CN106197537B - A kind of integrated passive wireless sensor of humiture - Google Patents
A kind of integrated passive wireless sensor of humiture Download PDFInfo
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- CN106197537B CN106197537B CN201610498970.8A CN201610498970A CN106197537B CN 106197537 B CN106197537 B CN 106197537B CN 201610498970 A CN201610498970 A CN 201610498970A CN 106197537 B CN106197537 B CN 106197537B
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- Prior art keywords
- inductance
- wireless sensor
- groove
- passive wireless
- integrated passive
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- 229910045601 alloy Inorganic materials 0.000 claims abstract description 19
- 239000000956 alloy Substances 0.000 claims abstract description 19
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910000846 In alloy Inorganic materials 0.000 claims description 5
- 238000003181 co-melting Methods 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 241000233803 Nypa Species 0.000 claims description 3
- 235000005305 Nypa fruticans Nutrition 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 16
- 230000008859 change Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000001453 impedance spectrum Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention provides a kind of humiture integrated passive wireless sensor, including the LC resonant tanks that temperature sensitive inductance and humicap are formed；The temperature sensitive inductance is sandwich structure, including underlying substrate, the inductance mould and upper strata cover plate at middle part；Inductance mould is spiral groove, and the liquid metal alloy as liquid inductance is marked with groove, and the volume of liquid metal alloy is less than the volume of groove；The upper surface of liquid metal alloy is provided with one layer of oxide conformal layer in groove, and the height of oxide conformal layer is less than the height of groove upper surface；The humicap is arranged on upper strata cover plate away from inductance mould one side, and cascaded structure is formed with temperature sensitive inductance.The present invention is simple in construction, manufacture difficulty is low, the sensitive amount of finished product is big, temperature sensor structure is novel, can realize that humiture passive and wireless senses simultaneously.
Description
Technical field
The present invention relates to the integrated passive wireless sensor of the novel warm humidity based on MEMS (microelectromechanical systems) technique,
The integrated passive wireless sensor of especially a kind of humiture.
Background technology
It by Parameter Switch to be measured is resonant frequency that LC (inductance capacitance) passive wireless sensor, which is, and passes through Mutual Inductance Coupling
The resonant frequency of mode non-cpntact measurement sensor node, so as to realize passive and wireless sensing purpose.LC passive wireless sensors
Inside is free of active component, simple in construction, in theory with infinite life.Therefore, be very suitable for food and medicine packaging detection,
The applications such as building safety is detected and package reliability is verified.With wireless sense network, the fast development of Internet of Things industry, LC
Passive wireless sensor has broad application prospects.General existing LC passive wireless sensors are both in the list of environment
Individual parameter is sensed, such as temperature, humidity, pressure, pH value, but in actual applications, is examined while temperature and humidity
Measuring tool has bigger application value, and using temperature parameters value as compensating factor during moisture measurement, can also obtain more smart
True humidity measurements.Therefore, design realizes that humiture passive wireless sensor has very important application prospect.
The content of the invention
Goal of the invention：Two parameters of humiture and passive wireless sensor simple in construction can be detected simultaneously to provide,
The present invention proposes a kind of integrated passive wireless sensor of humiture.
Technical scheme：Technical scheme proposed by the present invention is：
A kind of integrated passive wireless sensor of humiture, including the LC resonance that temperature sensitive inductance and humicap are formed return
Road；
The temperature sensitive inductance is sandwich structure, including underlying substrate 1, the inductance mould 3 and upper strata cover plate 4 at middle part；Electricity
Sense mould 3 is spiral groove, and the liquid metal alloy 2 as liquid inductance, the body of liquid metal alloy 2 are marked with groove
Volume of the product less than groove；The upper surface of liquid metal alloy 2 is provided with one layer of oxide conformal layer 5 in groove, and oxide is conformal
The height of layer 5 is less than the height of groove upper surface；
The humicap is arranged on upper strata cover plate 4 away from the one side of inductance mould 3, and tandem junction is formed with temperature sensitive inductance
Structure.
Further, the humicap is interdigital capacitor, includes the interdigital electrode 6 of sheet, the one side patch of interdigital electrode 6
On the upper surface of upper strata cover plate 4, wet sensitive medium 7 is coated with another side.
Specifically, the liquid metal alloy 2 is co-melting gallium-indium alloy.
Specifically, the oxide conformal layer 5 is metal oxide layer.
Specifically, the interdigital electrode 6 is platinum electrode, the wet sensitive medium 7 is graphene oxide.
Specifically, the underlying substrate 1, inductance mould 3 and upper strata cover plate 4 are made by PDMS material.
