CN105810798A - EMC (epoxy molding compound) inverted support and single-packaged lens structure and manufacture method thereof - Google Patents
EMC (epoxy molding compound) inverted support and single-packaged lens structure and manufacture method thereof Download PDFInfo
- Publication number
- CN105810798A CN105810798A CN201610352249.8A CN201610352249A CN105810798A CN 105810798 A CN105810798 A CN 105810798A CN 201610352249 A CN201610352249 A CN 201610352249A CN 105810798 A CN105810798 A CN 105810798A
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- Prior art keywords
- emc
- support
- glue
- upside
- lens structure
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Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229920006336 epoxy molding compound Polymers 0.000 title abstract description 44
- 239000003292 glue Substances 0.000 claims abstract description 43
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 19
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 239000000741 silica gel Substances 0.000 claims description 24
- 229910002027 silica gel Inorganic materials 0.000 claims description 24
- 229960001866 silicon dioxide Drugs 0.000 claims description 24
- 238000000465 moulding Methods 0.000 claims description 19
- 239000006071 cream Substances 0.000 claims description 17
- 239000011265 semifinished product Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 7
- 238000010410 dusting Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000011112 process operation Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims description 2
- 230000007480 spreading Effects 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 5
- 238000009826 distribution Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000010992 reflux Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an EMC (epoxy molding compound) inverted support and single-packaged lens structure and a manufacture method thereof. This structure comprises an EMC support and a wafer, the wafer is inversely mounted on the EMC support through tin paste, a white spot powder layer is arranged above the wafer, a layer of self-adhesive glue is provided outside the white spot powder layer, and the outside of the self-adhesive glue is packaged at a time through a silicone lens; this method includes a process of die bonding, reflux welding, dehumidifying, applying of the white spot powder layer, and lens packaging. The defect of low light efficiency due to total reflection of plane package can be overcome, the light efficiency is increased by 8-12% as compared to that of a planar packaging structure, secondary light distribution design is facilitated, and the cost is lower.
Description
Technical field
The present invention relates to LED encapsulation technology field, specifically, relate to a kind of EMC upside-down mounting support and add a package lens
Structure and preparation method thereof.
Background technology
SMD-LED technology is maked rapid progress, the SMD paster of existing 1-3W currently without corresponding product, traditional pottery 3535,
3030 and imitative lumen series of products in, imitative lumen support is the highest with pottery series of products finished product, room for price-cut the most not quite.Existing
The manufacturing process technique of the supporting structure such as imitative lumen complex, the consumption of raw materials in whole encapsulation process is relatively big, produces into
This height, and when using, dead lamp rate is high.
It addition, use now its exiting surface of encapsulation of EMC support to be planar package, fluorescent material is stimulated the wide-angle of outgoing
Light is easily totally reflected when package surface penetrates, and such structure light efficiency is the highest, and is difficult to do secondary light-distribution.
Drawbacks described above, is worth solving.
Summary of the invention
In order to overcome the deficiency of existing technology, the present invention provide a kind of EMC upside-down mounting support add a package lens structure and
Manufacture method.
Technical solution of the present invention is as described below:
EMC upside-down mounting support adds a package lens structure, it is characterised in that include EMC support and wafer,
Described wafer is inverted on described EMC support by tin cream, and described wafer is arranged over white point bisque, described white light
Point bisque is externally provided with a layer self-adhered adhesive, and described self-adhesive is outside once to be encapsulated by silica-gel lens.
The present invention according to such scheme, it is characterised in that described EMC support be 3.0mm*3.0mm*0.52mm circle cup or
3.5*3.5*0.7mm circle cup.
The present invention according to such scheme, it is characterised in that described tin cream is unleaded noresidue tin cream.
The present invention according to such scheme, it is characterised in that passed through Reflow Soldering between described wafer with described tin cream and be connected.
The present invention according to such scheme, it is characterised in that described self-adhesive is the silica gel of one-component, its thickness is 0.003mm.
The present invention according to such scheme, it is characterised in that be provided with the bowl of fixing described wafer in described EMC support.
The present invention according to such scheme, it is characterised in that the refractive index of described white point bisque is 1.5.
The present invention according to such scheme, it is characterised in that described white point bisque is the glue that dusts, described in dust glue uniform spreading
It is located on described wafer, in described bowl and the upper surface of described EMC support.
The present invention according to such scheme, it is characterised in that described in the dust thickness of glue be 0.05um.
The present invention according to such scheme, it is characterised in that described self-adhesive coat described in dust the surface of glue.
The present invention according to such scheme, it is characterised in that described white point bisque is white light packaging plastic, described white light encapsulates
Glue is filled in described bowl.
