CN105792535A - Heat treatment coating method for printed circuit board - Google Patents
Heat treatment coating method for printed circuit board Download PDFInfo
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- CN105792535A CN105792535A CN201410808621.2A CN201410808621A CN105792535A CN 105792535 A CN105792535 A CN 105792535A CN 201410808621 A CN201410808621 A CN 201410808621A CN 105792535 A CN105792535 A CN 105792535A
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- film
- heat treatment
- circuit board
- printed circuit
- layer
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a heat treatment coating method for a printed circuit board. The method comprises the following steps: pasting a dry film on covering Cu of a PCB, covering the dry film with a film for exposure and then electroplating a first Cu layer on the film; pasting the dry film outside the first Cu layer, covering the dry film with the film for exposure and then electroplating a second Cu layer on the film; electroplating Sn by a chemical Sn dipping method on the basis of the second Cu layer; and then hot melting the PCB in glycerinum.
Description
Technical field
Present invention relates particularly to the heat treatment coating process of a kind of printed circuit board.
Background technology
Fast development along with electronic technology, current wiring board design needs to adopt micro hole, Small Distance, thin wire to be laid out in a large number, so that wiring board manufacturing technology difficulty is more and more higher, modern electronic product assembles and nearly all launches on PCB, the selection of component's feet and PCB coating and quality directly determine the quality of welding, are also the roots causing rosin joint.Current outer layer alkali etching line is in industry both needed to design according to multiple etching sections, and PCB is affected the factor of weld defect incidence rate height by this, depends mainly on the kind of coating and the resistance to environmental attack ability of quality of coating and coating.The PCB Copper Foil caused due to the spininess permeability of tin coating in prior art stores solderability and resistance to environmental attack ability after a period of time and declines fast and backend application manufacturability is poor.
Summary of the invention
For the defect that above-mentioned prior art exists, the technical problem to be solved is to provide the heat treatment coating process of a kind of erosion resistant printed circuit board.
In order to solve above-mentioned technical problem, the present invention provides the heat treatment coating process of a kind of printed circuit board, it is characterised in that comprise the steps:
(1) on the covering Cu of PCB printed board, dry film is pasted, after dry film covers film exposure, at film re-plating the oneth Cu layer；
(2) outside a Cu layer, dry film is pasted again, after dry film covers film exposure, at film re-plating the 2nd Cu layer；
(3) chemistry leaching Sn method re-plating Sn on the 2nd Cu layer basis is adopted；
(4) then by PCB printed board glycerol in hot melt.
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: also the Sn layer thickness after described plating Sn is 1.5 μm-1.8 μm.
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: the line pattern line gap < 0.08mm of the film of described step (1) and (2).
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: in step (4), the hot melting temperature of glycerol is 235 DEG C.
The invention have the advantages that the heat treatment of Sn exceedes the fusing point of himself, make to be formed in the process of Sn layer at it to there occurs remelting, Sn forms bigger crystalloid, and ageing resistance strengthens.The generation of tin surfaces oxide can also be slowed down, and only at the end of current existing PCB electroless plating tin production line, a reflow welding need to be increased and connect stove, carry out a flow-type heat treatment step.Original improvement of manufacturing line cost is low, it is easy to promote the use of.
Detailed description of the invention
(1) on the covering Cu of PCB printed board, dry film is pasted, after dry film covers film exposure, at film re-plating the oneth Cu layer；
(2) outside a Cu layer, dry film is pasted again, after dry film covers film exposure, at film re-plating the 2nd Cu layer；
(3) chemistry leaching Sn method re-plating Sn on the 2nd Cu layer basis is adopted；
(4) then by PCB printed board glycerol in hot melt.
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: also the Sn layer thickness after described plating Sn is 1.5 μm-1.8 μm, it is preferable that 1.6 μm.
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: the line pattern line gap < 0.08mm of the film of described step (1) and (2), it is preferable that 0.07mm.
Further improvement as the heat treatment coating process of the above-mentioned a kind of printed circuit board of the present invention: in step (4), the hot melting temperature of glycerol is 235 DEG C.
The technical scheme above embodiment of the present invention provided is described in detail, principle and the embodiment of the embodiment of the present invention are set forth by specific case used herein, and the explanation of above example is only applicable to help to understand the principle of the embodiment of the present invention；Simultaneously for one of ordinary skill in the art, according to the embodiment of the present invention, all will change in detailed description of the invention and range of application, in sum, this specification content should not be construed as limitation of the present invention.
Claims (4)
1. the heat treatment coating process of a printed circuit board, it is characterised in that comprise the steps:
(1) on the covering Cu of PCB printed board, dry film is pasted, after dry film covers film exposure, at film re-plating the oneth Cu layer；
(2) outside a Cu layer, dry film is pasted again, after dry film covers film exposure, at film re-plating the 2nd Cu layer；
(3) chemistry leaching Sn method re-plating Sn on the 2nd Cu layer basis is adopted；
(4) then by PCB printed board glycerol in hot melt.
2. the heat treatment coating process of a kind of printed circuit board according to claim 1, it is characterised in that: the Sn layer thickness after described plating Sn is 1.5 μm-1.8 μm.
3. the heat treatment coating process of a kind of printed circuit board according to claim 1, it is characterised in that: the line pattern line gap < 0.08mm of the film of described step (1) and (2).
4. the heat treatment coating process of a kind of printed circuit board according to claim 1, it is characterised in that: in step (4), the hot melting temperature of glycerol is 235 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410808621.2A CN105792535A (en) | 2014-12-24 | 2014-12-24 | Heat treatment coating method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410808621.2A CN105792535A (en) | 2014-12-24 | 2014-12-24 | Heat treatment coating method for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792535A true CN105792535A (en) | 2016-07-20 |
Family
ID=56386484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410808621.2A Pending CN105792535A (en) | 2014-12-24 | 2014-12-24 | Heat treatment coating method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105792535A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980562A (en) * | 2022-06-28 | 2022-08-30 | 珠海中京电子电路有限公司 | Manufacturing method of pure tin plated plate, PCB and terminal equipment |
-
2014
- 2014-12-24 CN CN201410808621.2A patent/CN105792535A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980562A (en) * | 2022-06-28 | 2022-08-30 | 珠海中京电子电路有限公司 | Manufacturing method of pure tin plated plate, PCB and terminal equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160720 |