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CN105866747A - Active phased array radar transmit-receive component and manufacturing method thereof - Google Patents

Active phased array radar transmit-receive component and manufacturing method thereof Download PDF

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Publication number
CN105866747A
CN105866747A CN201610315852.9A CN201610315852A CN105866747A CN 105866747 A CN105866747 A CN 105866747A CN 201610315852 A CN201610315852 A CN 201610315852A CN 105866747 A CN105866747 A CN 105866747A
Authority
CN
China
Prior art keywords
phased array
amplifier
transmitting
array radar
connectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610315852.9A
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Chinese (zh)
Inventor
桂勇锋
金来福
丁德志
解启林
霍绍新
吕春明
李佩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 38 Research Institute
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CETC 38 Research Institute
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Publication date
Application filed by CETC 38 Research Institute filed Critical CETC 38 Research Institute
Priority to CN201610315852.9A priority Critical patent/CN105866747A/en
Publication of CN105866747A publication Critical patent/CN105866747A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/28Details of pulse systems
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

The invention discloses an active phased array radar transmit-receive component and a manufacturing method thereof. The component comprises four transmit-receive circuit units and a multifunctional multiplexing circuit unit. Each transmit-receive circuit unit comprises a circular isolator, an amplitude limiter, a low-noise amplifier, a driving amplifier and a power amplifier. The multifunctional multiplexing circuit unit comprises a 1:4 strip line power dividing/combining network, four amplitude and phase multifunctional circuits, four waveform controlled circuits and four power modulation circuits. The receipt signal of each transmit-receive circuit unit is input through an antenna, and the receipt signals of four channels are synthesized and output finally through the 1:4 strip line power dividing/combining network after passing through the circular isolators, the amplitude limiters, the low-noise amplifiers and the amplitude and phase multifunctional circuits. Emission signals are input through a common terminal of the component and output through the 1:4 strip line power dividing/combining network, the amplitude and phase multifunctional circuits, the driving amplifiers, the power amplifiers and the circular isolators. The invention further discloses a design method and manufacturing method of the component.

Description

A kind of Connectors for Active Phased Array Radar transmitting-receiving subassembly and preparation method thereof
Technical field
The present invention relates to a kind of radar transmit-receive assembly, particularly relate to a kind of Connectors for Active Phased Array Radar transmitting-receiving subassembly and Its manufacture method.
Background technology
A new generation's Connectors for Active Phased Array Radar system needs high-frequency wideband to work for improving certainty of measurement;For increasing prestige It is high-power that power needs to launch output;For suppressing graing lobe, preventing the many-valued ambiguity of angle measurement, it is desirable to channel unit It is smaller than the half-wavelength size of operating frequency;For being suitable for the platform uses such as airborne, spaceborne, it is desirable to Active Phased Array Face section highly integrated, low and weight amount.Active front is the core of Connectors for Active Phased Array Radar system, transmitting-receiving group Part is index and the cost key of active front, this most corresponding requirement a new generation transmitting-receiving subassembly Gonna breakthrough high frequency Work, broadband, high-power and highly integrated technological difficulties.
Traditional multi-joint transmitting-receiving subassembly uses " fragment of brick formula " structure, is primarily present following deficiency: (1) is most It is operated in X-band and following, more than X-band and millimere-wave band successful Application is little;(2) mostly belong to In narrowband systems, absolute bandwidth 4GHz there is also a lot of technological difficulties;(3) passage cascade number is insufficient, Each passage is stand-alone integrated so that unit interval and size of components section big, high;(4) heat dissipation design is the most complete Face so that output is limited;Therefore, traditional transmitting-receiving subassembly form can not meet under these occasions The application demand of radar load.
Summary of the invention
It is contemplated that solve the problems referred to above at all, it is provided that a kind of Connectors for Active Phased Array Radar transmitting-receiving subassembly and system thereof Making method, the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the present invention is a kind of Ku wave band broadband high-power height collection One-tenth degree Connectors for Active Phased Array Radar transmitting-receiving subassembly, can effectively solve the Ku active front of wave band Connectors for Active Phased Array Radar Broadband (14-18Ghz), high-power (>=8W), highly integrated (array element distance≤half-wavelength, tetrad collection Become, chip type (component thickness≤7mm)) technological difficulties, solve prior art airborne, spaceborne The problem being unsatisfactory for use demand of the aspects such as frequency band, power, volume, feed is there is Deng application scenario.
The solution of the present invention is: a kind of Connectors for Active Phased Array Radar transmitting-receiving subassembly, and it is that a four-way is received Send out assembly, and include: four road transmission circuit unit, a road multifunctional multiplexing circuit unit;Every road transmitting-receiving electricity Road unit includes: belt isolater, amplitude limiter, low-noise amplifier, driving amplifier and power amplifier; Multifunctional multiplexing circuit unit includes: 14 strip line merits divide/synthesize network, four width mutually multi-functional Circuit, four ripple control circuit, four power supply modulator circuits;Four width phase multifunctional circuits, four ripple control electricity Road, four power supply modulator circuit Jun Yu tetra-road transmission circuit unit are corresponding;Wherein:
The reception signal of every road transmission circuit unit is inputted by antenna, through corresponding belt isolater in order to increase Transceiver channel is isolated, then through corresponding amplitude limiter in order to prevent reception passage from burning, is then passed through corresponding low noise Acoustic amplifier in order to ensure relatively low noise coefficient and to amplify, be then passed through corresponding width phase multifunctional circuit in order to Realize receiving branch amplitude and phase controlling, finally divided/synthesize network by four passages by 14 strip line merits Reception signal syntheses output;Amplitude limiter, low-noise amplifier constitute the main body frame receiving passage;
The transmitting signal of every road transmission circuit unit is inputted by assembly common port, divides through 14 strip line merits/closes Become network four width phase multifunctional circuits of supply in order to realize transmitting branch amplitude and phase controlling, the most successively Through driving amplifier, power amplifier, belt isolater output;Amplifier, power amplifier are constituted to be launched The main body frame of passage.
As the improvement further of such scheme, every road circuit unit has transmitting state, reception state, mates and bear The tri-state carrying state is the most optional, and reception and amplitude and the phase place launched all can independently control.
As the further improvement of such scheme, amplitude limiter, low-noise amplifier are loaded in reception molybdenum copper carrier On, driving amplifier, power amplifier are loaded on transmitting molybdenum copper carrier.
Further, network, four width phase multifunctional circuits, four ripple control electricity are divided/synthesized to 14 strip line merits Road, four power supply modulator circuits all design and are loaded in a LTCC multilamellar imposite.
As the further improvement of such scheme, belt isolater is put with power with amplitude limiter, belt isolater Interconnection mode between big device is respectively adopted gold wire bonding and gold ribbon bonding.
As the further improvement of such scheme, width phase multifunctional circuit includes that SP3T switch, numerical control decline Subtract device, digital phase shifter and compensation amplifier;The switch controlling signal provided according to corresponding ripple control circuit, depends on Secondary after numerical-control attenuator, digital phase shifter, via SP3T switch switching select conducting transmission channel, Or receive passage or a matched load.
As the further improvement of such scheme, the external radio frequency interface of this assembly includes: antenna end 4 tunnel blindmate Formula SMP radio frequency (RF) coaxial connector, common port 1 road SSMA radio frequency (RF) coaxial connector.
As the further improvement of such scheme, use between four passages of this component internal and this assembly The metal muscle of housing integration processing is separately.
As the further improvement of such scheme, 14 strip line merits divide/synthesize network to bury strip line biography in using Defeated;LTCC multilamellar imposite is begun to speak at six as substrate altogether, is width phase multifunctional circuit bonding part the most everywhere, It is input interface microstrip line-strip line flat bed transition at one, is output interface strip line-microstrip line flat bed at one Transition.
The present invention also provides for the manufacture method of above-mentioned any Connectors for Active Phased Array Radar transmitting-receiving subassembly, and it includes following Step:
Step one, substrate manufacture: use LTCC Technology to make one piece of LTCC multilamellar imposite, base Flaggy number is 17 layers;
Step 2, substrate load: use Sn/Au eutectic weldering mode that LTCC multilamellar imposite is welded in an one On the housing changed;
Step 3, component mounting: use Sn/Au eutectic weldering mode to be welded on amplitude limiter, low-noise amplifier Receive on molybdenum copper carrier, use Sn/Au eutectic weldering mode to be welded on transmitting in driving amplifier, power amplifier On molybdenum copper carrier, width phase multifunctional circuit, ripple control circuit, power supply modulator circuit all use conducting resinl to be bonded at On LTCC multilamellar imposite, the storage capacitor in each circuit uses lead-tin soldering mode to be welded in LTCC multilamellar imposite On, then utilize spun gold pressure welding and ball bonding to complete the interconnection between chip and chip chamber, chip and substrate;
Step 4, carrier load: reception molybdenum copper carrier, transmitting molybdenum copper carrier, belt isolater are directly filled It is welded on housing, then utilizes spun gold/gold ribbon to complete the interconnection between chip and chip chamber, chip and substrate;
Step 5, airtight soldering and sealing: adopt between low frequency interface and the housing of this Connectors for Active Phased Array Radar transmitting-receiving subassembly With integral sintering, high frequency induction welding mode between radio frequency connector and the housing of this assembly, is used to seal, so Parallel soldering and sealing is used to seal between back casing and the cover plate of this assembly.
The Connectors for Active Phased Array Radar transmitting-receiving subassembly that the present invention provides is that Ku wave band broadband high-power is highly integrated to be had Source phased-array radar transmitting-receiving subassembly, by using LTCC multilamellar imposite space multiplexing technique, Broadband Matching electricity Network technology, width are divided/synthesized to road design optimizing, high efficiency and heat radiation designing technique, interior buried strap shape live width band merit Band microstrip line-strip line flat bed ladder gradual transition technology, output interface are blind arranges meter and multi-chip module assembling Technology, it is achieved that the high-frequency wideband of transmitting-receiving subassembly, high-power, small size, chip type;Pass through transceiver channel Modularized design and Technology, manufacturability design technology, power supply modulator circuit designing technique, fall volume set Meter technology, radio frequency interface induction welding technology, housing low-frequency connector integrated welding connection technology and multi-chip module Auto-assembling technique, it is achieved that the height of transmitting-receiving subassembly finished product airtight, high and highly reliable.
Accompanying drawing explanation
Fig. 1 is the circuit connection diagram of the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the embodiment of the present invention;
Fig. 2 is the connection diagram of width phase multifunctional circuit in Fig. 1;
Fig. 3 is the external structure schematic diagram of the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the embodiment of the present invention;
Fig. 4 is the circuit layout schematic diagram of the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the embodiment of the present invention;
Fig. 5 is that the multi-functional compound circuit unit of the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the embodiment of the present invention is used Ltcc substrate is begun to speak structural representation.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation The every other embodiment obtained under property work premise, broadly falls into the scope of protection of the invention.
Ku wave band broadband high-power is highly integrated has for a kind of for the Connectors for Active Phased Array Radar transmitting-receiving subassembly of the present invention Source phased-array radar transmitting-receiving subassembly device.The embodiment of the present invention utilize LTCC multilamellar imposite space multiplexing technique, Inside bury strip line merit divide/synthesize network technology, wideband microband line-strip line flat bed ladder gradual transition technology, Broadband matching circuit design optimizing, high efficiency and heat radiation designing technique, output interface are blind arranges meter and multi-chip Assembling components technology, it is achieved that the high-frequency wideband of transmitting-receiving subassembly, high-power, small size and chip type.Thus Connectors for Active Phased Array Radar transmitting-receiving subassembly provided by the present invention has broadband, high-power, highly integrated, Gao Ke The speciality leaned on.
Fig. 1 is the Ku wave band transmitting-receiving subassembly i.e. circuit connection diagram of Connectors for Active Phased Array Radar transmitting-receiving subassembly. This assembly is a four-way transmitting-receiving subassembly, has four road transmission circuit unit and a road multifunctional multiplexing circuit list Unit.Every road transmission circuit unit includes belt isolater 1 (i.e. circulator in Fig. 1), amplitude limiter 2, low Noise amplifier 3, driving amplifier 5 and power amplifier 6.One road composite multifunction circuit unit is with one LTCC multilamellar imposite covers a 1:4 strip line merit and divides/synthesize network 7 (i.e. 1:4 merit in Fig. 1 Point/combiner), four width phase multifunctional circuits 4 (i.e. multi-functional width phase control in Fig. 1), four ripple controls Circuit 8 and four power supply modulator circuits 9 (i.e. power modulation in Fig. 1).
The reception signal of every road transmission circuit unit is inputted by antenna, and the belt isolater 1 through assembly (is used To increase transceiver channel isolation), amplitude limiter 2 (burning in order to prevent from receiving passage), low-noise amplifier 3 (in order to ensure relatively low noise coefficient), width phase multifunctional circuit 4 are (in order to realize receiving branch amplitude and phase Position controls), finally divided/synthesize network 7 to be exported by the reception signal syntheses of four passages by 14 strip line merits. Wherein, amplitude limiter 2 tolerates pulse power and is up to 15W, can be effectively ensured and receive low-noise amplifier 3 Safety.Low-noise amplifier 3 uses 0.25um GaAs PHEMT technique and Low-noise Design Technology, line Property gain high, noise coefficient is little, can effectively realize the low-noise factor of whole assembly.Amplitude limiter 2, low Noise amplifier 3 constitutes the main body frame receiving passage.
The transmitting signal of every road transmission circuit unit is inputted by assembly common port, divides through 14 strip line merits/closes One-tenth network four passages of supply: width phase multifunctional circuit 4 (in order to realize transmitting branch amplitude and phase controlling), Driving amplifier 5, fixed attenuator 21 (such as Fig. 4), power amplifier 6, belt isolater 1 export. Output >=10W in power amplifier full bandwidth, output >=8W in assembly full bandwidth.Put in two-stage The fixed attenuator 21 of 1dB is increased, to improve cascade standing wave, increase spatial separation and then prevent between big device Self-oscillation possible under low temperature.Driving amplifier 5, power amplifier 6 constitute the body frame of transmission channel Frame.
The data of serial input are converted to parallel output signal by ripple control circuit 8, are used for controlling transceiver channel Amplitude, phase controlling and switch switching etc., and ensure launch and receive time-sharing work.Ripple control circuit 8 wraps The function contained has string turn and control, virtual protection, under-voltage protection, negative pressure protection and fault feedback etc..Ripple control The input signal of circuit 8 mainly have SD1 (the 1st channel serial data), SD2 (the 2nd channel serial data), SD3 (the 3rd channel serial data), SD4 (the 4th channel serial data), SC (serial clock), END (serial data terminates), SYN (system synchronization), TR-T (transmitting lock-out pulse), TR-R (receive same Pace pulse), SD-O (fault output), Clear (system reset);Wherein serioparallel exchange can realize 32 bit strings Turning and export, output level+5V/0V, parallel output comprises 6 displacement phase controls, 6 adjustable attenuation and 2 Bit switch controls.
Power supply modulator circuit 9 mainly includes speed-sensitive switch driver, large-current electric modulator of source, able to programme negative Power supply modulator and filter capacitor and storage capacitor, provide enough driving electric current also for each active device The work schedule realizing assembly controls.
Fig. 2 is the circuit connection diagram of width phase multifunctional circuit 4, and width phase multifunctional circuit 4 mainly includes SP3T switch 13,6 digital phase shifters 12 of 11,6 numerical-control attenuators and compensation amplifier 11. The switch controlling signal provided according to ripple control circuit 8, switching selects conducting transmission channel, or receives passage, Or matched load, so that transceiver channel can share a set of numerical-control attenuator and phase shifter, improve assembly Integrated level, reduce cost.
Fig. 3 is transmitting-receiving subassembly overall structure schematic diagram, and the external radio frequency interface of this assembly includes: antenna end 4 tunnel Blindmate formula SMP radio frequency (RF) coaxial connector 14, common port 1 road SSMA radio frequency (RF) coaxial connector 19.This group Part also has low frequency interface 17, low frequency interface 17 to be 25 core insulation.25 core insulation attached bags include 13 single data Line (Clear, SD1, SD2, SD3, SD4, SC, END, SYN, TR-R, TR-T, AGND (simulation ground), DGND (digitally), SD-O), 12 power lines, the most only need a J71-25ZK The micro-rectangular electric connector of type can complete control signal and supply input.Therefore, signal can collect with power interface Become: with J71-25ZK small rectangular electric connector manufacture 5 × 5 25 core insulations.
The metal muscle of processing integrated with housing 18 is used to separate between four passages of component internal, to improve Isolation between passage and avoid cavity effect.In each passage, amplitude limiter 2 and low-noise amplifier 3 are straight Connect molybdenum copper carrier and (shown in Fig. 4), driving amplifier and power amplifier direct molybdenum copper carrier installation (figure are installed Shown in 4), the width phase multifunctional circuit on four tunnels, ripple control circuit and power supply modulator circuit etc. are loaded in 1 17 On layer LTCC multilamellar imposite 16.Meanwhile, single-layer ceramic substrate circuit 15 is set for transmission circuit unit Feed.
Fig. 5 is that the circuit of 17 layers of LTCC multilamellar imposite 16 is begun to speak schematic diagram.1:4 merit divide/synthesize network, Signal transmission (except at circuit interface) buries strip line 20 in all using and transmits.Ltcc substrate begins to speak 6 altogether Place, is wherein that in the i.e. ltcc substrate in width phase multifunctional circuit bonding part, width phase multifunction chip is begun to speak position at 4 Put 23, be that input interface microstrip line-strip line i.e. ltcc substrate of flat bed transition inputs near radiofrequency signal at 1 End i.e. common port is begun to speak position 24, is output interface strip line-microstrip line i.e. ltcc substrate of flat bed transition at 1 RF signal output is begun to speak position 22.
The Ku wave band broadband high-power highly integrated Connectors for Active Phased Array Radar transmitting-receiving subassembly dress of the embodiment of the present invention The Making programme following steps put.
Substrate manufacture.LTCC Technology is used to make one piece of LTCC multilamellar imposite 16, substrate size For 48.6mm × 40.3mm × 1.7mm, the substrate number of plies is 17 layers.
Substrate loads: use Sn/Au eutectic weldering mode that LTCC multilamellar imposite 16 is welded in the housing of integration On 18.
Component mounting.Sn/Au eutectic weldering mode is used to be welded on reception amplitude limiter 2, low-noise amplifier 3 On molybdenum copper carrier, Sn/Au eutectic weldering mode is used to be welded on transmitting in driving amplifier 5, power amplifier 6 On molybdenum copper carrier, power supply chip, control chip, width phase multifunction chip, filter capacitor, resistance all use Conducting resinl is bonded on LTCC multilamellar imposite, and storage capacitor uses lead-tin soldering mode to be welded in LTCC multilamellar imposite On 16, spun gold pressure welding and ball bonding is then utilized to complete the interconnection between chip and chip chamber, chip and substrate.
Belt isolater 1 and the amplitude limiter 2 of receiving circuit unit, the power amplifier 5 of radiating circuit unit Between by traditional pin soldering interconnection mode be improved to respectively gold wire bonding and gold ribbon bonding, eliminate soldering Welding quality uncontrollability and the batch discordance impact on radio-frequency front-end key electrical performance indexes.
Carrier load: molybdenum copper carrier will be received, launch molybdenum copper carrier, belt isolater 1, transmission circuit confession The direct welding equipment of electric unit plate on housing 18, then utilize spun gold/gold ribbon be bonded chip and chip chamber, Interconnection between chip and substrate.
Airtight soldering and sealing.Integral sintering, radio frequency connector (i.e. antenna is used between low frequency interface and housing 18 Hold 4 tunnel blindmate formula SMP radio frequency (RF) coaxial connector 14 and common port SSMP radio frequency (RF) coaxial connectors 19) with Use high frequency induction welding mode to seal between housing 18, on the basis of the above, adopt between housing 18 and cover plate Seal with parallel soldering and sealing, it is achieved while low frequency vertical connects, it is ensured that the airtight index of height of assembly.
Embodiments provide a kind of Ku highly integrated Connectors for Active Phased Array Radar of wave band broadband high-power to receive Send out assembly apparatus, at least can bring following beneficial effect.
1, integrated use LTCC multilamellar imposite space multiplexing technique of the present invention, broadband matching circuit optimization design Technology, in bury strip line merit and divide/synthesize network technology, wideband microband line-strip line flat bed ladder gradual transition Technology, output interface are blind arranges meter and multi-chip module package technique, it is achieved that the high frequency wideband of transmitting-receiving subassembly Band work, unit interval are less than half-wavelength and the good Electro Magnetic Compatibility of multichannel of mid frequency.Thus this Bright provided transmitting-receiving subassembly has broadband, high-power, highly integrated, the speciality of small size.
2, use Transmit-Receive Unit direct carrier weldering designing technique, greatly improve radio frequency ground connection and heat dispersion; Use efficient transmission matching technique, cascade standing wave optimisation technique, space isolation technology, design of Reducing Rating technology, The protection of virtual protection, negative pressure, under-voltage protection, pulse power modulation technique, housing seal solder technology, pole Improve greatly stability and the high reliability of component operation, thus transmitting-receiving subassembly provided by the present invention has greatly Power, high efficiency, highly reliable speciality.
3, use transceiver channel modularized design and Technology, LTCC multilamellar imposite space multiplexing technique, Two dimension multi-chip auto-assembling technique, production process can review control technology, improve assembly manufacturability, Yield rate, thus transmitting-receiving subassembly provided by the present invention has the speciality of low cost, high finished product rate.
Obviously, those skilled in the art can carry out various change and modification without deviating from this to the present invention Bright spirit and scope.So, if the present invention these amendment and modification belong to the claims in the present invention and Within the scope of its equivalent technologies, then the present invention is also intended to comprise these change and modification.

Claims (10)

1. a Connectors for Active Phased Array Radar transmitting-receiving subassembly, it is characterised in that: it is a four-way transmitting-receiving subassembly, And include four road transmission circuit unit, a road multifunctional multiplexing circuit unit;Every road transmission circuit unit includes Belt isolater (1), amplitude limiter (2), low-noise amplifier (3), driving amplifier (5) and merit Rate amplifier (6);Multifunctional multiplexing circuit unit include 14 strip line merits divide/synthesize network (7), Four width phase multifunctional circuit (4), four ripples control circuit (8), four power supply modulator circuits (9);Four Individual width phase multifunctional circuit (4), four ripples control circuit (8), four power supply modulator circuits (9) are all with four Road transmission circuit unit is corresponding;Wherein:
The reception signal of every road transmission circuit unit is inputted by antenna, through corresponding belt isolater (1) in order to Increase transceiver channel isolation, then through corresponding amplitude limiter (2) in order to prevent reception passage from burning, be then passed through Corresponding low-noise amplifier (3), in order to ensure relatively low noise coefficient and to amplify, is then passed through corresponding width the most Functional circuit (4) in order to realize receiving branch amplitude and phase controlling, finally by 14 strip line merits divide/ The reception signal syntheses of four passages is exported by synthesis network (7);Amplitude limiter (2), low-noise amplifier (3) main body frame of reception passage is constituted;
The transmitting signal of every road transmission circuit unit is inputted by assembly common port, divides through 14 strip line merits/closes Become network (7) supply four width phase multifunctional circuit (4) in order to realize transmitting branch amplitude and phase controlling, The most successively through driving amplifier (5), power amplifier (6), belt isolater (1) output;Drive Amplifier (5), power amplifier (6) constitute the main body frame of transmission channel.
2. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: every road circuit Unit have launch state, receive state, matched load state tri-state the most optional, and receive and launch amplitude All can independently control with phase place.
3. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: amplitude limiter (2), Low-noise amplifier (3) is loaded on reception molybdenum copper carrier, driving amplifier (5), power amplifier (6) It is loaded on transmitting molybdenum copper carrier.
4. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: 14 bands Shape line merit divide/synthesize network (7), four width phase multifunctional circuit (4), four ripples control circuit (8), Four power supply modulator circuits (9) are all designed and are loaded in a LTCC multilamellar imposite.
5. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: isolation of going in ring Interconnection mode between device (1) and amplitude limiter (2), belt isolater (1) and power amplifier (6) It is respectively adopted gold wire bonding and gold ribbon bonding.
6. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: the mutually more merits of width Can include that SP3T switchs (11), numerical-control attenuator (13), digital phase shifter (12) by circuit (4) With compensation amplifier (10);The switch controlling signal provided according to corresponding ripple control circuit (8), sequentially passes through After numerical-control attenuator (13), digital phase shifter (12), select via SP3T switch (11) switching Turn on transmission channel or receive passage or a matched load.
7. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: this assembly pair Outer radio frequency interface includes: antenna end 4 tunnel blindmate formula SMP radio frequency (RF) coaxial connector (14), common port 1 Road SSMA radio frequency (RF) coaxial connector (19).
8. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: in this assembly The metal muscle of processing integrated with the housing of this assembly (18) is used to separate between four passages in portion.
9. Connectors for Active Phased Array Radar transmitting-receiving subassembly as claimed in claim 1, it is characterised in that: 14 bands Shape line merit divides/synthesizes network (7) to bury strip transmission in using;LTCC multilamellar imposite is opened altogether as substrate At chamber six, it is width phase multifunctional circuit (4) bonding part the most everywhere, is input interface microstrip line-band at one Shape line flat bed transition, is output interface strip line-microstrip line flat bed transition at one.
10. a Connectors for Active Phased Array Radar transmitting-receiving subassembly as in one of claimed in any of claims 1 to 9 Manufacture method, it is characterised in that: it comprises the following steps:
Step one, substrate manufacture: use LTCC Technology to make one piece of LTCC multilamellar imposite, base Flaggy number is 17 layers;
Step 2, substrate load: use Sn/Au eutectic weldering mode that LTCC multilamellar imposite is welded in an one On the housing changed;
Step 3, component mounting: use Sn/Au eutectic weldering mode to be welded on amplitude limiter, low-noise amplifier Receive on molybdenum copper carrier, use Sn/Au eutectic weldering mode to be welded on transmitting in driving amplifier, power amplifier On molybdenum copper carrier, width phase multifunctional circuit, ripple control circuit, power supply modulator circuit all use conducting resinl to be bonded at On LTCC multilamellar imposite, the storage capacitor in each circuit uses lead-tin soldering mode to be welded in LTCC multilamellar imposite On, then utilize spun gold pressure welding and ball bonding to complete the interconnection between chip and chip chamber, chip and substrate;
Step 4, carrier load: reception molybdenum copper carrier, transmitting molybdenum copper carrier, belt isolater are directly filled It is welded on housing, then utilizes spun gold/gold ribbon to complete the interconnection between chip and chip chamber, chip and substrate;
Step 5, airtight soldering and sealing: adopt between low frequency interface and the housing of this Connectors for Active Phased Array Radar transmitting-receiving subassembly With integral sintering, high frequency induction welding mode between radio frequency connector and the housing of this assembly, is used to seal, so Parallel soldering and sealing is used to seal between back casing and the cover plate of this assembly.
CN201610315852.9A 2016-05-11 2016-05-11 Active phased array radar transmit-receive component and manufacturing method thereof Pending CN105866747A (en)

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CN201610315852.9A CN105866747A (en) 2016-05-11 2016-05-11 Active phased array radar transmit-receive component and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN201610315852.9A CN105866747A (en) 2016-05-11 2016-05-11 Active phased array radar transmit-receive component and manufacturing method thereof

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CN107505600A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Multifunction chip circuit
CN107505601A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Wide-band microwave width phase control applied to phased array system receives and dispatches multifunction chip
CN108008357A (en) * 2017-12-11 2018-05-08 广东黑林通信技术有限公司 A kind of azimuth plane synthesizer for radar antenna
CN108512569A (en) * 2018-03-20 2018-09-07 成都创亿嘉科技有限公司 A kind of signal receiving and transmitting system of Active Arrays
CN108732563A (en) * 2018-08-21 2018-11-02 无锡华测电子系统有限公司 A kind of multichannel tile type transmitting-receiving subassembly
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CN109216935A (en) * 2018-08-24 2019-01-15 中国电子科技集团公司第二十九研究所 A kind of integrated assembly method of millimeter wave phased array
CN109245793A (en) * 2018-09-29 2019-01-18 中国电子科技集团公司第五十四研究所 A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method
CN109507688A (en) * 2017-09-15 2019-03-22 清华大学 A kind of laser beam emitting device, laser radar detection device and method
CN109787587A (en) * 2018-12-27 2019-05-21 西北核技术研究所 A kind of dexterity type microwave combination pulse generator
CN109901125A (en) * 2019-03-11 2019-06-18 中国电子科技集团公司第三十八研究所 A kind of airborne two-dimentional Connectors for Active Phased Array Radar antenna calibration device and method
CN110320500A (en) * 2019-06-10 2019-10-11 南京理工大学 A kind of high integration, inexpensive Connectors for Active Phased Array Radar radio-frequency front-end
CN110346765A (en) * 2018-04-02 2019-10-18 航天金鹏科技装备(北京)有限公司 A kind of highly integrated four-way TR component
CN110596649A (en) * 2019-09-18 2019-12-20 上海航天电子通讯设备研究所 T/R assembly
CN111025235A (en) * 2019-12-16 2020-04-17 南京吉凯微波技术有限公司 Microwave TR assembly with ultra-wide working bandwidth
CN111157980A (en) * 2019-12-31 2020-05-15 中国电子科技集团公司第十三研究所 Transceiver assembly
CN111835376A (en) * 2020-08-10 2020-10-27 航天科工通信技术研究院有限责任公司 High-integration multi-channel tile type T/R assembly and arrangement method
CN113015390A (en) * 2019-12-20 2021-06-22 五基星(成都)科技有限公司 Machine box
CN113098551A (en) * 2021-04-27 2021-07-09 电子科技大学 HTCC three-dimensional receiving and transmitting assembly
CN114167357A (en) * 2021-10-22 2022-03-11 北京无线电测量研究所 X-Ku waveband four-channel miniaturized broadband time-delay T/R module
CN114460544A (en) * 2022-01-25 2022-05-10 中国电子科技集团公司第三十八研究所 Phased array radio frequency multi-beam forming network and control method
CN114665280A (en) * 2022-03-28 2022-06-24 中国电子科技集团公司第十研究所 Three-dimensional transmitting-receiving feed network applied to flat-panel packaged array antenna
CN118354517A (en) * 2024-06-18 2024-07-16 南京邮电大学 Radio frequency transceiver module with embedded micro-channel heat dissipation structure

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CN109507688A (en) * 2017-09-15 2019-03-22 清华大学 A kind of laser beam emitting device, laser radar detection device and method
CN107505601A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Wide-band microwave width phase control applied to phased array system receives and dispatches multifunction chip
CN107505600A (en) * 2017-09-30 2017-12-22 天津中科海高微波技术有限公司 Multifunction chip circuit
CN108008357A (en) * 2017-12-11 2018-05-08 广东黑林通信技术有限公司 A kind of azimuth plane synthesizer for radar antenna
CN108512569A (en) * 2018-03-20 2018-09-07 成都创亿嘉科技有限公司 A kind of signal receiving and transmitting system of Active Arrays
CN110346765A (en) * 2018-04-02 2019-10-18 航天金鹏科技装备(北京)有限公司 A kind of highly integrated four-way TR component
CN109149130A (en) * 2018-07-26 2019-01-04 西南电子技术研究所(中国电子科技集团公司第十研究所) Active phase array antenna receive-transmit system
CN108732563A (en) * 2018-08-21 2018-11-02 无锡华测电子系统有限公司 A kind of multichannel tile type transmitting-receiving subassembly
CN108732563B (en) * 2018-08-21 2024-02-09 无锡华测电子系统有限公司 Multichannel tile formula transceiver module
CN109216935A (en) * 2018-08-24 2019-01-15 中国电子科技集团公司第二十九研究所 A kind of integrated assembly method of millimeter wave phased array
CN109216935B (en) * 2018-08-24 2020-07-17 中国电子科技集团公司第二十九研究所 Millimeter wave phased array integrated assembly method
CN109245793A (en) * 2018-09-29 2019-01-18 中国电子科技集团公司第五十四研究所 A kind of multichannel tile type phased array transmitting-receiving array and its manufacturing method
CN109245793B (en) * 2018-09-29 2023-05-09 中国电子科技集团公司第五十四研究所 Multichannel tile type phased array transceiver array and manufacturing method thereof
CN109787587A (en) * 2018-12-27 2019-05-21 西北核技术研究所 A kind of dexterity type microwave combination pulse generator
CN109787587B (en) * 2018-12-27 2020-10-09 西北核技术研究所 Dexterous microwave combined pulse generator
CN109901125A (en) * 2019-03-11 2019-06-18 中国电子科技集团公司第三十八研究所 A kind of airborne two-dimentional Connectors for Active Phased Array Radar antenna calibration device and method
CN110320500A (en) * 2019-06-10 2019-10-11 南京理工大学 A kind of high integration, inexpensive Connectors for Active Phased Array Radar radio-frequency front-end
CN110596649A (en) * 2019-09-18 2019-12-20 上海航天电子通讯设备研究所 T/R assembly
CN111025235A (en) * 2019-12-16 2020-04-17 南京吉凯微波技术有限公司 Microwave TR assembly with ultra-wide working bandwidth
CN113015390A (en) * 2019-12-20 2021-06-22 五基星(成都)科技有限公司 Machine box
CN111157980A (en) * 2019-12-31 2020-05-15 中国电子科技集团公司第十三研究所 Transceiver assembly
CN111835376A (en) * 2020-08-10 2020-10-27 航天科工通信技术研究院有限责任公司 High-integration multi-channel tile type T/R assembly and arrangement method
CN113098551A (en) * 2021-04-27 2021-07-09 电子科技大学 HTCC three-dimensional receiving and transmitting assembly
CN114167357A (en) * 2021-10-22 2022-03-11 北京无线电测量研究所 X-Ku waveband four-channel miniaturized broadband time-delay T/R module
CN114460544A (en) * 2022-01-25 2022-05-10 中国电子科技集团公司第三十八研究所 Phased array radio frequency multi-beam forming network and control method
CN114460544B (en) * 2022-01-25 2024-05-10 中国电子科技集团公司第三十八研究所 Phased array radio frequency multi-beam forming network and control method
CN114665280A (en) * 2022-03-28 2022-06-24 中国电子科技集团公司第十研究所 Three-dimensional transmitting-receiving feed network applied to flat-panel packaged array antenna
CN118354517A (en) * 2024-06-18 2024-07-16 南京邮电大学 Radio frequency transceiver module with embedded micro-channel heat dissipation structure

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Application publication date: 20160817