Specifically, the underlying substrate 1, inductance mould 3 and upper strata cover plate 4 are by NIPA material system
Into.
Beneficial effect：Compared with prior art, the present invention has the advantage that：
1st, simple in construction, manufacture difficulty is relatively low；
2nd, making material cost is low, manufacture craft is simple and the sensitive amount of finished product is big.
3rd, temperature sensor structure is novel, can realize that humiture passive and wireless senses simultaneously.
Brief description of the drawings
Fig. 1 is the three-dimensional structure diagram of the embodiment of the present invention；
Fig. 2 is the longitudinal section sectional view in the embodiment of the present invention；
In figure：1st, underlying substrate, 2, liquid metal alloy, 3, inductance mould, 4, upper strata cover plate, 5, oxide conformal layer,
6th, interdigital electrode, 7, wet sensitive medium.
Embodiment
The present invention is further described below in conjunction with the accompanying drawings.
It is as shown in Figure 1 the three-dimensional structure diagram of the embodiment of the present invention, including the LC that temperature sensitive inductance and humicap are formed humorous
Shake loop；Temperature sensitive inductance is sandwich structure, including underlying substrate 1, the inductance mould 3 and upper strata cover plate 4 at middle part；Inductance mould
3 be spiral groove, the liquid metal alloy 2 as liquid inductance is marked with groove, the volume of liquid metal alloy 2 is less than
The volume of groove；The upper surface of liquid metal alloy 2 is provided with one layer of oxide conformal layer 5, the height of oxide conformal layer 5 in groove
Height of the degree less than groove upper surface；The humicap is arranged on upper strata cover plate 4 away from the one side of inductance mould 3, and temperature sensitive
Inductance forms cascaded structure；Humicap is interdigital capacitor, includes the interdigital electrode 6 of sheet, and the one side of interdigital electrode 6 is attached to
On layer cover plate 4 upper surface, wet sensitive medium 7 is coated with another side.
In above-mentioned technical proposal, underlying substrate 1 plays pedestal, and the effect of oxide conformal layer 5 is to ensure liquid metal
The mechanical stability of alloy inductance.
In the present embodiment, underlying substrate 1, inductance mould 3 and upper strata cover plate 4 are made from PDMS material, liquid gold
Category alloy 2 is the co-melting gallium-indium alloy of liquid (EGaIn), and oxide conformal layer 5 is metal oxide, and interdigital electrode 6 is metal platinum
Electrode, wet sensitive medium 7 are graphene oxide film.
The manufacturing process of the integrated passive wireless sensor of humiture described in the present embodiment is as follows：
(1) first, SU-8 formpistons are made, by PDMS resins and curing agent by volume 10：1 dosage ratio, is fully stirred
Mix, vacuum suction takes out all bubbles, and is poured on the formpiston of shaping, after removing bubble removing again, is placed in 2h in 75 DEG C of baking ovens
Solidified above.
(2) full wafer PDMS cover plates are taken off after solidifying, shape on demand make by lithography underlying substrate 1, inductance mould 3 and on
Layer cover plate 4.Hollow needle drilling is used to be used as fluid inlet and outlet on inductance mould 3, nitrogen blows remaining fines off, that is, prepared
PDMS inductance moulds；
(3) inductance mould 3 is directed at fitting with underlying substrate 1, is placed in 1h in 80 DEG C of baking ovens, realizes inductance mould 3 and bottom
The sealing of layer substrate 1；
(4) the co-melting gallium-indium alloy of liquid is injected in inductance mould 3, is looked unfamiliar after injection in the co-melting gallium-indium alloy upper table of liquid
Into oxide conformal layer 5；
(5) deposit to form patterned interdigitated platinum electrode by platinum in the one side of upper strata cover plate 4；By inductance mould
Tool 3 is directed at fitting with the another side of upper strata cover plate 4, realizes sealing；
(6) graphene oxide humidity-sensitive medium is finally sprayed on platinum electrode.
In the present embodiment, inductance is injected into microchannel by liquid metal alloy 2 and formed, it is only necessary to by photoetching and
The method of Quick-forming.
Operation principle of the present utility model is：Temperature sensitive inductance and humicap LC resonant tanks in series, when humidity is sent out
During changing, the dielectric constant of graphene oxide wet sensitive medium changes, that is, causes the change of sensor node resonant frequency；
When the temperature varies, the shape of PDMS inductance mould can change due to expanding with heat and contract with cold, and then cause liquid metal
The pattern of alloy 2, which changes, causes inductance value to change, so as to cause the impedance value at sensor node resonant frequency
Change.Outside read-out system can extract this impedance spectrum figure by the cordless of inductance coil near-field coupling,
And then determine temperature to be measured and humidity value.