The present invention according to such scheme, it is characterised in that described self-adhesive coats described white light packaging plastic and described EMC
The upper surface of support.
A kind of EMC upside-down mounting support adds the manufacture method of a package lens structure, it is characterised in that comprise the following steps:
S1: die bond operation；
S2: carry out Reflow Soldering operation by eight warm area Reflow Soldering boards；
S3: dehumidify and be coated with white point bisque；
Package lens Molding process operations of S4: silica gel.
The present invention according to such scheme, it is characterised in that in described step S1, specifically includes following steps:
S11: toast 2 hours in the horizontal oven of 150 degree, EMC support is dehumidified；
S12: use plane stencil printer and 3D printed steel mesh print solder paste in EMC support bowl, described plane tin cream
Printer is high accuracy printer, and its positional precision is 0.05um；
S13: the EMC support printed is carried out die bond operation in LED bonder, true by camera on die bond board
Determine tin cream position and be identified accurate die bond.
The present invention according to such scheme, it is characterised in that in described step S3, white point bisque is the glue that dusts, by spray
Good for the trial glue that dusts is carried out dusting operation by powder machine in Pulse Spraying mode, and the thickness that dusts is 0.05um, the most quiet after having dusted
Put or toast, make sealing semi-finished product.
The present invention according to such scheme, it is characterised in that in described step S3, white point bisque is white light packaging plastic, will
The good white light packaging plastic of trial, by carrying out a glue after encapsulation white light point gum machine mixing evacuation, toasts after putting glue, makes
Sealing semi-finished product.
The present invention according to such scheme, it is characterised in that in described step S4, specifically includes following steps:
S41: the EMC support semi-finished product after coating white point bisque are dehumidified；
S42: spray a layer self-adhered adhesive on EMC support semi-finished product, room temperature stands；
S43: after being mixed by AB silica gel with special mold pressing, molds one by mould heating Molding on compression molding forming machine
Secondary package lens, the demoulding；
Package lens length of S44: silica gel is baked, and makes Molding semi-finished product；
S45: by single of Molding semi-finished product cutting point, and package handling.
According to the present invention of such scheme, it has the beneficial effects that:
1, the present invention is with EMC support as substrate carrier, low cost；
2, flip chip tin cream die bond, thermal impedance is little, and whole lamp thermal impedance is little；
3, package lens of silica gel, luminance raising, goes out light and is better than the imitative lumen structure of tradition, compare plane packaging structure and promote
Light efficiency about 8%-12%, light efficiency is higher；
4, lens angle can be changed and meet the design of different secondary luminous intensity distribution；
5, volume is less, and application space is wider.
Accompanying drawing explanation
Fig. 1 is the contour structures schematic diagram of the present invention；
Fig. 2 is the top view of EMC support of the present invention；
Fig. 3 is EMC upside-down mounting support of the present invention and the top view of wafer；
Fig. 4 is the distributed architecture schematic diagram of glue of dusting in the embodiment of the present invention one；
Fig. 5 is the side sectional view after the embodiment of the present invention one encapsulation；
Fig. 6 is the distributed architecture schematic diagram of white light packaging plastic in the embodiment of the present invention two；
Fig. 7 is the side sectional view after the embodiment of the present invention two encapsulation.
In the drawings, 10, EMC support；11, bowl；20, tin cream；30, wafer；41, dust glue；42, white light encapsulation
Glue；50, self-adhesive；60, silica-gel lens.
Detailed description of the invention
Below in conjunction with the accompanying drawings and the present invention is conducted further description by embodiment:
As Figure 1-3, a kind of EMC upside-down mounting support adds a package lens structure, including EMC support 10 and wafer 30.
Wafer 30 is inverted on EMC support 10 by tin cream 20, passed through Reflow Soldering and be connected between wafer 30 with tin cream 20.EMC
The bowl 11 of fixed wafer it is provided with in support 10.
Wherein, tin cream 20 is unleaded noresidue tin cream.
EMC (Epoxy Molding Compound) is to use new Epoxy material and etching technique at Molding equipment
The frame form of a kind of Highgrade integration under Feng Zhuan.EMC support 10 specification be 3.0mm*3.0mm*0.52mm circle cup or
3.5*3.5*0.7mm circle cup etc..EMC support 10 is a kind of for full wafer support, and a point single mode need to be cut and just complete, need to be adopted
Few by molten stannum residual, good fluidity, the tin cream that particle diameter is little, it is printed in EMC3030 carrier cup with 3D steel mesh, then carries out
Reflow Soldering operation.
Embodiment one
As illustrated in figures 4-5, wafer 30 is arranged over white point bisque, and white point bisque is refractive index 1.5 and above silica gel
Form with fluorescent material (the different colours phosphor combination mixed containing ratio).
