CN106181111A - A kind of high-performance copper aluminum composite solder - Google Patents
A kind of high-performance copper aluminum composite solder Download PDFInfo
- Publication number
- CN106181111A CN106181111A CN201610675925.5A CN201610675925A CN106181111A CN 106181111 A CN106181111 A CN 106181111A CN 201610675925 A CN201610675925 A CN 201610675925A CN 106181111 A CN106181111 A CN 106181111A
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- Prior art keywords
- solder
- wettability
- raw material
- following raw
- copper
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of high-performance copper aluminum composite solder, including major ingredient and adjuvant；Described major ingredient is made up of following raw material: copper 0.5～4.0%, aluminum 0.2～4.7%, remaining is stannum；Described adjuvant is made up of following raw material: phosphorus 0.005～0.05%, nickel 0.05～0.2%, antimony 0.5～4.5%, indium 0.3～4.21%, bismuth 1.0～3.56%, ferrum 0.005～0.015%, rhenium 0.03～0.32% and zinc 1.0～6.0%.This general all fusing point of solder solving application now is the highest, and wettability is poor, the situation that cost is the highest, improve the performance of solder, it is to avoid cause great inconvenience to user, it is ensured that the later stage uses normally, improve using effect and service efficiency, and the interpolation of bismuth, it is possible to decrease the fusion temperature of solder, improves wettability and the creep-resistant property of solder, and add a small amount of antimony, the tissue of solder alloy can be refined, reduce fusing point, improve intensity and the wettability of solder.
Description
Technical field
The present invention relates to Copper-Aluminum compound solder technology field, be specially a kind of high-performance copper aluminum composite solder.
Background technology
Solder is soldering material, the use history in existing more than 4000 years, and its fusing point is lower than by weldering mother metal.In brazing process
Solder is heated to above solder melt point, and less than the temperature of mother metal fusing point, after solder fusing, fills play movement and mother metal
There is metallurgy action, thus realize the connection of material.With solder welding material have flexible, simple, be not required to big equipment investment
Etc. advantage, occupy particularly important status at electrical engineering Material Field.
The kind of solder is more, can be divided into slicken solder and the big class of hard solder two according to fusing point.Generally by fusing point less than 450 DEG C
Solder be referred to as slicken solder, and the solder that fusing point is higher than 450 DEG C is referred to as hard solder.Electrical engineering slicken solder includes tin-lead, stannum
Base is unleaded, auri, indio, bismuthino and zinc-base solder etc.；Hard solder used includes aluminum base and copper-based solder etc..
At present, on market to the production of solder and manufacture and in use, although present solder welding material has
Flexibly, simply, be not required to the advantage of big equipment investment etc., but, the general all fusing points of the solder of application now are the highest, and wettability is relatively
Difference, cost is the highest, still there is Performance comparision low, gives and causes great inconvenience when using, and affects the normal use in later stage, reduces
Using effect and service efficiency.
Summary of the invention
(1) solve the technical problem that
For the deficiencies in the prior art, the invention provides a kind of high-performance copper aluminum composite solder, solve present weldering
It is low still to there is Performance comparision in material, gives and causes great inconvenience when using, and affects the normal use in later stage, reduces using effect
Problem with service efficiency.
(2) technical scheme
For realizing object above, the present invention is achieved by the following technical programs: a kind of high-performance copper aluminum composite solder,
Including major ingredient and adjuvant；
Described major ingredient is made up of following raw material: copper 0.5～4.0%, aluminum 0.2～4.7%, remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.005～0.05%, nickel 0.05～0.2%, antimony 0.5～4.5%, indium
0.3～4.21%, bismuth 1.0～3.56%, ferrum 0.005～0.015%, rhenium 0.03～0.32% and zinc 1.0～6.0%.
Preferably, including major ingredient and adjuvant；
Described major ingredient is made up of following raw material: copper 2.68%, aluminum 2.97%, and remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.235%, nickel 0.132%, antimony 3.2%, indium 2.467%, bismuth
2.35%, ferrum 0.0098%, rhenium 0.156% and zinc 3.34%.
(3) beneficial effect
The invention provides a kind of high-performance copper aluminum composite solder, by copper, aluminum, stannum be major ingredient and with phosphorus, nickel, antimony, indium,
Being equipped with of bismuth and ferrum, the general all fusing points of solder solving application now are the highest, and wettability is poor, the feelings that cost is the highest
Condition, improve the performance of solder, it is to avoid causes great inconvenience to user, it is ensured that the later stage uses normally, improves
Using effect and service efficiency, and the interpolation of bismuth, it is possible to decrease the fusion temperature of solder, improve wettability and the creep resistant of solder
Performance, and add a small amount of antimony, the tissue of solder alloy can be refined, reduce fusing point, improve intensity and the wettability of solder.
