CN105972016B - Pressing method and device - Google Patents
Pressing method and device Download PDFInfo
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- CN105972016B CN105972016B CN201510880313.5A CN201510880313A CN105972016B CN 105972016 B CN105972016 B CN 105972016B CN 201510880313 A CN201510880313 A CN 201510880313A CN 105972016 B CN105972016 B CN 105972016B
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- pressure measuring
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- 238000003825 pressing Methods 0.000 title abstract description 90
- 230000007246 mechanism Effects 0.000 claims abstract description 156
- 238000001179 sorption measurement Methods 0.000 claims abstract description 9
- 230000008878 coupling Effects 0.000 claims description 23
- 238000010168 coupling process Methods 0.000 claims description 23
- 238000005859 coupling reaction Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 5
- 238000007906 compression Methods 0.000 claims 5
- 238000010521 absorption reaction Methods 0.000 claims 4
- 238000009966 trimming Methods 0.000 claims 2
- 238000010792 warming Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000009530 blood pressure measurement Methods 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000011345 viscous material Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Automatic Assembly (AREA)
Abstract
本发明在于提供一种压合方法及装置。该压合装置包括:一触压机构,设有加热器及通有负压;一测压机构,设有荷重感测元件以取得加压荷重信息;一旋转机构,设有驱动件以连动该触压机构吸附的第一物件进行旋转微调方位;一调整机构,设有微调件可连动微调该触压机构对第一物件的下压施力;使第一物件受触压机构负压执行一吸附步骤及加温步骤,并在吸附后以旋转机构执行对位步骤,然后将第一物件叠置于第二物件上进行向下压合的加压步骤,并经测压机构执行压力记录步骤,从而以调整机构微调适当的下压施力,使二物件压合、烘干在一单元架构完成。
The present invention provides a pressing method and device. The pressing device includes: a contact pressure mechanism provided with a heater and a negative pressure; a pressure measuring mechanism provided with a load sensing element to obtain pressurized load information; a rotating mechanism provided with a driving member for linkage The first object adsorbed by the contact pressure mechanism rotates and fine-tunes its orientation; an adjustment mechanism is provided with a fine-tuning component that can be linked to finely adjust the pressing force exerted by the contact pressure mechanism on the first object; so that the first object is subject to the negative pressure of the contact pressure mechanism Perform an adsorption step and a heating step, and use a rotating mechanism to perform an alignment step after adsorption, and then stack the first object on the second object to perform a pressurization step of pressing down, and perform the pressure measurement through the pressure measuring mechanism Record the steps so that the adjustment mechanism can be used to fine-tune the appropriate pressing force so that the pressing and drying of the two objects can be completed in one unit structure.
Description
技术领域technical field
本发明是有关于一压合方法及装置,尤指一种将二物件间涂设粘性材料并进行压合固定的压合方法及装置。The present invention relates to a lamination method and device, especially to a lamination method and device for applying viscous material between two objects and then laminating and fixing them.
背景技术Background technique
一般电子元件常经由涂覆粘性材料来使多个元件进行固着,同时因为这些电子元件具有细小、量大而质精的生产需求,为了可以自动化生产,常必须在同一设备上同时进行多道功能的制程,以手机的按键为例,此种按键因应手机数量的庞大,及一键操控多功能,故按键本身必须与载有电路或感测元件的PC板结合,此种结合常须借由粘性材料来达成,但粘性材料本身因其流动性因素,必须提供烘干或热烤的制程来使其固定牢固;一般制程中为因应其量大,采用可以进行移载于不同制程设备的载盘来承载此类进行粘合后必须进行压合、烘烤的物件,使多数个以矩阵排列于一载盘的物件在涂覆粘性材料后,载盘被送进一压合装置中进行压合,然后再将载盘送至一烘烤装置中,以进行热固二物件间粘性材料的程序。Generally, electronic components are often coated with viscous materials to fix multiple components. At the same time, because these electronic components have small, large-volume and high-quality production requirements, in order to automate production, it is often necessary to perform multiple functions on the same equipment at the same time. Take the keys of mobile phones as an example. Due to the large number of mobile phones and the multi-functions controlled by one key, the keys themselves must be combined with a PC board carrying circuits or sensing components. This combination often requires Viscous material can be achieved, but the viscous material itself must be provided with a drying or hot-baking process to fix it firmly due to its fluidity; in general, due to the large amount of it, a load that can be transferred to different process equipment is used. The tray is used to carry such objects that must be pressed and baked after being bonded, so that a plurality of objects arranged in a matrix on a tray are coated with viscous material, and the tray is sent into a pressing device for pressing Combine, and then send the tray to a baking device for heat-fixing the adhesive material between the two objects.
