CN106057791A - System-level packaging chip and preparation method thereof and device comprising the same - Google Patents
System-level packaging chip and preparation method thereof and device comprising the same Download PDFInfo
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- CN106057791A CN106057791A CN201610584959.3A CN201610584959A CN106057791A CN 106057791 A CN106057791 A CN 106057791A CN 201610584959 A CN201610584959 A CN 201610584959A CN 106057791 A CN106057791 A CN 106057791A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83024—Applying flux to the bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/8321—Applying energy for connecting using a reflow oven
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H01L2224/83815—Reflow soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/858—Bonding techniques
- H01L2224/85801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92147—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/02—Terminal devices
- H04W88/06—Terminal devices adapted for operation in multiple networks or having at least two operational modes, e.g. multi-mode terminals
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- Microelectronics & Electronic Packaging (AREA)
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- Computer Networks & Wireless Communication (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
The present invention relates to the microelectronic field, and discloses a system-level packaging chip and a preparation method thereof and a device comprising the same. The chip comprises a microcontroller processing unit and a safety chip unit configured to perform encryption of the signals outputted by the microcontroller processing unit. The safety chip unit is packaged in the system-level packaging chip to perform encryption of the signals outputted by the microcontroller processing unit so as to ensure the data safety.
Description
Technical field
The present invention relates to microelectronic, in particular it relates to a kind of system in package chip, comprise this system in package core
The equipment of sheet and the preparation method of this system in package chip.
Background technology
Internet of Things (Internet of Things) is the important component part of generation information technology, and Internet of Things is exactly thing
The Internet that thing is connected.It utilizes the communication technology such as localized network or the Internet sensor, controller, machine, personnel and thing
It is linked togather Deng by the way of new, forms people and be connected with thing with thing, thing, it is achieved information-based, remote management and control and intellectuality
Network.It is a kind of Ubiquitous Network set up on the internet.The important foundation of technology of Internet of things and core are still interconnections
Net, by various wired and wireless network and the Internet converged, passes real-time and accurately by the information of object.At Internet of Things
On the information of sensor timing acquiring need to be transmitted by network, owing to its quantity is the hugest, define magnanimity information,
In transmitting procedure, in order to ensure correctness and the promptness of data, it is necessary to adapt to various heterogeneous network and agreement.
Along with the Internet of Things continuous demand to chips such as high integration, super-small and super low-power consumptions, and chip and
The continuous progress of mechanics of communication, networked devices needs more functional chip is encapsulated in system in package (SiP) the inside,
Estimate that the Internet of Things intelligent domestic of 80% and wearable device will use SiP module in the time of following 5 to 10 years, because of
Smaller for SiP, there is more preferable resistance to mechanical and chemical attack ability, it is possible to notable shorten product development and put on market
In the cycle, less radio-frequency performance is more stable, the more high plurality of advantages of reliability.
Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things.This SiP module comprises BB/MAC/
PHY processing unit 100, RF front-end module 102, wave filter 110, wave filter 112, agitator 106, agitator 108, Yi Jicun
Storage 104.BB/MAC/PHY processing unit 100 is for transmitting or receiving and process signal.Radio-frequency module 102 is connected to BB/
MAC/PHY processing unit 100, for processing the agreement of radiofrequency signal and radio frequency transmission.BB/MAC/PHY processing unit 100 comprises
Transmission/reception the mode being connected to RF front-end module 102 selects port, makes BB/MAC/PHY processing unit 100 can determine one
Processing mode.Memory connects 104 and is connected to BB/MAC/PHY processing unit 100, and wherein this memory can be non-volatile (non-
Volatile) memory.RF front-end module 102 comprises first antenna port and the second antenna port, to be connected to first day
Line and the second antenna.Therefore, BB/MAC/PHY processing unit 100 comprises the antenna diversity selection end being connected to radio-frequency front-end 102
Mouthful, make the BB/MAC/PHY processing unit 100 can be to select an antenna diversity mode.BB/MAC/PHY processing unit 100 also comprises
Bluetooth port, to be connected to bluetooth module.BB/MAC/PHY processing unit 100 inclusion region bus port is to be connected to a region
Bus.In the prior art, universal input/output device (GPIO), combined testing action group adapter (JTAG
Connector), first value configuration, field bus, compact flash memory and secure digital input and output/universal serial convergence periphery
Interface (SDIO/GSPI) is respectively connecting to the corresponding connectivity port of BB/MAC/PHY processing unit 100, sets in advance performing it
Fixed function.
But, along with Internet of Things is to the chip continuous demand in its various aspects of performance, the SiP module shown in Fig. 1 is with more
More it is difficult to meet the demand of Internet of Things.This area need a kind of can be at aspect of performance more than the SiP module shown in Fig. 1.
Summary of the invention
It is an object of the invention to provide a kind of system in package chip, the equipment comprising this system in package chip and be somebody's turn to do
The preparation method of system in package chip, it can show and existing SiP module better performance.