Accompanying drawing explanation
Fig. 1 is the isothermal line projection of ternary alloy three-partalloy richness Sn side of the present invention；
Fig. 2 is the wettability figure of solder of the present invention；
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
The solder of Sn-Al-Cu is to add Cu on the basis of Sn-Al solder to form, and owing to having, fusing point is low, wettability phase
To the advantage such as higher and comprehensive mechanical property is excellent, it is acknowledged as the lead-free solder that current combination property is optimal, most widely used
Alloy.Eutectic composition is Sn-3.8Al-0.7Cu, and eutectic temperature is 217 DEG C.
The fusing point of the solder of Sn-Al-Cu is lower than Sn-Cu system and Sn-Al system, and wettability is good, and intensity and plasticity are high, have
Excellent heat-resistant anti-fatigue characteristic, it is 125 DEG C of croop properties placed far above Sn-Pb solder, and it is little that time for balance is up to 3849
Time, this is dispersed in parent phase Sn with Cu6Sn5 and Al3Sn intermetallic compound, alloy structure uniformly, fine and close relevant.This is
Alloy is had an optimistic view of by industry owing to many-sided performance more balances, and the most substantial amounts of data promotes the most energetically
It is admitted by industry and accepts.What application was most at present is Sn-3.0Al-0.5Cu alloy, and its fatigue life is higher than Sn-37Pb
Nearly 3 times.Compared with Sn-Al, Sn-Al-Cu system solder is less to the Cu dissolution extent on components and parts and PCB substrate.But at certain
A little aspects, the reliability of Sn-Al-Cu solder is but low than Sn-37Pb solder, and as plastic strain is relatively low, this is for some large scales
Creep fault etc. be disadvantageous.The wettability of solder is affected little by the content of Al, Cu element.
In the solder of Sn-Al-Cu, add trace alloying element, can further improve the comprehensive platform performance of solder.
Add a small amount of Sb, the tissue of solder alloy can be refined, reduce fusing point, improve intensity and the wettability of solder.
But Sb content is unsuitable excessive, and otherwise the fragility of solder increases, and affects the reliability of machining property and solder joint.
Research worker in early days, in order to significantly reduce the fusing point of the solder of Sn-Al-Cu, adds the falls such as In, Zn in solder
Melting element, although effectiveness comparison is obvious, but In is noble metal, and resource-constrained, and the membership that adds of Zn weakens the moistening of solder
Property and antioxygenic property, just because of the existence of these shortcomings, both elements seldom apply the solder at Sn-Al-Cu
On.
Add Bi element, it is possible to decrease the fusion temperature of solder, improve wettability and the creep-resistant property of solder, but along with Bi
The increase of addition, solidus temperature can decline to a great extent, and the range of decrease of liquidus temperature is the least.Subelement at present still uses
Coating containing Pb, is easily formed Sn/Pb/Bi low melting point phase (96 DEG C) in using the tissue near containing welding point interface after Bi solder, from
And have a strong impact on the reliability of solder joint.
The coating of PCB upper Cu pad is very big to Sn-Al-Cu welding point interface structure influence, Chinese Academy of Sciences's Shanghai micro-system
Showing with the result of study of information technology institute, when using NiAu coating, that upper and lower interface is formed is all (Cu, Ni) Sn, heat
Number of strokes increases, and (Cu, Ni) Sn grows up, but overall pattern does not has significant change；When using HASL coating, the IMC (gold of interface
Compound between genus) it is made up of Cu6Sn5 and Cu3Sn, thermal shock number increases, and interface I MC shows as obvious two-layer, two-layer IMC
The most substantially thicken, and in interface, hole occurs.Compared with HASL coating, NiAu coating IMC growth rate is relatively slow, interface atresia
Hole generates, thus has higher reliability.
The fusion temperature of Sn-Al-Cu system solder is 217-221 DEG C, it is necessary to could become liquid completely when reaching 240 DEG C
State, so welding temperature to reach about 245 DEG C.The wettability of Sn-Al-Cu solder is poorer than Sn-Pb solder, and this is whole unleaded
The problem that solder all suffers from.The machining property of Sn-Al-Cu system solder is preferable, can make paste, wire, spherical or pre-
Make the various ways such as shape, be widely used in the multiple welding procedures such as Reflow Soldering, wave-soldering, manual welding and immersed solder.
It is below chemical composition and the fusing point table of Copper-Aluminum compound solder of the present invention:
Below in conjunction with some embodiments, the present invention is further explained, it should be appreciated that following example are intended to explanation, no
Should be taken as limiting.
