CN105733173B - A kind of preparation method of energy-efficient phenolic foam board - Google Patents
A kind of preparation method of energy-efficient phenolic foam board Download PDFInfo
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- CN105733173B CN105733173B CN201410764518.2A CN201410764518A CN105733173B CN 105733173 B CN105733173 B CN 105733173B CN 201410764518 A CN201410764518 A CN 201410764518A CN 105733173 B CN105733173 B CN 105733173B
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Abstract
The present invention relates to a kind of preparation methods of energy-efficient phenolic foam board：(1) it stocks up according to following components and parts by weight content：Expandability resol 100, foaming agent 2~6, fire retardant 5~15, foam stabiliser 2~4, curing agent 10~20；(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed, be put into baking oven；(3) control oven temperature, mold is carried out at different temperatures foaming stage by stage processing, after take out mold, that is, energy-efficient phenolic foam board is prepared.Compared with prior art, the product that the present invention is prepared meets the characteristics of energy-efficient, lightweight, and thermal coefficient can be down to 0.022W/mK.
Description
Technical field
The present invention relates to external-wall heat-insulation material fields, more particularly, to a kind of preparation side of energy-efficient phenolic foam board
Method.
Background technology
With the continuous generation of current external wall outer insulation material fire, for using external-wall heat-insulation material in architectural engineering
It studies more and more.In numerous thermal insulation materials, the phenol formaldehyde foam made of Foaming of phenolic resin is as a kind of novel heat preservation
Material is referred to as " king of heat preservation ", while it has many advantages, such as fire resisting, corrosion-resistant, environmentally friendly, has been used widely in foreign countries, very
Multinational family specifies the preferred phenolic foam material of architectural design as building heat insulation material.It studies and starts to walk because of domestic phenol formaldehyde foam
Than later, foreign level is far not achieved in many performances, so using being very restricted, but with domestic enterprise and research
The continuous research of personnel, phenol formaldehyde foam still have prodigious development prospect at home.
The thermal coefficient of domestic phenolic foam heat insulation plate is generally relatively high, essentially 0.030~0.040W/mK, property
Energy-efficient requirement can far be not achieved.Chinese patent CN102953446A discloses a kind of phenol formaldehyde foam of composite flame-proof material
Thermal insulation board, including phenolic foam heat insulation plate coat one layer of resistance of re-coating after a bed boundary agent on phenolic foam heat insulation plate outer surface
Combustible material.A bed boundary agent is first coated on phenolic foam heat insulation plate outer surface and is then coated with one layer of fire proofing, is enhanced
The surface strength of plate body improves the fire retardant performance of plate body, reduces thermal losses.But the thermal insulation board of this layer structure
Once ablation fire proofing, in the follow-up process flame retardant effect will drastically reduce.
Invention content
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of thermal coefficient can be with
Reach 0.022W/mK, to be greatly improved phenolic foam board heat-insulating property energy-efficient phenolic foam board
Preparation method.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of preparation method of energy-efficient phenolic foam board, using following steps：
(1) it stocks up according to following components and parts by weight content：It is expandability resol 100, foaming agent 2~6, fire-retardant
Agent 5~15, foam stabiliser 2~4, curing agent 10~20；
(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed,
It is put into baking oven；
(3) control oven temperature, mold is carried out at different temperatures foaming stage by stage processing, after take out mold,
Energy-efficient phenolic foam board is prepared.
Expandability resol is water-soluble thermosetting phenolic resin, alkali catalyst is used in building-up process, such as
The control of sodium hydroxide, barium hydroxide etc., wherein moisture is controlled in 5~8wt%, viscosity in 12000~18000cps.
The foaming agent is the mixture of pentane and isopentane, and boiling point is at 30~31 DEG C.
The fire retardant is inorganic combustion inhibitor, aluminium hydroxide, the silica of the mesh of preferable particle size >=1200.
The foam stabiliser is the mixture of the dimethicone that weight ratio is 1: 1 and Tween 80 composition.
The curing agent is 30~40: 40: 20 by weight by p-methyl benzenesulfonic acid, phenolsulfonic acid, sulfuric acid, phosphoric acid, water:
20: 30~40 mix.
In an oven, point three different temperatures sections carry out interim foaming to mold, and three temperature sections are respectively 50-60 DEG C of hair
Steep 5-10min, 70-80 DEG C of foaming 3-5min, 90 DEG C of foaming 3-5min.
Compared with prior art, the present invention is foamed using three temperature sections, and when low temperature is conducive to the preliminary shape of complex
At and material flowing；Medium temperature can effectively control complex growth when foaming is identical as the primary solidification of phenolic resin
Step.When so that foam growing to perfect condition, phenolic resin is concurrently cured, the gas in fully wrapped around firmly foam；High temperature mistake
Cheng Zhong keeps the phenolic resin curing of primary solidification more thorough, in the stacking process for preventing the later stage, the gas broken wall ease in foam
Go out.Phenolic foam board rate of closed hole prepared by this technique is improved significantly, final to make to which thermal coefficient is also greatly lowered
Standby product meets the characteristics of energy-efficient, lightweight, and thermal coefficient can be down to 0.022W/mK.