To achieve these goals, the present invention provides a kind of system in package chip for household electrical appliance, and this is system-level
Encapsulation chip comprises: microcontroller processing unit, and this system in package chip also comprises: safety chip unit, for described
The signal that microcontroller processing unit is exported is encrypted.
Wherein, this system in package chip also comprises: RF front-end module；Analog-digital converter and digital to analog converter；Micro-control
Device processing unit processed；And Wifi BB/MAC/PHY unit, be connected with described microcontroller processing unit, be used for performing below
One or more in operation: digital-to-analogue will be carried out from the signal of described microcontroller processing unit via described digital to analog converter
After conversion, sent by described RF front-end module；And receive by the reception of described RF front-end module and by described
Analog-digital converter carries out the signal after analog digital conversion, and transmits the signal to described microcontroller processing unit.
Wherein, this system in package chip also comprises: coupling and wave filter, is connected to described RF front-end module with described
Between the antenna of system in package chip exterior.
Wherein, this system in package chip also comprises: system bus unit, described microcontroller processing unit and described peace
Full chip unit is connected via this system bus unit.
Wherein, this system in package chip also comprises peripheral interface, is connected to described microcontroller processing unit.
Wherein, described peripheral interface comprise following one or more: universal asynchronous receiving-transmitting transmitter UART interface；Outside serial
If interface SPI；Universal input/output GPIO interface；And twin wire universal serial bus I2C interface.
Wherein, this system in package chip also comprises: BT BB/MAC/PHY processing unit, and being used for will be from described micro-control
After the signal of device processing unit processed carries out digital-to-analogue conversion via described digital to analog converter, sent by described RF front-end module
Go out；And/or receive by RF front-end module reception and carried out the signal after analog digital conversion by described analog-digital converter, and
Transmit the signal to described microcontroller processing unit.
Wherein, this system in package chip also comprise following one or more: temperature sensor, for by Temperature Quantity change
For the signal of telecommunication, and this signal of telecommunication is sent to by described microcontroller processing unit；And humidity sensor, for by humidity amount
Be converted to the signal of telecommunication, and this signal of telecommunication is sent to by described microcontroller processing unit.
Wherein, this system in package chip also comprises: infrared ray sensor, is used for producing whether reaction exists human body or dynamic
The signal of telecommunication that thing is movable, and this signal of telecommunication is sent to by described microcontroller processing unit.
Wherein, this system in package chip also comprises: the first agitator, for producing the first frequency of oscillation, for described
Other modules in system in package chip use at normal manipulation mode；And second agitator, for producing the second vibration
Frequency, uses at electricity-saving operation mode for other modules in described system in package chip.
Wherein, this system in package chip also comprise following one or more: flash memory access memorizer, with described microcontroller
Device processing unit is connected；And random access memory, it is connected with described microcontroller processing unit.
Wherein, this system in package chip also comprises Power Management Unit, in described system in package chip
Electricity consumption module for power supply.
Correspondingly, the present invention also provides for a kind of equipment comprising said system level encapsulation chip, and this equipment can include following
One or more: wearable device, household electrical appliance and Intelligent illumination device.
Correspondingly, the present invention also provides for a kind of method preparing said system level encapsulation chip, and the method includes: to PCB
Substrate carries out paste solder printing, tin cream print is placed on the pad of pcb board；The pcb board that print is equipped with tin cream carries out chip attachment；Right
The pcb board being pasted with chip carries out Reflow Soldering, so that chip is fixed on described pcb board；To the PCB being fixed with described chip
Plate carries out nude film welding and epoxy cure, so that nude film is fixed on described pcb board；And to being fixed with described chip
And the pcb board of nude film carries out go between welding, injection mo(u)lding, injection mo(u)lding after-hardening and coating electro-magnetic screen layer, thus produce
Described system in package chip.
Wherein, before PCB substrate is carried out paste solder printing, the method also includes preheating described PCB substrate.
Wherein, after the pcb board being pasted with chip is carried out Reflow Soldering, the method also includes: after Reflow Soldering
Pcb board is carried out, the scaling powder of residual during to remove Reflow Soldering；And the PCB substrate after cleaning is dried.
Wherein, the welding that goes between is carried out after described pcb board is carried out epoxy cure and/or to described pcb board
After, the method also includes: described pcb board is carried out plasma cleaning.
Wherein, carrying out described pcb board between injection mo(u)lding after-hardening and coating electro-magnetic screen layer, the method also includes
Below one or more: pcb board is carried out laser marking, integrated circuit testing, cuts and dry.
Wherein, to described pcb board coating electro-magnetic screen layer after, the method also include following one or more: to institute
State pcb board and carry out system level testing, Defect Scanning, drying and tape package.By technique scheme, by system-level
Encapsulation safety chip unit in encapsulation chip, the signal that can be exported microcontroller processing unit is encrypted, thus ensures
Information Security.
