CN106019855B - 基于衍射的重叠量测工具和方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 127
- 239000002131 composite material Substances 0.000 claims abstract description 114
- 238000005259 measurement Methods 0.000 claims abstract description 31
- 230000005855 radiation Effects 0.000 claims description 41
- 230000003287 optical effect Effects 0.000 claims description 35
- 238000000059 patterning Methods 0.000 claims description 34
- 238000001514 detection method Methods 0.000 claims description 26
- 230000000007 visual effect Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 238000003909 pattern recognition Methods 0.000 claims description 7
- 230000000737 periodic effect Effects 0.000 claims description 5
- 230000000644 propagated effect Effects 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims 4
- 239000004744 fabric Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 238000010276 construction Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 240000006909 Tilia x europaea Species 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
- G03F7/706849—Irradiation branch, e.g. optical system details, illumination mode or polarisation control
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/0274—Photolithographic processes
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- Manufacturing & Machinery (AREA)
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
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Abstract
一种用于确定在衬底上的第一光栅和第二光栅之间的重叠误差的方法,所述第二光栅位于第一光栅的顶部上,第二光栅具有与第一光栅大致相同的节距,第二光栅和第一光栅形成复合光栅,所述方法包括:提供第一照射束,用于在入射角度下沿着所述衬底的表面在第一水平方向上照射所述复合光栅;和测量来自所述复合光栅的第一级衍射束的第一强度;提供第二照射束,用于在所述入射角度下沿着所述衬底的表面在第二水平方向上照射所述复合光栅,其中所述第二水平方向与所述第一水平方向相反;和测量来自所述复合光栅的负第一级衍射束的第二强度。
Description
本申请是申请日为2008年12月9日、申请人为ASML荷兰有限公司、中国专利申请号为200880121125.2、国际申请号为PCT/NL2008/050785的中国专利申请的分案申请。
相关申请的交叉引用
本申请要求于2007年12月17日申请的第61/006,073号美国临时申请的权益,通过引用在此处将其全部内容并入本文中。
技术领域
本申请涉及基于衍射的重叠量测工具和基于衍射的重叠量测的方法。
背景技术
光刻设备是一种将所需图案应用到衬底上(通常应用到所述衬底的目标部分上)的机器。例如,可以将光刻设备用在集成电路(IC)的制造中。在这种情况下,可以将可选地称为掩模或掩模版的图案形成装置用于生成待形成在所述IC的单层上的电路图案。可以将该图案转移到衬底(例如,硅晶片)上的目标部分(例如,包括一部分管芯、一个或多个管芯)上。典型地,经由成像将所述图案转移到在所述衬底上设置的辐射敏感材料(抗蚀剂)层上。通常,单个衬底将包含连续形成图案的相邻目标部分的网络。公知的光刻设备包括:所谓步进机,在所述步进机中,通过将整个图案一次曝光到所述目标部分上来辐射每一个目标部分;以及所谓扫描器,在所述扫描器中,通过辐射束沿给定方向(“扫描”方向)扫描所述图案、同时沿与该方向平行或反向平行的方向同步扫描所述衬底来辐射每一个目标部分。还可以通过将所述图案压印到所述衬底上,而将所述图案从所述图案形成装置转移到所述衬底上。
