CN105750736A - Laser cutting method for double-layer glass - Google Patents
Laser cutting method for double-layer glass Download PDFInfo
- Publication number
- CN105750736A CN105750736A CN201610278411.6A CN201610278411A CN105750736A CN 105750736 A CN105750736 A CN 105750736A CN 201610278411 A CN201610278411 A CN 201610278411A CN 105750736 A CN105750736 A CN 105750736A
- Authority
- CN
- China
- Prior art keywords
- groove
- glass
- cutting method
- laser cutting
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a laser cutting method for double-layer glass in order to solving problems in the prior art.Automatic production can be achieved, and therefore cutting efficiency is effectively improved; in addition, the cutting precision is high, and the cutting surface is smooth and attractive.In order to achieve the purpose, the laser cutting method for the double-layer glass comprises the steps that an ultra-fast laser beam penetrates through the first glass to be focused on the upper surface of the second glass for scanning, and the upper surface of the second glass is cut to form a first groove; the ultra-fast laser beam is focused on the upper surface of the first glass for scanning along the track of the first groove, and the upper surface of the first glass is cut to form a second groove; pressure is applied along the first groove and the second groove from bottom to top for cracking, or pressure is applied along the second groove and the first groove from top to bottom for cracking.Preferentially, the pulse of the ultra-fast laser beam is not larger than 10 picoseconds.
Description
Technical field
The present invention relates to a kind of laser cutting method for double glazing, in particular for the cutting method of point plate of LCDs.
Background technology
Along with the application of LCDs is more and more extensive, the yield of LCDs is also increasing, and wherein LCDs divides the cutting efficiency of plate and quality also more and more important.A point plate for LCDs is made up of two blocks of glass, and method conventional at present is to adopt diamant after the scribing respectively of upper and lower two blocks of glass, then by manually glass being carried out sliver, the method efficiency is low, it is impossible to realize automated production.
Summary of the invention
The invention aims to solve the prior art problem of above-mentioned existence, it is provided that a kind of laser cutting method for double glazing, it may be achieved automated production, thus being effectively improved cutting efficiency, and cutting accuracy is high, and cutting surfaces is bright and clean attractive in appearance.
In order to realize object above, a kind of laser cutting method for double glazing, step includes:
(1) through the first glass, ultrafast laser bundle is focused on the second glass top surface to be scanned, cut out the first groove at described second glass top surface；
(2) ultrafast laser bundle focuses on described first glass top surface be scanned along the track of the first groove, cut out the second groove at described first glass top surface；
(3) apply pressure from bottom to top along described first groove and described second groove and carry out sliver, or apply pressure from top to down along described second groove and described first groove and carry out sliver.
Preferably, the pulse of described ultrafast laser bundle is not more than 10 psecs.
The another method of the present invention, step includes:
(1) through the first glass, ultrafast laser bundle is focused on the second lower glass surface to be scanned, cut out the first groove at described second glass top surface；
(2) ultrafast laser bundle focuses on described first lower glass surface be scanned along the track of the first groove, cut out the second groove at described first glass top surface；
(3) apply pressure from bottom to top along described first groove and described second groove and carry out sliver, or apply pressure from top to down along described second groove and described first groove and carry out sliver.
Preferably, the pulse of described ultrafast laser bundle is not more than 10 psecs.
The laser cutting method using the present invention can effectively realize automatization's cutting of double glazing, especially point plate of LCDs, thus improving production efficiency, and cutting accuracy is high, and cutting surfaces is bright and clean attractive in appearance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of laser cutting method for double glazing of the present invention；
Fig. 2 is the another kind of a kind of laser cutting method schematic diagram for double glazing of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Fig. 1 is the schematic diagram of a kind of laser cutting method for double glazing of the present invention.As it can be seen, when double glazing is cut, especially point plate of liquid crystal display screen, first focuses on the second glass 2 upper surface 2a by ultrafast laser bundle through the first glass 3 and is scanned, cut out the first groove 4 at the second glass 2 upper surface 2a；Then ultrafast laser bundle focuses on the first glass 3 upper surface 3a, and the track along the first groove 4 is scanned, and cuts out the second groove 5 at the first glass 3 upper surface 3a；3rd, pressure 1 is applied from bottom to top along the first groove 4 and the second groove 5, first glass 3 and the second glass 2 are carried out sliver, or applies pressure from top to down along the second groove 5 and the first groove 4 and carry out sliver, so by unidirectional applying pressure effectively to realize sliver.Preferably, the pulse of ultrafast laser bundle is not more than 10 psecs, more effectively to ensure the fineness of cutting accuracy and facet.
Fig. 2 is the decomposing schematic representation that the another kind of the present invention drags soldering method automatically.As it can be seen, when double glazing is cut, especially point plate of liquid crystal display screen, first focuses on the second glass 2 lower surface 2a by ultrafast laser bundle through the first glass 3 and is scanned, cut out the first groove 4 at the second glass 2 lower surface 2a；Then ultrafast laser bundle focuses on the first glass 3 upper surface 3a, and the track along the first groove 4 is scanned, and cuts out the second groove 5 at the first glass 3 lower surface 3a；3rd, pressure 1 is applied from bottom to top along the first groove 4 and the second groove 5, first glass 3 and the second glass 2 are carried out sliver, or applies pressure 6 from top to down along the second groove 5 and the first groove 4 and carry out sliver, so by unidirectional applying pressure effectively to realize sliver.Preferably, the pulse of ultrafast laser bundle is not more than 10 psecs, more effectively to ensure the fineness of cutting accuracy and facet.
