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CN106118545A - Medicinal composite package film - Google Patents

Medicinal composite package film Download PDF

Info

Publication number
CN106118545A
CN106118545A CN201610604875.1A CN201610604875A CN106118545A CN 106118545 A CN106118545 A CN 106118545A CN 201610604875 A CN201610604875 A CN 201610604875A CN 106118545 A CN106118545 A CN 106118545A
Authority
CN
China
Prior art keywords
parts
line
bonding glue
defoamer
formaldehyde
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610604875.1A
Other languages
Chinese (zh)
Inventor
陈轶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI HUATAI MEDICINE PACKAGING CO Ltd
Original Assignee
WUXI HUATAI MEDICINE PACKAGING CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI HUATAI MEDICINE PACKAGING CO Ltd filed Critical WUXI HUATAI MEDICINE PACKAGING CO Ltd
Priority to CN201610604875.1A priority Critical patent/CN106118545A/en
Publication of CN106118545A publication Critical patent/CN106118545A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J107/00Adhesives based on natural rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J145/00Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • B32B2439/80Medical packaging
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Packages (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)

Abstract

The invention discloses a kind of medicinal composite package film, including: from the printing layer set gradually inside outward, theca externa, first bonding glue-line, aluminium foil layer, second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 5 ~ 8 parts, sodium hydroxide solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer 1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20 ~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, bisphenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and Raney's nickel catalyst 1 ~ 3 part.By the way, present invention bonding therein glue-line pliability is good, improves the serviceability of entirety.

Description

Medicinal composite package film
Technical field
The present invention relates to field of packaging material, particularly relate to a kind of medicinal composite package film.
Background technology
At present, the outer package of the medical product such as medicine tablet, capsule suppository is used mostly blister package.Blister package be by Bubble-cap and back cover that product sealing is formed at transparent plastic sheet (with cardboard, plastic sheeting or thin slice, aluminium foil or theirs is compound Material is made) between a kind of packing method.Existing this back cover is essentially all employing clad aluminum foil, existing this multiple Close and could be improved in aluminium foil performance.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of medicinal composite package film, bonding glue-line pliability therein Good, improve the serviceability of entirety.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of medicinal composite package film, Including: from the printing layer set gradually inside outward, theca externa, the first bonding glue-line, aluminium foil layer, the second bonding glue-line and heat-sealing Layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 5 ~ 8 parts, hydroxide Sodium solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer 1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20 ~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, bisphenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and thunder Buddhist nun's Raney nickel 1 ~ 3 part.
In a preferred embodiment of the present invention, described first bonding glue-line and the second bonding glue-line all include following weight The component of part: toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts, defoamer 1 part, dimethylbenzene are molten Agent 5 parts, natural rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A type epoxy resin 5 parts, 1 part of formaldehyde With Raney's nickel catalyst 1 part.
In a preferred embodiment of the present invention, toluenesulfonic acid 6 parts, sodium hydroxide solution 6 parts, pinene resin 23 parts, silicon Ash 4 parts, defoamer 4 parts, xylene solvent 8 parts, natural rubber 25 parts, pi-allyl aceto-acetamide 3 parts, silicon dioxide 3 parts, double Phenol A type epoxy resin 8 parts, 2 parts of formaldehyde and Raney's nickel catalyst 2 parts.
In a preferred embodiment of the present invention, toluenesulfonic acid 8 parts, sodium hydroxide solution 8 parts, pinene resin 25 parts, silicon Ash 5 parts, defoamer 5 parts, xylene solvent 10 parts, natural rubber 30 parts, pi-allyl aceto-acetamide 5 parts, silicon dioxide 5 parts, Bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and Raney's nickel catalyst 3 parts.
The invention has the beneficial effects as follows: the medicinal composite package film of the present invention, bonding glue-line pliability therein is good, improves Overall serviceability.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection Enclose.
The embodiment of the present invention includes:
Embodiment one:
A kind of medicinal composite package film, including: from the printing layer set gradually inside outward, theca externa, the first bonding glue-line, aluminium foil Layer, the second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include the component of following weight portion: Toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts, defoamer 1 part, xylene solvent 5 parts, natural Rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A type epoxy resin 5 parts, 1 part of formaldehyde and Raney's nickel are urged Agent 1 part.
Embodiment two:
Toluenesulfonic acid 6 parts, sodium hydroxide solution 6 parts, pinene resin 23 parts, silicon ash 4 parts, defoamer 4 parts, xylene solvent 8 parts, Natural rubber 25 parts, pi-allyl aceto-acetamide 3 parts, silicon dioxide 3 parts, bisphenol A type epoxy resin 8 parts, 2 parts of formaldehyde and thunder Buddhist nun Raney nickel 2 parts.
Embodiment three:
Toluenesulfonic acid 8 parts, sodium hydroxide solution 8 parts, pinene resin 25 parts, silicon ash 5 parts, defoamer 5 parts, xylene solvent 10 Part, natural rubber 30 parts, pi-allyl aceto-acetamide 5 parts, silicon dioxide 5 parts, bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and Raney's nickel catalyst 3 parts.
The invention has the beneficial effects as follows: the medicinal composite package film of the present invention, bonding glue-line pliability therein is good, improves Overall serviceability.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck Territory, is the most in like manner included in the scope of patent protection of the present invention.