对于光刻工艺,图案在衬底上的后续层中的位置应当尽可能地精确,用于正确地限定衬底上的器件特征,所述衬底的特征全都应当具有在特定容许度内的尺寸。重叠误差(即在后续层之间的不匹配)应当在明确限定的容许度内,用以形成功能器件。
为此,重叠测量模块通常用于确定衬底上的图案与如在图案的顶部上的抗蚀剂层中所定义的掩模图案的重叠误差。
重叠测量模块典型地用光学装置进行所述测量。抗蚀剂层中的掩模图案的位置相对于衬底上的图案的位置通过测量来自被光源照射的光学标识的光学响应来确定。由光学标识产生的信号由传感器布置测量。通过使用传感器的输出可以获得重叠误差。典型地,重叠误差被测量所在的图案位于目标部分之间的划线中。
对于重叠量测来说已知有两种基本构思。
第一构思涉及基于图像测量重叠误差。将衬底上的图案的图像的位置与抗蚀剂层中的掩模图案的位置相比较。通过所述比较来确定重叠误差。测量重叠误差的示例是所谓的“箱中箱”结构,其中在外箱中的内箱的位置被相对于外箱的位置进行测量。
基于图像的重叠误差测量可能对于振动敏感,而且也对测量期间的聚焦的品质敏感。为此,基于图像的重叠误差测量可能在遭受振动的环境中是较不精确的,例如在轨道系统内。另外,基于图像的重叠测量可能易受光学装置中的像差的影响,其可能进一步地减小了测量的精度。
第二构思涉及基于衍射的重叠误差测量。第一光栅位于衬底上的图案层中,且第二光栅位于抗蚀剂层中,其节距大致与第一光栅的节距相同。第二光栅名义上位于第一光栅的顶部上。通过测量如由彼此叠加的第一和第二光栅产生的衍射图案的强度,可以获得对于重叠误差的测量。如果一些重叠误差出现在第一和第二光栅之间,那么这可以由衍射图案检测到。
在基于衍射的重叠误差测量中,因为从光栅周围的邻近区域反射的光会干扰衍射图案的强度水平,所以可以仅照射第一和第二光栅。然而,趋势是要实现管芯中的接近临界结构的重叠误差测量(但不一定在划线内)。此外,要求是减小光栅的尺寸,以便具有对于电路来说更大的可利用的面积。在一定程度上,这样的要求可能通过减小照射束的横截面来满足,所述照射束撞击到第一和第二光栅上,以便避免照射光栅外面的区域。然而,照射束的最小横截面主要由物理规律所限制(即由于衍射而受限制)。在下文中,使发生束的衍射的横截面尺寸将被称为衍射极限。
发明内容
期望具有一种改善的基于衍射的重叠误差测量系统和方法。
根据本发明的一个方面,提供了一种用于确定在衬底的表面上的第一图案和叠加到所述第一图案上的第二图案之间的重叠误差的方法,所述衬底包括在第一图案中的第一光栅和在所述第一光栅的顶部上的第二光栅,所述第二光栅具有与所述第一光栅的节距大致相同的节距,所述第二光栅和所述第一光栅形成第一复合光栅,所述方法包括:提供第一照射束,用于在入射角度下沿着所述衬底的表面在第一水平方向上照射至少所述第一复合光栅,所述衬底位于固定位置;测量来自所述第一复合光栅的第一级衍射束的第一强度;提供第二照射束,用于在所述入射角度下沿着所述衬底的表面在第二水平方向上照射至少所述第一复合光栅,其中所述第二水平方向与所述第一水平方向相反,所述衬底位于所述固定的位置;和测量来自所述第一复合光栅的负第一级衍射束的第二强度。
根据本发明的一个方面,所述方法还包括确定在所述第一强度和所述第二强度之间的强度差,所述强度差与在所述第一光栅和所述第二光栅之间的重叠误差成比例。
根据本发明的一个方面,所述第一照射束和第二照射束是公共的照射束的部分。
根据本发明的一个方面,所述公共的照射束具有环形横截面。
根据本发明的一个方面,所述入射角相对于所述衬底的表面是倾斜的,所述第一衍射束和所述负第一衍射束相对于所述表面的法线的衍射角小于所述入射角。
根据本发明的一个方面,所述入射角大致垂直于所述衬底的表面,所述方法包括:使用所述第一照射束作为所述第二照射束,测量来自所述第一复合光栅的所述第一级衍射束的第一强度的步骤和测量来自所述第一复合光栅的所述第一级衍射束的第二强度的步骤在所述第一照射束的提供期间被连续地实施。
根据本发明的一个方面,所述方法包括:在提供所述第一照射束时阻挡除了所述第一衍射级之外的衍射级辐射束;在提供所述第二照射束时阻挡除了所述负第一衍射级之外的衍射级辐射束。
根据本发明的一个方面,测量来自所述复合光栅的所述第一级衍射束的第一强度的步骤包括:通过模式识别检测仅由所述第一级衍射束获得的所述复合光栅的图像,且测量来自所述复合光栅的仅由所述负第一级衍射束获得的所述复合光栅的第二强度的步骤包括:通过模式识别检测仅由所述负第一级衍射束获得的所述复合光栅的图像。
根据本发明的一个方面,所述方法包括:在所述衬底上提供第二复合光栅,所述第二复合光栅由所述第一图案中的第三光栅和所述第一光栅的顶部上的第四光栅形成,所述第三光栅和所述第四光栅具有与所述第一和第二光栅的节距大致相同的节距,其中所述第一复合光栅被在偏移方向上沿着所述光栅方向偏置第一偏移,和所述第二复合光栅被在所述偏移方向上沿着所述光栅方向偏置第二偏移,所述第一偏移不同于所述第二偏移;提供第一照射束,用于在所述入射角度下沿着所述衬底的表面在第一水平方向上照射所述第二复合光栅,所述衬底位于固定位置;和测量来自所述第二复合光栅的第一级衍射束的第一强度;提供第二照射束,用于在所述入射角度下沿着所述衬底的表面在第二水平方向上照射所述第二复合光栅,和测量来自所述第二复合光栅的负第一级衍射束的第二强度。
