CN105778848A - Low-dielectric-constant adhesive for flexible printed circuit boards and application method thereof - Google Patents
Low-dielectric-constant adhesive for flexible printed circuit boards and application method thereof Download PDFInfo
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- CN105778848A CN105778848A CN201610281363.6A CN201610281363A CN105778848A CN 105778848 A CN105778848 A CN 105778848A CN 201610281363 A CN201610281363 A CN 201610281363A CN 105778848 A CN105778848 A CN 105778848A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09J127/18—Homopolymers or copolymers of tetrafluoroethene
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a low-dielectric-constant adhesive for flexible printed circuit boards and an application method thereof. The adhesive is made from the following components according to parts by weight: 5-20 parts of halogen-free epoxy resin, 25-60 parts of low-dielectric thermoplastic resin, 5-10 parts of a solidifying agent, 2-8 parts of a flame retardant, 20-40 parts of a low-dielectric filler, 1-5 parts of a curing accelerator, and 2-10 parts of other aids. The application of the adhesive includes: dissolving the components in an organic solvent to form an adhesive dispersionand applying and curing the adhesive dispersion. The adhesive of the invention is low to 2.6-3.0 (1 GHz) in dielectric constant and is resistant to high temperature and good in flexibility, a flexible copper-clad board material (namely flexible printed circuit board) and flexible covering film prepared with the adhesive are good in flame retardancy, peeling strength, solder heat-resistance, electric property and high-temperature resistance, and the adhesive of the invention is useful in the production and bonding of flexible printed circuit products.
Description
Technical field
The invention belongs to technical field of polymer materials, relate to a kind of flexible printed circuit board adhesive, particularly relate to
A kind of flexible printed circuit board low-k adhesive and application process thereof.
Background technology
Along with information processing and the rapid development of Information Communication, market is to electronic product higher reliability, faster information
Transmission and miniaturization, the demand energetically of multifunction, promote the fast development of high frequency technique.Make to be applied in a large number simultaneously
The flexible print wiring board of mobile phone, notebook, LCDs etc. is also imparted with the requirement of high frequency performance.Flexible printing
Circuit manufacturing is as one of the basis of electronic product, and the exploitation of advanced low-k materials is speed-raising high frequency technique development, carries
Rise one of important channel of electric terminal vendor product performance.
The dielectric constant of the binding agent being currently used for flexible copper-clad panel material is distributed in 3.2-4.0 (1GHz).The present invention's
Purpose, it is simply that a kind of low-k that dielectric constant is 2.6-3.0 (1GHz) that can use under high frequency condition will be provided soft
Property adhesive.
Summary of the invention
The invention aims to promote electronic terminal product performance further, it is provided that a kind of heat-resist, flexibility
Can be good, the low 2.6-3.0 of dielectric constant (1GHz), the flexible printed circuit board low-k that can use under high frequency condition sticks
Mixture, it is adaptable to bind macromolecule membrane and Copper Foil in flexible copper-clad panel material.
It is a further object of the present invention to provide the application process of a kind of above-mentioned adhesive.
The present invention to achieve these goals, by the following technical solutions:
A kind of flexible printed circuit board low-k adhesive, it is characterised in that include following parts by weight of component:
Comprising at least two epoxide group in the present invention in the molecular structure of halogen-free epoxy resin, this epoxy resin is permissible
Polysiloxanes, urethanes, polyimides or polyamide structure or the like it is bonded in skeleton.Epoxy resin is preferred
Epikote 828 (Japan Epoxy Resins Co, Ltd manufacture), (Guangzhou Hong Chang electronic material industry is limited for GELR-128E
Company), Polydis3680S (Strucktol), Epikote 1256 (phenoxy resin, Japan Epoxy Resins Co,
Ltd manufacture) in the mixture of one or more.
Low dielectric heat plastic resin in the present invention is solubility low dielectric polyimides, and this polyimides is compared common poly-
Acid imide, F atom is introduced in the molecular structure of polyimides by it, owing to C-F key is less than c h bond polarizability and F can increase
Add free volume, therefore can effectively reduce dielectric constant and the dielectric loss of polyimides.Low dielectric polyimide structures can be as follows
Shown in:
Ar can be
Or
Deng.