Claims (4)

1. a medicinal composite package film, it is characterised in that including: from the printing layer set gradually inside outward, theca externa, first Bonding glue-line, aluminium foil layer, the second bonding glue-line and hot sealing layer, described first bonding glue-line and the second bonding glue-line all include following The component of weight portion: toluenesulfonic acid 5 ~ 8 parts, sodium hydroxide solution 5 ~ 8 parts, pinene resin 20 ~ 25 parts, silicon ash 2 ~ 5 parts, defoamer 1 ~ 5 part, xylene solvent 5 ~ 10 parts, natural rubber 20 ~ 30 parts, pi-allyl aceto-acetamide 2 ~ 5 parts, silicon dioxide 2 ~ 5 parts, double Phenol A type epoxy resin 5 ~ 10 parts, 1 ~ 3 part of formaldehyde and Raney's nickel catalyst 1 ~ 3 part.
Medicinal composite package film the most according to claim 1, it is characterised in that described first bonding glue-line and the second bonding Glue-line all includes the component of following weight portion: toluenesulfonic acid 5 parts, sodium hydroxide solution 5 parts, pinene resin 20 parts, silicon ash 2 parts, Defoamer 1 part, xylene solvent 5 parts, natural rubber 20 parts, pi-allyl aceto-acetamide 2 parts, silicon dioxide 2 parts, bisphenol A-type Epoxy resin 5 parts, 1 part of formaldehyde and Raney's nickel catalyst 1 part.
3. the first bonding glue-line described in and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 6 parts, hydroxide Sodium solution 6 parts, pinene resin 23 parts, silicon ash 4 parts, defoamer 4 parts, xylene solvent 8 parts, natural rubber 25 parts, pi-allyl second Acyl acetamide 3 parts, silicon dioxide 3 parts, bisphenol A type epoxy resin 8 parts, 2 parts of formaldehyde and Raney's nickel catalyst 2 parts.
4. the first bonding glue-line described in and the second bonding glue-line all include the component of following weight portion: toluenesulfonic acid 8 parts, hydroxide Sodium solution 8 parts, pinene resin 25 parts, silicon ash 5 parts, defoamer 5 parts, xylene solvent 10 parts, natural rubber 30 parts, pi-allyl second Acyl acetamide 5 parts, silicon dioxide 5 parts, bisphenol A type epoxy resin 10 parts, 3 parts of formaldehyde and Raney's nickel catalyst 3 parts.
CN201610604875.1A 2016-07-29 2016-07-29 Medicinal composite package film Pending CN106118545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610604875.1A CN106118545A (en) 2016-07-29 2016-07-29 Medicinal composite package film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610604875.1A CN106118545A (en) 2016-07-29 2016-07-29 Medicinal composite package film

Publications (1)

Publication Number Publication Date
CN106118545A true CN106118545A (en) 2016-11-16

Family

ID=57254118

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610604875.1A Pending CN106118545A (en) 2016-07-29 2016-07-29 Medicinal composite package film

Country Status (1)

Country Link
CN (1) CN106118545A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105385364A (en) * 2015-12-28 2016-03-09 青岛文晟汽车零部件有限公司 Sealant for electrical apparatus insulation
CN105437695A (en) * 2015-12-29 2016-03-30 浙江金石包装有限公司 Covering film for medicinal PTP (press through packaging) and preparation method of covering film
CN105440998A (en) * 2015-11-26 2016-03-30 河南豫冠化工科技开发有限公司 Low-temperature fast-curing epoxy resin adhesive and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105440998A (en) * 2015-11-26 2016-03-30 河南豫冠化工科技开发有限公司 Low-temperature fast-curing epoxy resin adhesive and preparation method thereof
CN105385364A (en) * 2015-12-28 2016-03-09 青岛文晟汽车零部件有限公司 Sealant for electrical apparatus insulation
CN105437695A (en) * 2015-12-29 2016-03-30 浙江金石包装有限公司 Covering film for medicinal PTP (press through packaging) and preparation method of covering film

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161116

WD01 Invention patent application deemed withdrawn after publication