Other features and advantages of the present invention will be described in detail in detailed description of the invention part subsequently.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and constitutes the part of description, with following tool
Body embodiment is used for explaining the present invention together, but is not intended that limitation of the present invention.In the accompanying drawings:
Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things；
The block chart of the SiP module that Fig. 2 provides for one embodiment of the invention；
The block chart of the SiP module that Fig. 3 provides for another embodiment of the present invention；
The fabrication processing figure of the SiP module that Fig. 4 provides for one embodiment of the invention；And
Fig. 5 for another embodiment of the present invention provide the fabrication processing figure of SiP module.
Description of reference numerals
100 BB/MAC/RF processing unit 102 radio-frequency front-ends
104 memory 106 first agitators
108 second agitator 110 wave filter
112 wave filter 200 MCU
201 system bus unit 202 FLASH
203 RAM 204 WiFi BB/MAC/PHY unit
205 BT BB/MAC/PHY unit 206 analog-digital converters
207 digital to analog converter 208 RF front-end modules
209 coupling and wave filter 210 peripheral interfaces
211 Temperature Humidity Sensor 212 Power Management Unit
213 first agitator 214 second agitators
215 infrared sensor 216 safety chip unit
Detailed description of the invention
Below in conjunction with accompanying drawing, the detailed description of the invention of the present invention is described in detail.It should be appreciated that this place is retouched
The detailed description of the invention stated is merely to illustrate and explains the present invention, is not limited to the present invention.
The block chart of the SiP module that Fig. 2 provides for one embodiment of the invention.As in figure 2 it is shown, one embodiment of the invention provides
SiP module comprise: microcontroller processing unit (Mirco Controller Unit；MCU)200；And safety chip unit
216, it is encrypted for the signal that described MCU 200 is exported.
This safety chip is a to be applied to the low-power consumption of USBKEY, low cost, high security, multi-functional code core
Sheet.This chip has a key management on sheet (include password generate, store, renewal etc.), RSA, ECC (SM2) coprocessor in sheet,
Realize digital signature and authentication, SM1, SM4, DES (TDES) hardware algorithm core in sheet, SM3, SHA hardware algorithm core in sheet,
Support the various communication interfaces such as USB, SPI, UART.Safety chip is by linking together with MCU 200.Data pass through safe core
Sheet carries out retransmiting away after safety is encrypted.Receiving terminal also has corresponding decryption method to decipher, it is ensured that the safety of data transmission.
The block chart of the SiP module that Fig. 3 provides for another embodiment of the present invention.Below in conjunction with Fig. 3 to this another embodiment
It is described further.It should be noted that this embodiment illustrated in fig. 3 comprises number of modules or unit, these modules or unit
Can form individually or in any combination be comprised in SiP module.For the mould being discussed in detail in above-mentioned embodiment illustrated in fig. 2
Block or unit, repeat no more in this.
In the embodiment shown in fig. 3, SiP module also comprises: RF front-end module 208；Analog-digital converter 206 and digital-to-analogue turn
Parallel operation 207；System bus unit 201；And Wireless Fidelity (WiFi) base band/medium plan/radio frequency (Base Band/
Media Access Control/Radio Frequency；BB/MAC/PHY) unit 204, process single with described microcontroller
Unit (Mirco Controller Unit；MCU) 200 are connected via described system bus unit 201, are used for performing following operation
In one or more: the signal from described microcontroller processing unit 200 is counted via described digital to analog converter 207
After mould conversion, sent by described RF front-end module 208；And reception is received by described RF front-end module 208,
And carried out the signal after analog digital conversion by described analog-digital converter 206, and transmit the signal to the process of described microcontroller
Unit 200.
In the present embodiment, MAC 200 can use ARMCortex-M4 processor, and this processor cores is at Cortex-
Growing up on the basis of M3 kernel, its performance improves 20% than Cortex-M3.Floating-point, DSP, parallel computation are newly increased
Deng.Effective and wieldy control and the Digital Signals market of signal processing function mixing in order to satisfied needs.It is high
The signal processing function of effect combines with the low-power consumption of Cortex-M processor family, low cost and wieldy advantage.
Cortex-M4 provides unrivaled function, controls 32 integrated with leading Digital Signal Processing to meet need
Will the market of very high energy efficiency rank.Cortex-M4 processor uses single clock cycle multiply-accumulate (MAC) list of an extension
Unit, single-instruction multiple-data (SIMD) instruction optimized, saturation arithmetic instruction and an optional single-precision floating point unit (FPU).
These functions are based on the innovative technology of performance ARMCortex-M series processors feature, including risc processor kernel, high
Performance 32 bit CPU, there is deterministic computing, low latency 3 stage pipeline, up to 1.25DMIPS/MHz；Thumb-2 instruction set,
The optimal mixing of 16/32 bit instruction, less than 8 equipment 3 times code size, performance is had no adverse effect, it is provided that optimal
Code density；Low-power consumption mode, integrated sleep state support, multi-power domain, software based on framework control；In nested vector
Disconnected controller (NVIC), low latency, low jitter interrupt response, need not assemble programming, the interruption service example write with pure C language
Journey, can complete outstanding interrupt processing；Instrument and RTOS support, widely third party's instrument support, Cortex microcontroller soft
Part interface standard (CMSIS), to greatest extent increase software achievement are reused；CoreSight debugging and tracking, JTAG or 2 pin strings
Line debugging (SWD) connects, supports multiprocessor, supports real-time tracking.Additionally, this processor additionally provide one optional in
Deposit protected location (MPU), it is provided that the debugging/tracking function of low cost and integrated resting state, to increase motility.Embedded
Developer will quickly be designed and released the end product attracted people's attention, and possesses most functions and minimum power consumption and chi
Very little.