现有技术中,采用一压合装置对载盘上多数矩阵排列的物件同时进行压合的操作,对于矩阵排列的每一物件难同时取得完全相同的压合压力;而各物件排列时的定位精度亦会影响压合粘着的精度,且看似同时进行多数矩阵排列的物件压合,却除困难取得一致压合粘着品质外,因为必须再进行烘烤制程,故效率并非绝佳!尤其压合后进行输送至烘烤制程的过程中,可能造成物件与物件间粘合品质、精度改变,使烘烤制程是在一有虞虑的压合粘着品质下进行,造成不合格率增加!In the prior art, a pressing device is used to simultaneously perform pressing operations on most matrix-arranged objects on the tray, and it is difficult to obtain exactly the same pressing pressure for each matrix-arranged object at the same time; and the positioning of each object when arranging Accuracy will also affect the accuracy of lamination and adhesion, and it seems that most objects arranged in a matrix are laminated at the same time, but it is difficult to obtain consistent lamination and adhesion quality, because the baking process must be performed again, so the efficiency is not perfect! Especially during the process of conveying to the baking process after pressing, it may cause changes in the bonding quality and precision between objects, so that the baking process is carried out under a worrying pressing and adhesion quality, resulting in an increase in the failure rate !
发明内容Contents of the invention
因此,本发明的目的在于提供一种可于加压同时进行加热烘干的压合方法。Therefore, the object of the present invention is to provide a pressing method that can perform heating and drying while pressurizing.
本发明的另一目的在于提供一种可于加压同时进行加热烘干的压合装置。Another object of the present invention is to provide a pressing device capable of heating and drying while applying pressure.
本发明的又一目的在于提供一种依据所述压合方法的装置。Yet another object of the present invention is to provide a device according to said pressing method.
依据本发明目的的压合方法,包括:提供第一物件,使其受一压合装置的负压执行吸附步骤;提供第二物件,使其受已吸附第一物件的压合装置下压;该压合装置在同一垂直轴向上设有由下到上依序设置的一触压机构、一测压机构、一旋转机构、一调整机构,该触压机构吸附第一物件后执行对位步骤的第一物件方位检测,方位检测结果回馈给旋转机构,该旋转机构连动测压机构,该测压机构连动旋转微调该触压机构吸附第一物件的方位角度,再将第一物件叠置于第二物件上进行向下压合的加压步骤,並借由对调整机构微调,连动改变该触压机构下压施力的程度。The pressing method according to the object of the present invention includes: providing the first object to be subjected to the negative pressure of a pressing device to perform the adsorption step; providing the second object to be pressed down by the pressing device that has adsorbed the first object; The pressing device is provided with a pressure contact mechanism, a pressure measurement mechanism, a rotation mechanism, and an adjustment mechanism arranged in sequence from bottom to top on the same vertical axis. The pressure contact mechanism performs alignment after absorbing the first object In step 1, the orientation detection of the first object, the orientation detection result is fed back to the rotation mechanism, the rotation mechanism is linked with the pressure measuring mechanism, and the pressure measurement mechanism is linked to rotate to fine-tune the orientation angle of the first object absorbed by the contact pressure mechanism, and then the first object The step of pressing down on the second object is carried out, and by fine-tuning the adjusting mechanism, the degree of pressing force of the pressing mechanism is changed in conjunction.
依据本发明另一目的的压合装置,包括:一触压机构,设于一载座上滑轨的滑座上;一旋转机构,设于该载座的一框座中相隔间距的上固定座与下固定座间被定位;一调整机构,设于该上固定座上;一测压机构,位于旋转机构与触压机构间,其受旋转机构所连动,而连动触压机构中的一转轴旋转;借由对调整机构的微调操作,可连动经旋转机构、测压机构而使该触压机构可在载座上滑轨作上、下微调位移;该载座承载由触压机构、测压机构、旋转机构、调整机构所组构形成的装置并设于一固定座上,载座在固定座上可作上、下滑移,固定座可设于一般机台中可供位移的轨道上受操控,以使整体压合装置可被位移到定位对待加工物进行施作。According to another object of the present invention, the press-fitting device includes: a pressing mechanism, which is arranged on the slide seat of the upper slide rail of a carrier; The seat and the lower fixed seat are positioned; an adjustment mechanism is located on the upper fixed seat; a pressure measuring mechanism is located between the rotating mechanism and the contact pressure mechanism. A rotating shaft rotates; through the fine-tuning operation of the adjustment mechanism, the contact pressure mechanism can be fine-tuned up and down on the slide rail of the carrier through the linkage of the rotating mechanism and the pressure measuring mechanism; the carrier is carried by the touch The device formed by the pressure mechanism, the pressure measuring mechanism, the rotation mechanism and the adjustment mechanism is set on a fixed seat. The carrier can slide up and down on the fixed seat. The fixed seat can be set in a general machine for The displacement track is controlled so that the whole pressing device can be displaced to a position for processing the object to be processed.
依据本发明另一目的的压合装置,包括:一触压机构,通有负压,可对一第一物件进行吸附;一测压机构,设有荷重感测元件以取得加压荷重信息;一旋转机构,设有驱动件以连动该触压机构吸附的第一物件进行旋转微调方位;该触压机构、测压机构、旋转机构在同一垂直轴向上由下到上依序设置。According to another object of the present invention, a pressing device includes: a pressure-contacting mechanism with a negative pressure for absorbing a first object; a pressure-measuring mechanism with a load sensing element to obtain pressurized load information; A rotating mechanism is provided with a driving member to rotate and fine-tune the orientation of the first object adsorbed by the pressing mechanism; the pressing mechanism, the pressure measuring mechanism and the rotating mechanism are sequentially arranged on the same vertical axis from bottom to top.
依据本发明又一目的的压合装置,包括:用以执行如前述压合方法的装置。A pressing device according to another object of the present invention includes: a device for performing the aforementioned pressing method.
本发明实施例的压合方法及装置,在实施上由于压合装置的触压机构、测压机构、旋转机构、调整机构皆设在同一单元架构上,而使其模座、抵压轴、第一联结座、第二联结座及其间的荷重感测元件、转轴、微调件皆在同一垂直轴向上对物件进行施作,进而使压合制程中加温步骤、吸附步骤、对位步骤、加压步骤、压力记录步骤皆在同一单元架构的压合装置中执行,不仅可对二物件的粘着后压合可作精确的对位、压合,且压合、烘干在同一单元架构完成,对于下压程度的压力值可以作有效的回馈、记录及补偿、微调,对于加热温度亦能有效的掌握控制,使压合制程的效益大幅提升。The pressing method and device of the embodiment of the present invention, because the pressing mechanism, the pressure measuring mechanism, the rotating mechanism and the adjusting mechanism of the pressing device are all arranged on the same unit structure, so that the mold base, the pressing shaft, the second The first connecting seat, the second connecting seat and the load sensing element, the rotating shaft and the fine-tuning member between them all act on the object on the same vertical axis, so that the heating step, adsorption step, alignment step, The pressurization step and pressure recording step are all carried out in the lamination device with the same unit structure. Not only can the two objects be bonded and then pressed, but also can be accurately aligned and pressed, and the lamination and drying are completed in the same unit structure. , the pressure value of the pressing degree can be effectively fed back, recorded, compensated, and fine-tuned, and the heating temperature can also be effectively mastered and controlled, so that the benefits of the pressing process are greatly improved.
附图说明Description of drawings
为让本发明的上述目的、特征和优点能更明显易懂,以下结合附图对本发明的具体实施方式作详细说明,其中:In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:
图1是本发明实施例中压合装置的立体示意图。Fig. 1 is a schematic perspective view of a pressing device in an embodiment of the present invention.
图2是本发明实施例中压合装置的左侧示意图。Fig. 2 is a left side schematic view of the pressing device in the embodiment of the present invention.
图3是本发明实施例中压合装置的剖面示意图。Fig. 3 is a schematic cross-sectional view of a pressing device in an embodiment of the present invention.
图4是本发明实施例中压合装置中触压机构的立体示意图。Fig. 4 is a schematic perspective view of the pressing mechanism of the pressing device in the embodiment of the present invention.
图5是本发明实施例中压合装置中触压机构的剖面示意图。Fig. 5 is a schematic cross-sectional view of the pressing mechanism in the pressing device according to the embodiment of the present invention.
图6是本发明实施例中压合装置中测压机构的立体示意图。Fig. 6 is a three-dimensional schematic diagram of a pressure measuring mechanism in a pressing device in an embodiment of the present invention.
图7是本发明实施例中压合装置中测压机构的剖面示意图。Fig. 7 is a schematic cross-sectional view of the pressure measuring mechanism in the pressing device in the embodiment of the present invention.
图8是本发明实施例中压合装置中旋转机构及调整机构的立体示意图。Fig. 8 is a three-dimensional schematic diagram of a rotating mechanism and an adjusting mechanism in a pressing device in an embodiment of the present invention.
图9是本发明实施例中压合装置中旋转机构及调整机构的剖面示意图。Fig. 9 is a schematic cross-sectional view of a rotating mechanism and an adjusting mechanism in a pressing device according to an embodiment of the present invention.
图10是本发明实施例中压合装置对应第一物件的示意图。Fig. 10 is a schematic diagram of a pressing device corresponding to a first object in an embodiment of the present invention.
图11是本发明实施例中压合装置吸附第一物件的示意图。Fig. 11 is a schematic diagram of the pressing device absorbing the first object in the embodiment of the present invention.
图12是本发明实施例中压合装置受CCD检测装置进行检测对位的示意图。Fig. 12 is a schematic diagram of the detection and alignment of the pressing device by the CCD detection device in the embodiment of the present invention.
图13是本发明实施例中压合装置在吸附第一物件下对应第二物件的示意图。Fig. 13 is a schematic diagram of the pressing device corresponding to the second object under the adsorption of the first object in the embodiment of the present invention.
图14是本发明实施例中压合装置在吸附第一物件下对第二物件加压的示意图。Fig. 14 is a schematic diagram of pressurizing the second object under the adsorption of the first object by the pressing device in the embodiment of the present invention.
符号说明:Symbol Description:
A 触压机构 A1 本体A Contact mechanism A1 body
A11 热源传感器 A2 抵压轴A11 Heat source sensor A2 Pressure shaft
A21 轴承 A22 模座A21 Bearing A22 Die Holder
A221 管道 A222 开口A221 Pipe A222 Opening
A223 底部 A23 套座A223 bottom A23 sleeve
A231 第二接头 A232 气嘴A231 Second connector A232 Gas nozzle
A24 突缘 A25 管道A24 flange A25 pipe
A26 第一接头 A27 加热器A26 First connector A27 Heater
B 测压机构 B1 第一联结座B Pressure measuring mechanism B1 first coupling seat
B11 下扣座 B12 座架B11 Lower Buckle B12 Seat Frame
B121 下台座 B122 上台座B121 Lower pedestal B122 Upper pedestal
B123 座架 B124 钻座B123 Mount B124 Drill Block
B2 第二联结座 B21 上扣座B2 Second coupling seat B21 Upper buckle seat
B22 嵌座 B221 嵌槽B22 Insert B221 Insert
B23 第一弹性元件 B3 荷重感测元件B23 First elastic element B3 Load sensing element
C 旋转机构 C1 转轴C Swivel C1 Shaft
C11 上轴座 C12 下轴座C11 Upper shaft seat C12 Lower shaft seat
C2 头罩 C21 轴承C2 Hood C21 Bearing
C22 垫座 C23 间隔件C22 Pedestal C23 Spacer
C24 余隙 C25 第二弹性元件C24 Clearance C25 Second elastic element
C3 驱动件 C4 皮带C3 Drive C4 Belt
D 调整机构 D1 罩架D Adjustment mechanism D1 Hood frame
D11 螺座 D2 微调件D11 Screw seat D2 Trimmer
D21 螺固件 D3 抵块D21 screw D3 block
D4 第三弹性元件 E 载座D4 The third elastic element E carrier
E1 滑轨 E2 滑座E1 Rail E2 Carriage
E3 框座 E31 上固定座E3 frame base E31 upper mount
E32 下固定座 F 固定座E32 Lower mount F mount
G 第一物件 G1 主部位G first object G1 main part
G2 次部位 G3 次部位G2 Subsite G3 Subsite
H 第二物件 K 检测装置H Second object K Detection device
具体实施方式Detailed ways
请参阅图1、2,本发明实施例的压合方法及装置可以如图中所示的装置来说明,该压合装置主要是在同一垂直轴向上设有由下到上依序设置的一触压机构A、一测压机构B、一旋转机构C、一调整机构D;其中,该触压机构A设于一载座E上滑轨E1的滑座E2上;该旋转机构C设于载座E的一框座E3中相隔间距的上固定座E31与下固定座E32间被定位;该调整机构D设于该上固定座E31上;该测压机构B则位于旋转机构C与触压机构A间,其受旋转机构C所连动,而连动触压机构A中的一转轴(请参阅图3)旋转;借由对调整机构D的微调操作,可连动经旋转机构C、测压机构B而使该触压机构A可在载座E上滑轨E1作上、下微调位移;该载座E承载由触压机构A、测压机构B、旋转机构C、调整机构D所组构形成的装置并设于一固定座F上,载座E在固定座F上可作上、下滑移,固定座F可设于一般机台中可供位移的轨道上受操控,以使整体压合装置可被位移到定位对待加工物进行施作。Please refer to Figures 1 and 2. The pressing method and device of the embodiment of the present invention can be described as the device shown in the figure. The pressing device is mainly arranged on the same vertical axis from bottom to top. A pressure-touching mechanism A, a pressure-measuring mechanism B, a rotating mechanism C, and an adjusting mechanism D; wherein, the pressure-touching mechanism A is set on the sliding seat E2 of the slide rail E1 on a carrier E; the rotating mechanism C is set It is positioned between the upper fixed seat E31 and the lower fixed seat E32 in a frame seat E3 of the carrier E; the adjustment mechanism D is set on the upper fixed seat E31; the pressure measuring mechanism B is located between the rotating mechanism C and the lower fixed seat E32. Between the touch mechanism A, it is linked by the rotation mechanism C, and a rotating shaft (see Figure 3) in the linkage touch mechanism A rotates; by fine-tuning the adjustment mechanism D, it can be linked by the rotation mechanism C. Pressure measuring mechanism B so that the pressure-touching mechanism A can be fine-tuned up and down on the slide rail E1 of the carrier E; The device formed by the mechanism D is set on a fixed seat F, the carrier E can slide up and down on the fixed seat F, and the fixed seat F can be set on a track that can be displaced in a general machine to be controlled , so that the whole pressing device can be displaced to a position for processing the object to be processed.