The laser cutting method using the present invention can effectively realize automatization's cutting of double glazing, especially point plate of LCDs, thus improving production efficiency, and cutting accuracy is high, and cutting surfaces is bright and clean attractive in appearance.
Claims (4)
1., for a laser cutting method for double glazing, step includes:
(1) through the first glass, ultrafast laser bundle is focused on the second glass top surface to be scanned, cut out the first groove at described second glass top surface；
(2) ultrafast laser bundle focuses on described first glass top surface be scanned along the track of the first groove, cut out the second groove at described first glass top surface；
(3) apply pressure from bottom to top along described first groove and described second groove and carry out sliver, or apply pressure from top to down along described second groove and described first groove and carry out sliver.
2. laser cutting method as claimed in claim 1, it is characterised in that the pulse of described ultrafast laser bundle is not more than 10 psecs.
3., for a laser cutting method for double glazing, step includes:
(1) through the first glass, ultrafast laser bundle is focused on the second lower glass surface to be scanned, cut out the first groove at described second glass top surface；
(2) ultrafast laser bundle focuses on described first lower glass surface be scanned along the track of the first groove, cut out the second groove at described first glass top surface；
(3) apply pressure from bottom to top along described first groove and described second groove and carry out sliver, or apply pressure from top to down along described second groove and described first groove and carry out sliver.
4. laser cutting method as claimed in claim 3, it is characterised in that the pulse of described ultrafast laser bundle is not more than 10 psecs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278411.6A CN105750736A (en) | 2016-04-28 | 2016-04-28 | Laser cutting method for double-layer glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278411.6A CN105750736A (en) | 2016-04-28 | 2016-04-28 | Laser cutting method for double-layer glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105750736A true CN105750736A (en) | 2016-07-13 |
Family
ID=56326337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610278411.6A Pending CN105750736A (en) | 2016-04-28 | 2016-04-28 | Laser cutting method for double-layer glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105750736A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
| CN108857084A (en) * | 2018-09-27 | 2018-11-23 | 江苏金琥珀光学科技股份有限公司 | A kind of laser cutting method of tempered glass |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN112088147A (en) * | 2018-05-07 | 2020-12-15 | 康宁股份有限公司 | Laser induced separation of transparent oxide glasses |
| CN114850700A (en) * | 2022-06-09 | 2022-08-05 | 浙江华工光润智能装备技术有限公司 | Laser cutting equipment and method for laminated glass |
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| JP2005132694A (en) * | 2003-10-31 | 2005-05-26 | Japan Steel Works Ltd:The | Glass cutting method |
| CN101391860A (en) * | 2007-09-21 | 2009-03-25 | 韩国情报通信大学校产学协力团 | A cutter for substrate using microwaves laser beam and method thereof |
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| JP2010113338A (en) * | 2009-07-29 | 2010-05-20 | Nishiyama Stainless Chemical Kk | Method for manufacturing glass substrate for fpd |
| CN101844275A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Method for dividing substrate |
| CN104025251A (en) * | 2011-09-21 | 2014-09-03 | 雷蒂安斯公司 | Systems and processes that singulate materials |
| KR20150056399A (en) * | 2013-11-15 | 2015-05-26 | 주식회사 에스에프에이 | Device for glass cutting |
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2016
- 2016-04-28 CN CN201610278411.6A patent/CN105750736A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005132694A (en) * | 2003-10-31 | 2005-05-26 | Japan Steel Works Ltd:The | Glass cutting method |
| US7423237B2 (en) * | 2003-10-31 | 2008-09-09 | The Japan Steel Works, Ltd. | Method of cutting laminated glass with laser beams |
| CN101505908A (en) * | 2006-08-24 | 2009-08-12 | 康宁股份有限公司 | Laser separation of thin laminated glass substrates for flexible display applications |
| CN101391860A (en) * | 2007-09-21 | 2009-03-25 | 韩国情报通信大学校产学协力团 | A cutter for substrate using microwaves laser beam and method thereof |
| CN101844275A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Method for dividing substrate |
| JP2010113338A (en) * | 2009-07-29 | 2010-05-20 | Nishiyama Stainless Chemical Kk | Method for manufacturing glass substrate for fpd |
| CN104025251A (en) * | 2011-09-21 | 2014-09-03 | 雷蒂安斯公司 | Systems and processes that singulate materials |
| KR20150056399A (en) * | 2013-11-15 | 2015-05-26 | 주식회사 에스에프에이 | Device for glass cutting |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
| CN112088147A (en) * | 2018-05-07 | 2020-12-15 | 康宁股份有限公司 | Laser induced separation of transparent oxide glasses |
| CN112088147B (en) * | 2018-05-07 | 2023-05-23 | 康宁股份有限公司 | Laser induced separation of transparent oxide glass |
| US11964898B2 (en) | 2018-05-07 | 2024-04-23 | Corning Incorporated | Laser-induced separation of transparent oxide glass |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN108857084A (en) * | 2018-09-27 | 2018-11-23 | 江苏金琥珀光学科技股份有限公司 | A kind of laser cutting method of tempered glass |
| CN114850700A (en) * | 2022-06-09 | 2022-08-05 | 浙江华工光润智能装备技术有限公司 | Laser cutting equipment and method for laminated glass |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160713 |
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| WD01 | Invention patent application deemed withdrawn after publication |