In the present embodiment, WiFi BB/MAC/PHY processing unit 204 can be 2.4/5GHz frequency modulation, Baseband processor
(baseband processor), multimedia agreement medium plan (multi-media protocol media access
Control) or central authorities process (central processing) unit.WiFi BB/MAC/PHY processing unit 204 has height
Usefulness, power saving and be applicable to the characteristic such as intelligent domestic and Internet of Things application device, and wherein this intelligent domestic and Internet of Things
Net application device can be dehumidifier, air-conditioning, depurator, air cooler, fan, warmer, refrigerator, rotary drum washing machine, rolling
Cylinder washing machine, electric heater, electric cooking pot, electric cooker, mobile phone, mobile phone, personal digital assistant (PDA), voice-over-net transmission
(VoIP), MP3/MP4 player.The transmitter of WiFi BB/MAC/PHY processing unit 204 combines homophase and quadrature baseband letter
Number, and convert the signal into the frequency to be sent.The receptor of WiFi BB/MAC/PHY processing unit 204 uses double frequency that changes to tie
Structure and be not required to the plug-in intermediate-frequency filter of chip.Frequency synthesizer is supported by frequency defined in 802.11 specifications.WiFi BB/
MAC/PHY processing unit 204 orthogonal frequency domain to be supported multiplexing (Orthogonal Frequency Division
Multiplexing；OFDM), and medium plan also support IEEE 802.11 wireless medium access control agreement and
802.11i confidentiality (security).
WiFi BB/MAC/PHY processing unit 204 can comprise a system bus port so that this WiFi BB/MAC/PHY
Processing unit can be connected with microcontroller processing unit 200 by system bus port, it is thus possible to provides high speed operation fortune
OK.System bus is only by the assistance of storage buffer, and not by any bridger (bridge) and/or the assistance of I/O interface, counts
According to, address and control signal along advanced high-performance system bus (Advanced High Speed Buses；AHB) line connects
To microcontroller processing unit.Compared with the processing speed of system bus, the processing speed of bridger and/or I/O interface is the most relatively
Low.One advantage of system bus is high data throughput (Throughput), and the data processing amount in the unit interval is significantly larger than
The data processing amount of SDIO/SPI.System bus simplifies the design of hardware.It is easy to use Modular Structure Design method, towards
As long as the chip design of bus makes MCU plug-in unit, memory card and I/O plug-in unit etc. according to the rules, they are connected into bus
Just can work, without the detailed operation considering bus.System bus simplifies system structure simultaneously.Whole system structure is clear
Clear.Line is few, and base plate line can printing.System bus makes system expansibility good.One is that scale expands, and scale only expands
Only need to insert some plug-in units with type more.Two is that function expands, and function expansion needs only to insert according to bus standard design is new
Part, plug-in unit inserts the position of machine does not often have strict restriction.System bus is connectable to microcontroller storage bus, or directly
Receive microcontroller processing unit in succession.System bus makes system update performance good.Because MCU, memorizer, I/O interface etc.
All be suspended in bus by bus regulation, as long as thus bus design is appropriate, can at any time along with processor chip and
Other design new plug-in unit about the progress of chip, and new plug-in unit is inserted on base plate and is updated system, other plug-in units and the end
Plate line typically need not change.
RF front-end module 208 is connected to WiFi BB/MAC/PHY processing unit 204, to connect by analog-digital converter 206
The collection of letters number.WiFi BB/MAC/PHY processing unit 204 is connected to RF front-end module 208 by digital to analog converter 207, to send out
The number of delivering letters.WiFi BB/MAC/PHY processing unit 204 comprise transmission/reception mode select port, delivery port, receiving port,
And power control terminal mouth.This transmission/reception mode selects port respectively by digital to analog converter 207/ analog-digital converter 206 even
It is connected to the transmission/receiving port of radio-frequency front-end 208, makes WiFi BB/MAC/PHY processing unit 204 can control radio-frequency front-end mould
Block 208, with the signal in processing in transmission or receiving.
Coupling and wave filter 209 can separately exist in the SiP module of this embodiment, also can be included in RF front-end module
In 208.Antenna, by coupling and wave filter 209, is connected to the connectivity port of RF front-end module 208, and it provides a road
Footpath, to transmit/to receive signal to antenna.Therefore, the signal of WiFi BB/MAC/PHY processing unit 204 is via digital to analog converter
207, RF front-end module 208, coupling and wave filter 209 and antenna are launched.Equally, WiFi BB/MAC/PHY processes single
Unit 204 also can receive signal via antenna, coupling and wave filter 209, RF front-end module 208 and analog-digital converter 206.