根据本发明的一个方面,提供了一种检测系统,所述检测系统被配置以确定在衬底的表面上的第一图案和叠加到所述第一图案上的第二图案之间的重叠误差,所述检测系统包括照射源、多个透镜、孔径光阑和图像检测器,所述多个透镜被沿着用于保持衬底的衬底位置和图像检测器之间的光学路径布置,所述衬底包括在第一图案中的第一光栅和在所述第一光栅的顶部上的第二光栅,所述第二光栅具有与所述第一光栅的节距大致相同的节距,所述第二光栅和所述第一光栅形成复合光栅;所述照射源被配置以形成第一照射束,用于在入射角度下沿着所述衬底的表面在第一水平方向上照射所述衬底上的所述复合光栅,所述衬底位于衬底位置;所述图像检测器被布置用以接收来自复合光栅的第一级衍射束;所述照射源被布置用以形成第二照射束,用于在所述入射角度下沿着所述衬底的表面在第二水平方向上照射所述衬底上的复合光栅,其中所述第二水平方向与所述第一水平方向相反,所述衬底位于所述衬底位置;所述图像检测器被布置以接收来自所述复合光栅的负第一级衍射束。
根据本发明的一个方面,提供了一种光刻设备,所述光刻设备包括用于确定在衬底的表面上的第一图案和叠加到如上所述的第一图案上的第二图案之间的重叠误差的检测系统。
附图说明
现在参照随附的示意性附图,仅以举例的方式,描述本发明的实施例,其中,在附图中相应的附图标记表示相应的部件,且其中:
图1描述了根据本发明的实施例的光刻设备;
图2a、2b、2c示出了根据实施例的基于衍射的重叠误差量测;
图3a、3b示出了分别在第一测量和第二测量期间根据本发明的实施例的基于衍射的重叠误差检测系统;
图4a示出作为重叠误差的函数的负第一级衍射束和第一级衍射束的强度的示例性测量;
图4b示出作为重叠误差的函数的在负第一级衍射束和第一级衍射束之间的强度差;和
图5示出如由根据本发明确定的基于衍射的重叠误差和基于图像的重叠误差之间的相关性。
具体实施方式
图1示意性地示出根据本发明的一个实施例的光刻设备。所述设备包括:照射系统(照射器)IL,配置用于调节辐射束B(例如,紫外(UV)辐射或极紫外(EUV)辐射);图案形成装置支撑件或支撑结构(例如掩模台)MT,构造用于支撑图案形成装置(例如掩模)MA并与配置用于根据确定的参数精确地定位图案形成装置的第一定位装置PM相连;衬底台(例如晶片台)WT,构造用于保持衬底(例如涂覆有抗蚀剂的晶片)W,并与配置用于根据确定的参数精确地定位衬底的第二定位装置PW相连;和投影系统(例如折射式投影透镜系统)PS,所述投影系统PS配置用于将由图案形成装置MA赋予辐射束B的图案投影到衬底W的目标部分C(例如包括一根或多根管芯)上。
所述照射系统可以包括各种类型的光学部件,例如折射型、反射型、磁性型、电磁型、静电型或其它类型的光学部件、或其任意组合,以引导、成形、或控制辐射。
图案形成装置支撑件或支撑结构以依赖于图案形成装置的方向、光刻设备的设计以及诸如图案形成装置是否保持在真空环境中等其它条件的方式保持图案形成装置。图案形成装置支撑件或支撑结构可以采用机械的、真空的、静电的或其它夹持技术来保持图案形成装置。所述支撑结构可以是框架或台,例如,其可以根据需要成为固定的或可移动的。所述支撑结构可以确保图案形成装置位于所需的位置上(例如相对于投影系统)。在这里任何使用的术语“掩模版”或“掩模”都可以认为与更上位的术语“图案形成装置”同义。
这里所使用的术语“图案形成装置”应该被广义地理解为表示能够用于将图案在辐射束的横截面上赋予辐射束、以便在衬底的目标部分上形成图案的任何装置。应当注意,被赋予辐射束的图案可能不与在衬底的目标部分上的所需图案完全相符(例如如果该图案包括相移特征或所谓辅助特征)。通常,被赋予辐射束的图案将与在目标部分上形成的器件中的特定的功能层相对应,例如集成电路。
图案形成装置可以是透射式的或反射式的。图案形成装置的示例包括掩模、可编程反射镜阵列以及可编程液晶显示(LCD)面板。掩模在光刻术中是公知的,并且包括诸如二元掩模类型、交替型相移掩模类型、衰减型相移掩模类型和各种混合掩模类型之类的掩模类型。可编程反射镜阵列的示例采用小反射镜的矩阵布置,每一个小反射镜可以独立地倾斜,以便沿不同方向反射入射的辐射束。所述已倾斜的反射镜将图案赋予由所述反射镜矩阵反射的辐射束。
这里使用的术语“投影系统”应该广义地解释为包括任意类型的投影系统,包括折射型、反射型、反射折射型、磁性型、电磁型和静电型光学系统、或其任意组合,如对于所使用的曝光辐射所适合的、或对于诸如使用浸没液或使用真空之类的其他因素所适合的。这里使用的术语“投影透镜”可以认为是与更上位的术语“投影系统”同义。
如这里所示的,所述设备是透射型的(例如,采用透射式掩模)。替代地,所述设备可以是反射型的(例如,采用如上所述类型的可编程反射镜阵列,或采用反射式掩模)。
所述光刻设备可以是具有两个(双台)或更多衬底台(和/或两个或更多的掩模台)的类型。在这种“多台”机器中,可以并行地使用附加的台,或可以在一个或更多个台上执行预备步骤的同时,将一个或更多个其它台用于曝光。
光刻设备还可以是这种类型,其中衬底的至少一部分可以被相对高折射率的液体(例如,水)覆盖,以便填充投影系统和衬底之间的空间。浸没液体还可应用至光刻设备中的其它空间,例如在图案形成装置(例如掩模)和投影系统之间。浸没技术在本领域中可以用于提高投影系统的数值孔径是公知的。在此处所使用的术语“浸没”并不是指结构(例如衬底)必须浸没在液体中,而是仅指液体在曝光期间位于例如投影系统和衬底之间。