In the present embodiment, white point bisque is the glue 41 that dusts, and the thickness of the glue 41 that dusts is 0.05um, and the glue 41 that dusts is uniform
It is layed on wafer 30, in bowl 11 and the upper surface of EMC support 11.The glue 41 that dusts is externally provided with a layer self-adhered adhesive 50,
Self-adhesive 50 is outside once to be encapsulated by silica-gel lens 60, and the thickness of self-adhesive 50 is 0.003mm, and self-adhesive 50 is coated with
It is distributed in the surface of the glue 41 that dusts.
Self-adhesive 50 is the silica gel content of one pack system, for bonding support, white light glue and a molding silica-gel lens.Silicon
Glue lens 60 mixes for liquid A glue and B glue, and at high temperature (130-150 DEG C in solid-state) passes through mould to mold
(molding) mode, is bonded in silica-gel lens on EMC support 10.
Embodiment two
As shown in fig. 6-7, unlike embodiment one, in the present embodiment, wafer 30 is arranged over white point bisque, in vain
Luminous point bisque is refractive index 1.5 and above silica gel and fluorescent material (the different colours phosphor combination mixed containing ratio) composition.
In the present embodiment, white point bisque is white light packaging plastic 42, is filled in bowl 11 from light packaging plastic 42.White light
Packaging plastic 42 is externally provided with a layer self-adhered adhesive 50, and self-adhesive 50 is outside once to be encapsulated by silica-gel lens 60, self-adhesive
50 upper surfaces coating white light packaging plastic 42 and EMC support 10.
Self-adhesive 50 is the silica gel content of one pack system, for bonding support, white light glue and a molding silica-gel lens.Silicon
Glue lens 60 mixes for liquid A glue and B glue, and at high temperature (130-150 DEG C in solid-state) passes through mould to mold
(molding) mode, is bonded in silica-gel lens on EMC support 10.
A kind of EMC upside-down mounting support adds the manufacture method of a package lens structure, it is characterised in that comprise the following steps:
1, die bond operation.Concrete:
Under the conditions of 150 degree/1H, EMC support is dehumidified；Use plane stencil printer and 3D printed steel mesh at EMC
Print solder paste in support bowl, plane stencil printer is high accuracy printer, and its positional precision is 0.05um3D printed steel mesh
For external import tool.The EMC support printed is carried out die bond operation in LED bonder, is identified accurately with PR
Die bond.
2, carrying out Reflow Soldering operation by eight warm area Reflow Soldering boards, temperature requirement is accurate, actual temperature and design temperature in stove
Relevant less than 10 degree, actual temp curve sets according to tin cream.
3, dehumidify and be coated with white point bisque.
White point bisque is glue or the white light packaging plastic of dusting.Wherein, glue operation of dusting is a kind of novel LED point powder mode,
It is realized by duster, the fluorescent material good by trial and the mixing of Prima proportioning, carries out dusting operation in Pulse Spraying mode,
Dust thickness about 0.05um.Stand or baking operation, make sealing semi-finished product；In white light packaging plastic encapsulation process, with encapsulation
White light point gum machine carries out a glue, and white light glue is fluorescent material+silica gel etc., to carry out a glue after the white light glue mixing evacuation that trial is good,
Baking operation, makes sealing semi-finished product.
Package lens Molding process operations of S4: silica gel.
Molding specification: the present invention is used the procedure for producing mode adding a package lens to be silica gel Molding processing procedure,
Production procedure is as follows:
(1) the EMC support semi-finished product after coating white point bisque are dehumidified；
(2) spraying a layer self-adhered adhesive PRIMA on support, room temperature stands；
(3) with liquid A/B mould top glue, compression molding forming machine molds a package lens by mould heating Molding,
The demoulding；
(4) package lens length of silica gel is baked, and makes Molding semi-finished product；
(5) by Molding semi-finished product single/package handling of cutting point.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted, and
All these modifications and variations all should belong to the protection domain of claims of the present invention.
Above in conjunction with accompanying drawing, patent of the present invention is carried out exemplary description, it is clear that the realization of patent of the present invention is not by above-mentioned
The restriction of mode, if the various improvement that the method design that have employed patent of the present invention is carried out with technical scheme, or the most improved
Design and the technical scheme of patent of the present invention are directly applied to other occasion, the most within the scope of the present invention.
Claims (10)
1.EMC upside-down mounting support adds a package lens structure, it is characterised in that include EMC support and wafer,
Being provided with the bowl of fixing described wafer in described EMC support, described wafer is inverted on described EMC support by tin cream,
Described wafer is arranged over white point bisque, and described white point bisque is externally provided with a layer self-adhered adhesive, passes through outside described self-adhesive
Silica-gel lens once encapsulates.