In this embodiment, SiP module also can comprise: bluetooth (BT) BB/MAC/PHY processing unit 205, for will be from
After the signal of described MCU 200 carries out digital-to-analogue conversion via described digital to analog converter 207, by described RF front-end module
208 send；And/or reception is received by RF front-end module 208 and is carried out analog digital conversion by described analog-digital converter 206
Signal afterwards, and transmit the signal to described MCU 200.
In the present embodiment, this BTBB/MAC/PHY processing unit 204 can be 2.4/5GHz frequency modulation, Baseband processor
(baseband processor), multimedia agreement medium plan (multi-media protocol media access
Control) or central authorities process (central processing) unit.This BTBB/MAC/PHY processing unit 204 has low merit
Consumption, low cost, high benefit and be applicable to mouse, earphone, printer, wireless microphone, keyboard, personal digital assistant
(PDA), smart mobile phone, mobile phone, panel computer and multimedia player.BTBB/MAC/PHY processing unit 204 compatibility is also
Support bluetooth 4.0+BLE agreement, bluetooth 4.1 agreement, bluetooth 4.2 agreement completely.
RF front-end module 208 is connected to BT BB/MAC/PHY processing unit 205 by analog-digital converter 206, to receive
Signal.BT BB/MAC/PHY processing unit 205 is connected to RF front-end module 208, to send letter by digital to analog converter 207
Number.BT BB/MAC/PHY processing unit 205 comprises transmission/reception mode and selects port, delivery port, receiving port, Yi Ji electricity
Source controls port.This transmission/reception mode selects port to be connected to penetrate by digital to analog converter 207/ analog-digital converter 206 respectively
Frequently transmission/the receiving port of front-end module 208, makes BT BB/MAC/PHY processing unit 205 can control RF front-end module
208, with the signal in processing in transmission or receiving.
As it is shown on figure 3, in this embodiment, SiP module also can comprise peripheral interface, is connected to described system bus list
Unit.This peripheral interface comprise following one or more: universal asynchronous receiving-transmitting transmitter UART interface；Serial peripheral equipment interface SPI；Logical
Use input/output GPIO interface；And twin wire universal serial bus I2C interface.Certainly, the present invention is not limited to this, also can basis
Need to arrange other interfaces.Thereby, all kinds of peripheral hardware can be facilitated to access SiP module.
As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: temperature sensor, be used for
Temperature Quantity is converted to the signal of telecommunication, and sends to by described microcontroller processing unit via described system bus unit；And
Humidity sensor, for humidity amount is converted to the signal of telecommunication, and sends to by described microcontroller via described system bus unit
Device processing unit.This temperature sensor and humidity sensor are shown generally as Temperature Humidity Sensor 211 in figure 3.
Specifically, Temperature Humidity Sensor 211 refers to Temperature Quantity and humidity amount are converted into easy measured process
The equipment of the signal of telecommunication or device, Temperature Humidity Sensor is usually measures Temperature Quantity and relative humidity amount.In relative humidity i.e. gas
Steam vapour amount (water vapor pressure) contained by (usually in air) and saturated steam amount (saturated vapor under its air same case
Pressure) percentage ratio.
Humidity sensor can be capacitance type humidity sensor, this capacitance type humidity sensor by polymer, finger electrodes and
Silicon substrate is constituted, and have employed distribution of electrodes and the coating technique of uniqueness so that induction apparatus not only will not aoxidize, moreover it is possible to quickly receives water
Molecule.Temperature sensor can be made up of the PNP transistor being in diode mode, and during variations in temperature, output voltage will become
Change.
Generally speaking, the energy consumption of Temperature Humidity Sensor is 80 μ W (at 12,3V, under the conditions of 1 measurement/second)；RH works
Scope is 0-100%RH；Calibrate completely, linearisation, and the numeral output of temperature-compensating；Wide power voltage scope, from 2.4 to
5.5V；I2C interface communication speed is up to 1MHz and carries 2 optional addresses of user；Typical accuracy reaches 2%RH and 0.3 DEG C；Start
Speed is fast and the time of measurement is short；Long-term work is reliable and stable, temperature year drift value < 0.03 degree/year；Humidity year drift value <
0.25%RH/year is long-lasting and concordance is good；Temperature and moisture sensors integration, it is simple to produce, saves PCB surface and amasss and produce
Product miniaturization.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: infrared ray sensor 215, is used for producing reaction and is
The no signal of telecommunication that there is human body or animal activity, and send to being processed by described microcontroller single via described system bus unit
Unit.
