CN106118545A - Medicinal composite package film - Google Patents
Medicinal composite package film Download PDFInfo
- Publication number
- CN106118545A CN106118545A CN201610604875.1A CN201610604875A CN106118545A CN 106118545 A CN106118545 A CN 106118545A CN 201610604875 A CN201610604875 A CN 201610604875A CN 106118545 A CN106118545 A CN 106118545A
- Authority
- CN
- China
- Prior art keywords
- parts
- line
- bonding glue
- defoamer
- formaldehyde
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J107/00—Adhesives based on natural rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/80—Medical packaging
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Packages (AREA)
- Medical Preparation Storing Or Oral Administration Devices (AREA)
Abstract
The invention discloses a kind of medicinal composite package film, including: from the printing layer set gradually inside outward, theca externa, first bonding glue-line, aluminium foil layer, second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 5 ~ 8 parts, sodium hydroxide solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer 1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20 ~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, bisphenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and Raney's nickel catalyst 1 ~ 3 part.By the way, present invention bonding therein glue-line pliability is good, improves the serviceability of entirety.
Description
Technical field
The present invention relates to field of packaging material, particularly relate to a kind of medicinal composite package film.
Background technology
At present, the outer package of the medical product such as medicine tablet, capsule suppository is used mostly blister package.Blister package be by
Bubble-cap and back cover that product sealing is formed at transparent plastic sheet (with cardboard, plastic sheeting or thin slice, aluminium foil or theirs is compound
Material is made) between a kind of packing method.Existing this back cover is essentially all employing clad aluminum foil, existing this multiple
Close and could be improved in aluminium foil performance.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of medicinal composite package film, bonding glue-line pliability therein
Good, improve the serviceability of entirety.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of medicinal composite package film,
Including: from the printing layer set gradually inside outward, theca externa, the first bonding glue-line, aluminium foil layer, the second bonding glue-line and heat-sealing
Layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 5 ~ 8 parts, hydroxide
Sodium solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer 1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20
~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, bisphenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and thunder
Buddhist nun's Raney nickel 1 ~ 3 part.
In a preferred embodiment of the present invention, described first bonding glue-line and the second bonding glue-line all include following weight
The component of part: toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts, defoamer 1 part, dimethylbenzene are molten
Agent 5 parts, natural rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A type epoxy resin 5 parts, 1 part of formaldehyde
With Raney's nickel catalyst 1 part.
In a preferred embodiment of the present invention, toluenesulfonic acid 6 parts, sodium hydroxide solution 6 parts, pinene resin 23 parts, silicon
Ash 4 parts, defoamer 4 parts, xylene solvent 8 parts, natural rubber 25 parts, pi-allyl aceto-acetamide 3 parts, silicon dioxide 3 parts, double
Phenol A type epoxy resin 8 parts, 2 parts of formaldehyde and Raney's nickel catalyst 2 parts.
In a preferred embodiment of the present invention, toluenesulfonic acid 8 parts, sodium hydroxide solution 8 parts, pinene resin 25 parts, silicon
Ash 5 parts, defoamer 5 parts, xylene solvent 10 parts, natural rubber 30 parts, pi-allyl aceto-acetamide 5 parts, silicon dioxide 5 parts,
Bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and Raney's nickel catalyst 3 parts.
The invention has the beneficial effects as follows: the medicinal composite package film of the present invention, bonding glue-line pliability therein is good, improves
Overall serviceability.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
The embodiment of the present invention includes:
Embodiment one:
A kind of medicinal composite package film, including: from the printing layer set gradually inside outward, theca externa, the first bonding glue-line, aluminium foil
Layer, the second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion:
Toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts, defoamer 1 part, xylene solvent 5 parts, natural
Rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A type epoxy resin 5 parts, 1 part of formaldehyde and Raney's nickel are urged
Agent 1 part.
