CN106141196A - A kind of tin ball particle and its preparation method and application - Google Patents
A kind of tin ball particle and its preparation method and application Download PDFInfo
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- CN106141196A CN106141196A CN201510187664.8A CN201510187664A CN106141196A CN 106141196 A CN106141196 A CN 106141196A CN 201510187664 A CN201510187664 A CN 201510187664A CN 106141196 A CN106141196 A CN 106141196A
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Abstract
The present invention relates to a kind of tin ball particle and its preparation method and application, under inert gas atmosphere, heating lead-free solder makes raw materials melt, is sufficiently stirred for alloy solution；Under inert gas atmosphere, alloy solution is made alloy liquid droplet；Indirectly cool down inert gas flow with liquid, condense alloy liquid droplets in-10～-190 DEG C, in 0～15 DEG C, in the inert atmosphere of 20～40RH%, stabilization processes 1～3 day；Carrying out composition detection, the tin ball particle preparing can application in BGA package.Compared with prior art, the preparation technology of the present invention is simple, it is adaptable to large-scale production, and the tin ball particle constituent content of the present invention is stable, and quality is good, is difficult to blackening and surface non-oxidation phenomenon.
Description
Technical field
The present invention relates to solid-state tin alloy material and its preparation method and application, especially relate to a kind of tin variole
Grain and its preparation method and application.
Background technology
With current industrial and consumer electronics market to the miniaturization of product, high reliability, high security,
The requirement of the aspects such as high-performance, chip components and parts are to miniaturization, Large Copacity, highly integrated and high performance direction
Development.The encapsulation technology of chip constantly develops with the development of chip technology, and every generation chip is required for
Technology therewith is had to require corresponding encapsulation technology, and the development of surface installation technique (SMT), to encapsulation skill
The requirement of art has reached a new height.The appearance of BGA package technology (PCB of ball grid array structure),
Become the optimal selection of the high density high performance chip packaging such as CPU, graphic chips, consumption electronic product such as hand
Machine, notebook computer, digital camera etc. also use BGA package form widely.
Chinese patent CN1954946A discloses the preparation method of a kind of Pb-free solder ball, the steps include: A)
Pb-free solder material component adds antioxidant and grain refiner, is smelted into liquid；Antioxidant is attached most importance to
Amount is than phosphorus and the thallium being 1: 1, and its addition is the 0.006-0.03% of raw material weight；Grain refiner addition
0.003-0.005% for scolding tin weight；B) surface configuration has some spherical moulds in semicircle shape round pool, its
At least more than half is placed in scolding tin melt liquid, rotates this mould, makes the little round pool of die surface fill with scolding tin
Melt liquid, when spherical mould rotates to nitrogen mouth, cooled and solidified sizing under nitrogen protection, continuing by mould
Continuous rotation, the solder ball of sizing falls from discharging opening.
Tin ball preparation method described herein, owing to whole production process is by inert gas shielding, it is not necessary to melting
The ashbury metal liquid melting adds antioxidant and grain refiner.Tin ball preparation method described herein
Molten alloy liquid can be mixed into according to the ratio of various metal ingredients needed for tin ball alloy accurately, reduce
Impurity.Speed of production up to can arrive 2000pcs per second simultaneously, alloying pellet size is uniform, and is producing
By the change of frequency in journey, the particle diameter of product is accurately adjusted, simple and convenient.With patent
CN1954946A compares, and the tin ball alloying pellet composition being obtained is more accurate, it is not necessary to dose in addition to raw material
Any oxidation-resistant material can ensure the ultralow oxygen content of product.Meanwhile, production efficiency is higher, can be very clever
Produce various sizes of product alively.
Content of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and provide one to overcome
In prior art, the silver-colored ratio in tin ball and silver content cannot accurately control, and the preparation technology of ternary tin ball is multiple
, there is the defect of oxidation in the perishable blackout of tin ball that is miscellaneous, that prepare, provides a kind of tin ball particle and preparation thereof
Method.The preparation technology of the present invention is simple, simplifies shaping flow process, it is adaptable to large-scale production, the tin preparing
Ball particle constituent content is stable, and quality is good, is difficult to blackening and surface non-oxidation phenomenon.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of preparation method of tin ball particle, employing following steps:
1) under inert gas atmosphere, heating lead-free solder makes it melt, and makes a diameter of after mix and blend
The alloy liquid droplet of 0.2～0.8mm；
2) indifferent gas to-10～-190 DEG C, after then utilization cools down for the inert gas flow is indirectly cooled down with liquid nitrogen
Body condensation alloy liquid droplet, obtains tin ball forming body；
3) it is placed in tin ball forming body in constant temperature and humidity and inert gas atmosphere, stabilization processes 1～3 day；
4) composition of the tin ball forming body after stabilization processes is detected, the wherein composition of various alloys
Content tolerance, in the range of 1wt%, is qualified tin ball particle.