请参阅图3、4、5本发明实施例的触压机构A包括:Please refer to Figures 3, 4, and 5. The pressing mechanism A of the embodiment of the present invention includes:
一本体A1,设于载座E的滑座E2(参阅图1)上,其上设有热源传感器A11;A body A1, which is set on the sliding seat E2 (see Figure 1) of the carrier E, on which a heat source sensor A11 is arranged;
一抵压轴A2,其设于本体A1中并受轴承A21所枢设可作旋转,抵压轴A2上方受测压机构B连动,下方则接设有一模座A22,模座A22借二呈半环状的套座A23与抵压轴A2下方一突缘A24固结,而可与抵压轴A2作拆卸、组合及同步上、下或旋转;抵压轴A2与模座A22中设有彼此相连通的管道A25、A221,该管道A25于模座A22下方设有开口A222,可借一内通气压的第一接头A26输入负压,而提供模座A22下方可进行吸附物件的能力;该套座A23中亦设有管道,可借内通气压的第二接头A231输入负压,而提供套座A23下方二气嘴A232可进行吸附物件的能力;抵压轴A2中设有提供热源的加热器A27,其下端抵于模座A22,使其热源可达于模座A22底部A223,所述热源传感器A11与抵压轴A2抵近,可检测监控加热器A27所传递给抵压轴A2的温度以进行控制。A pressing shaft A2, which is set in the main body A1 and pivoted by the bearing A21 for rotation, the upper pressing shaft A2 is linked by the pressure measuring mechanism B, and the lower part is connected with a mold base A22, and the mold base A22 is formed by two halves The ring-shaped sleeve A23 is solidified with a flange A24 below the pressing shaft A2, and can be disassembled, assembled and synchronously up, down or rotated with the pressing shaft A2; Pipelines A25 and A221, the pipeline A25 is provided with an opening A222 under the mold base A22, and a negative pressure can be input through a first joint A26 with internal air pressure to provide the ability to absorb objects under the mold base A22; the sleeve A23 There is also a pipeline in the middle, which can input negative pressure through the second joint A231 of the internal air pressure, and provide the ability of the second air nozzle A232 under the sleeve A23 to absorb objects; the pressure axis A2 is equipped with a heater A27 that provides a heat source. Its lower end is against the mold base A22, so that the heat source can reach the bottom A223 of the mold base A22. The heat source sensor A11 is close to the pressing shaft A2, and can detect and monitor the temperature transmitted to the pressing shaft A2 by the monitoring heater A27 for control.
请参阅图3、6、7,该测压机构B包括:Please refer to Figures 3, 6, and 7, the pressure measuring mechanism B includes:
一第一联结座B1,位于测压机构B下方并与触压机构A的抵压轴A2上端联结并连动,包括:一与抵压轴A2上端联结并连动的下扣座B11,以及位于下扣座B11上方的座架B12;该座架B12包括位于下方的下台座B121及位于上方的上台座B122,其间设有上、下端分别与上台座B122、下台座B121固设且环列相间隔的三支轴架B123;下台座B121上设有一钻座B124;A first coupling seat B1, which is located below the pressure measuring mechanism B and is connected and linked with the upper end of the pressing shaft A2 of the pressure contact mechanism A, including: a lower buckle seat B11 connected with and linked with the upper end of the pressing shaft A2, and a bottom seat B11 located at the bottom The seat frame B12 above the buckle seat B11; the seat frame B12 includes the lower platform B121 located below and the upper platform B122 located above, and the upper and lower ends are respectively fixed and spaced apart from the upper platform B122 and the lower platform B121. The three support brackets B123; the lower pedestal B121 is provided with a drill base B124;
一第二联结座B2,与旋转机构C的一转轴C1下端联结并连动,其整体设于该第一联结座B1中座架B12的三支轴架B123间;第二联结座B2包括:一与转轴C1下端联结并连动的上扣座B21,以及位于第二联结座B11下方一体设置的盘状嵌座B22,嵌座B22以周缘环列相间隔的四嵌槽B221分别各嵌扣其所各自对应的轴架B123;嵌座B22与第一联结座B1的上台座B122间设有一套设在上扣座B21上的弹簧构成的第一弹性元件B23;A second connecting seat B2 is connected and interlocked with the lower end of a rotating shaft C1 of the rotating mechanism C, and is integrally arranged between the three support brackets B123 of the seat frame B12 in the first connecting seat B1; the second connecting seat B2 includes: An upper buckle seat B21 connected and interlocked with the lower end of the rotating shaft C1, and a disc-shaped seat B22 integrally arranged under the second coupling seat B11, the seat B22 is respectively embedded with four interlocking grooves B221 spaced apart in a ring around the periphery The respective corresponding shaft brackets B123; the first elastic element B23 composed of a set of springs arranged on the upper buckle seat B21 is arranged between the nest B22 and the upper pedestal B122 of the first coupling seat B1;
一荷重感测元件B3,设于第一联结座B1的钻座B124与第二联结座B2的嵌座B22间;A load sensing element B3, located between the drill base B124 of the first coupling base B1 and the nest B22 of the second coupling base B2;
旋转机构C的旋轴C1借连动上扣座B21以带动嵌座B22旋转,嵌座B22再以各嵌槽B221嵌扣轴架B123连动第一联结座B1的整个座架B12旋转,使座架B12连动下扣座B11带动触压机构A的抵压轴A2旋转。The rotating shaft C1 of the rotating mechanism C drives the seat B22 to rotate by interlocking the buckle seat B21, and the seat B22 uses the sockets B221 to buckle the shaft frame B123 to link the entire seat frame B12 of the first coupling seat B1 to rotate. The seat frame B12 is linked with the lower button seat B11 to drive the pressing shaft A2 of the pressing mechanism A to rotate.
请参阅图3、8、9,本发明实施例的旋转机构C包括:Referring to Fig. 3, 8, 9, the rotating mechanism C of the embodiment of the present invention includes:
设于载座E的框座E3中相隔间距的上固定座E31与下固定座E32间的转轴C1,该转轴C1下方与测压机构B的第二联结座B2的上扣座B21联结连动,并借一下轴座C12枢设于下固定座E32,转轴C1上方设有一固设于一轴承C21上而可旋转的头罩C2,并借一上轴座C11枢设于上固定座E31;头罩C2下方螺固有一垫座C22,头罩C2、垫座C22下方与上固定座E31间设有一间隔件C23,其内径与转轴C1上端轴径间设有余隙C24,该余隙C24中以一弹簧构成的第二弹性元件C25套设在该转轴C1上端轴径处,第二弹性元件C25上端顶于头罩C2及垫座C22,下方抵于与上固定座E31枢设的上轴座C11,转轴C1上端轴径及碟盘状固定件C2并受调整机构D所作用微调;该转轴C1中间轴径大,上、下两端轴径小,该中间轴径部分并受一马达构成的驱动件C3以一皮带C4绕设而带动可作旋转;该驱动件C3设于上固定座E31上。The rotating shaft C1 between the upper fixing seat E31 and the lower fixing seat E32 arranged in the frame seat E3 of the carrier E, the bottom of the rotating shaft C1 is connected and linked with the upper buckle seat B21 of the second coupling seat B2 of the pressure measuring mechanism B , and pivoted on the lower fixed seat E32 by the lower shaft seat C12, a rotatable head cover C2 fixed on a bearing C21 is arranged above the rotating shaft C1, and pivotally mounted on the upper fixed seat E31 by an upper shaft seat C11; A cushion C22 is screwed under the hood C2, and a spacer C23 is provided between the hood C2, the bottom of the pedestal C22 and the upper fixing seat E31, and a clearance C24 is provided between its inner diameter and the shaft diameter of the upper end of the rotating shaft C1. In the clearance C24 The second elastic element C25 composed of a spring is sheathed on the upper end of the rotating shaft C1. The upper end of the second elastic element C25 abuts against the hood C2 and the cushion C22, and the lower end abuts against the upper shaft pivoted with the upper fixing seat E31 Seat C11, the shaft diameter of the upper end of the rotating shaft C1 and the disc-shaped fixing part C2 are fine-tuned by the adjustment mechanism D; The driving part C3 formed can be rotated by a belt C4 around it; the driving part C3 is arranged on the upper fixing seat E31.