The preferred PIAD100H of this polyimides (Japan's waste river chemistry), PIAD100L (Japan's waste river chemistry), PIAD200
The mixture of one or more in (Japan's waste river chemistry).
Firming agent in the present invention is in amine curing agent, amide-type firming agent, anhydride group firming agent and phenolic resin
A kind of.Preferably there are amine based curative and the benzene equal four such as diaminodiphenyl-methane (DDS), dicyandiamide (DICY) and phenylenediamine
Anhydride, trimellitic anhydride, methyl this dicarboxylic acid anhydride of tetrahydrochysene, hexahydrophthalic anhydride and 4-methyl tetrahydro phthalic anhydride (MTHPA-
600) etc..
Fire retardant in the present invention is organic hypophosphite compound, aluminium hydroxide, one or more in magnesium hydroxide
Mixture.
The most organic hypophosphite compound structure is as follows:
(wherein, R5And R6Representing substituted or unsubstituted univalence hydrocarbyl respectively, M represents alkali metal)
The preferred organic hypo-aluminum orthophosphate of organic hypophosphite compound (SPB-100, Otsuka Chemical), organic phosphorus
Acid calcium, organic zinc hypophosphite etc..
Low dielectric filler in the present invention is politef (Shanghai is to haze Chemical Co., Ltd.), (Japan is big for polyphenylene oxide
Gold Industrial Co., Ltd), polypropylene (Daikin Industries,Ltd.), polyfluorinated ethylene propylene (Daikin industry strain formula meeting
Society) in the mixture of one or more.And the low dielectric filler of the present invention is fluorine-containing filler.
Polyphenylene oxide structure is as follows:
Polypropylene structural is as follows:
Curing accelerator in the present invention is 2-methylimidazole, 2-ethyl imidazol(e), 2-phenyl-4 Methylimidazole. and described
The mixture of one or more in the ethyl isocyanate compound of imidazolium compounds.
Other auxiliary agent coupling agent in the present invention can be the one in silane coupler, chromium complex coupling.Preferably SHIN-ETSU HANTOTAI
Chemistry KBM-603 silane coupler, the one in DOW CORNING z6040 silane coupler.Add coupling agent and can be effectively improved filler
With the compatibility of resin, wellability, dispersibility.
The application process of a kind of above-mentioned flexible printed circuit board low-k adhesive, has first been dissolved in each component
Forming glue dispersion in machine solvent and be coated solidification again, described organic solvent is N,N-dimethylacetamide, methyl second
In base ketone, N,N-dimethylformamide, toluene, methanol, ethanol, isopropanol, acetone, butanone, ethylene glycol monomethyl ether and Ketohexamethylene one
Kind or several mixture.
The application process of a kind of above-mentioned flexible printed circuit board low-k adhesive, employs changing of larger share
The low dielectric polyimides of property and fluorine-containing filler, this bi-material all while there is relatively low dielectric constant and dielectric loss,
Also has good flame resistance.Therefore two kinds of dielectric materials are used together available lower dielectric constant and dielectric loss product,
And the fire retardant that only need to add the least deal just can reach good flame retardant effect.And polyimides softness is good, without volume
Also the toughness of adhesive and flexibility can be made in the case of outer interpolation toughened resin to reach the use requirement of flexible copper-clad board industry.
Above-mentioned application process specifically comprises the following steps when preparing flexible printed circuit board:
By in described glue dispersion coating to low dielectric high-temperature resistant membrane, heat 2-10min through 80 DEG C-160 DEG C
Removing organic solvent dry compositions, form semi-solid preparation state, then under the conditions of 100 DEG C-160 DEG C, hot pressing, on Copper Foil, obtains
Flexible copper-clad panel material, finally, by flexible copper-clad panel material 80 DEG C-180 DEG C carry out being fully cured i.e. obtain flexible printing electricity
Road plate.