Embodiment two:
Toluenesulfonic acid 6 parts, sodium hydroxide solution 6 parts, pinene resin 23 parts, silicon ash 4 parts, defoamer 4 parts, xylene solvent 8 parts,
Natural rubber 25 parts, pi-allyl aceto-acetamide 3 parts, silicon dioxide 3 parts, bisphenol A type epoxy resin 8 parts, 2 parts of formaldehyde and thunder Buddhist nun
Raney nickel 2 parts.
Embodiment three:
Toluenesulfonic acid 8 parts, sodium hydroxide solution 8 parts, pinene resin 25 parts, silicon ash 5 parts, defoamer 5 parts, xylene solvent 10
Part, natural rubber 30 parts, pi-allyl aceto-acetamide 5 parts, silicon dioxide 5 parts, bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and
Raney's nickel catalyst 3 parts.
The invention has the beneficial effects as follows: the medicinal composite package film of the present invention, bonding glue-line pliability therein is good, improves
Overall serviceability.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (4)
1. a medicinal composite package film, it is characterised in that including: from the printing layer set gradually inside outward, theca externa, first
Bonding glue-line, aluminium foil layer, the second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include following
The component of weight portion: toluenesulfonic acid 5 ~ 8 parts, sodium hydroxide solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer
1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20 ~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, double
Phenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and Raney's nickel catalyst 1 ~ 3 part.
Medicinal composite package film the most according to claim 1, it is characterised in that described first bonding glue-line and the second bonding
Glue-line all includes the component of following weight portion: toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts,
Defoamer 1 part, xylene solvent 5 parts, natural rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A-type
Epoxy resin 5 parts, 1 part of formaldehyde and Raney's nickel catalyst 1 part.
3. the first bonding glue-line described in and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 6 parts, hydroxide
Sodium solution 6 parts, pinene resin 23 parts, silicon ash 4 parts, defoamer 4 parts, xylene solvent 8 parts, natural rubber 25 parts, pi-allyl second
Acyl acetamide 3 parts, silicon dioxide 3 parts, bisphenol A type epoxy resin 8 parts, 2 parts of formaldehyde and Raney's nickel catalyst 2 parts.
4. the first bonding glue-line described in and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 8 parts, hydroxide
Sodium solution 8 parts, pinene resin 25 parts, silicon ash 5 parts, defoamer 5 parts, xylene solvent 10 parts, natural rubber 30 parts, pi-allyl second
Acyl acetamide 5 parts, silicon dioxide 5 parts, bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and Raney's nickel catalyst 3 parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610604875.1A CN106118545A (en) | 2016-07-29 | 2016-07-29 | Medicinal composite package film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610604875.1A CN106118545A (en) | 2016-07-29 | 2016-07-29 | Medicinal composite package film |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106118545A true CN106118545A (en) | 2016-11-16 |
Family
ID=57254118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610604875.1A Pending CN106118545A (en) | 2016-07-29 | 2016-07-29 | Medicinal composite package film |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106118545A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105385364A (en) * | 2015-12-28 | 2016-03-09 | 青岛文晟汽车零部件有限公司 | Sealant for electrical apparatus insulation |
CN105437695A (en) * | 2015-12-29 | 2016-03-30 | 浙江金石包装有限公司 | Covering film for medicinal PTP (press through packaging) and preparation method of covering film |
CN105440998A (en) * | 2015-11-26 | 2016-03-30 | 河南豫冠化工科技开发有限公司 | Low-temperature fast-curing epoxy resin adhesive and preparation method thereof |
-
2016
- 2016-07-29 CN CN201610604875.1A patent/CN106118545A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105440998A (en) * | 2015-11-26 | 2016-03-30 | 河南豫冠化工科技开发有限公司 | Low-temperature fast-curing epoxy resin adhesive and preparation method thereof |
CN105385364A (en) * | 2015-12-28 | 2016-03-09 | 青岛文晟汽车零部件有限公司 | Sealant for electrical apparatus insulation |
CN105437695A (en) * | 2015-12-29 | 2016-03-30 | 浙江金石包装有限公司 | Covering film for medicinal PTP (press through packaging) and preparation method of covering film |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161116 |
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WD01 | Invention patent application deemed withdrawn after publication |