请参阅图3、8、9,本发明实施例的调整机构D包括:Referring to Fig. 3, 8, 9, the adjustment mechanism D of the embodiment of the present invention includes:
一罩架D1,其下方呈开口状并罩置于上固定座E31,使转轴C1上端受罩置于其内,罩架D1上端设有一螺座D11,螺座D11上螺设有一微调件D2,其前端设有一抵块D3,抵块D3与旋转机构C的转轴C1上方头罩C22间设有一弹簧构成的第三弹性元件D4,其中,该第三弹性元件D4的扬程及线径均较该第二弹性元件C25大,微调件D2并可借螺固件D21予以在微调后螺固定位。A cover frame D1, the bottom of which is open and placed on the upper fixing seat E31, so that the upper end of the rotating shaft C1 is covered and placed in it. The upper end of the cover frame D1 is provided with a screw seat D11, and the screw seat D11 is provided with a trimmer D2. , the front end is provided with a block D3, between the block D3 and the hood C22 above the rotating shaft C1 of the rotating mechanism C, a third elastic element D4 composed of a spring is arranged, wherein the lift and wire diameter of the third elastic element D4 are relatively large The second elastic element C25 is large, and the fine-tuning member D2 can be screwed in place after fine-tuning by means of the screw member D21.
本发明实施例的压合方法是以前述的压合装置执行,包括:The pressing method of the embodiment of the present invention is performed by the aforementioned pressing device, including:
一加温步骤,将抵压轴A2中的加热器A27使其热源达于模座A22底部A223,所述热源传感器A11检测监控加热器A27所传递给抵压轴A2的温度以控制模座A22随时保持在一定的预设温度;In the first heating step, the heater A27 in the pressing shaft A2 is used to make its heat source reach the bottom A223 of the mold base A22, and the heat source sensor A11 detects and monitors the temperature delivered to the pressing shaft A2 by the heater A27 to control the mold base A22 to keep at a certain preset temperature;
一吸附步骤,使载座E承载由触压机构A、测压机构B、旋转机构C、调整机构D所组构形成的压合装置,借固定座F在机台中可供位移的轨道上受操控,以使整体压合装置可被位移到定位对应第一物件G(配合参阅第10图),其中,该模座A22对应第一物件G的主部位G1,套座A23下方的二气嘴A232对应物件G的次部位G2、G3;使载座E承载由触压机构A、测压机构B、旋转机构C、调整机构D所组构形成的压合装置在固定座F上作上、下方向滑移,并借第一接头A26输入负压经抵压轴A2与模座A22中彼此相连通的管道A25、A221,而自开口A222提供模座A22下方进行对第一物件G吸附(配合参阅图11);In the first adsorption step, the carrier E carries the pressing device formed by the pressure contact mechanism A, the pressure measurement mechanism B, the rotation mechanism C, and the adjustment mechanism D. Manipulate so that the overall pressing device can be displaced to locate the corresponding first object G (see Figure 10 for cooperation), wherein the mold base A22 corresponds to the main part G1 of the first object G, and the two air nozzles below the sleeve A23 A232 corresponds to the sub-parts G2 and G3 of the object G; the carrier E carries the pressing device formed by the contact pressure mechanism A, the pressure measurement mechanism B, the rotation mechanism C, and the adjustment mechanism D on the fixed seat F, and Slide in the downward direction, and use the first joint A26 to input negative pressure through the pressure shaft A2 and the pipes A25 and A221 connected to each other in the mold base A22, and provide the bottom of the mold base A22 from the opening A222 to adsorb the first object G (matching See Figure 11);
一对位步骤,借固定座F在机台中可供位移的轨道上受操控,以使整体压合装置在已吸附第一物件G下被位移到一由CCD检测装置K(配合参阅图12)对应的上方,使CCD检测装置K对第一物件G被吸附定位在模座A22的方位检测结果回馈给旋转机构C的驱动件C3,使驱动件C3驱使转轴C1连动测压机构B的第二联结座B2、第一联结座B1,而使抵压轴A2与模座A22被连动旋转微调下方吸附第一物件G的方位角度,使其对位在预先规划的定位;In the alignment step, the fixed seat F is controlled on the track that can be displaced in the machine table, so that the overall pressing device is displaced to a CCD detection device K after the first object G has been adsorbed (see Figure 12). Correspondingly above, let the CCD detection device K feedback the detection result of the orientation of the first object G being adsorbed and positioned on the mold base A22 to the driving part C3 of the rotating mechanism C, so that the driving part C3 drives the rotating shaft C1 to link with the first part of the pressure measuring mechanism B. The second coupling seat B2 and the first coupling seat B1, so that the pressing shaft A2 and the mold base A22 are rotated in conjunction with each other to fine-tune the azimuth angle of the first object G adsorbed below, so that the alignment is at the pre-planned position;
一加压步骤,借固定座F在机台中可供位移的轨道上受操控,以使整体压合装置在已吸附第一物件G并已完成对位下,被位移到一第二物件H上方(配合参阅图13),此时第二物件H上表面已预先涂覆粘性材料;然后使载座E承载由触压机构A、测压机构B、旋转机构C、调整机构D所组构形成的压合装置在固定座F上作上、下方向滑移,而使抵压轴A2下方模座A22连动已吸附的第一物件G下压第二物件H上表面(配合参阅图14);In a pressurization step, the fixed seat F is controlled on the track that can be displaced in the machine, so that the overall pressing device is displaced to the top of a second object H after the first object G has been adsorbed and the alignment has been completed. (Refer to Figure 13), at this time, the upper surface of the second object H has been pre-coated with viscous material; The press-fitting device slides up and down on the fixed seat F, so that the mold base A22 below the pressing axis A2 is linked with the first object G that has been adsorbed and presses down on the upper surface of the second object H (see Figure 14 for cooperation);
一压力记录步骤,于该加压步骤中,该抵压轴A2下方的模座A22对应第一物件G下压第二物件H上表面下压施力的程度,将经由抵压轴A2传递到测压机构B设于第一联结座B1的钻座B124与第二联结座B2的嵌座B22间的荷重感测元件B3,荷重感测元件B3将把取得加压荷重信息回馈传递给机台的控制装置(图中未示)进行记录,以确认加压的力道是否在预设被允许的范围;当加压的力道不在预设被允许的范围时,借由对调整机构D中微调件D2的旋转微调,改变第三弹性元件D4对转轴C1上方头罩C22的弹性施力程度,使其连动至改变该抵压轴A2下方的模座A22对应第一物件G下压第二物件H上表面下压施力的程度。A pressure recording step, in the pressurization step, the degree of pressure exerted by the mold base A22 below the pressing axis A2 corresponding to the first object G pressing down on the upper surface of the second object H will be transmitted to the pressure measurement via the pressing axis A2 Mechanism B is installed on the load sensing element B3 between the drill base B124 of the first coupling base B1 and the nest B22 of the second coupling base B2. The load sensing element B3 will feed back the obtained pressurized load information to the control of the machine device (not shown in the figure) to record to confirm whether the force of pressurization is within the preset allowable range; when the force of pressurization is not within the preset allowable range, by adjusting Rotate fine-tuning to change the degree of elastic force exerted by the third elastic element D4 on the hood C22 above the rotating shaft C1, so that it is linked to change the mold base A22 below the pressing shaft A2 corresponding to the first object G to press down on the upper surface of the second object H The amount of downforce applied.
本发明实施例的压合方法中,压合装置的触压机构A、测压机构B、旋转机构C、调整机构D皆设在同一单元架构上,而使其模座A22、抵压轴A2、第一联结座B1、第二联结座B2及其间的荷重感测元件B3、转轴C1、微调件D2皆在同一垂直轴向上对物件进行施作,进而使压合制程中加温步骤、吸附步骤、对位步骤、加压步骤、压力记录步骤皆在同一单元架构的压合装置中执行,不仅可对二物件的粘着后压合可作精确的对位、压合,且压合、烘干在同一单元架构完成,对于下压程度的压力值可以作有效的回馈、记录及补偿、微调,对于加热温度亦能有效的掌握控制,使压合制程的效益大幅提升。In the pressing method of the embodiment of the present invention, the pressing mechanism A, the pressure measuring mechanism B, the rotating mechanism C, and the adjusting mechanism D of the pressing device are all set on the same unit structure, so that the mold base A22, the pressing shaft A2, The first connecting seat B1, the second connecting seat B2 and the load sensing element B3 between them, the rotating shaft C1, and the fine-tuning member D2 are all applied to the object on the same vertical axis, so that the heating step and adsorption in the pressing process Steps, alignment steps, pressurization steps, and pressure recording steps are all carried out in the lamination device with the same unit structure. Not only can the precise alignment and lamination of the two objects be carried out after lamination, but also lamination, baking It is done in the same unit structure, which can effectively feedback, record, compensate, and fine-tune the pressure value of the pressing degree, and can also effectively control the heating temperature, which greatly improves the efficiency of the pressing process.
虽然本发明已以较佳实施例揭示如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作些许的修改和完善,因此本发明的保护范围当以权利要求书所界定的为准。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.
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