参照图1,所述照射器IL接收从辐射源SO发出的辐射束。该源和所述光刻设备可以是分立的实体(例如当该源为准分子激光器时)。在这种情况下,不会将该源考虑成形成光刻设备的一部分,并且通过包括例如合适的定向反射镜和/或扩束器的束传递系统BD的帮助,将所述辐射束从所述源SO传到所述照射器IL。在其它情况下,所述源可以是所述光刻设备的组成部分(例如当所述源是汞灯时)。可以将所述源SO和所述照射器IL、以及如果需要时设置的所述束传递系统BD一起称作辐射系统。
所述照射器IL可以包括用于调整所述辐射束的角强度分布的调整器AD。通常,可以对所述照射器的光瞳平面中的强度分布的至少所述外部和/或内部径向范围(一般分别称为σ-外部和σ-内部)进行调整。此外,所述照射器IL可以包括各种其它部件,例如积分器IN和聚光器CO。可以将所述照射器用于调节所述辐射束,以在其横截面中具有所需的均匀性和强度分布。
所述辐射束B入射到保持在图案形成装置支撑件或支撑结构(例如,掩模台)MT上的所述图案形成装置(例如,掩模)MA上,并且通过所述图案形成装置来形成图案。已经穿过图案形成装置(例如掩模)MA之后,所述辐射束B通过投影系统PS,所述PS将辐射束聚焦到所述衬底W的目标部分C上。通过第二定位装置PW和位置传感器IF(例如,干涉仪器件、线性编码器或电容传感器)的帮助,可以精确地移动所述衬底台WT,例如以便将不同的目标部分C定位于所述辐射束B的路径中。类似地,例如在从掩模库的机械获取之后,或在扫描期间,可以将所述第一定位装置PM和另一个位置传感器(图1中未明确示出)用于相对于所述辐射束B的路径精确地定位图案形成装置(例如掩模)MA。通常,可以通过形成所述第一定位装置PM的一部分的长行程模块(粗定位)和短行程模块(精定位)的帮助来实现图案形成装置支撑件(例如掩模台)MT的移动。类似地,可以采用形成所述第二定位装置PW的一部分的长行程模块和短行程模块来实现所述衬底台WT的移动。在步进机的情况下(与扫描器相反),所述图案形成装置支撑件(例如掩模台)MT可以仅与短行程致动器相连,或可以是固定的。可以使用掩模对准标记M1、M2和衬底对准标记P1、P2来对准图案形成装置(例如掩模)MA和衬底W。尽管所示的衬底对准标记占据了专用目标部分,但是它们可以位于目标部分之间的空间(这些公知为划线对齐标记)中。类似地,在将多于一个的管芯设置在图案形成装置(例如掩模)MA上的情况下,所述掩模对准标记可以位于所述管芯之间。
可以将所述设备用于以下模式中的至少一种中:
1.在步进模式中,在将图案形成装置支撑件(例如掩模台)MT和衬底台WT保持为基本静止的同时,将赋予所述辐射束的整个图案一次投影到目标部分C上(即,单一的静态曝光)。然后将所述衬底台WT沿X和/或Y方向移动,使得可以对不同目标部分C曝光。在步进模式中,曝光场的最大尺寸限制了在单一的静态曝光中成像的所述目标部分C的尺寸。
2.在扫描模式中,在对图案形成装置支撑件(例如掩模台)MT和衬底台WT同步地进行扫描的同时,将赋予所述辐射束的图案投影到目标部分C上(即,单一的动态曝光)。衬底台WT相对于图案形成装置支撑件(例如掩模台)MT的速度和方向可以通过所述投影系统PS的(缩小)放大率和图像反转特征来确定。在扫描模式中,曝光场的最大尺寸限制了单一动态曝光中所述目标部分的宽度(沿非扫描方向),而所述扫描运动的长度确定了所述目标部分的高度(沿所述扫描方向)。
3.在另一个模式中,将用于保持可编程图案形成装置的图案形成装置支撑件(例如掩模台)MT保持为基本静止,并且在对所述衬底台WT进行移动或扫描的同时,将赋予所述辐射束的图案投影到目标部分C上。在这种模式中,通常采用脉冲辐射源,并且在所述衬底台WT的每一次移动之后、或在扫描期间的连续辐射脉冲之间,根据需要更新所述可编程图案形成装置。这种操作模式可易于应用于利用可编程图案形成装置(例如,如上所述类型的可编程反射镜阵列)的无掩模光刻术中。
也可以采用上述使用模式的组合和/或变体,或完全不同的使用模式。
图2a、2b、2c示出了照射束和2个重叠光栅之间的相互作用,所述重叠光栅可以用于根据实施例的衍射重叠量测。
在图2a中,显示出了复合光栅110、120的横截面,其显示出零重叠误差。
在衬底100上构造出了复合光栅,所述复合光栅包括第一光栅110和第二光栅120。第一光栅110被图案化在衬底材料中,且包括沿着光栅方向X1的第一周期性结构。
在实施例中,第一光栅的周期性结构包括插入有辅线112的多条主线111。周期性结构被形成在层115中。
为了清楚起见,在图2a中仅用参考标记标出了1条主线111和1条相邻的辅线112。
光栅110的节距P等于1条线111和1条辅线112的宽度。
本领域技术人员将认识到,可以由在衬底线111之间中的沟道来产生辅线112,所述沟道被用不同于衬底材料的材料填充。例如,衬底材料是硅,沟道材料是类似于二氧化硅的电介质或类似于钨或铜的金属。
在第一光栅110的顶部上设置有第二光栅120。第二光栅由第二周期性结构构成。
在显示出的实施例中,第二周期性结构包括沿着光栅方向X1插入沟道122的多条线121。
在这个例子中,线121被设置到第一光栅110的辅线112的顶部上。第二光栅120具有在方向X1上等于一条线121和一个沟道122的宽度的节距P’。第二光栅120的节距P’被选择成大致等于第一光栅110的节距P。在实施例中,第二光栅120的线121的宽度可以大致与第一光栅110的辅线112的宽度相同。
可替代地,第二光栅120的线121可以设置到第一光栅110的主线111的顶部上。
第二光栅可以是形成在抗蚀剂层125中的图案。
在图2a的情形中,第一和第二光栅110和120的对准是理想的,理想地错位为零(其被称作为零重叠误差)。第二光栅120的线121与第一光栅110的辅线112完全对准。