Specific implementation mode
With reference to specific embodiment, the present invention is described in detail.
Embodiment 1
A kind of preparation method of energy-efficient phenolic foam board, using following steps：
(1) it stocks up according to following components and parts by weight content：Expandability resol 100, foaming agent 2, fire retardant
5, foam stabiliser 2, curing agent 10, wherein the moisture control of expandability resol exists in 5~8wt%, viscosity control
12000~18000cps, foaming agent are the mixture of pentane and isopentane,For its boiling point at 30~31 DEG C, fire retardant is grain size
The aluminium hydroxide of >=1200 mesh, foam stabiliser are the mixture of dimethicone and Tween 80, and mass content is respectively 50%, Gu
Agent is p-methyl benzenesulfonic acid, phenolsulfonic acid, sulfuric acid, phosphoric acid, water are mixed by weight 30: 40: 20: 20: 30；
(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed,
It is put into baking oven；
(3) oven temperature is controlled, the processing of foaming stage by stage is carried out at different temperatures to mold, specifically, at 50 DEG C
Foam 10min, 70 DEG C of foaming 5min, 90 DEG C of foaming 5min, after take out mold, that is, energy-efficient phenolic aldehyde bubble is prepared
Foam plate.
Embodiment 2
A kind of preparation method of energy-efficient phenolic foam board, using following steps：
(1) it stocks up according to following components and parts by weight content：Expandability resol 100, foaming agent 4, fire retardant
10, foam stabiliser 3, curing agent 15, wherein the moisture control of expandability resol is in 5~8wt%, viscosity control
In 12000~18000cps, foaming agent is the mixture of pentane and isopentane, and for boiling point at 30~31 DEG C, fire retardant is grain
The aluminium hydroxide of the mesh of diameter >=1200, foam stabiliser are the mixture of the dimethicone that weight ratio is 1: 1 and Tween 80 composition,
Curing agent be p-methyl benzenesulfonic acid, phenolsulfonic acid, sulfuric acid, phosphoric acid, water in proportion: mix at 35: 40: 20: 20: 35；
(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed,
It is put into baking oven；
(3) oven temperature is controlled, the processing of foaming stage by stage is carried out at different temperatures to mold, specifically, at 55 DEG C
Foam 8min, 75 DEG C of foaming 5min, 90 DEG C of foaming 4min, after take out mold, that is, energy-efficient phenolic aldehyde bubble is prepared
Foam plate.
Embodiment 3
A kind of preparation method of energy-efficient phenolic foam board, using following steps：
(1) it stocks up according to following components and parts by weight content：Expandability resol 100, foaming agent 6, fire retardant
15, foam stabiliser 4, curing agent 20, wherein the moisture control of expandability resol is in 5~8wt%, viscosity control
In 12000~18000cps, foaming agent is the mixture of pentane and isopentane, and for boiling point at 30~31 DEG C, fire retardant is grain
The silica of the mesh of diameter >=1200, foam stabiliser are the mixture of the dimethicone that weight ratio is 1: 1 and Tween 80 composition,
Curing agent be p-methyl benzenesulfonic acid, phenolsulfonic acid, sulfuric acid, phosphoric acid, water in proportion: mix at 40: 40: 20: 20: 40；
(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed,
It is put into baking oven；
(3) oven temperature is controlled, the processing of foaming stage by stage is carried out at different temperatures to mold, specifically, at 60 DEG C
Foam 5min, 80 DEG C of foaming 3min, 90 DEG C of foaming 3min, after take out mold, that is, energy-efficient phenolic aldehyde bubble is prepared
Foam plate.
Test and other physical properties of thermal coefficient are carried out to the phenolic foam heat insulation plate that embodiment 1-3 is prepared
Test.
The physical property of 1 gained phenolic foam heat insulation plate of embodiment：Thermal coefficient：0.018W/mK density=39kg/m3
Compressive strength=0.11Mpa.The physical property of 2 gained phenolic foam heat insulation plate of embodiment：Thermal coefficient：0.019W/mK is close
Degree=40kg/m3Compressive strength=0.12Mpa.The physical property of 1 gained phenolic foam heat insulation plate of embodiment：Thermal coefficient：
0.022W/mK density=44kg/m3Compressive strength=0.14Mpa.It can be seen that phenolic foam board prepared by above-mentioned technique closes
Porosity is improved significantly, and to which thermal coefficient is also greatly lowered, the product finally prepared meets energy-efficient, lightweight
Feature.
Claims (7)
1. a kind of preparation method of energy-efficient phenolic foam board, which is characterized in that use following steps：
(1) it stocks up according to following components and parts by weight content：Expandability resol 100, foaming agent 2~6, fire retardant 5
~15, foam stabiliser 2~4, curing agent 10~20, the wherein moisture of expandability resol are controlled in 5~8wt%,
Viscosity is controlled in 12000~18000cPs；
(2) it stirs evenly, is subsequently poured into mold under homogenizer after mixing above-mentioned raw materials, mold is sealed, be put into
Baking oven；
(3) in an oven, point three different temperatures sections carry out interim foaming to mold, and three temperature sections are respectively 50-60 DEG C of hair
Steep 5-10min, 70-80 DEG C foaming 3-5min, 90 DEG C foaming 3-5min, after take out mold, that is, be prepared energy-efficient
Phenolic foam board.