EMC upside-down mounting support the most according to claim 1 adds a package lens structure, it is characterised in that described white light
Point bisque for dusting glue, described in dust that glue uniform spreading is located on described wafer, described bowl is interior and described EMC support upper
Surface.
EMC upside-down mounting support the most according to claim 2 adds a package lens structure, it is characterised in that described self-adhesion
Glue dusts the surface of glue described in coating.
EMC upside-down mounting support the most according to claim 1 adds a package lens structure, it is characterised in that described white light
Point bisque is white light packaging plastic, and described white light packaging plastic is filled in described bowl.
EMC upside-down mounting support the most according to claim 4 adds a package lens structure, it is characterised in that described self-adhesion
Glue coats described white light packaging plastic and the upper surface of described EMC support.
6.EMC upside-down mounting support adds the manufacture method of a package lens structure, it is characterised in that comprise the following steps:
S1: die bond operation；
S2: carry out Reflow Soldering operation by eight warm area Reflow Soldering boards；
S3: dehumidify and be coated with white point bisque；
Package lens Molding process operations of S4: silica gel.
EMC upside-down mounting support the most according to claim 6 adds the manufacture method of a package lens structure, it is characterised in that
In described step S1, specifically include following steps:
S11: in horizontal oven, EMC support is dehumidified；
S12: use plane stencil printer and 3D printed steel mesh print solder paste in EMC support bowl, described plane tin cream
Printer is high accuracy printer, and its positional precision is 0.05um；
S13: the EMC support printed is carried out die bond operation in LED bonder, true by camera on die bond board
Determine tin cream position and be identified accurate die bond.
EMC upside-down mounting support the most according to claim 6 adds the manufacture method of a package lens structure, it is characterised in that
In described step S3, white point bisque is the glue that dusts, and is carried out in Pulse Spraying mode by the glue that dusts good for trial by duster
Dust operation, stand after having dusted or toast, making sealing semi-finished product.
EMC upside-down mounting support the most according to claim 6 adds the manufacture method of a package lens structure, it is characterised in that
In described step S3, white point bisque is white light packaging plastic, is mixed by encapsulation white light point gum machine by white light packaging plastic good for trial
Carry out a glue after closing evacuation, toast after some glue, make sealing semi-finished product.
EMC upside-down mounting support the most according to claim 6 adds the manufacture method of a package lens structure, and its feature exists
In, in described step S4, specifically include following steps:
S41: the EMC support semi-finished product after coating white point bisque are dehumidified；
S42: spray a layer self-adhered adhesive on EMC support semi-finished product, room temperature stands；
S43: after being mixed by AB silica gel with special mold pressing, molds one by mould heating Molding on compression molding forming machine
Secondary package lens, the demoulding；
Package lens length of S44: silica gel is baked, and makes Molding semi-finished product；
S45: by single of Molding semi-finished product cutting point, and package handling.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610352249.8A CN105810798B (en) | 2016-05-26 | 2016-05-26 | EMC upside-down mounting supports add package lens structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610352249.8A CN105810798B (en) | 2016-05-26 | 2016-05-26 | EMC upside-down mounting supports add package lens structure and preparation method thereof |
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| CN105810798B CN105810798B (en) | 2018-03-02 |
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Cited By (6)
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| CN106252243A (en) * | 2016-09-09 | 2016-12-21 | 深圳连硕三悠自动化科技有限公司 | A kind of device and method for the encapsulation of bulb-shaped semiconductor components and devices |
| CN107726074A (en) * | 2017-12-02 | 2018-02-23 | 唐先成 | A kind of new E MC supports carry the LED lamp bead of angle control lens |
| CN109411587A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of purple LED production method and its purple LED containing silica-gel lens |
| CN109411459A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of high optical power purple LED fluorescent tube containing silica-gel lens |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
| CN113451158A (en) * | 2021-04-25 | 2021-09-28 | 福建天电光电有限公司 | Flip chip package structure and manufacturing process thereof |
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| CN109411459A (en) * | 2018-12-10 | 2019-03-01 | 邱凡 | A kind of high optical power purple LED fluorescent tube containing silica-gel lens |
| CN109411587B (en) * | 2018-12-10 | 2020-11-27 | 浙江单色电子科技有限公司 | Production method of purple light LED containing silica gel lens and purple light LED |
| CN109411459B (en) * | 2018-12-10 | 2023-12-29 | 浙江单色电子科技有限公司 | High-light-power ultraviolet LED lamp tube containing silica gel lens |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
| CN113451158A (en) * | 2021-04-25 | 2021-09-28 | 福建天电光电有限公司 | Flip chip package structure and manufacturing process thereof |
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