在图2a中,示意性地显示出照射束IB和复合光栅110、120之间的相互作用的实施例。
在这一实施例中,照射束IB以第一斜入射角β射到在光栅方向X1上的光栅结构上。相对于表面法线n获得了入射角β。照射束IB被复合光栅110、120散射,且分别形成(至少)第一级和零级的两个衍射束B+和B0,分别地,第一级衍射束B+以角度θ(相对于表面法线n)离开衬底,零级衍射束以镜面反射离开。注意到,复合光栅110、120的节距P和照射束IB的波长被选择以便满足衍射条件。在图2a中,在一个平面中显示出了衍射级和照射束,但这仅是为了简便。本发明的实施例也可以用于锥形衍射,其中衍射束可以不与照射束处于同一平面中。
依赖于光栅的节距P(对于P=P’)和照射束IB的波长的比,也可能出现更高级衍射束,但在此处这些被省略。
在图2b中,与图2a的复合光栅110、120的横截面相同的横截面用于照射束IB的第二斜入射。
在图2b中,照射束IB以第二斜入射角-β射到光栅结构上。第二斜入射角-β具有与第一入射角β相同的大小,但是相比较而言被沿着光栅方向X1在相反的方向上引导。第二入射角-β被相对于表面法线n获得。
照射束IB被复合光栅110、120散射,且分别形成(至少)第一(负)级和零级的两个衍射束B-和B0,且它们分别地以角度-θ和镜面反射离开衬底。
衍射束B+示出了第一衍射级,衍射束B-示出了负第一衍射级。由于第一和第二光栅被完全对准的事实,复合光栅是对称的,即第一光栅110的辅线112与第二光栅120的线121一致,用作复合线112、121。由于复合光栅的对称性,衍射图案也是对称的:即第一级衍射束B+的强度I+大致等于负第一级衍射束B-的强度I-。
I+=I-=I+0 式(1),
其中I+0表示用于对称的复合光栅的第一级衍射束的强度。
在图2c中,显示出复合光栅110、120的横截面,其显示出非零的重叠误差。第二光栅120的线121显示出相对于第一光栅的辅线112的重叠误差(错位)ε。结果,图2c中显示出的复合光栅是不对称的,第二光栅120的线121与第一光栅110的辅线112相比被移动距离ε。
由于不对称,在第一斜入射角β下测量的第一级衍射束B+的强度I+在这种情形中不等于在第二斜入射角-β下测量的负第一级衍射束B-的强度I-。
对于小的重叠误差,衍射束的强度的变化与重叠误差成线性比例。作为重叠误差ε的函数的第一级衍射束B+的强度I+被很好地近似为:
I+=I+0+K×ε 式(2),
其中K是比例因子。
负第一级衍射束B-的强度I-被近似为:
I-=I+0-K×ε 式(3)
通过采用差ΔI=I+-I-,所获得的信号与重叠误差ε成线性比例:
ΔI=2K×ε 式(4)
在下文将更加详细地讨论比例因子K。
在另外的实施例中,重叠量测可以包括使用第一照射束IB1和第二照射束IB2,每个照射束大致正入射到复合光栅110、120上。本领域技术人员将认识到,在这样的实施例中,第一照射束IB1和第二照射束IB2是一致的,且被提供作为单个照射束。第一照射束可以用作为第二照射束。在照射束的正入射情况下,也会出现第一级衍射束和负第一级衍射束B+、B-。这些束B+、B-的强度将显示为与关于图2a-2c和式(1-4)在上文描述的关系相同的关系。在这一实施例中,第一级衍射束和负第一级衍射束的强度差ΔI可以通过使用第一照射束且连续地分别测量第一级衍射束和负第一级衍射束的强度来进行测量。
图3a示意性地显示出在保持复合光栅110、120的衬底的第一测量中根据本发明的实施例的基于衍射的重叠误差检测系统(下文称作为检测系统)200。检测系统可以包括支撑件,在本发明的实施例中该支撑件被配置以支撑衬底。在本发明的实施例中,支撑件也可以是图1的光刻设备的衬底台。
在这个实施例中,检测系统200包括多个透镜、第一、第二、第三和第四正透镜L1,L2,L3,L4、孔径光阑DF以及图像检测器ID。
在检测系统200中,光轴OP被布置成从复合光栅110、120可以在斜入射角度下被照射束IB照射所在的衬底位置延伸至复合光栅的图像可以被投影到图案检测器ID上所在的位置。
例如,图像检测器ID可以是CCD摄相机。照射的区域大于光栅的区域。或者说,周围环境也被照射。这被称为“过填充(overfill)”。
沿着光轴OP,第一、第二、第三和第四正透镜L1、L2、L3、L4被布置,其中它们的各自的中心位于光轴上,使得复合光栅110、120的图像可以被投影到检测系统200的图像检测器ID上。
第一透镜L1被设置在衬底位置的上方,衬底100上的复合光栅110、120可以设置在所述衬底位置上。第一透镜和衬底位置之间的距离大致等于第一透镜L1的焦距F1。第二和第三透镜L2、L3被沿着光轴OP成对布置,且距离第一透镜L1一定距离。第四透镜L4被布置作为图像检测器ID的投影透镜。孔径光阑DF位于第三和第四透镜L3、L4之间。
在测量期间,具有复合光栅110、120的衬底位于衬底位置。复合光栅110、120位于预定的位置(表示为Q)。第一照射束IB1被在沿着衬底的表面在第一水平方向上(由箭头D1表示的)的斜入射情况下的不对称的照射模式中使用。例如,第一照射束沿着一方向传播,所述方向具有沿衬底的表面的第一水平方向的分量。第一照射束IB1进入第一透镜L1,使得在穿过第一透镜之后第一照射束IB1以一角度照射到复合光栅上,其产生成衍射角度θ的第一衍射级束B+。结果,现在第一级衍射束B+被在衬底的表面衍射,零级衍射束B0被以镜面反射衍射(在这个例子中以角度2θ衍射)。