2. a kind of preparation method of energy-efficient phenolic foam board according to claim 1, which is characterized in that described
Expandability resol is water-soluble thermosetting phenolic resin, and sodium hydroxide, barium hydroxide conduct are used in building-up process
Catalyst preparation obtains.
3. a kind of preparation method of energy-efficient phenolic foam board according to claim 1, which is characterized in that described
Foaming agent is the mixture of pentane and isopentane, and boiling point is at 30~31 DEG C.
4. a kind of preparation method of energy-efficient phenolic foam board according to claim 1, which is characterized in that described
Fire retardant is inorganic combustion inhibitor.
5. a kind of preparation method of energy-efficient phenolic foam board according to claim 4, which is characterized in that described
Inorganic combustion inhibitor is aluminium hydroxide, the silica of the mesh of grain size >=1200.
6. a kind of preparation method of energy-efficient phenolic foam board according to claim 1, which is characterized in that described
Foam stabiliser is that dimethicone and Tween 80 are 1: 1 mixture constituted in mass ratio.
7. a kind of preparation method of energy-efficient phenolic foam board according to claim 1, which is characterized in that described
Curing agent is that p-methyl benzenesulfonic acid, phenolsulfonic acid, sulfuric acid, phosphoric acid, water are 30~40 by weight:40:20:20:30~40 mixing
It forms.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410764518.2A CN105733173B (en) | 2014-12-11 | 2014-12-11 | A kind of preparation method of energy-efficient phenolic foam board |
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| CN201410764518.2A CN105733173B (en) | 2014-12-11 | 2014-12-11 | A kind of preparation method of energy-efficient phenolic foam board |
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| CN105733173B true CN105733173B (en) | 2018-11-13 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108034188B (en) * | 2017-12-04 | 2020-12-15 | 安徽复材科技有限公司 | Preparation method of glass wool reinforced phenolic foam composite board |
| CN109456569A (en) * | 2018-09-04 | 2019-03-12 | 徐州市华天塑业有限公司 | A kind of environment-friendly type foam board |
| CN109486096A (en) * | 2018-09-04 | 2019-03-19 | 徐州市华天塑业有限公司 | A kind of novel sound insulating high temperature resistant foam board |
| CN110746738B (en) * | 2019-10-28 | 2023-10-20 | 株洲时代新材料科技股份有限公司 | Phenolic resin foaming prepreg, preparation method and application thereof |
| CN111732814B (en) * | 2020-07-28 | 2023-05-09 | 福建天利高新材料有限公司 | High-performance fireproof flame-retardant phenolic foam and preparation method thereof |
| CN113715426A (en) * | 2021-08-30 | 2021-11-30 | 雪宝家居集团有限公司 | Preparation process of flame-retardant environment-friendly board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962971A (en) * | 2009-07-24 | 2011-02-02 | 苏州美克思科技发展有限公司 | Phenolic foam insulation board for high-strength walls and manufacturing method thereof |
| CN103613904A (en) * | 2013-11-27 | 2014-03-05 | 山东圣泉化工股份有限公司 | Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof |
| CN103848951A (en) * | 2014-03-20 | 2014-06-11 | 新疆科西嘉新材料有限公司 | Method for continuously producing expandable phenolic resin |
| CN103878916A (en) * | 2014-03-20 | 2014-06-25 | 新疆科西嘉新材料有限公司 | Method for continuously producing ultra-thick phenolic aldehyde outer wall heat-preservation board |
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2014
- 2014-12-11 CN CN201410764518.2A patent/CN105733173B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962971A (en) * | 2009-07-24 | 2011-02-02 | 苏州美克思科技发展有限公司 | Phenolic foam insulation board for high-strength walls and manufacturing method thereof |
| CN103613904A (en) * | 2013-11-27 | 2014-03-05 | 山东圣泉化工股份有限公司 | Low-density low-acidicity phenol formaldehyde foam board and preparation technique thereof |
| CN103848951A (en) * | 2014-03-20 | 2014-06-11 | 新疆科西嘉新材料有限公司 | Method for continuously producing expandable phenolic resin |
| CN103878916A (en) * | 2014-03-20 | 2014-06-25 | 新疆科西嘉新材料有限公司 | Method for continuously producing ultra-thick phenolic aldehyde outer wall heat-preservation board |
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Effective date of registration: 20200323 Address after: 215000 No.50, Weihe Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Suzhou Meikesi New Energy Technology Co., Ltd Address before: 215121, No. 50, Ho sum Road, Suzhou Industrial Park, Jiangsu, Suzhou, China Patentee before: SUZHOU MAX TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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Granted publication date: 20181113 Termination date: 20201211 |