Glue-line dry thickness scope when preparing flexible printed circuit board in 5-45 μm, preferably 10-30 μm, Copper Foil therein
The electrolytic copper foil goods of the rolling that be typically used for conventional flex copper-clad plate material are preferably used, and copper thickness is typically 5-70 μ
m。
Above-mentioned application process specifically comprises the following steps when the flexible coverlay of preparation:
By in described glue dispersion coating to low dielectric heatproof thin film, remove through 80 DEG C-160 DEG C heating 2-10min
Remove organic solvent dry compositions, form semi-solid preparation state, then under the conditions of 50 DEG C-80 DEG C with release paper or mould release membrance material
Compound, obtain flexible coverlay.
Glue-line dry thickness scope during the flexible coverlay of preparation in 5 to 45 μm, preferably 10 to 30 μm.
The present invention, relative to prior art, has the advantage that
The dielectric constant of adhesive of the present invention as little as 2.6-3.0 (1GHz), high temperature resistant, softness is good, uses the present invention
Flexible copper-clad panel material (i.e. flexible printed circuit board) that adhesive prepares and flexible coverlay, have good fire resistance, shell
From intensity, scolding tin thermostability, electrical property and heat-resisting quantity, adhesive of the present invention can be used for flexible print circuit series of products
Produce and bonding.
Detailed description of the invention
Below in conjunction with specific embodiment, the invention will be further described:
Embodiment 1:
The mixed proportion of every kind of component in adhesive composition is labeled as shown in the hurdle of embodiment 1 in Table 1, by third
Ketone (MEK), the mixed solvent of DMF (DMF) adds in resulting composition, generates dispersion, forms glue,
Wherein mixture concentration 38%.
Glue is coated on low dielectric heatproof thin film (Hangzhou Fu Mo new material company limited, the thickness through surface energy treatments
Degree: 25 μm) on, through the baking of 130 DEG C of * 5min of baking oven, make compositions enter semi-cured state, form the dry painting of 20 μm
Layer, then with Copper Foil (BHY22BT, Japan Energy manufactures, thickness: 35 μm) pressing, the material obtained is at 80 DEG C of-180 DEG C of *
4h is fully cured, and obtains end product flexible copper-clad panel material.According to the method for testing described below to this flexible copper-clad
The characteristic of panel material is tested, and the results are shown in Table 1.
Embodiment 2:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in embodiment 2 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Embodiment 3:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in embodiment 3 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Embodiment 4:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in embodiment 4 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Comparative example 1:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in comparative example 1 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Comparative example 2:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in comparative example 2 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Comparative example 3:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in comparative example 3 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Comparative example 4:
Except the mixed proportion of every kind of component of adhesive mixture is to be shown in Table 1 the ratio being labeled as in comparative example 4 hurdle
Outside example, preparing of flexible copper-clad panel material is in the same manner as in Example 1, also according to the method for testing 1 described below to this flexibility
Copper-clad plate properties of materials is tested, and the results are shown in Table 1.
Method of testing
1, peel strength (Peel strength, kgf/cm)
Testing peel strength according to IPC-TM-650 2.4.9, its process is: form width on flexible copper-clad panel material
For the circuit pattern of 3.175mm, then bond on tester by viscous for low dielectric heatproof pellicular front under normal temperature condition, Copper Foil is shelled
Clamping from a bit of fixture makes Copper Foil become an angle of 90 degrees with flexible copper-clad plate material surface, peels off Copper Foil with speed 50mm/min,
Take the meansigma methods of tensile test.
2, scolding tin heat-resistance test method
Testing scolding tin thermostability according to IPC-TM-650 2.4.13, its process is: determine on flexible copper-clad panel material
The square of 5cm × 5cm is directly immersed in constant temperature tin-lead liquid, stannum furnace temperature 230～350 DEG C, testing time 10s, and test and works as
Test sample does not has bubble, peeling, or maximum temperature when fading.