As a kind of preferred embodiment to technical scheme of the present invention, inductance mould 3 can use anisotropy
The membrane material of deformation such as NIPA, the controllability of such deformation are higher.
As another preferred embodiment to technical scheme of the present invention, temperature sensitive inductance can be designed as multilayer knot
Structure, each layer are formed by inductance mould 3 and liquid metal alloy 2, and two adjacent interlayers are separated by interlayer made of PDMS,
It is this to design the sensitivity for both having added temperature, the Q values of resonant tank can be improved again, contribute to signal extraction and analysis.
As another preferred embodiment to technical scheme of the present invention, humicap may be designed in liquid
Metal electrode electric capacity, simplify processing technology.
Described above is only the preferred embodiment of the present invention, it should be pointed out that：For the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (7)
1. the integrated passive wireless sensor of a kind of humiture, it is characterised in that formed including temperature sensitive inductance and humicap
LC resonant tanks；
The temperature sensitive inductance is sandwich structure, including underlying substrate (1), the inductance mould (3) and upper strata cover plate (4) at middle part；
Inductance mould (3) is spiral groove, and the liquid metal alloy (2) as liquid inductance is marked with groove, and liquid metal closes
The volume of golden (2) is less than the volume of groove；The upper surface of liquid metal alloy (2) is provided with one layer of oxide conformal layer in groove
(5), the height of oxide conformal layer (5) is less than the height of groove upper surface；
The humicap is arranged on upper strata cover plate (4) away from inductance mould (3) one side, and tandem junction is formed with temperature sensitive inductance
Structure.
A kind of 2. integrated passive wireless sensor of humiture according to claim 1, it is characterised in that the wet sensitive electricity
Hold and be attached to for the interdigital electrode (6) of interdigital capacitor, including sheet, the one side of interdigital electrode (6) on upper strata cover plate (4) upper surface,
Wet sensitive medium (7) is coated with another side.
A kind of 3. integrated passive wireless sensor of humiture according to claim 1, it is characterised in that the liquid gold
It is co-melting gallium-indium alloy to belong to alloy (2).
A kind of 4. integrated passive wireless sensor of humiture according to claim 1, it is characterised in that the oxide
Conformal layer (5) is metal oxide layer.
A kind of 5. integrated passive wireless sensor of humiture according to claim 2, it is characterised in that the interdigital electricity
Pole (6) is platinum electrode, and the wet sensitive medium (7) is graphene oxide.
A kind of 6. integrated passive wireless sensor of humiture according to claim 1, it is characterised in that the back lining
Bottom (1), inductance mould (3) and upper strata cover plate (4) are made by PDMS material.
A kind of 7. integrated passive wireless sensor of humiture according to claim 1, it is characterised in that the back lining
Bottom (1), inductance mould (3) and upper strata cover plate (4) are made by NIPA material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610498970.8A CN106197537B (en) | 2016-06-29 | 2016-06-29 | A kind of integrated passive wireless sensor of humiture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610498970.8A CN106197537B (en) | 2016-06-29 | 2016-06-29 | A kind of integrated passive wireless sensor of humiture |
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| Publication Number | Publication Date |
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| CN106197537A CN106197537A (en) | 2016-12-07 |
| CN106197537B true CN106197537B (en) | 2018-02-23 |
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| CN110713168B (en) * | 2018-07-13 | 2023-09-26 | 浙江清华柔性电子技术研究院 | Method for preparing microfluidic device |
| WO2020073604A1 (en) * | 2018-10-11 | 2020-04-16 | 东南大学 | Piezoelectric-based lc-type rotational speed sensor for measuring centripetal force |
| CN110108381A (en) * | 2019-04-26 | 2019-08-09 | 南京邮电大学 | LC passive wireless sensor that is a kind of while detecting temperature, humidity |
| CN111740203A (en) * | 2020-06-11 | 2020-10-02 | 电子科技大学 | High Q value temperature perception ELC resonance structure based on liquid metal |
| CN111964721B (en) * | 2020-08-17 | 2021-07-06 | 四川大学 | Non-contact temperature and humidity sensor and detection method |
| CN115299886A (en) * | 2022-08-29 | 2022-11-08 | 电子科技大学 | Wireless capsule, preparation method thereof and wearable gastrointestinal biological signal sensing system |
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2016
- 2016-06-29 CN CN201610498970.8A patent/CN106197537B/en not_active Expired - Fee Related
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