This infrared ray sensor can be Thermoelectric Infrared Sensor, and this Thermoelectric Infrared Sensor includes optical system
System, detecting element and change-over circuit.Pyroelectric infrared sensor is thermally sensitive sensor.It is by ceramic oxide or pressure
Transistor element forms, and makes electrode on two surfaces of element, when in the range of Sensor monitoring, temperature has the change of Δ T, and heat
Release electrical effect and can produce electric charge Δ Q on two electrodes, produce a faint voltage Δ V the most between electrodes.Due to it
Output impedance high, have a field effect transistor to carry out impedance transformation in the sensor.Electric charge Δ Q produced by pyroelectric effect
Can be combined by the ion in air and disappear, i.e. when ambient temperature-stable is constant, Δ T=0, then sensor is without output.When
Human body enters detection zone, because human body temperature and ambient temperature have difference, produces Δ T, then has Δ T to export；If human body enters detection
Behind district motionless, then temperature is not changed in, and sensor does not the most output.So this sensor for human detection or the work of animal
Dynamic sensing.
Pyroelectric infrared sensor sensitivity up to 3.6mVpp and there is splendid signal to noise ratio；Height during variations in temperature is steady
Qualitative；It is suitable for the reflow soldering of 240 DEG C of peak values；The ken reaches ± 50 °；Wide supply voltage scope reaches 2 to 15V；To outside
The high noise immunity of noise (vibration, RFI etc.).
As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: flash memory access memorizer
(flash) 202, it is connected with described MCU 200 and described system bus unit 201；And random access memory (RAM) 203,
With described MCU 200 and described system bus unit 201.Described MCU 200 can to this flash memory access memorizer 202 and/or with
Machine access memorizer 203 is written and read operation.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: the first agitator 213, for producing the first vibration
Frequency, uses at normal manipulation mode for other modules in described system in package chip；And second agitator 214,
For producing the second frequency of oscillation, use at electricity-saving operation mode for other modules in described system in package chip.
Such as, the first agitator 213 can produce the first frequency of oscillation, and this first frequency of oscillation is sent to WiFi BB/
MAC/PHY unit 204, BT BB/MAC/PHY unit 205, infrared sensor 215, Temperature Humidity Sensor 211 etc. make for it
With.In the present embodiment, the first frequency of oscillation is about 40MHz.Second agitator 214 can produce the second frequency of oscillation, is about
32KHz, this second frequency of oscillation also can be transferred into WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205,
Infrared sensor 215, Temperature Humidity Sensor 211 etc. use for it.WiFi BB/MAC/PHY unit 204, BT BB/MAC/
PHY unit 205, infrared sensor 215, Temperature Humidity Sensor 211 etc. work in 40MHz when general operation mode, in power saving
Then work in 32kHz during mode.
As it is shown on figure 3, in this embodiment, SiP module also can comprise: Power Management Unit 212, for described system
Electricity consumption module for power supply in level encapsulation chip, such as WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, red
Outer sensor 215, Temperature Humidity Sensor the 211, first agitator 213 and the second agitator 214 etc..
In the present embodiment, WiFi BB/MAC/PHY processing unit 204 can be intelligent domestic and the list of Internet of Things application
One chip, MCU 200 can be intelligent domestic and the one chip of Internet of Things application, and Temperature Humidity Sensor 211 can be wisdom
Household and Internet of Things application one chip, infrared sensor unit 215 can be intelligent domestic and Internet of Things application single
Chip, such as complementary metal oxide layer semiconductor (Complementary Metal Oxide Semiconductor；CMOS)
Chip.
Fig. 4 is the fabrication processing figure of the SiP module of one embodiment of the invention.As shown in Figure 4, one embodiment of the invention
Also providing for a kind of method preparing said system level encapsulation chip, the method includes: PCB substrate is carried out paste solder printing, by stannum
Cream print is placed on the pad of pcb board；The pcb board that print is equipped with tin cream carries out chip attachment, and this chip is the packaged of band pin
Chip；The pcb board being pasted with chip is carried out Reflow Soldering, so that chip is fixed on described pcb board；Described to being fixed with
The pcb board of chip carries out nude film welding and epoxy cure, so that nude film is fixed on described pcb board, this nude film is not
Encapsulated and without pin, and fix through epoxy resin, the ability of the antidetonation of SiP can be made to be better than general printed circuit
Plate；And the welding that carries out the pcb board being fixed with described chip and nude film going between, injection mo(u)lding, injection mo(u)lding after-hardening and
Coating electro-magnetic screen layer, thus produce described system in package chip.
Produce, therefore owing to having stress in injection molding process during injection ring epoxy resins (Molding Compound)
Chip packaged in above-mentioned SiP module and nude film must have certain resistance to compression and thermostability.Multiple bare chip or mould can be taked
Block carries out arrangement and assembles, can use the 3D encapsulation technology of stacking to increase the quantity of wafer or module, thus in vertical direction
Add the number of plies that can place wafer, further enhance the Function Integration Mechanism ability of sip technique.And interior bonds technology can be single
Pure line bonding (Wire Bonding), it is possible to use chip bonding (Flip Chip), it is possible to the two is used with.