第一级衍射束B+和零级束B0穿过第一透镜L1。因为复合光栅位于第一透镜L1的焦距F1处,所以第一级衍射束和零级衍射束B+、B0在穿过第一透镜L1之后被平行地引导。
接下来,第一级和零级衍射束B+、B0穿过第二透镜L2。第一级衍射束B+大致与光轴一致,且穿过第二透镜L2的中心。零级衍射束B0离轴地穿过第二透镜L2,且在所述穿过之后被引导通过第二透镜L2的焦点。
第三透镜L3被布置成焦点F3与第二透镜L2的焦点F2一致。
第一级衍射束B+与第三透镜的光轴一致,且穿过第三透镜L3的中心和继续位于光轴上。零级衍射束B0离轴地穿过第三透镜。由于第二和第三透镜的焦点F2、F3一致的事实,在穿过第三透镜L3之后零级衍射束大致平行于光轴。
孔径光阑DF设置在光轴上且在第三透镜L3的后面,其被布置以阻挡零衍射级。孔径光阑DF允许在光轴OP上的第一级衍射束B+穿过,且阻挡零级衍射束B0。这样,摄相机上的图像仅由第一衍射级形成,而不由零衍射级形成。这种成像模式通常被称为“暗场”成像。孔径光阑DF被布置成具有允许阻挡零级衍射束B0和允许第一级衍射束B+通过的宽度。
结果,仅使用第一级衍射或负第一级衍射将复合光栅的图像形成到CCD摄相机上。然后,本领域技术人员已知的适合的图像处理和模式识别算法可以用于从在复合光栅周围的产品结构辨识复合光栅。孔径光阑的应用允许使用横截面尺寸比衍射极限大的照射束,同时光栅的尺寸可以小于由衍射极限所表示的尺寸。
最终,第一级衍射束B+穿过第四透镜L4,该第四透镜L4被布置用于将第一级衍射束B+成像到图像检测器ID上。
以这种方式,源自于第一级衍射束B+的复合光栅110、120的图像被投影到图像检测器ID上。因为图像经由一较高(第一)衍射级形成,所以图像将显示出没有对单独的光栅线进行调制。
注意到,第一衍射级可以不必完全地垂直于所述表面。第一衍射级可以与晶片表面成任意角度,只要它被孔径光阑所透射(而没有使得任何其它衍射级通过孔径光阑)即可。
由在图像检测器上记录的复合光栅110、120的图像可以确定强度I+。用模式识别算法(例如边缘检测)来确定光栅的图像的精确位置。
图3b示意性地显示出在保持复合光栅110、120的衬底的第二测量中根据本发明的实施例的基于衍射的重叠误差检测系统。
在图3b中,用如在之前的视图中显示的表示的实体的参考标记相同的参考标记来表示相对应的实体。
在第二测量中,在与如在图3a中显示的第一测量期间所使用的第一水平方向D1相反的第二水平方向(由箭头D2表示的)上通过第二照射束IB2不对称地照射复合光栅110、120。例如,第二照射束沿着一方向传播,所述方向具有沿着衬底表面的在第一水平方向上的分量。复合光栅被保持在与第一测量期间相同的预定位置Q上。
在这些条件下,负第一级衍射束B-当前被垂直于衬底的表面衍射,零级衍射束B0被以角度θ衍射。孔径光阑DF被布置以具有允许阻挡零级衍射束B0且允许使负第一级衍射束B-通过的宽度。
结果,在第二测量期间,来自于负第一级衍射束B-的复合光栅110、120的图像被投影到图像检测器ID上。可以由在图像检测器ID上所记录的复合光栅110、120的图像,来确定强度I-。再次,可以使用模式识别技术来辨识CCD上必须进行强度测量的区域。
注意到,在不同的实施例中,照射束大致正入射。如本领域技术人员可以认识的,这一实施例可以使用不同的但功能等同的照射/检测布局,其中仅在第一情形中允许第一级衍射束穿过和在第二情形中允许负第一级衍射束穿过的孔径光阑的功能将是相同的。
另外,注意到斜入射不是必须的,但是可以是优选的,这是因为它允许使用具有更小节距的光栅。
如上所述,根据式(4),第一级衍射束B+的强度I+与负第一级衍射束B-的差与重叠误差ε成比例。比例因子K依赖于加工条件、照射束的波长、衍射角度和偏振。对于给定的过程、波长、衍射角度以及偏振的组合来说,期望进行比例因子的校准,这对于本领域技术人员来说是可以理解的。
在本发明的实施例中,通过确定衬底上的两个偏置的复合光栅上的重叠误差ε来对比例因子K进行校准。每一偏置的复合光栅具有在第一光栅110和第二光栅120之间的各自的预定的内置的偏移。两个偏置的光栅相对彼此位于衬底上的固定的位置上。
第一偏置的复合光栅在沿着光栅方向X1的偏移方向上具有第一内置的偏移+d。第二偏置复合光栅具有第二内置的偏移-d,所述偏移-d大小等于沿着光栅方向X1的第一内置偏移,但与其符号相反。
在重叠误差ε的情形中,第一偏置复合光栅显示出总的重叠误差ε+d,第二偏置复合光栅显示出总的重叠误差ε-d。
第一偏置复合光栅上的第一衍射级与负第一衍射级之间的强度差ΔI1和第二偏置复合光栅上的第一衍射级与负第一衍射级之间的强度差ΔI2由下式给出:
对于第一偏置复合光栅来说
ΔI1=K×(ε+d) 式(5)
而对于第二偏置复合光栅来说
ΔI2=K×(ε-d) 式(6)
消去因子K可得到:
在实施例中,第一偏置复合光栅和第二偏置复合光栅可以由图3a、3b中显示的检测系统同时进行测量。在所述情形中,图像检测器ID同时记录来自第一偏置复合光栅的图像和第二偏置复合光栅的图像。通过使用图像处理软件,第一偏置复合光栅的图像的强度和第二偏置复合光栅的强度可以被分别确定。可以使用式(5)-(7)来计算重叠误差ε。
因为第一和第二照射束IB1、IB2中每个都处于掠入射,所以将从复合光栅(即产品区域)外面的表面区域反射离开的光将不会通过第一、第二、第三和第四透镜L1、L2、L3、L4的系统到达图像检测器ID。在本发明的实施例中,第一和/或第二照射束IB1、IB2可以具有比衬底上的复合光栅110、120大的横截面,而不会导致从光栅外面的表面反射离开的光与由复合光栅衍射的光之间发生干扰。