3, anti-flammability
First Copper Foil is etched from flexible copper-clad panel material and prepare sample.Test according to flame-retardant standard UL94V-0
The anti-flammability of this sample.If sample meets the needs of flame-retardant standard UL94V-0, evaluate it preferably, use 0 represent if
Sample backlog demand, it is poor for evaluating it, uses X to represent.
Table 1: the composition of embodiment 1-4 and comparative example 1-4 and product test (consisting of of the most each embodiment or comparative example
Weight portion forms)
Low dielectric filler exists with powder particle form, there is space, using common dielectric resin during accumulation between granule
Time, this space filled by the resin of high dielectric constant, even if adding the low dielectric filler of higher share, dielectric constant still under
Drop limited.Filler can be made to be improved with the interface compatibility of resin it addition, add coupling agent, in system, defect reduces, from
And adhesive strength gets a promotion, dielectric constant is reduced.
Embodiment 5
The glue of embodiment 1 is coated on the low dielectric heatproof thin film through surface energy treatments, and (Hangzhou fluorine film new material has
Limit company, thickness: 25 μm) on, through the baking of 140 DEG C of * 3min of baking oven, make compositions enter semi-cured state, form 25 μm
Dry coating, then 65 DEG C with release paper fit, obtain end product flexibility coverlay.
Embodiment 6
The glue of embodiment 2 is coated on the low dielectric heatproof thin film through surface energy treatments, and (Hangzhou fluorine film new material has
Limit company, thickness: 25 μm) on, through the baking of 120 DEG C of * 5min of baking oven, make compositions enter semi-cured state, form 20 μm
Dry coating, then 50 DEG C with release paper fit, obtain end product flexibility coverlay.
Embodiment 7
The glue of embodiment 3 is coated on the low dielectric heatproof thin film through surface energy treatments, and (Hangzhou fluorine film new material has
Limit company, thickness: 25 μm) on, through the baking of 160 DEG C of * 2min of baking oven, make compositions enter semi-cured state, form 30 μm
Dry coating, then 80 DEG C with release paper fit, obtain end product flexibility coverlay.
According to the pressing described below and ageing method this flexibility coverlay material processed and carry out characteristic test again.
Compression method:
After the release paper removing flexible coverlay, flexible coverlay is spread bright with 1OZ day ore deposit JTCS pure copper foil, make
With 180 DEG C of pressing-in temps, the gauge pressure of 100kg, precompressed 10S, press against 120S.
Carry out the 160 DEG C of ripening 2hr of materials'use obtained being fully cured and carry out peeling off by force according to test methodology above
Degree, scolding tin thermostability and anti-flammability test, result is as shown in table 2:
Table 2:
| Characteristic | Unit | Embodiment 5 | Embodiment 6 | Embodiment 7 |
| Peel strength | kgf/cm | 1.2 | 0.96 | 1.2 |
| Scolding tin thermostability | ℃ | 320 | 320 | 320 |
| Dielectric constant Dk (1GHz) | - | 2.64 | 2.70 | 2.75 |
| Dielectric loss Df (1GHz) | - | 0.009 | 0.011 | 0.013 |
| Anti-flammability | 94V-0 | 0 | 0 | 0 |
Claims (10)
1. a flexible printed circuit board low-k adhesive, it is characterised in that include following group by weight
Point:
Halogen-free epoxy resin 5-20 part,
Low dielectric heat plastic resin 25-60 part,
Firming agent 5-10 part,
Fire retardant 2-8 part,
Low dielectric filler 20-40 part,
Curing accelerator 1-5 part,
Other auxiliary agent 2-10 part.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Halogen-free epoxy resin molecular structure in comprise at least two epoxide group.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Thermoplastic resin be fluorine-containing low dielectric polyimides.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Firming agent be the one in amine curing agent, amide-type firming agent, anhydride group firming agent and phenolic resin；Described solidification promotees
Entering agent is 2-methylimidazole, 2-ethyl imidazol(e), 2-phenyl-4 Methylimidazole. and the ethyl isocyanate of these imidazolium compoundss
The mixture of one or more in compound.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Fire retardant be organic hypophosphite compound, aluminium hydroxide, the mixture of one or more in magnesium hydroxide.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Low dielectric filler be the mixture of one or more in politef, polyphenylene oxide, polypropylene, polyfluorinated ethylene propylene, low
Dielectric filler is fluorine-containing filler.
A kind of flexible printed circuit board low-k adhesive the most according to claim 1, it is characterised in that described
Other auxiliary agent be coupling agent, coupling agent can be the one in silane coupler, chromium complex coupling agent.
8. the flexible printed circuit board application side of low-k adhesive according to any one of claim 1-7
Method, it is characterised in that each component being first dissolved in organic solvent formation glue dispersion and is coated solidification again, described has
Machine solvent be DMAC N,N' dimethyl acetamide, methyl ethyl ketone, N,N-dimethylformamide, toluene, methanol, ethanol, isopropanol, third
The mixture of one or more in ketone, butanone, ethylene glycol monomethyl ether and Ketohexamethylene.
The application process of flexible printed circuit board low-k adhesive the most according to claim 8, its feature exists
In, comprise the following steps when preparing flexible printed circuit board:
By in described glue dispersion coating to low dielectric heatproof thin film, remove through 80 DEG C-160 DEG C heating 2-10min and have
Machine solvent dry compositions, form semi-solid preparation state, then under the conditions of 100 DEG C-160 DEG C hot pressing on Copper Foil, it is thus achieved that flexible
Copper-clad plate material, finally, carries out being fully cured at 80 DEG C-180 DEG C by flexible copper-clad panel material and i.e. obtains flexible printed circuit board.
The application process of flexible printed circuit board low-k adhesive the most according to claim 8, its feature exists
In, comprise the following steps during the flexible coverlay of preparation:
By in described glue dispersion coating to low dielectric heatproof thin film, remove through 80 DEG C-160 DEG C heating 2-10min and have
Machine solvent dry compositions, form semi-solid preparation state, then multiple with release paper or mould release membrance material under the conditions of 50 DEG C-80 DEG C
Close, obtain flexible coverlay.
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| CN201610281363.6A CN105778848A (en) | 2016-04-28 | 2016-04-28 | Low-dielectric-constant adhesive for flexible printed circuit boards and application method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106240127A (en) * | 2016-07-27 | 2016-12-21 | 重庆德凯实业股份有限公司 | A kind of manufacture method of halogen-free flame-retardant copper-clad plate |
| CN106633637A (en) * | 2016-11-22 | 2017-05-10 | 苏州赛伍应用技术有限公司 | Flexible heat-conducting resin for metal-based copper-cladded plate |
| CN108084960A (en) * | 2018-01-09 | 2018-05-29 | 金光 | Flexible printer circuit Protection glue and preparation method thereof |
| CN108287451A (en) * | 2018-01-24 | 2018-07-17 | 浙江福斯特新材料研究院有限公司 | A kind of photosensitive cover film resin combination of low dielectric |
| CN109517538A (en) * | 2018-11-22 | 2019-03-26 | 广东莱尔新材料科技股份有限公司 | A kind of adhesive and preparation method thereof, Flexible copper-clad plate and preparation method thereof |
| CN110669336A (en) * | 2019-11-08 | 2020-01-10 | 中山市鸿盛新材料有限公司 | Modified fluorine-containing polyimide resin composition and preparation method thereof |
| CN110669218A (en) * | 2019-10-09 | 2020-01-10 | 广东东溢新材料科技有限公司 | Modified polyimide, adhesive composition, and preparation method and application thereof |
| CN112680172A (en) * | 2020-11-11 | 2021-04-20 | 浙江福斯特新材料研究院有限公司 | Flame-retardant covering film composition, covering film product and multi-layer laminated rigid-flexible composite board |