Therefore multiple wafer package self-organizing system in single packaging body can be had height by the SiP prepared in this way
Conformability and miniaturization characteristic, be suitably applied the electronic product of the characteristics such as little, multi-functional, the low-power consumption of volume, the most wearable
Equipment (such as, intelligent watch, bracelet, glasses, shoes etc.), household electrical appliance (such as, dehumidifier, air-conditioning, depurator, air cooler,
Fan, warmer, refrigerator, rotary drum washing machine, roller washing machine, electric heater, electric cooking pot, electric cooker etc.) and intelligent lighting
Equipment.And, make into the most independent potted element to integrate with sip technique, just can reduce encapsulation volume to save sky
Between, and shorten interelement connection line and make resistance reduce, promote electrical effect, finally present miniature package and replace sheet
The advantage of circuit board, the most still can maintain wafer original function out of the ordinary.Additionally, because SIP is that interlock circuit is complete with packaging body
Cladding, therefore can increase resist chemical and resistance to stress (Anti-stress) ability of circuit board, and can improve product entirety can
By property, life of product also can be promoted.
Fig. 5 is the fabrication processing figure of the SiP module of another embodiment of the present invention.Below in conjunction with Fig. 5, the present invention is described
The fabrication processing of SiP module.First, PCB substrate is preheated；Then, PCB substrate is carried out paste solder printing, will
Tin cream print is placed on the pad of pcb board；Afterwards, pcb board print being equipped with tin cream carries out chip attachment so that the contact on chip
Being wired on the pin of pcb board, these pins are connected with the foundation of other devices further through the wire on pcb board, this core
Sheet mounting operation can use Fuji chip mounter to complete；Afterwards, the pcb board being pasted with chip carries out Reflow Soldering, in order to chip can
It is soldered in PCB substrate；Afterwards, the scaling powder of residual when removing Reflow Soldering；Afterwards, PCB substrate drying is again carried out；It
After, carry out nude film welding and epoxy cure；Afterwards, the epoxy resin of residual is removed by plasma cleaning；Afterwards, carry out
Lead-in wire welding, this lead-in wire welding operation can use K&S wire bonder to carry out；Afterwards, plasma cleaning is carried out；Afterwards, it is molded
Molding, this injection mo(u)lding operation can use the forming machines such as TOWA；After moulding, injection hardening is carried out；Afterwards, to chip
Carrying out laser marking, mark completes laggard line integrated circuit test (ICT), chip cutting, drying, electro-magnetic screen layer coating, should
Chip cutting can use the cutting machines such as DFD, and the coating of this electro-magnetic screen layer can use the coating machines such as LINCOTEC to carry out；Afterwards, enter
Row system level testing and Defect Scanning, to be confirmed whether to have wafer damage, carry out drying, last tape package afterwards.Afterwards, become
Product OQC OQC, and transport away after finished product OQC is qualified.
After above-mentioned part steps, need to carry out visual inspection (FVI) or automated optical inspection (AOI), and inspection qualified it
After carry out to next step just now.The above step flow process of the present invention is the technological process of innovation, to ensureing wireless fidelity systems
The performance of level encapsulating products has important effect.Product is made to have compact, multi-functional, the characteristic of low-power consumption.
The Form Factor of the present invention, its area is less than or much smaller than 150 square millimeters, and height is less than or is much smaller than 2.0 in the least
Rice, this highly comprises weld pad or soldered ball (soldering pads or balls) and isolation cover structure or shapes material (shield
Structure or molding material) thickness.The present invention also uses and is generally of six or four layers of (layer) lamination
Structure (stack-up structure), or the thin printed circuit board (PCB) of the most multilayer laminated structure is as substrate
(substrate), such as when using LTCC (Low Temperature Cofired Ceramic；LTCC) make
During for substrate, use 12 or the printed circuit board (PCB) of ten layer laminate structure.Surface then part (Surface Mount
Devices；SMDs), flip package part (Flip Chip Packaged Device) or other there is wafer-level package
The part of (Chip Scaled Package) was embedded in the upper strata copper film (top-side copper) of substrate in the past, and these
Part also can be embedded in lower floor's copper film (bottom-side copper) or internal layer copper film (inner-side according to design
copper)。
The SiP of the band Wi-Fi function prepared by the above-mentioned processing technology of the present invention and congenerous are with type Wi-Fi module
The comparison of index of correlation, either receiving sensitivity, or size, resistance to mechanical and chemical attack, waterproof and antidetonation, the present invention
The advantage of Wi-Fi SIP the most obvious, shown in table specific as follows:
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention is not limited to above-mentioned reality
Execute the detail in mode, in the technology concept of the present invention, technical scheme can be carried out multiple letter
Monotropic type, these simple variant belong to protection scope of the present invention.
It is further to note that each the concrete technical characteristic described in above-mentioned detailed description of the invention, at not lance
In the case of shield, can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to various can
The compound mode of energy illustrates the most separately.
Additionally, combination in any can also be carried out between the various different embodiment of the present invention, as long as it is without prejudice to this
The thought of invention, it should be considered as content disclosed in this invention equally.
