip
Siloxane film；The clear hard cover board is placed in the polydimethylsiloxanefilm film of the second layer, the clear hard
Cover board controls position and the direction of motion by the accurate guide frame part；The inching gear installation pedestal is installed on described
The end of accurate guide frame part, the inching gear are installed in the inching gear installation pedestal；
Micro-fluidic chip gas interface, fluidic interface and electricity are both provided with the clear hard cover board and the substrate to connect
Mouthful, micro-fluidic chip gas interface, fluidic interface and electricity on the clear hard cover board of different size and the substrate
The specification of interface, quantity and layout are different, can be needed according to the channel layout and/or experiment of different micro-fluidic chips into
Row is replaced, or is customized according to the demand and/or experiment needs of certain microfluidic control chip；The substrate and the clear hard
Cover board has flatness, the depth of parallelism and verticality requirement, and the align member coordinated with the accurate guide frame part has tolerance dimension
It is required that；The clear hard cover board is made of rigid transparent material.
2. the sealing-in device of micro-fluidic chip according to claim 1, it is characterised in that the inching gear is superfine spiral shell
Line actuator lever or piezoelectric ceramics actuator.
3. the sealing-in device of micro-fluidic chip according to claim 1, it is characterised in that the precision guide frame is swallow
One of tail pair, screw thread pair, ball-screw, more bar combined mechanisms and precision machined guide rail.
4. the sealing-in device of micro-fluidic chip according to claim 1, it is characterised in that the table of the clear hard cover board
Coating film treatment is passed through in face.
5. the sealing-in device of the micro-fluidic chip according to one of claim 1-4, it is characterised in that the poly dimethyl silicon
The thickness of oxygen alkane film is 50 microns to 1 millimeter.
6. a kind of method for sealing of micro-fluidic chip, it is characterised in that including three steps：
Assemble sealing-in device：Accurate guide frame part is fixedly mounted on substrate in corresponding align member by fastener, will be micro-
Fluidic chip, which is placed in, to be laminated with the substrate of one layer of polydimethylsiloxanefilm film, and second is laminated on the micro-fluidic chip
The polydimethylsiloxanefilm film of layer, is capped clear hard lid in the polydimethylsiloxanefilm film of the second layer
Plate, the clear hard cover board control position and the direction of motion, inching gear installation base by the accurate guide frame part
Seat is installed on the end of the accurate guide frame, and inching gear is installed in the inching gear installation pedestal, since then, entirely
Sealing-in device is in the state that assembling finishes；
Parameter setting and initial adjusting：According to it is selected or design the inching gear characteristic, to the inching gear into
Row zeroing and tune are synchronous, set the decrement of the inching gear, and be compressed；
Dynamic debugging：Required gas exterior connector, liquid external connector and electric joint outer part are passed through corresponding
Gas interface, fluidic interface and electrical interface access the micro-fluidic chip, liquid channel system and air-channel system are opened, according to described
The feedback states of micro-fluidic chip adjust the decrement of the inching gear so that micro-fluidic chip is operated in optimum state, adjusts
After whole, the inching gear self-locking.
7. the method for sealing of micro-fluidic chip according to claim 6, it is characterised in that by reversely adjusting the fine motion
The mode of the decrement of device, can quickly split the micro-fluidic chip of sealing-in, and micro-fluidic chip after the fractionation and
The sealing-in device can be reused.
8. the method for sealing of micro-fluidic chip according to claim 6, it is characterised in that in parameter setting and initial adjusting
In step, the inching gear is set according to the passage depth, front end fluid driving pressure size in selected micro-fluidic chip
Decrement.
9. the method for sealing of micro-fluidic chip according to claim 6, it is characterised in that in dynamic debugging step, institute
Stating the feedback states of micro-fluidic chip includes：Whether the micro-fluidic chip leaks, the liquid of the micro-fluidic chip liquid outlet
Whether body change in flow amplitude and pneumatic micro valve opening and closing are normal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610644980.8A CN106219482B (en) | 2016-08-08 | 2016-08-08 | The sealing-in device and method for sealing of a kind of micro-fluidic chip |
Applications Claiming Priority (1)
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| CN102120562B (en) * | 2010-11-09 | 2013-05-15 | 北京理工大学 | Auxiliary pressurizing device for chip bonding |
| JP5152361B2 (en) * | 2011-04-20 | 2013-02-27 | ウシオ電機株式会社 | Work bonding method and bonding apparatus |
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