孔径光阑DF的大数值孔径值是优选的,因为它允许在复合光栅和其中内嵌了复合光栅的周围产品区域之间的急剧转变。因为同时,孔径光阑DF被布置成阻挡零级衍射束B0,所以孔径光阑DF的数值孔径具有上极限,在所述上极限在足够的零级衍射束抑制和由于来自产品区域的反射造成的足够低的串扰之间实现了折中。可行的是,这种方法允许使用尺寸约10×10μm2的复合光栅。
注意到,建模软件可以允许计算产品区域和内嵌的复合光栅的布局,对于其可以进一步最小化串扰。这种方法可以允许设计具有尺寸约4×4μm2的内嵌的复合光栅。
在实施例中,孔径光阑DF的数值孔径为约0.7,而第一透镜的数值孔径为约0.95。
图4a示出作为偏置光栅上的偏移D的函数的负第一级衍射束和第一级衍射束的强度的示例性测量。
在图4a中,对于具有节距P=660nm的复合光栅和波长为λ=700nm的照射束,显示出负第一级衍射束B-的强度I-和第一级衍射束B+的强度I+随着偏移d的变化。注意到,对于接近0nm的偏移,强度I+、I-的变化是大致线性的。
图4b示出作为如图4b中显示的偏置光栅上的偏移d的函数的负第一级衍射束和第一级衍射束之间的强度差。注意到,对于接近0nm的偏移,强度差ΔI的变化是大致线性的。
图5显示出如由本发明所确定的基于衍射的重叠误差和基于图像的重叠误差之间的相关性。
对于多个样品,如由基于衍射的重叠误差量测所测量的偏置的复合光栅的偏移d也被基于图像的重叠误差量测所测量。在图5中,显示出由衍射测量的重叠(沿着垂直轴线)和如由基于图像的方法测量的重叠(沿着水平轴线)的相关性。由实线显示出数据的线性拟合。在方法的误差范围内,实线的系数是1。相关系数超过0.99。
注意到,如上所述的照射束IB可能是单个束。可替代地,照射束的横截面的形状可以是半环形形状。在所述情形中,图3a中的非对称的照射可以由一半环形束来进行,而如图3b显示的来自相反方向的不对称的照射可以由另一半环形束来进行。
可以由例如单色灯或激光源的光源来产生照射束IB。具有相对高强度的激光源可以在能够使用短时间进行测量的情形中使用。
尽管在本文中可以做出具体的参考,将所述光刻设备用于制造IC,但应当理解这里所述的光刻设备可以有其他的应用,例如,集成光学系统、磁畴存储器的引导和检测图案、平板显示器、液晶显示器(LCD)、薄膜磁头等的制造。本领域技术人员应该理解的是,在这种替代应用的情况中,可以将其中使用的任意术语“晶片”或“管芯”分别认为是与更上位的术语“衬底”或“目标部分”同义。这里所指的衬底可以在曝光之前或之后进行处理,例如在轨道(一种典型地将抗蚀剂层涂到衬底上,并且对已曝光的抗蚀剂进行显影的工具)、量测工具和/或检验工具中。在可应用的情况下,可以将所述公开内容应用于这种和其它衬底处理工具中。另外,所述衬底可以处理一次以上,例如以便产生多层IC,使得这里使用的所述术语“衬底”也可以表示已经包含多个已处理层的衬底。
尽管以上已经做出了具体的参考,在光学光刻术的情况中使用本发明的实施例,但应该理解的是,本发明可以用于其他应用中,例如压印光刻术,并且只要情况允许,不局限于光学光刻术。在压印光刻术中,图案形成装置中的拓扑限定了在衬底上产生的图案。可以将所述图案形成装置的拓扑印刷到提供给衬底的抗蚀剂层中,在其上通过施加电磁辐射、热、压力或其组合来使抗蚀剂固化。在抗蚀剂固化之后,图案形成装置从抗蚀剂上移走,并在抗蚀剂中留下图案。
这里使用的术语“辐射”和“束”包含全部类型的电磁辐射,包括:紫外(UV)辐射(例如具有约365、355、248、193、157或126nm的波长)和极紫外(EUV)辐射(例如具有5-20nm范围内的波长),以及粒子束,例如离子束或电子束。
在上下文允许的情况下,所述术语“透镜”可以表示各种类型的光学部件中的任何一种或它们的组合,包括折射式、反射式、磁性式、电磁式和静电式的光学部件。
尽管以上已经描述了本发明的特定的实施例,但是应该理解的是本发明可以以与上述不同的形式实现。例如,本发明可以采取包含用于描述上述公开的方法的一个或更多个机器可读指令序列的计算机程序的形式,或者采取具有在其中存储的这种计算机程序的数据存储介质的形式(例如,半导体存储器、磁盘或光盘)。
以上的描述是说明性的,而不是限制性的。因此,本领域的技术人员将明白,在不背离所附的权利要求的保护范围的情形下,可以对所描述的本发明进行修改。
Claims (17)
1.一种用于确定衬底的表面上的第一图案和叠加到所述第一图案上的第二图案之间的重叠误差的方法,所述第一图案包括第一光栅,所述第二图案包括在所述第一光栅的顶部上的第二光栅,所述第二光栅具有与所述第一光栅大致相同的节距,所述第二光栅和所述第一光栅形成复合光栅,所述方法包括步骤:
提供第一照射束,用于在入射角度下以不对称方式照射至少所述复合光栅,所述第一照射束具有沿着所述衬底的表面在第一水平方向上的分量,所述衬底位于固定位置;
测量来自所述复合光栅的第一级衍射束的第一强度;
提供第二照射束,用于在所述入射角度下以不对称方式照射至少所述复合光栅,所述第二照射束具有沿着所述衬底的表面在第二水平方向上的分量,其中所述第二水平方向与所述第一水平方向相反,所述衬底位于所述固定位置;和
测量来自所述复合光栅的负第一级衍射束的第二强度。
2.根据权利要求1所述的方法,还包括步骤:
确定在所述第一强度和所述第二强度之间的强度差,所述强度差与在所述第一光栅和所述第二光栅之间的重叠误差成比例。
3.根据权利要求1所述的方法,其中所述第一照射束和第二照射束是公共的照射束的部分。
4.根据权利要求3所述的方法,其中所述公共的照射束具有环形横截面。
5.根据权利要求1所述的方法,其中所述入射角相对于所述衬底的表面是倾斜的,所述第一级衍射束和所述负第一级衍射束相对于所述表面的法线的衍射角小于所述入射角。
6.根据权利要求1所述的方法,其中测量来自所述复合光栅的第一级衍射束的第一强度的步骤包括:
通过模式识别检测仅由所述第一级衍射束获得的所述复合光栅的图像,和
其中,测量来自所述复合光栅的负第一级衍射束的第二强度的步骤包括:
通过模式识别检测仅由所述负第一级衍射束获得的所述复合光栅的图像。
7.根据权利要求1所述的方法,还包括步骤:
在所述衬底上提供第二复合光栅,所述第二复合光栅由在所述第一图案中的第三光栅和在所述第一光栅顶部上的第四光栅形成,所述第三光栅和所述第四光栅具有与所述第一和第二光栅的节距大致相同的节距,其中所述第一光栅被图案化在衬底材料中且包括沿着光栅方向的周期性结构,且所述复合光栅被在偏移方向上沿着所述光栅方向偏置第一偏移,且所述第二复合光栅被在所述偏移方向上沿着所述光栅方向偏置第二偏移,所述第一偏移不同于所述第二偏移;
提供第一照射束,用于在所述入射角度下照射所述第二复合光栅,使得所述第一照射束沿着具有沿着所述衬底的表面在第一水平方向上的分量的方向传播,所述衬底位于固定位置;
测量来自所述第二复合光栅的第一级衍射束的第一强度;
提供第二照射束,用于在所述入射角度下照射所述第二复合光栅,使得所述第二照射束沿着具有沿着所述衬底的表面在第二水平方向上的分量的方向传播;和
测量来自所述第二复合光栅的负第一级衍射束的第二强度。
8.根据权利要求1所述的方法,包括步骤:
在提供所述第一照射束时阻挡除了所述第一级衍射束之外的衍射级辐射束;和
在提供所述第二照射束时阻挡除了所述负第一级衍射束之外的衍射级辐射束。
9.根据权利要求1所述的方法,其中,来自于所述复合光栅的第一级衍射束和来自于所述复合光栅的负第一级衍射束均垂直于衬底的表面。
10.一种复合光栅,所述复合光栅形成在衬底上,包括:
第一光栅,所述第一光栅被图案化在衬底材料中且包括沿着光栅方向的周期性结构,所述第一光栅的周期性结构包括多条主线,在所述主线之间的沟道中插入有辅线,所述第一光栅的节距等于1条主线和1条辅线的宽度;和
第二光栅,所述第二光栅设置在第一光栅的顶部上且包括沿着光栅方向的周期性结构,所述第二光栅的周期性结构包括多条线以及沿着光栅方向插入的沟道,
其中,所述第一光栅具有与第二光栅的节距大致相同的节距,且所述第一光栅的沟道被不同于衬底材料的材料填充,且
其中,第二光栅的线设置到第一光栅的辅线的顶部上且具有与第一光栅的辅线相同的宽度。
11.一种检测系统,所述检测系统被配置以确定衬底的表面上的第一图案和叠加到所述第一图案上的第二图案之间的重叠误差,所述第一图案包括第一光栅,所述第二图案包括在所述第一光栅的顶部上的第二光栅,所述第二光栅具有与所述第一光栅的节距大致相同的节距,所述第二光栅和所述第一光栅形成复合光栅,所述系统包括:
照射源,所述照射源被配置以(a)形成第一照射束,用于在入射角度下以不对称方式照射在所述衬底上的所述复合光栅,使得所述第一照射束沿着具有沿着所述衬底的表面在第一水平方向上的分量的方向传播,所述衬底位于衬底位置;和(b)形成第二照射束,用于在所述入射角度下以不对称方式照射在所述衬底上的所述复合光栅,使得所述第二照射束沿着具有沿着所述衬底的表面在第二水平方向上的分量的方向传播,其中所述第二水平方向与所述第一水平方向相反,所述衬底位于所述衬底位置;
图像检测器,所述图像检测器被配置以接收来自所述复合光栅的负第一级衍射束;
多个透镜,所述多个透镜被沿着所述衬底位置和所述图像检测器之间的光学路径布置;和
孔径光阑。
12.根据权利要求11所述的检测系统,其中所述图像检测器被配置以通过模式识别方法仅采用第一级衍射束和所述负第一级衍射束来检测所述复合光栅的图像。
13.根据权利要求11所述的检测系统,其中所述多个透镜包括邻近所述衬底的表面的至少一个物镜和邻近所述图像检测器的投影透镜,所述孔径光阑被沿着在所述物镜和所述投影透镜之间的光学路径布置,且
其中所述物镜具有第一数值孔径值且所述孔径光阑具有第二数值孔径值,所述第二数值孔径值小于所述第一数值孔径值。
14.根据权利要求11所述的检测系统,其中所述检测系统的所述孔径光阑被配置以在形成所述第一照射束时阻挡除了所述第一级衍射束之外的衍射级辐射束,且在形成所述第二照射束时阻挡除了所述负第一级衍射束之外的衍射级辐射束。
15.根据权利要求11所述的检测系统,其中,来自于所述复合光栅的第一级衍射束和来自于所述复合光栅的负第一级衍射束均垂直于衬底的表面。
16.一种光刻设备,所述光刻设备包括根据权利要求11至15中任一项所述的检测系统。
17.根据权利要求16所述的光刻设备,还包括:
照射系统,所述照射系统被配置以调节辐射束;
图案形成装置支撑件,所述图案形成装置支撑件被配置以保持图案形成装置,所述图案形成装置被配置以使辐射束图案化,用以形成图案化的辐射束;
衬底台,所述衬底台被配置以保持所述衬底;和
投影系统,所述投影系统被配置以将所述图案化的辐射束投影到所述衬底上。
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