Described lead-free solder include tin indium, tin bismuth, tin antimony, Xi Yin, tin copper, SAC, tin silver bismuth indium,
SAC indium or SAC bismuth alloy.
Specifically, the composition of lead-free solder can be as shown in the table.
Step 1) in lead-free solder be heated to 350～450 DEG C, after melting through air-flow bubbling mix and blend,
The time of mix and blend is 1～3h, and pressure during mixing is 1～25psi, therefore, and the material of the container being used
Matter can be selected for any to bear 500 DEG C and not softening indeformable, and can bear the material of 100psi pressure
Material.In the present invention, what the material of described container was preferably in iron, copper, stainless steel, pottery and glass appoints
One, is more preferably stainless steel.
Use nozzle to prepare alloy liquid droplet, apply the pressure of 50～70psi to melted lead-free solder solution,
The nozzle making solution pass through vibration forms alloy liquid droplet, and the vibration frequency of nozzle is 200～2000Hz；Vibration width
Degree is 0.1～0.8mm.
Described inert gas is nitrogen, argon gas or helium.
Step 2) use bilayer sleeve indirectly to cool down, liquid nitrogen is passed through bilayer sleeve inner tube and outer tube
Between region, inert gas flow flows through from inner tube, it is achieved cooling.
Step 3) in use numerical control control carry out stabilization processes, thermostat temperature is 0～15 DEG C, and humidity is
20～40RH%.
Step 4) use atomic emission detection tin ball forming body composition.
In the present invention one preferably embodiment, by an exhaust filtering system by generation in preparation process
Metallic dust is collected, and environment is prepared in purification, it is to avoid the injury to staff and external environment.
Present invention also offers the tin ball particle being prepared by above-mentioned preparation method.
Wherein, the shape of the tin ball particle is generally spherical.The average grain diameter of the tin ball particle is generally
0.2～0.8mm.The tin ball particle of the present invention is at room temperature solid-state.
In the present invention, by common sense in the field, described tin ball particle, need to be in anhydrous, anaerobic, filling inertia
The glove box of gas is packaged, is stored in clean vial.
The tin ball particle being prepared by above-mentioned preparation method can application in BGA package.
Compared with prior art, the invention have the advantages that
1st, the technique separately melting in prior art is merged into list by the preparation method of the tin ball of the present invention
One technique, simplifies shaping flow process.
The 2nd, the preparation method of the present invention remaining, the raw material in container is in the protection of inert gas, keeps away
From oxygen and moisture contamination, prepared tin ball quality is good.
3rd, the preparation method of the present invention changes the pressure differential within furnace chamber so that molten alloy liquid bubbling boils
Rise, accurately can adjust, from the size of bubbling, the advantage that explanation is fully merged.Composition Control is at desired extent band
Cross all right.Effectively can control binary or the multi-component of lead-free solder in desired extent.
4th, the preparation method of the present invention is in the overall process of shaping, by inert gas shielding, before being molded simultaneously
Carry out bubbling boiling process to alloy liquid so that each composition is sufficiently mixed, the tin ball particle after shaping
Not turning black, non-oxidation, each component content are accurately reliable.
5th, the present invention utilizes liquid nitrogen as medium, can quick cooling down high-temperature drop, save time and cost.
Because being the indirectly type of cooling, spheroid does not contact cooling medium, fundamentally stops secondary pollution, and
The tedious steps of degreasing, again simple flow can be saved, improve production efficiency.
6th, in the preferred embodiment of the present invention, the metallic dust that whole technological process produces all is filtered
Systemic absorption filters, protection production environment and workman's personal safety.
Detailed description of the invention
Further illustrate the present invention below by the mode of embodiment, but therefore do not limit the present invention to institute
Among the scope of embodiments stated.The experimental technique of unreceipted actual conditions in the following example, according to routine side
Method and condition, or select according to catalogue.
Embodiment 1
Tin, silver, copper are by weight proportioning Sn:Ag:Cu=96.5:3:0.5, and preparation average weight is 1.7mg's
Tin ball particle.