Embodiment one
A kind of high-performance copper aluminum composite solder, comprises the following steps:
Major ingredient is made up of following raw material: copper 0.5%, aluminum 0.2%, and remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.005%, nickel 0.05%, antimony 0.5%, indium 0.3%, bismuth 1.0%, ferrum
0.005%, rhenium 0.03% and zinc 1.0%.
Embodiment two
A kind of high-performance copper aluminum composite solder, comprises the following steps:
Major ingredient is made up of following raw material: copper 2.68%, aluminum 2.97%, and remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.235%, nickel 0.132%, antimony 3.2%, indium 2.467%, bismuth
2.35%, ferrum 0.0098%, rhenium 0.156% and zinc 3.34%.
Embodiment three
A kind of high-performance copper aluminum composite solder, comprises the following steps:
Major ingredient is made up of following raw material: copper 4.0%, aluminum 4.7%, and remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.05%, nickel 0.2%, antimony 4.5%, indium 4.21%, bismuth 3.56%, ferrum
0.015%, rhenium 0.32% and zinc 6.0%.
In sum, this high-performance copper aluminum composite solder, by copper, aluminum, stannum be major ingredient and with phosphorus, nickel, antimony, indium, bismuth and
Being equipped with of ferrum, the general all fusing points of solder solving application now are the highest, and wettability is poor, the situation that cost is the highest, carries
The high performance of solder, it is to avoid cause great inconvenience to user, it is ensured that the later stage uses normally, improves use effect
Fruit and service efficiency, and the interpolation of bismuth, it is possible to decrease the fusion temperature of solder, improve wettability and the creep-resistant property of solder,
And add a small amount of antimony, the tissue of solder alloy can be refined, reduce fusing point, improve intensity and the wettability of solder.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, permissible
Understand and these embodiments can be carried out multiple change without departing from the principles and spirit of the present invention, revise, replace
And modification, the scope of the present invention be defined by the appended.
Claims (2)
1. a high-performance copper aluminum composite solder, it is characterised in that: include major ingredient and adjuvant；
Described major ingredient is made up of following raw material: copper 0.5～4.0%, aluminum 0.2～4.7%, remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.005～0.05%, nickel 0.05～0.2%, antimony 0.5～4.5%, indium 0.3～
4.21%, bismuth 1.0～3.56%, ferrum 0.005～0.015%, rhenium 0.03～0.32% and zinc 1.0～6.0%.
A kind of high-performance copper aluminum composite solder the most according to claim 1, it is characterised in that: include major ingredient and adjuvant；
Described major ingredient is made up of following raw material: copper 2.68%, aluminum 2.97%, and remaining is stannum；
Described adjuvant is made up of following raw material: phosphorus 0.235%, nickel 0.132%, antimony 3.2%, indium 2.467%, bismuth 2.35%, ferrum
0.0098%, rhenium 0.156% and zinc 3.34%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675925.5A CN106181111A (en) | 2016-08-16 | 2016-08-16 | A kind of high-performance copper aluminum composite solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610675925.5A CN106181111A (en) | 2016-08-16 | 2016-08-16 | A kind of high-performance copper aluminum composite solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106181111A true CN106181111A (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610675925.5A Pending CN106181111A (en) | 2016-08-16 | 2016-08-16 | A kind of high-performance copper aluminum composite solder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848817A (en) * | 2017-03-28 | 2017-06-13 | 王淑珍 | A kind of high-capacity optical fiber laser |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN102152021A (en) * | 2011-01-25 | 2011-08-17 | 天津大学 | Lead-free solder for hot dipping of solar battery and preparation method thereof |
| CN103889644A (en) * | 2012-10-09 | 2014-06-25 | 阿尔法金属公司 | Lead-free and antimony-free tin solder reliable at high temperatures |
| CN105234580A (en) * | 2015-11-17 | 2016-01-13 | 镇江市锶达合金材料有限公司 | High-strength lead-free brazing filler metal for brazing |
-
2016
- 2016-08-16 CN CN201610675925.5A patent/CN106181111A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN102152021A (en) * | 2011-01-25 | 2011-08-17 | 天津大学 | Lead-free solder for hot dipping of solar battery and preparation method thereof |
| CN103889644A (en) * | 2012-10-09 | 2014-06-25 | 阿尔法金属公司 | Lead-free and antimony-free tin solder reliable at high temperatures |
| CN105234580A (en) * | 2015-11-17 | 2016-01-13 | 镇江市锶达合金材料有限公司 | High-strength lead-free brazing filler metal for brazing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106848817A (en) * | 2017-03-28 | 2017-06-13 | 王淑珍 | A kind of high-capacity optical fiber laser |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |