CN105822909A - Ultraviolet filament lamp - Google Patents
Ultraviolet filament lamp Download PDFInfo
- Publication number
- CN105822909A CN105822909A CN201610249331.8A CN201610249331A CN105822909A CN 105822909 A CN105822909 A CN 105822909A CN 201610249331 A CN201610249331 A CN 201610249331A CN 105822909 A CN105822909 A CN 105822909A
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- Prior art keywords
- ultraviolet
- filament
- substrate
- ultraviolet filament
- led chip
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to the technical field of ultraviolet LEDs, in particular to an ultraviolet filament and an ultraviolet filament lamp. The ultraviolet filament comprises a base plate and ultraviolet LED chips, wherein the ultraviolet LED chips are fixed on the base plate. According to the ultraviolet filament, the ultraviolet LED chips are fixed on the base plate to form the ultraviolet filament which forms the ultraviolet filament lamp, so that the ultraviolet filament lamp can emit ultraviolet rays in a full angle to meet the application in different places, and the applicability of the ultraviolet LED chips is improved.
Description
Technical field
The present invention relates to ultraviolet LED technical field, particularly relate to a kind of ultraviolet filament and ultraviolet filament lamp.
Background technology
Deep ultraviolet LED(UVLED) it is just to start volume production and practical recent years.The same with common white light LEDs, UVLED is also point source, it is impossible to forms 360 degree of full angles and " illuminates ", which greatly limits UVLED and use and apply.Traditional mercury lamp would not there is problems in that, but hydrargyrum is poisonous as heavy metal, is denounced by people always.After people worry to use mercury lamp very much, cause hydrargyrum for revealing, bring life danger etc. situation.UVLED does not has mercury pollution, and is environmental protection, energy-conservation good product, has the advantages such as length in service life.It is the trend of a certainty that UVLED replaces mercury lamp, and how making UVLED lamp omnidirectional is an important problem in UVLED field instantly.
Summary of the invention
The present invention is to solve that UVLED lamp in prior art can not the technical problem of omnidirectional, it is provided that a kind of ultraviolet filament and ultraviolet filament lamp.
A kind of ultraviolet filament, wherein, including substrate and UV LED chip, described UV LED chip is fixing on the substrate.
Further, described substrate is provided with the first bus separated from one another and the second bus；The positive pole of described UV LED chip and negative pole are fixed with described first bus and the second bus and are electrically connected respectively.
Further, described substrate is provided with crystal bonding area；Described crystal bonding area has positive pole contiguous block and negative pole contiguous block；The positive pole of described UV LED chip and negative pole are fixed with described positive pole contiguous block and negative pole contiguous block and are electrically connected respectively.
Further, described substrate has some described crystal bonding areas, is electrically connected by the 3rd bus between described crystal bonding area.
Further, described substrate has some described crystal bonding areas, is electrically connected by aluminum glitter flakes between described crystal bonding area.
Further, at least side of described UV LED chip is provided with at least one ultraviolet light reflector.
Further, described ultraviolet light reflector shape is one or more in cone, cylinder and spheroid.
Further, described substrate includes matrix and the sidewall extended upward by described matrix dual-side.
Further, the medial surface of described sidewall is less than 165 degree with the angle of described matrix more than 125 degree.
Further, described substrate is provided with ultraviolet light reflecting layer.
Further, described substrate is quartz glass substrate or sapphire substrate or aluminum substrate；The insulation transmissive film of one layer of ultraviolet light it is provided with on described aluminum substrate.
The embodiment of the present invention also provides for a kind of ultraviolet filament lamp.This ultraviolet filament lamp includes above-mentioned ultraviolet filament.
Further, described ultraviolet filament lamp is bulb lamp.
Further, including some described ultraviolet filaments, the cover body of saturating ultraviolet light and lamp holder, described cover body is blistered cover body, it is provided with support in described cover body, described ultraviolet filament is arranged on described support, and described ultraviolet filament electrically connects with described lamp holder, and described lamp holder and described cover body are formed and seal space.
Further, described ultraviolet filament lamp is ultraviolet filament fluorescent tube.
Further, including some described ultraviolet filaments, the housing of the saturating ultraviolet light of bar shaped, bar shaped is heat sink and two lamp holders, described lamp holder is formed with described housing and seals space, described ultraviolet filament be evenly provided on described bar shaped heat sink on, described bar shaped is heat sink to be positioned at described sealing space and is fixed on described lamp holder.
Beneficial effect: the present invention is fixed on substrate formation ultraviolet filament by UV LED chip, and is formed ultraviolet filament lamp by uviol lamp silk, it is achieved ultraviolet filament lamp full angle emitting ultraviolet light, meets the application of different occasion, improves the suitability of UV LED chip.
Accompanying drawing explanation
Fig. 1 is the ultraviolet filament schematic perspective view of the embodiment of the present invention one.
Fig. 2 is the ultraviolet filament schematic top plan view of the embodiment of the present invention one.
Fig. 3 is the ultraviolet filament cross-sectional structure schematic diagram of the embodiment of the present invention one.
Fig. 4 is the ultraviolet filament cross-sectional structure schematic diagram of the embodiment of the present invention two.
Fig. 5 is the ultraviolet filament schematic perspective view of the embodiment of the present invention.
Fig. 6 is the ultraviolet filament schematic perspective view of the embodiment of the present invention three.
Fig. 7 is the uviol lamp silk ball bulb lamp structure schematic diagram of the embodiment of the present invention.
Fig. 8 is the ultraviolet filament lamp tube structure schematic diagram of the embodiment of the present invention.
Detailed description of the invention
Several aspects of the present invention it are described below with reference to the example application for explanation.It should be appreciated that the many details of statement, relation and method provide and fully understand the present invention.But, will readily appreciate that those of ordinary skill in the related art, the present invention can be implemented in the case of without one or more details or the present invention can be implemented with additive method.
Embodiment one
Fig. 1 is the ultraviolet filament schematic perspective view of the embodiment of the present invention one.Fig. 2 is the ultraviolet filament schematic top plan view of the embodiment of the present invention one.Fig. 3 is the ultraviolet filament cross-sectional structure schematic diagram of the embodiment of the present invention one.
Refer to Fig. 1 to Fig. 3, propose the ultraviolet filament of the embodiment of the present invention one.The ultraviolet filament of the present embodiment includes substrate 100 and UV LED chip 300, and this UV LED chip 300 is fixed on this substrate 100.The ultraviolet filament of the embodiment of the present invention, it is not necessary to UV LED chip 300 is encapsulated on support, cost-effective.The present invention is fixed on substrate formation ultraviolet filament by UV LED chip, and is formed ultraviolet filament lamp by uviol lamp silk, it is achieved ultraviolet filament lamp full angle emitting ultraviolet light, meets the application of different occasion, improves the suitability of UV LED chip.Typically, the ultraviolet filament of the present embodiment having multiple UV LED chip 300, it is integrated to carry out multiple UV LED chip, meets the demand of different field.The ultraviolet filament of the present embodiment can apply formation bulb lamp, it is also possible to application forms daylight lamp (i.e. strip light or fluorescent tube, now send ultraviolet light), can apply to indoor sterilization field, such as hospital or dining room sterilize, it is also possible to be applied to curing field, it is achieved UV paints solidification.
This substrate 100 can be hard substrate, it is also possible to for flexible base board.The material of this hard substrate can be glass or ceramic material, it is also possible to for metal material.The material of this flexible base board can be flexible PCB, it is also possible to for flexiplast.The present embodiment preferably this substrate 100 uses the ceramic substrate of hard, and this ceramic substrate has the advantages such as insulation and perfect heat-dissipating.In order to improve the injection efficiency of ultraviolet light, the present invention preferably has ultraviolet light reflecting layer, such as aluminum film layer in the surface configuration of this substrate 100.In the present embodiment, this aluminum film layer is formed on this ceramic substrate.Further preferably, this aluminum film layer is formed with silica membrane layer, facilitates the circuit arrangement of this UV LED chip.
In the present embodiment, this substrate 100 be preferably shaped to strip, form filament shape.
In some other embodiments, this substrate 100 is preferably aluminum substrate, and this aluminum substrate has good deep ultraviolet light-reflecting property, can improve the injection efficiency of ultraviolet light, will not be absorbed by filament itself, cause the loss that ultraviolet light is unnecessary.Select aluminum substrate time, it is generally required to aluminum substrate fixing UV LED chip one side formed one layer of ultraviolet light insulation transmissive film, such as insulating silica silicon thin film.
In some other embodiments, the material of this substrate 100 is preferably quartz glass or sapphire, forms quartz glass substrate or sapphire substrate.This quartz glass substrate or sapphire substrate can well transmitting UV, especially wavelength at the ultraviolet of below 300nm.This quartz glass substrate or sapphire substrate make ultraviolet have an opportunity, through substrate injection itself, to reduce and absorbed by filament itself, increase ultraviolet light injection.
In the present embodiment, this UV LED chip 300 can be to use three kinds of modes fixing on the substrate 100.The first is that this UV LED chip 300 is fixed and electrically connected to the form using bus, so there is no need to gold thread and connects, and reduces cost and improves light efficiency.The second is to use crystal bonding area and aluminum glitter flakes to fix and electrically connect this UV LED chip 300, it is also possible to need not gold thread.The third is to use bus and crystal bonding area to combine, it is also possible to need not gold thread.
UV LED chip 300 quantity in the present embodiment preferably this ultraviolet filament is multiple, such as 5 or 10, sets itself as required.Above-mentioned second, with in the third fixed form, this substrate 100 is provided with the crystal bonding area consistent with this UV LED chip 300 quantity.Fig. 5 is the ultraviolet filament schematic perspective view of the embodiment of the present invention.Refer to Fig. 5, this substrate 100 is provided with two crystal bonding areas 130, crystal bonding area is provided with positive pole contiguous block and negative pole contiguous block (not shown).This UV LED chip 300 is positioned in this crystal bonding area 130, and the positive pole of this UV LED chip 300 and negative pole are fixed with this positive pole contiguous block and negative pole contiguous block and electrically connected respectively.In order to make to be formed between this UV LED chip 300 two-by-two electric pathway, this enforcement preferably employs aluminum glitter flakes 230 and is arranged on two-by-two between UV LED chip 300.This aluminum glitter flakes 230 plays the purpose of conduction and light reflection ultraviolet.The width of this aluminum glitter flakes 230 is consistent with this substrate 100, and length, more than the spacing between two crystal bonding areas 130, forms arch, similar arch bridge, it is easier to light reflection ultraviolet.In some embodiments it is possible to use the 3rd bus to substitute this aluminum glitter flakes 230, i.e. the 3rd bus electrical connection between this crystal bonding area 130.3rd bus can complete with this crystal bonding area 130 simultaneously, cost-effective, it is possible to use metal deposition technique growth is made.The material of the present embodiment the preferably the 3rd bus is aluminum, has preferable ultraviolet reflecting power.
The ultraviolet filament of the present embodiment is preferably provided with the first bus 210 and the second bus 220 separated from one another on this ceramic substrate 100.This first bus 210 and the second bus 220 are not connected with independently of one another.This first bus 210 is covered with the side of this substrate 100, and this second bus 220 is covered with the opposite side of this substrate 100.This first bus 210 is by electrode 241 and external electrical connections, and this second bus 220 is by electrode 242 and external electrical connections.Use the first bus 210 and design of the second bus 220, it is convenient to omit the making of crystal bonding area, because the both positive and negative polarity of this UV LED chip 300 can be fixed and be connected electrically in respectively on the first bus 210 and the second bus 220.Therefore, this design can place this UV LED chip 300 multiple, is not limited by crystal bonding area.First bus 210 is for being connected with the positive electrical of UV LED chip 300, and this second bus 220 is connected with the negative electricity of this UV LED chip 300.This first bus 210 and the second bus 220 can be formed in the way of using silk-screen.This first bus 210 and the second bus 220 material are conductive silver paste.This first bus 210 and the second bus 220 can also form (i.e. forming two metal levels) by the way of metal deposit on the surface of this ceramic substrate 100.The method that such as can use magnetron sputtering deposits.Metal level can complete to use the form of eutectic with the connection of this UV LED chip 300 electrode.This UV LED chip 300 is formed on this first bus 210 and the second bus 220, this UV LED chip 300 be presented herein below sky, facilitate air or other gas circulation, be conducive to heat radiation.
This UV LED chip 300 is preferably the wavelength deep ultraviolet LED chip less than 300nm, and further preferably this UV LED chip 300 is the deep ultraviolet LED chip of 240nm to 290nm.This UV LED chip 300 refers to, not through the bare crystalline of encapsulation, refer to Fig. 3, and this bare crystalline (this UV LED chip 300) includes luminous zone 330 and the anelectrode 310 electrically connected with luminous zone 330 and negative electrode 320.This luminous zone 330 includes Sapphire Substrate and the n type semiconductor layer, luminescent layer and the p type semiconductor layer that are sequentially formed in Sapphire Substrate.The present embodiment preferably this UV LED chip 300 is flip-chip, conveniently electrically connects with the first bus 210 and the second bus 220.
The ultraviolet filament of the present embodiment is advantageously integrated multiple UV LED chip 300, has higher versatility and the suitability.
Embodiment two
Fig. 4 is the ultraviolet filament cross-sectional structure schematic diagram of the embodiment of the present invention two.Refer to Fig. 4, the ultraviolet filament of the present embodiment is with the difference of embodiment one: at least side of UV LED chip 300 is provided with at least one ultraviolet light reflector 150.This ultraviolet light reflector 150 be shaped as in cone, cylinder and spheroid one or more.Cone can be cone, tetrahedron, multiaspect cone etc. cone.This cylinder can be strip cylinder, cylinder, multi-faceted column and irregular cylinder.This spheroid can be 3/4 spheroid, 1/2 spheroid or complete sphere.The present embodiment preferably this this ultraviolet light reflector 150 is shaped as cone, facilitates the injection of light.
This ultraviolet light reflector 150 can effectively propose the ultraviolet light that this UV LED chip 300 side sends, and promotes the light extraction efficiency of front ultraviolet light.
Embodiment three
Fig. 6 is the ultraviolet filament schematic perspective view of the embodiment of the present invention three.Refer to Fig. 6, the ultraviolet filament of the present embodiment is with the difference of embodiment 1: this substrate 100 includes matrix 110 and the sidewall 120 extended upward by this matrix 110 dual-side.This UV LED chip 300 is positioned on this matrix.Preferably the upper surface of this UV LED chip 300 and the upper surface flush of this sidewall 120, so do not interfere with out light.Further, preferably the medial surface 121 of this sidewall 120 and the angle of this matrix 110 are more than 125 degree less than 165 degree, preferably 135 degree, are so conducive to the side reflecting this UV LED chip 300 to go out light.It is that aluminum material is made or is coated with aluminum thin film on the substrate to make this substrate 100 have the ability of light reflection ultraviolet, preferably this substrate.
Embodiment four
The embodiment of the present invention also provides for a kind of ultraviolet filament lamp, and this ultraviolet filament lamp includes above-mentioned ultraviolet filament.
Fig. 7 is the uviol lamp silk ball bulb lamp structure schematic diagram of the embodiment of the present invention.Refer to Fig. 7, the ultraviolet filament lamp of the present embodiment is uviol lamp silk bulb lamp, this bulb lamp includes some described ultraviolet filaments 20, the cover body 70 of saturating ultraviolet light and lamp holder 50, this cover body 70 is blistered cover body, it is provided with support 60 in this cover body 70, this ultraviolet filament 20 is arranged on this support 60, and this ultraviolet filament 20 electrically connects with this lamp holder 50, and this lamp holder 50 and this cover body 70 are formed and seal space.This lamp holder 50 has and external electrical connections and for fixing helicitic texture 80.
Fig. 8 is the ultraviolet filament lamp tube structure schematic diagram of the embodiment of the present invention.Refer to Fig. 8, the ultraviolet filament lamp of the present embodiment is ultraviolet filament fluorescent tube.This ultraviolet filament fluorescent tube includes some above-mentioned ultraviolet filaments 20, the housing 30 of the saturating ultraviolet light of bar shaped, bar shaped is heat sink 10 and two lamp holders 40, this lamp holder 40 is formed with this housing 30 and seals space, this ultraviolet filament 20 is evenly provided in this bar shaped heat sink 10, and this bar shaped is heat sink 10 to be positioned at this sealing space and be fixed on this lamp holder 40.
Describe the present invention to the above being merely cited for property, be not limited to the present invention.It should be pointed out that, for the person of ordinary skill of the art, the present invention can be made some improvement, revise and deform, but these improve, revise and deform and are within the scope of the present invention being regarded as without departing from the spirit of the invention.
Claims (16)
1. a ultraviolet filament, it is characterised in that include substrate and UV LED chip, described UV LED chip is fixing on the substrate.
2. ultraviolet filament as claimed in claim 1, it is characterised in that be provided with the first bus separated from one another and the second bus on described substrate；The positive pole of described UV LED chip and negative pole are fixed with described first bus and the second bus and are electrically connected respectively.
3. ultraviolet filament as claimed in claim 1, it is characterised in that be provided with crystal bonding area on described substrate；Described crystal bonding area has positive pole contiguous block and negative pole contiguous block；The positive pole of described UV LED chip and negative pole are fixed with described positive pole contiguous block and negative pole contiguous block and are electrically connected respectively.
4. ultraviolet filament as claimed in claim 3, it is characterised in that described substrate has some described crystal bonding areas, is electrically connected by the 3rd bus between described crystal bonding area.
5. ultraviolet filament as claimed in claim 3, it is characterised in that described substrate has some described crystal bonding areas, is electrically connected by aluminum glitter flakes between described crystal bonding area.
6. the ultraviolet filament as described in claim 2 or 3 or 4, it is characterised in that at least side of described UV LED chip is provided with at least one ultraviolet light reflector.
7. ultraviolet filament as claimed in claim 6, it is characterised in that described ultraviolet light reflector shape is one or more in cone, cylinder and spheroid.
8. ultraviolet filament as claimed in claim 1, it is characterised in that described substrate includes matrix and the sidewall extended upward by described matrix dual-side.
9. ultraviolet filament as claimed in claim 8, it is characterised in that the medial surface of described sidewall is less than 165 degree with the angle of described matrix more than 125 degree.
10. the ultraviolet filament as described in claim 1 or 8 or 9, it is characterised in that be provided with ultraviolet light reflecting layer on described substrate.
The 11. ultraviolet filaments as described in claim 1 or 8 or 9, it is characterised in that described substrate is quartz glass substrate or sapphire substrate or aluminum substrate；The insulation transmissive film of one layer of ultraviolet light it is provided with on described aluminum substrate.
12. 1 kinds of ultraviolet filament lamps, it is characterised in that include the ultraviolet filament described in any one of claim 1 to 11.
13. ultraviolet filament lamps as claimed in claim 12, it is characterised in that described ultraviolet filament lamp is bulb lamp.
14. ultraviolet filament lamps as claimed in claim 13, it is characterized in that, including some described ultraviolet filaments, the cover body of saturating ultraviolet light and lamp holder, described cover body is blistered cover body, it is provided with support in described cover body, described ultraviolet filament is arranged on described support, and described ultraviolet filament electrically connects with described lamp holder, and described lamp holder and described cover body are formed and seal space.
15. ultraviolet filament lamps as claimed in claim 12, it is characterised in that described ultraviolet filament lamp is ultraviolet filament fluorescent tube.
16. ultraviolet filament lamps as claimed in claim 15, it is characterized in that, including some described ultraviolet filaments, the housing of the saturating ultraviolet light of bar shaped, bar shaped is heat sink and two lamp holders, described lamp holder is formed with described housing and seals space, described ultraviolet filament be evenly provided on described bar shaped heat sink on, described bar shaped is heat sink to be positioned at described sealing space and is fixed on described lamp holder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610249331.8A CN105822909A (en) | 2016-04-21 | 2016-04-21 | Ultraviolet filament lamp |
| PCT/CN2017/071035 WO2017181751A1 (en) | 2016-04-21 | 2017-01-13 | Uv filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610249331.8A CN105822909A (en) | 2016-04-21 | 2016-04-21 | Ultraviolet filament lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105822909A true CN105822909A (en) | 2016-08-03 |
Family
ID=56526284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610249331.8A Pending CN105822909A (en) | 2016-04-21 | 2016-04-21 | Ultraviolet filament lamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105822909A (en) |
| WO (1) | WO2017181751A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017181751A1 (en) * | 2016-04-21 | 2017-10-26 | 圆融健康科技（深圳）有限公司 | Uv filament lamp |
| CN108662444A (en) * | 2017-03-30 | 2018-10-16 | 深圳市优固科技有限公司 | Ultraviolet leds light supply apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117716162A (en) * | 2021-07-19 | 2024-03-15 | 昕诺飞控股有限公司 | LED filament for disinfection |
| WO2023232670A1 (en) * | 2022-06-02 | 2023-12-07 | Signify Holding B.V. | Led filament comprising leds arranged to emit uv light |
| WO2024028211A1 (en) * | 2022-08-01 | 2024-02-08 | Signify Holding B.V. | Lamp having different uv led filaments emitting different uv light asymmetrically arranged in said lamp |
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| CN102352974B (en) * | 2011-09-07 | 2013-09-11 | 俞国林 | Light emitting diode (LED) ultraviolet germicidal lamp |
| CN102614540A (en) * | 2012-03-13 | 2012-08-01 | 湖南省食品安全生产工程技术研究中心 | LED (Light Emitting Diode) ultraviolet germicidal lamp |
| CN202568985U (en) * | 2012-03-13 | 2012-12-05 | 湖南省食品安全生产工程技术研究中心 | LED (light emitting diode) ultraviolet sterilization lamp |
| KR20150077912A (en) * | 2013-12-30 | 2015-07-08 | 이창민 | The lighting for living body activity and air quality control |
| CN103794603A (en) * | 2014-02-18 | 2014-05-14 | 江苏新广联科技股份有限公司 | Packaging-free UVLED solidification light source module |
| CN203842065U (en) * | 2014-05-27 | 2014-09-24 | 厦门丰泓照明有限公司 | Convenient and efficient LED sterilization device |
| CN105822909A (en) * | 2016-04-21 | 2016-08-03 | 圆融健康科技（深圳）有限公司 | Ultraviolet filament lamp |
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2016
- 2016-04-21 CN CN201610249331.8A patent/CN105822909A/en active Pending
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2017
- 2017-01-13 WO PCT/CN2017/071035 patent/WO2017181751A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202342524U (en) * | 2011-09-07 | 2012-07-25 | 俞国林 | LED (Light-Emitting Diode) ultraviolet sterilization lamp |
| CN105122479A (en) * | 2013-03-04 | 2015-12-02 | 优凡株式会社 | Chip-on-board uv led package and production method therefor |
| CN203826376U (en) * | 2014-02-18 | 2014-09-10 | 江苏新广联科技股份有限公司 | Package-free UVLED solidification light source module group |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017181751A1 (en) * | 2016-04-21 | 2017-10-26 | 圆融健康科技（深圳）有限公司 | Uv filament lamp |
| CN108662444A (en) * | 2017-03-30 | 2018-10-16 | 深圳市优固科技有限公司 | Ultraviolet leds light supply apparatus |
| CN108662444B (en) * | 2017-03-30 | 2021-01-05 | 深圳市优绿源科技有限公司 | Ultraviolet LED light source device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017181751A1 (en) | 2017-10-26 |
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Application publication date: 20160803 |