The preparation method of tin ball particle:
1) it, under an argon atmosphere, raw material (tin silver 3 bronze medals 0.5) being added closed container, is warming up to 400
DEG C make raw materials melt, under the pressure of 20psi, mix 1.5 hours to mixing to obtain alloy solution；In inertia
Under gas atmosphere, by pressure, alloy solution, at 55psi, is extruded, by vibrating nozzle shape by Stress control
Becoming alloy liquid droplet, frequency and amplitude control respectively at 800Hz and 0.3mm, alloy solution are made aluminium alloy
Drip；
2) inert gas flow is indirectly cooled down with liquid nitrogen, with the inert gas flow after cooling in-100 DEG C of condensations
Described alloy liquid droplet, obtains tin ball forming body；
3) tin ball forming body is placed in constant temperature 10 DEG C, in constant humidity 30RH% and inert atmosphere, carries out (1～3)
Its stabilization processes；
4) using icp analysis to carry out composition detection, testing result is: Sn 96.6%, Ag 2.79%, Cu 0.48%.
The content of its silver of the tin ball particle preparing and copper is all in the range of designing content.
The average weight of this tin ball particle is 1.629mg.
Effect example:
Import and the commercially available tin ball of the tin ball particle of embodiment 1 and same specification is compared.
Table 1 uses tin ball particle and import and the commercially available tin ball parameter testing data of embodiment 1
| Project | Y&L tin ball | K1 import tin ball | K2 person of outstanding talent's Cen | K3Tasscom | K4Qualitek |
| Average diameter | 0.755 | 0.759 | 0.76 | 0.762 | 0.761 |
| Out of roundness | 1.0048 | 1.0061 | 1.0042 | 1.0047 | 1.0029 |
| Average quality | 1.629 | 1.669 | 1.682 | 1.691 | 1.677 |
| Quality Cpk | 2.05 | 1.34 | 4.44 | 2.04 | 1.82 |
| Max mass | 1.657 | 1.745 | 1.698 | 1.728 | 1.714 |
| Min mass | 1.607 | 1.618 | 1.666 | 1.661 | 1.628 |
| Extreme difference | 0.05 | 0.127 | 0.032 | 0.067 | 0.086 |
| Sn | 96.6 | 96.16 | 95.27 | 96.47 | 96.60 |
| Ag | 2.79 | 2.78 | 2.88 | 2.49 | 2.80 |
| Cu | 0.48 | 0.51 | 0.49 | 0.50 | 0.53 |
| Add up to | 99.87 | 99.45 | 98.63 | 99.45 | 99.93 |
Embodiment 2
A kind of preparation method of tin ball particle, employing following steps:
1) in a nitrogen atmosphere, heating tin indium lead-free solder makes it melt, and lead-free solder is heated to 350 DEG C,
After melting through air-flow bubbling mix and blend, the time of mix and blend is 1h, and pressure during mixing is 1psi,
Make the alloy liquid droplet of a diameter of 0.2mm after mix and blend, use nozzle to prepare alloy liquid droplet, to molten
The lead-free solder solution melting applies the pressure of 50psi, and the nozzle making solution pass through vibration forms alloy liquid droplet,
The vibration frequency of nozzle is 200Hz；Oscillation Amplitude is 0.1mm；
2) the stream of nitrogen gas condensation conjunction to-10 DEG C, after then utilization cools down for the stream of nitrogen gas is indirectly cooled down with liquid nitrogen
Gold drop, obtains tin ball forming body, uses bilayer sleeve indirectly to cool down, and liquid nitrogen is passed through in bilayer sleeve
Region between layer pipe and outer tube, stream of nitrogen gas flows through from inner tube, it is achieved cooling；
3) it is placed in tin ball forming body in constant temperature and humidity and nitrogen atmosphere, stabilization processes 1 day, use number
Control control carries out stabilization processes, and thermostat temperature is 0 DEG C, and humidity is 20RH%；
4) composition of the tin ball forming body after stabilization processes is detected, use atomic emission detection
The composition of tin ball forming body, wherein the component content tolerance of silver is in the range of 1wt%, is qualified tin
Ball particle, can application in BGA package.
Embodiment 3
A kind of preparation method of tin ball particle, employing following steps:
1) under an argon atmosphere, heating tin antimony lead-free solder makes it melt, and lead-free solder is heated to 450 DEG C,
After melting through air-flow bubbling mix and blend, the time of mix and blend is 3h, and pressure during mixing is 25psi
Make the alloy liquid droplet of a diameter of 0.8mm after mix and blend, use nozzle to prepare alloy liquid droplet, to molten
The lead-free solder solution melting applies the pressure of 70psi, and the nozzle making solution pass through vibration forms alloy liquid droplet,
The vibration frequency of nozzle is 2000Hz；Oscillation Amplitude is 0.8mm；
2) the argon stream condensation conjunction to-190 DEG C, after then utilization cools down for the argon stream is indirectly cooled down with liquid nitrogen
Gold drop, obtains tin ball forming body, uses bilayer sleeve indirectly to cool down, and liquid nitrogen is passed through in bilayer sleeve
Region between layer pipe and outer tube, argon stream flows through from inner tube, it is achieved cooling；
3) it is placed in tin ball forming body in constant temperature and humidity and argon gas atmosphere, use numerical control control to stabilize
Processing, thermostat temperature is 15 DEG C, and humidity is 40RH%, stabilization processes 3 days；
4) composition of the tin ball forming body after stabilization processes is detected, atomic emission spectrum can be used
The composition of detection tin ball forming body, wherein the component content tolerance of silver is in the range of 1wt%, and it is qualified to be
Tin ball particle, can application in BGA package.
Claims (10)
1. the preparation method of a tin ball particle, it is characterised in that employing following steps:
1) under inert gas atmosphere, heating lead-free solder makes it melt, and makes a diameter of after mix and blend
The alloy liquid droplet of 0.2～0.8mm；
2) indifferent gas to-10～-190 DEG C, after then utilization cools down for the inert gas flow is indirectly cooled down with liquid nitrogen
Body condensation alloy liquid droplet, obtains tin ball forming body；
3) it is placed in tin ball forming body in constant temperature and humidity and inert gas atmosphere, stabilization processes 1～3 day；
4) detecting the composition of the tin ball forming body after stabilization processes, wherein the component content of silver is public
Difference, in the range of 1wt%, is qualified tin ball particle.
2. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that step 1)
Described in lead-free solder include tin indium, tin bismuth, tin antimony, Xi Yin, tin copper, SAC, tin silver bismuth indium,
SAC indium or SAC bismuth alloy.
3. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that step 1)
Described in lead-free solder be heated to 350～450 DEG C, after melting through air-flow bubbling mix and blend, mixing is stirred
The time mixed is 1～3h, and pressure during mixing is 1～25psi.
4. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that step 1)
Middle employing nozzle prepares alloy liquid droplet, applies the pressure of 50～70psi to melted lead-free solder solution,
The nozzle making solution pass through vibration forms alloy liquid droplet, and the vibration frequency of nozzle is 200～2000Hz；Vibration width
Degree is 0.1～0.8mm.
5. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that described
Inert gas be nitrogen, argon gas or helium.
6. the preparation method of a kind of tin ball particle according to claim 1 or 5, it is characterised in that
Step 2) use bilayer sleeve indirectly to cool down, liquid nitrogen is passed through between bilayer sleeve inner tube and outer tube
Region, inert gas flow flows through from inner tube, it is achieved cooling.
7. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that step 3)
Middle employing numerical control control carries out stabilization processes, and thermostat temperature is 0～15 DEG C, and humidity is 20～40RH%.
8. the preparation method of a kind of tin ball particle according to claim 1, it is characterised in that step 4)
Use the composition of atomic emission detection tin ball forming body.
9. the tin ball particle that the preparation method as according to any one of claim 1-8 prepares.
10. application in BGA package for the tin ball particle as claimed in claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510187664.8A CN106141196A (en) | 2015-04-20 | 2015-04-20 | A kind of tin ball particle and its preparation method and application |
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| CN201510187664.8A CN106141196A (en) | 2015-04-20 | 2015-04-20 | A kind of tin ball particle and its preparation method and application |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807340A (en) * | 2019-01-31 | 2019-05-28 | 徐九生 | A kind of manufacture craft of conducting sphere |
| CN111545765A (en) * | 2020-04-17 | 2020-08-18 | 太极半导体（苏州）有限公司 | Method for preparing tin ball with uniform ball diameter and good sphericity |
| CN113059167A (en) * | 2021-03-17 | 2021-07-02 | 昆山宝创新能源科技有限公司 | Preparation method of passivated lithium microspheres and device and application thereof |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
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| US20030003011A1 (en) * | 2001-06-15 | 2003-01-02 | Rikiya Kato | Lead-free solder balls and method for the production thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109807340A (en) * | 2019-01-31 | 2019-05-28 | 徐九生 | A kind of manufacture craft of conducting sphere |
| CN111545765A (en) * | 2020-04-17 | 2020-08-18 | 太极半导体（苏州）有限公司 | Method for preparing tin ball with uniform ball diameter and good sphericity |
| CN113059167A (en) * | 2021-03-17 | 2021-07-02 | 昆山宝创新能源科技有限公司 | Preparation method of passivated lithium microspheres and device and application thereof |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
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Application publication date: 20161123 |