Claims (20)
1. a system in package chip, it is characterised in that this system in package chip comprises: microcontroller processing unit,
It is characterized in that, this system in package chip also comprises:
Safety chip unit, is encrypted for the signal being exported described microcontroller processing unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
RF front-end module；
Analog-digital converter and digital to analog converter；
Wifi BB/MAC/PHY unit, is connected with described microcontroller processing unit, for perform one in following operation or
Many persons:
After carrying out digital-to-analogue conversion from the signal of described microcontroller processing unit via described digital to analog converter, by institute
State RF front-end module to send；And
Receive and received and carried out by described analog-digital converter the signal after analog digital conversion by described RF front-end module, and will
This signal sends to described microcontroller processing unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
Coupling and wave filter, be connected between the antenna of described RF front-end module and described system in package chip exterior.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises system
Bus unit, described microcontroller processing unit is connected via this system bus unit with described safety chip unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises periphery
Interface, is connected to described microcontroller processing unit.
System in package chip the most according to claim 5, it is characterised in that described peripheral interface comprise following one or
Many persons:
Universal asynchronous receiving-transmitting transmitter UART interface；
Serial peripheral equipment interface SPI；
Universal input/output GPIO interface；And
Twin wire universal serial bus I2C interface.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
BT BB/MAC/PHY processing unit, for turning from the signal of described microcontroller processing unit via described digital-to-analogue
After parallel operation carries out digital-to-analogue conversion, sent by described RF front-end module；And/or reception is connect by RF front-end module
Receive and carried out the signal after analog digital conversion by described analog-digital converter, and transmitting the signal to the process of described microcontroller
Unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises following
One or more:
Temperature sensor, for Temperature Quantity is converted to the signal of telecommunication, and sends this signal of telecommunication to being processed by described microcontroller
Unit；And
Humidity sensor, for humidity amount is converted to the signal of telecommunication, and sends this signal of telecommunication to being processed by described microcontroller
Unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
Whether infrared ray sensor, exist the signal of telecommunication of human body or animal activity, and sent by this signal of telecommunication for producing reaction
To by described microcontroller processing unit.
System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:
First agitator, for producing the first frequency of oscillation, for other modules in described system in package chip normally
Operator scheme uses；And
Second agitator, for producing the second frequency of oscillation, for other modules in described system in package chip in power saving
Operator scheme uses.
11. system in package chips according to claim 1, it is characterised in that this system in package chip also comprise with
Lower one or many persons:
Flash memory access memorizer, is connected with described microcontroller processing unit；And
Random access memory, is connected with described microcontroller processing unit.
12. system in package chips according to claim 1, it is characterised in that this system in package chip also comprises:
Power Management Unit, for the electricity consumption module for power supply in described system in package chip.
13. 1 kinds of equipment comprised according to the system in package chip described in claim any one of claim 1-12.
14. equipment according to claim 13, it is characterised in that this equipment include following one or more: wearable set
Standby, household electrical appliance and Intelligent illumination device.
15. 1 kinds of methods prepared according to the system in package chip described in claim any one of claim 1-12, should
Method includes:
PCB substrate is carried out paste solder printing, tin cream print is placed on the pad of pcb board；
The pcb board that print is equipped with tin cream carries out chip attachment；
The pcb board being pasted with chip is carried out Reflow Soldering, so that chip is fixed on described pcb board；
The pcb board being fixed with described chip is carried out nude film welding and epoxy cure, so that nude film is fixed on described PCB
On plate；And
The pcb board being fixed with described chip and nude film is carried out go between welding, injection mo(u)lding, injection mo(u)lding after-hardening and coating
Electro-magnetic screen layer, thus produce described system in package chip.
16. methods according to claim 15, it is characterised in that before PCB substrate is carried out paste solder printing, the method
Also include described PCB substrate is preheated.
17. methods according to claim 15, it is characterised in that the pcb board being pasted with chip is carried out Reflow Soldering it
After, the method also includes:
Pcb board after Reflow Soldering is carried out, the scaling powder of residual during to remove Reflow Soldering；And
PCB substrate after cleaning is dried.
18. methods according to claim 15, it is characterised in that after described pcb board is carried out epoxy cure
And/or after described pcb board carries out lead-in wire welding, the method also includes:
Described pcb board is carried out plasma cleaning.
19. methods according to claim 15, it is characterised in that described pcb board is carried out injection mo(u)lding after-hardening with
Coating electro-magnetic screen layer between, the method also include following one or more:
Pcb board is carried out laser marking, integrated circuit testing, cuts and dry.
20. methods according to claim 15, it is characterised in that after to described pcb board coating electro-magnetic screen layer, should
Method also include following one or more:
Described pcb board is carried out system level testing, Defect Scanning, drying and tape package.
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| CN201610584959.3A CN106057791A (en) | 2016-07-22 | 2016-07-22 | System-level packaging chip and preparation method thereof and device comprising the same |
Applications Claiming Priority (1)
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|---|---|---|---|
| CN201610584959.3A CN106057791A (en) | 2016-07-22 | 2016-07-22 | System-level packaging chip and preparation method thereof and device comprising the same |
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Cited By (1)
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