| CN116285718A (en) * | 2022-12-29 | 2023-06-23 | 广东载乘新材料科技有限公司 | Manufacturing method of low dielectric loss pure film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63277290A (en) * | 1987-05-08 | 1988-11-15 | Junkosha Co Ltd | Adhesive of low dielectric constant |
| CN1306025A (en) * | 1999-12-10 | 2001-08-01 | 日东电工株式会社 | Polyamide acid and polyamideous resin prepared therefrom and its use in circuit board |
| JP4169978B2 (en) * | 2002-01-07 | 2008-10-22 | 株式会社カネカ | Low dielectric adhesive and film-like joining member comprising the same |
| CN103923589A (en) * | 2014-05-07 | 2014-07-16 | 新高电子材料（中山）有限公司 | Low-dielectric constant adhesive for flexible printed circuit board and application method thereof |
-
2016
- 2016-04-28 CN CN201610281363.6A patent/CN105778848A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63277290A (en) * | 1987-05-08 | 1988-11-15 | Junkosha Co Ltd | Adhesive of low dielectric constant |
| CN1306025A (en) * | 1999-12-10 | 2001-08-01 | 日东电工株式会社 | Polyamide acid and polyamideous resin prepared therefrom and its use in circuit board |
| JP4169978B2 (en) * | 2002-01-07 | 2008-10-22 | 株式会社カネカ | Low dielectric adhesive and film-like joining member comprising the same |
| CN103923589A (en) * | 2014-05-07 | 2014-07-16 | 新高电子材料（中山）有限公司 | Low-dielectric constant adhesive for flexible printed circuit board and application method thereof |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106240127A (en) * | 2016-07-27 | 2016-12-21 | 重庆德凯实业股份有限公司 | A kind of manufacture method of halogen-free flame-retardant copper-clad plate |
| CN106633637A (en) * | 2016-11-22 | 2017-05-10 | 苏州赛伍应用技术有限公司 | Flexible heat-conducting resin for metal-based copper-cladded plate |
| CN108084960A (en) * | 2018-01-09 | 2018-05-29 | 金光 | Flexible printer circuit Protection glue and preparation method thereof |
| CN108287451A (en) * | 2018-01-24 | 2018-07-17 | 浙江福斯特新材料研究院有限公司 | A kind of photosensitive cover film resin combination of low dielectric |
| CN109517538A (en) * | 2018-11-22 | 2019-03-26 | 广东莱尔新材料科技股份有限公司 | A kind of adhesive and preparation method thereof, Flexible copper-clad plate and preparation method thereof |
| CN109517538B (en) * | 2018-11-22 | 2020-12-29 | 广东莱尔新材料科技股份有限公司 | Adhesive and preparation method thereof, and flexible copper-clad plate and preparation method thereof |
| CN110669218A (en) * | 2019-10-09 | 2020-01-10 | 广东东溢新材料科技有限公司 | Modified polyimide, adhesive composition, and preparation method and application thereof |
| CN110669218B (en) * | 2019-10-09 | 2022-03-29 | 广东东溢新材料科技有限公司 | Modified polyimide, adhesive composition, and preparation method and application thereof |
| CN110669336A (en) * | 2019-11-08 | 2020-01-10 | 中山市鸿盛新材料有限公司 | Modified fluorine-containing polyimide resin composition and preparation method thereof |
| CN110669336B (en) * | 2019-11-08 | 2022-06-17 | 中山市鸿盛新材料有限公司 | Modified fluorine-containing polyimide resin composition and preparation method thereof |
| CN112680172A (en) * | 2020-11-11 | 2021-04-20 | 浙江福斯特新材料研究院有限公司 | Flame-retardant covering film composition, covering film product and multi-layer laminated rigid-flexible composite board |
| CN112680172B (en) * | 2020-11-11 | 2022-11-29 | 杭州福斯特电子材料有限公司 | Flame-retardant covering film composition, covering film product and multi-layer laminated rigid-flexible composite board |
| CN116285718A (en) * | 2022-12-29 | 2023-06-23 | 广东载乘新材料科技有限公司 | Manufacturing method of low dielectric loss pure film |
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Application publication date: 20160720 |